Mo/α-Al_2O_3界面的二次离子质谱研究

采用电子束蒸发方法，在200℃的抛光（1102）取向的蓝宝石（α－Al2O3）单晶衬底上淀积厚度为300nm的Mo膜。经870℃下不同真空退火时间处理后，运用MCs＋－SIMS技术进行了深度剖析，并结合XRD物相分析，对Mo／A2O3界面问题进行了探讨。结果表明，在Mo／Al2O3界面处存在原子相互扩散形成的过渡层。退火处理后，过渡层展宽，有MoO2生成。延长退火时间，过渡层变化不大。     

原子层淀积 Al2O3薄膜的热稳定性研究

以Al（CH3）3和H2O为反应源，在270℃下用原子层淀积（ALD）技术在Si衬底上生长了Al2O3薄膜．采用X射线衍射（XRD）、X射线光电子能谱（XPS）、原子力显微镜（AFM）和傅立叶变换红外光谱（FTIR）等分析手段对Al2O3薄膜的热稳定性进行了研究．结果表明刚淀积的薄膜中含有少量A-OH基团，高温退火后，Al-OH基团几乎消失，这归因于Al-OH基团之间发生反应而脱水．退火后的薄膜中O和Al元素的相对比例（1．52）比退火前的（1．57）更接近化学计量比的Al2O3．FTIR分析表明，在刚淀积的Al2O3中有少量的-CH3存在，CH3含量会随热处理温度的升高而减少．此外，在高温快速热退火后，Al2O3薄膜的表面平均粗糙度（RMS）明显改善，900℃热退火后其RMS达到1．15nm．     

GaN/Al_2O_3(0001)上Ge薄膜的CVD外延生长

本工作采用化学气相淀积方法,以GcH4为反应气源,以InN/CaN/Al2O3(0001)复合衬底作陪片,在CaN/Al2O3(0001)复合衬底上外延生长了Ge薄膜,并对生长机理进行了探讨.研究结果表明直接在N2气氛下外延得到了多晶Ge薄膜,表面较平整,由吸收光谱得出其带隙宽度为0.78 eV;经过H2预处理,CaN/Al2O3复合衬底表面出现金属In的沉积,外延Ge薄膜沿(111)方向择优生长,晶体质量较高.     

高度（100）取向PLT/PZT多层铁电薄膜的制备与性能研究

利用射频磁控溅射技术，以PbOx为过渡层，在Pt（111）/Ti/SiO2/Si（100）衬底上，采用原位溅射技术制备了高度（100）取向的[（Pb0.90La0.10）Ti0.975O3/Pb（Zr0.20Ti0.80）O3]n（n=1，2）{筒记为[PLT/PZT]。）多层铁电薄膜，研究了层数对多层铁电薄膜介电性能和铁电性能的影响。研究得出，（100）取向的PbOx，过渡层导致了[PLT/PZT]。多层铁电薄膜的（100）择优取向；高度（100）择优取向的[PLT/PZT]2薄膜具有更大的剩余极（2Pr=31.45μC/cm）和更好的“蝴蝶”状C-V曲线。这些研究结果表明，所制备的（100）取向的[PLT/PZT]2多层铁电薄膜具有优良的铁电性能。     

Si（111）衬底上非晶态GaN薄膜的晶化过程

采用磁控溅射法在Si（111）衬底上直接淀积GaN薄膜。通过X射线衍射谱（XRD）、X光电子能谱（XPS）和扫描电子显微镜（SEM）研究GaN薄膜由非晶态向多晶态的转化过程。实验结果表明：（1）在900℃氮气气氛中退火，非晶态GaN保持不变；（2）在900℃氨气气氛中退火，虽然非晶态GaN转化为多晶态GaN，但却出现中间相金属Ga；（3）在非晶态GaN向多晶态GaN转化过程中，GaN晶粒将逐渐增大。     

Al／Al2O3多层膜的表面和界面的分析研究

用热蒸发沉积和自然氧化及加热法制备纳米量级的Al/Al2O3薄膜和多层膜。用X射线光电子谱仪（XPS）和透射电镜（TEM）对样品进行检测。XPS实验说明自然氧化的Al2O3膜层厚在2－5nm。Al/Al2O3薄膜及多层膜的O与Al的原子浓度比为1.43-1.85。Ar离子刻蚀的XPS实验结果（刻蚀速率为0.09nm/s)说明：2个对层的Al/Al2O3多层膜截面样品具有周期性结构。TEM观察到了5个对层的Al/Al2O3多层膜的层状态结构，其周期为4nm。由此说明，热蒸发及自然氧化法是制备纳米量级的Al/Al2O3多层膜的有效方法。     

