Design of a 75‐nW, 0.5‐V subthreshold complementary metal–oxide–semiconductor operational amplifier

This work focuses on the subthreshold design of ultra low‐voltage low‐power operational amplifiers. A well‐defined procedure for the systematic design of subthreshold operational amplifiers (op‐amps) is introduced. The design of a 0.5‐V two‐stage Miller‐compensated amplifier fabricated with a 0.18‐µm complementary metal–oxide–semiconductor process is presented. The op‐amp operates with all transistors in subthreshold region and achieves a DC gain of 70 dB and a gain–bandwidth product of 18 kHz, dissipating just 75 nW. The active area of the chip is ≈0.057 mm². Experimental results demonstrate that well‐designed subthreshold op‐amps are a very attractive solution to implement sub‐1‐V energy‐efficient applications for modern portable electronic systems. A comparative analysis with low‐voltage, low‐power op‐amp designs available in the literature highlights that subthreshold op‐amps designed according to the proposed design procedure achieve a better trade‐off among speed, power, and load capacitance. Copyright © 2013 John Wiley & Sons, Ltd.     

A 60‐GHz power amplifier design with on‐chip tunable load‐matching network and power detect in 90‐nm CMOS

This paper presents a 60‐GHz power amplifier with on‐chip varactor‐based tunable load‐matching networks and an embedded DC temperature‐sensor‐based power detector. The output power can be monitored by the DC temperature sensor, and load‐matching network can be tuned by regulating the control voltage of the varactors, which can be used for correcting unpredictable process, supply voltage, and temperature (PVT) variations and load mismatch. Measured results show that the small‐signal gain of the CMOS power amplifier is up to 6.5 dB at 52 GHz. The power amplifier achieves 5 dBm output P1dB and 7 dBm saturated output power with 4.5% maximun power added efficiency (PAE) at 1 V control voltage. By sweeping the control voltage of the varactors, the power amplifier can obtain the maximun power gain, which can be used to solve the load mismatch. © 2016 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.     

A complementary metal–oxide semiconductor digitally programmable current conveyor

A second‐generation current conveyor with digitally programmable current gains is presented. A current division network with zero standby power consumption is utilized in two different ways to provide both gain and attenuation of the second‐generation current conveyor's current transfer characteristics. The proposed topology overcomes several drawbacks of the previous solutions through affording a more power and area efficient solution while exhibiting relatively wider tuning range and bandwidth. A variable‐gain amplifier and a two‐integrator‐loop filter biquad providing low‐pass and band‐pass responses are given as application examples. A modified two‐integrator‐loop topology is developed to offer independent control of the pole frequency and quality factor without disturbing the passband gain. Simulation results obtained from a standard 0.18 µm complementary metal–oxide semiconductor process are given. Copyright © 2011 John Wiley & Sons, Ltd.     

A 5‐GHz energy‐efficient tunable pulse generator for ultra‐wideband applications using a variable attenuator for pulse shaping

A new energy‐efficient tunable pulse generator is presented in this paper using 0.13‐µm CMOS technology for short‐range high‐data‐rate 3.1–10.6 GHz ultra‐wideband applications. A ring oscillator consisting of current‐starved CMOS inverters is quickly switched on and off for the duration of the pulse, and the amplitude envelope is shaped with a variable passive CMOS attenuator. The variable passive attenuator is controlled using an impulse that is created by a low‐power glitch generator (CMOS NOR gate). The glitch generator combines the falling edge of the clock and its delayed inverse, allowing the duration of the impulse to be changed over a wide range (500–900 ps) by varying the delay between the edges. The pulses generated with this technique can provide a sharp frequency roll off with high out‐of‐band rejection to help meet the Federal Communications Commission mask. The entire circuit operates in switched mode with a low average power consumption of less than 3.8 mW at 910 MHz pulse repetition frequency or below 4.2 pJ of energy per pulse. It occupies a total area of 725 × 600 µm² including bonding pads and decoupling capacitors, and the active circuit area is only 360 × 200 µm². Copyright © 2011 John Wiley & Sons, Ltd.     

A fast automatic frequency calibration technique for a 2–6 GHz frequency synthesizer

A fast automatic frequency calibration (AFC) technique is described. For fast AFC operation while eliminating the uncertainty of the initial phase relationship between the reference clock and voltage‐controlled oscillator output, two‐phase reference clocks are employed. The proposed AFC scheme is applied to a 2–6 GHz frequency synthesizer. The frequency synthesizer is implemented in a 0.18 µm complementary metal–oxide–semiconductor process and occupies 0.92 mm² while the AFC occupies only 0.01 mm². The AFC operation is completed in less than 1.6 µs. Copyright © 2012 John Wiley & Sons, Ltd.     

A 13 bit 10 MHz bandwidth MASH 3–2 Σ∆ modulator in 90 nm CMOS

In this paper, a new multi loop sigma‐delta (ΣΔ) modulator is proposed which employs one order redundant noise shaping in the first stage so the effect of the quantization noise leakage is minimized. Thus, analog circuit requirements are considerably relaxed compared to the conventional Multi‐stAge‐noise‐SHaping (MASH) structures. This enhancement makes the structure appropriate for low voltage and broadband applications. The proposed architecture is compared with traditional high‐order structures, and the advantages are demonstrated by both the analysis and behavioral system level simulations. As a prototype, the proposed MASH 3–2 sigma‐delta modulator is designed, and the detailed design procedure is presented from the system level to the circuit level in a 90 nm CMOS technology. Circuit level simulation results show that the modulator achieves a peak signal‐to‐noise and distortion ratio of 79.4 dB and 79 dB dynamic range over a 10 MHz bandwidth with a sampling frequency of 160 MHz. It consumes 35.4 mW power from a single 1 V supply. Copyright © 2012 John Wiley & Sons, Ltd.     

A linear,ultra wideband,low‐power, 2.1–5 GHz,VCO

A linear, Ultra Wideband, low‐power VCO, suitable for UWB‐FM applications is proposed, forming the main part of a UWB‐FM transmitter. The VCO is designed in TSMC 90thinspacenm digital CMOS process and includes a Source‐Coupled Multivibrator, used as current‐controlled oscillator (CCO) which generates output frequencies between 2.1 and 5 GHz and a voltage‐to‐current (V‐to‐I) converter which translates the VCO input voltage modulation signal to current. Two single‐ended inverter buffers are employed to drive either a differential or a single‐ended UWB antenna. The presented VCO is designed for 1 V power supply and exhibits a linear tuning range of 2.1–5 GHz, a differential output power of ?7.83 dBm±0.78 dB and low power consumption of 8.26 mW, including the output buffers, at the maximum oscillation frequency. It is optimized for a very high ratio of tuning range (81.69%) over power consumption equal to 9.95 dB. The desired frequency band of 3.1–5 GHz for UWB‐FM applications is covered for the entire industrial temperature range (?40 to 125^°C). Copyright © 2010 John Wiley & Sons, Ltd.     

900 MHZ radio‐frequency identification rectifier with optimization and reusing of electro‐static discharges protections in 180 nm digital CMOS technology

Sensitivity and electro‐static discharges (ESD) protection level are crucial parameters for any Ultra High‐Frequency (UHF) power rectifier–harvester designed for radio‐frequency identification (RFID) devices. While sensitivity limits the reading range of the interrogator‐to‐tag communication link, the requirement for an adequate protection against ESD is enforced in commercial devices connected to a printed antenna. Both resistive and capacitive parasitics of the protection circuits severely affect RF performance of the device. In the paper, a rectifier for UHF RFID embedding an ESD protection for 2 kV human‐body discharge model (HBM) level is proposed. The target of a low added parasitic capacitance is achieved by adapting the protection circuit to the RFID rectifier and reusing the ESD clamp for additional functions being mandatory in a UHF RFID front end. The layout of the ESD clamp has been optimized for minimum parasitic resistance without sacrificing the protection level. Two UHF harvesters were implemented in a 180 nm digital complementary metal‐oxide semiconductor (CMOS) technology, featuring a minimum sensitivity of ?15.5 dBm with an ESD protection level of 2 kV HBM. Copyright © 2014 John Wiley & Sons, Ltd.     

A 1.2 V 83 dB DR single‐ended input SC ΔΣ modulator including a large‐swing analog buffer for portable ECG applications

This study proposes a subsystem consisting of an analog buffer and a single‐ended input to a fully differential ΔΣ modulator to obtain low‐power consumption for portable electrocardiogram applications. With the proposed subsystem, the need for an inverting amplifier is avoided, and low‐power consumption is achieved. The ΔΣ modulator with a second order, 1 bit, and cascade of integrators feedforward structure consumes a low power, in which an inverting and a non‐inverting path implement a single‐ended input to fully‐differential signals. A double sampling technique is proposed for a digital‐to‐analog converter feedback circuit to reduce the effect of the reference voltage, reduce the amplifier requirements, and obtain low‐power consumption. Input‐bias and output‐bias transistors working in the weak‐inversion region are implemented to obtain an extremely large swing for the analog buffer. At a supply voltage of 1.2 V, signal bandwidth of 250 Hz, and sampling frequency of 128 kHz, the measurement results show that the modulator with a buffer achieves a 77 dB peak signal‐to‐noise‐distortion ratio, an effective‐number‐of‐bits of 12.5 bits, an 83 dB dynamic range, and a figure‐of‐merit of 156 dB. The total chip size is approximately 0.28 mm² with a standard 0.13 µm Complementary Metal‐Oxide‐Silicon (CMOS) process. Copyright © 2016 John Wiley & Sons, Ltd.     