Al_2O_3衬底上Pb(Zr,Ti)O_3铁电薄膜的外延生长与性能

以SrRuO3(SRO)作为缓冲层,利用脉冲激光沉积的方法,首次在蓝宝石(Al2O3)衬底上制备了PbZr0.52-Ti0.48O3(PZT)外延薄膜。利用X射线衍射分析得到了PZT薄膜与Al2O3衬底的外延关系,即(111)[110]PZT//(0001)[1010]Al2O3。所制备的PZT薄膜具有较强的铁电极化性能,饱和极化值达到138.3μC/cm2。同时,利用对电流-电压性质的测量研究了铁电极化的退反转现象。     

铜薄膜与Al_2O_3陶瓷界面结合力的IBAD过渡层增强

利用离子束辅助淀积(IBAD)方法在Al_2O_3陶瓷基片上镀制过渡金属层,然后在此过渡层上进一步用电子束蒸发镀制铜导电薄膜。这种复合方法镀制的铜膜在具有低电阻率的同时,界面附着力有大幅度增加。在本文实验条件下,有IBAD铜或钛过渡层薄膜的附着力比没有过渡层的薄膜附着力分别增加了5倍和8倍。     

采用水基原子层沉积工艺在石墨烯上沉积Al2O3介质薄膜研究

采用水基原子层沉积(H2O-based ALD)方法在石墨烯上直接生长Al2O3介质薄膜,研究了Al2O3成核机理.原子力显微镜(AFM)对Al2O3薄膜微观形态分析表明,沉积温度决定着Al2O3在石墨烯表面的成核生长情况,物理吸附在石墨烯表面的水分子是Al2O3成核的关键,物理吸附水分子的均匀性直接影响Al2O3薄膜的均匀性.在适当的温度窗口(100～130℃),Al2O3可以均匀沉积在石墨烯上,AFM测得Al2O3薄膜表面均方根粗糙度(RMS)为0.26 nm,X射线光电子能谱(XPS)表面分析与元素深度剖析表明,120℃下在石墨烯表面沉积的Al2O3薄膜中O和Al元素的含量比约为1.5.拉曼光谱分析表明,采用H2O-based ALD工艺沉积栅介质薄膜不会降低石墨烯晶体质量.     

Mo／α—Al2O3界面的二次离子质谱研究

采用电子束蒸发方法，在２００℃的抛光（１１０２）取向的蓝宝石（α－Ａｌ２Ｏ３）单晶衬底上淀积厚度为３００ｎｍ的Ｍｏ膜。经８７０℃下不同真空退火时间处理后，运用ＭＣｓ＾＋－ＳＩＭＳ技术进行了深度剖析，并结合ＸＲＤ物相分析，对Ｍｏ／Ａｌ２Ｏ３界面问题进行了探讨。结果表明，在Ｍｏ／Ａｌ２Ｏ３界面处存在原子相互扩散形成的过渡层。退火处理后，过渡层展宽，有ＭｏＯ２生成。延长退火时间，过渡层变化不大。     

Charge-trapping characteristics of Al2O3/Cu/Al2O3 nanolaminate structures prepared through atomic layer deposition

The nanolaminate Al2O3/Cu/Al2O3 structures were constructed on p-type Si (001) substrates using atomic layer deposition (ALD) process with the aim to fabricating nonvolatile charge-trap memories. Low temperature Cu thin layers were deposited through plasma-enhanced atomic layre depositon of Cu aminoalkoxide (Cu(dmamb)2) combined with hydrogen plasma and Al2O3 layers were prepared by thermal atomic layer deposition of trimethylaluminum (TMA) combined with H2O. Nonvolatile features were confirmed using capacitance-voltage (C-V) measurements. The copper film functions as a charge-trapping layer and the Al2O3 thin layers were employed as tunneling and control oxide layers. Line shapes and binding energies of Cu metal and the thin layer of 6 nm Cu in nanolaminate structures were observed in the X-ray photoelectron spectroscopy (XPS) and high resolution transmission electron microscopy (TEM) image. The V(FB) shift width of the Al2O3 (28 nm)/Cu (6 nm)/Al2O3 (4.2 nm)/Si laminate structure is found to be 4.75 V in voltage sweeping between -10 and +10 V, leading to the trap density of 1.68 x 10(18) cm(-3).     