A 40 M–1000 MHz 77.2‐dB spurious free dynamic range CMOS RF variable gain amplifier for digital TV tuner ICs

In this paper, a 40 M–1000 MHz 77.2‐dB spurious free dynamic range (SFDR) CMOS RF variable gain amplifier (VGA) has been presented for digital TV tuner applications. The proposed RFVGA adopts a wideband operational‐amplifier‐based VGA and a wideband buffer with differential multiple gated transistor linearization method for wideband operation and high linearity. The SFDR of the proposed RFVGA is also analyzed in detail. Fabricated in a 0.13‐µm CMOS process, the RFVGA provides 31‐dB gain range with 1‐dB gain step, a minimum noise figure of 7.5 dB at a maximum gain of 27 dB, and maximum in‐band output‐referred third‐order intercept point of 27.7 dBm, while drawing an average current of 27.8 mA with a supply voltage of 3.3 V. The chip core area is 0.54 mm × 0.4 mm. Copyright © 2014 John Wiley & Sons, Ltd.     

Development and evaluation of a long‐range 300‐m leaky coaxial cable in the 2.4‐GHz band for IEEE 802.11 b/g wireless network access

In installing wireless access systems for indoor use using IEEE 802.11b/g‐complied 2.4‐GHz band wireless local area network (LAN) units, problems that arise include blind zones and interferences caused by radio waves transmitted by neighboring access point units. To solve these problems, the use of leaky coaxial cables (LCXs) is a promising method. However, commercially available flexible LCXs with small diameters for 2.4‐GHz wireless LAN were not long enough for use in tunnels, underground facilities, and so on, and the communication characteristics of LCXs long enough for these places using wireless LAN units have not been reported. We have developed a flexible 300‐m long LCX for the 2.4‐GHz band and IEEE 802.11b/g‐complied wireless LAN units with high sensitivity. We evaluated its performance with four cable configurations and confirmed that this LCX provides wireless connections over 300 m along the cable and over 20 m lateral to the cable in an open‐air environment. We also found the coverage could be extended by a method of cable‐to‐cable links. IEEJ Trans 2010 DOI: 10.1002/tee.20604     

Circuit and system design for an 860–960 MHz RFID reader front‐ends with Tx leakage suppression in 0.18 − µm CMOS technology

This paper presents an RF Front‐END for an 860–960thinspaceMHz passive RFID Reader. The direct conversion receiver architecture with the feedback structure in the RF front‐end circuit is used to give good immunity against the large transmitter leakage and to suppress leakage. The system design considerations for receiver on NF and IIP3 have been discussed in detail. The RF Front‐END contains a power amplifier (PA) in transmit chain and receive front‐end with low‐noise amplifier, up/down mixer, LP filter and variable‐gain amplifier. In the transmitter, a differential PA with a new power combiner is designed and fabricated in a 0.18‐µm technology. The chip area is 2.65 mm × 1.35 mm including the bonding pads. The PA delivers an output power of 29 dBm and a power‐added efficiency of 24% with a power gain of 20 dB, including the losses of the bond‐wires. Copyright © 2011 John Wiley & Sons, Ltd.     

A configurable 2‐Gbps LVDS transceiver in 150‐nm CMOS with pre‐emphasis,equalization, and slew rate control

A configurable full‐duplex low‐voltage differential signaling transceiver is presented, which can be configured to operate either for smaller differential channels (a few inches of striplines) or for longer channels (10 m of twisted pair cables). The configurability is embedded in the form of functionalities like pre‐emphasis, equalization, and slew rate control within the transceiver. The transmitter employs a hybrid voltage–current‐mode driver, which due to replica action, achieves a high‐impedance current‐mode signal dispatch and at the same time provides a matched impedance at the near end for improved intersymbol interference. The transmitter achieves slew rate control through a band‐limited pre‐driver, while the pre‐emphasis is achieved through a capacitive feed‐forward. The receiver employs a large‐input common‐mode first stage enclosed in a common‐mode control loop that enables its first stage to also act like a domain shifter (VDDIO‐to‐VDDCORE) reducing the overall power consumption. The equalization in the receiver is implemented by using carefully sized active inductive loads inside the receiver. The transceiver is designed and fabricated in 150‐nm complementary metal–oxide–semiconductor, sharing the space with a larger die, occupying an area of 400 × 400μm. The measurement results demonstrate that the transceiver is operating at 2 Gbps both for a 4‐in microstrip and a 10‐m twisted pair CAT6 cable with 30 and 180 ps of total jitter, respectively. The built‐in impedance calibrator minimizes the spread in the on‐die termination at the near end provided by the transmitter‐minimizing bit error rate across process, voltage, and temperature corners. The transmitter consumes a total power of 17 mW operating at 2 Gbps, that is, 8.5 pJ/bit of energy consumption; the receiver consumes a total power of 3.5 mW while driving a load of 5 pF at 2 Gbps. Copyright © 2016 John Wiley & Sons, Ltd.     

A 6‐Gbps/lane receiver for a clock‐forwarded link in 65‐nm CMOS process

For a 6‐Gbps/lane clock‐forwarded link, a wireline receiver has been developed. The phases of the sampling clocks are aligned to the center of the input data eye by a clock and data recovery (CDR) circuit. In the CDR circuit, the sampling clock phases are rotated by a phase rotating phase locked loop (PLL). A three‐tap decision feedback equalizer (DFE) compensates for the loss of cable together with a continuous‐time linear equalizer (CTLE) to ensure sufficient eye opening for the CDR circuit to find the optimum sampling phase. The DFE coefficients are adaptively calculated based on the data and edge samples. Implemented in a 65‐nm CMOS process, the three‐lane 6‐Gbps/lane receiver for a clock‐forwarded link occupies 0.63 mm² including pads and consumes 288 mA from a 1.2‐V supply. Copyright © 2015 John Wiley & Sons, Ltd.     

A 4.8–6.8 GHz low phase noise LC VCO in 0.13‐µm CMOS technology

This letter presents a novel LC voltage controlled oscillator (VCO) supporting the high‐speed serial transmission standard of RapidIO in 0.13‐µm complementary metal‐oxide semiconductor technology. The low phase noise is achieved through several techniques including current source switching, parallel coupled negative transconductance cell, and varactor bias combination scheme. Measured results of proposed circuit show a low phase noise of ?120 dBc/Hz at 1 MHz offset from 6.25 GHz carrier and tuning range of 4.8 ~ 6.8 GHz (34.48%) while consuming 7.4 mW under the supply voltage of 1.2 V. Copyright © 2015 John Wiley & Sons, Ltd.     

A 0.1 to 2.7‐GHz SOI SP8T antenna switch adopting body self‐adapting bias technique for low‐loss high‐power applications

A low‐loss high‐power single‐pole 8‐throw antenna switch adopting body self‐adapting bias technique in a 0.18‐μm thick‐film partially depleted silicon‐on‐insulator complementary metal‐oxide‐semiconductor process is implemented for multimode multiband cellular applications. A topology with symmetric port design is developed. We employ the body‐contacted field‐effect transistor to handle high power level and obtain low harmonic distortion. However, the conventional bias method for body‐contacted field‐effect transistor leads to poor insertion loss (IL), serious imbalanced voltage division, and large die size. Therefore, a new body self‐adapting bias scheme is adopted to improve the IL and power handling capability with die area reward by removing the employment of extra biasing resistor and voltage supply at the body. The presented silicon‐on‐insulator antenna switch utilizing the new body bias strategy reveals similar harmonic performance as a conventional switch version, thanks to the analogous DC bias to the gate and body, while it exhibits effectively lower IL, imbalanced voltage division, and die area. The measured IL and 0.1‐dB compression point (P_?0.1dB), at 1.9/2.7 GHz, are roughly 0.52/0.82 dB and 39.2/36.9 dBm, respectively. The overall IL and P_?0.1dB are apparently improved by approximately 0.05 to 0.13 dB and 0.5 to 0.8 dBm compared with the conventional version.     

Using CAD tools for shortening the design cycle of high-performance sigma–delta modulators: A 16·4 bit, 9·6 kHz, 1·71 mW ΣΔM in CMOS 0·7 μm technology

This paper uses a CAD methodology proposed by the authors to design a low-power second-order ΣΔM. This modulator has been fabricated in a 0·7 μm CMOS technology to be used as the front-end of an energy-metering mixed-signal ASIC and features 16·4 bit at a digital output rate of 9·6 kHz with a power consumption of 1·71 mW. It yields a value of the power(W)/(2^{Resolution(bit)}×output rate (Hz)) figure which is the smallest reported to now, thus demonstrating the possibility to design high-performance embeddable ΣΔMs using CAD methodologies. © 1997 by John Wiley & Sons, Ltd.