Fabrication of 3-dimensional PbZr(1-x)Ti(x)O3 nanoscale thin film capacitors for high density ferroelectric random access memory devices

PbZr(x)Ti(1-x)O3 (PZT) thin films were deposited on 3-dimensional (3D) nano-scale trench structures for use in giga-bit density ferroelectric random access memories. PZT thin films were deposited by liquid delivery metalorganic chemical vapor deposition using Pb(thd)2, Zr(MMP)4, and Ti(MMP)4 precursors dissolved in ethyl cyclohexane. Iridium thin films were deposited by atomic layer deposition, and they exhibited excellent properties for capacitor electrodes even at a thickness of 20 nm. The trench capacitor was composed of three layers, viz. Ir/PZT/lr (20/60/20 nm), and had a diameter of 250 nm and a height of 400 nm. Almost 100% step coverage was obtained at a deposition temperature of 530 degrees C. The PZT thin film capacitors with a thickness of 60 nm on a planar structure exhibited a remnant polarization (Pr) of 28 microC/cm2, but the Pr value of the 3D PZT capacitors decreased slightly with decreasing 3D trench pattern size. The transmission electron microscope analysis indicated that the PZT thin films had compositional uniformity in the 3D trench region. Both columnar and granular grains were formed on the sidewalls of the trench capacitors, and their relative proportion exhibited strong size dependence. The trench capacitors with more columnar PZT grains showed good switching behavior under an external bias of 2.1 V and had a remnant polarization of 19-24 microC/cm2.     

The thickness effect of Bi3.25La0.75Ti3O12 buffer layer in PbZr0.58Ti0.42O3/Bi3.25La0.75Ti3O12 (PZT/BLT) multilayered ferroelectric thin films

A series of PbZr_0.58Ti_0.42O₃ (PZT) thin films with various Bi_3.25La_0.75Ti₃O₁₂ (BLT) buffer layer thicknesses were deposited on Pt/TiO₂/SiO₂/p-Si(100) substrates by RF magnetron sputtering. The X-ray diffraction measurements of PZT film and PZT/BLT multilayered films illustrate that the pure PZT film shows (111) preferential orientation, and the PZT/BLT films show (110) preferential orientation with increasing thickness of the BLT layer. There are no obvious diffraction peaks for the BLT buffer layer in the multilayered films, for interaction effect between the bottom BLT and top PZT films during annealing at the same time. From the surface images of field-emission scanning electron microscope, there are the maximum number of largest-size grains in PZT/BLT(30 nm) film among all the samples. The growth direction and grain size have significant effects on ferroelectric properties of the multilayered films. The fatigue characteristics of PZT and PZT/BLT films suggest that 30-nm-thick BLT is just an effective buffer layer enough to alleviate the accumulation of oxygen vacancies near the PZT/BLT interface. The comparison of these results with that of PZT/Pt/TiO₂/SiO₂/p-Si(100) basic structured film suggests that the buffer layer with an appropriate thickness can improve the ferroelectric properties of multilayered films greatly.     

PZT薄膜的MOCVD制备技术

采用直接液体榆运-金属有机化合物化学气相沉积技术（DLI-MOCVD）制备Pb（ZrxTi1-x）O3薄膜（PZT薄膜）,并进行了相关研究,通过调节MOCVD中影响PZT质量的主要工艺参数（温度、压力、系统的气体（Ar,O2）流量、衬底转速、蠕动泵速）,制备不同组分PZT薄膜（均匀性≥±95％,尺寸为2．54—20．32cm（1—8in）,厚度为50—500nm）．经XRD测试可见,PZT薄膜已形成钙钛矿结构．用SEM对其表面进行分析,结果表明,PZT薄膜表面致密均匀．     

(111)-Oriented Pb(Zr0.52Ti0.48)O3 thin film on Pt(111)/Si substrate using CoFe2O4 nano-seed layer by pulsed laser deposition

Perovskite Pb(Zr_0.52Ti_0.48)O₃ (PZT) thin film with perfect (111)-orientation was achieved on CoFe₂O₄ seeded-Pt(111)/Ti/SiO₂/Si substrate by pulsed laser deposition technique using target with limited excess Pb. Pyrochlore phase formation was suppressed on Pt by CoFe₂O₄ nano-seed layer (~7 nm), and perovskite PZT was achieved at temperature as low as 550 °C. CoFe₂O₄ seed layer that has perfect (111)-orientation acts as a promoter for perfectly (111)-orientated growth of PZT. PZT film grown at 600 °C has higher degree of crystalline orientation, lower surface roughness, and compacted microstructure in comparison to the film grown at 550 °C. The PZT film has a nano-size grain-feature structure with grain size of about 40–60 nm. Perovskite formation was also confirmed by ferroelectric measurement. The ferroelectric properties of PZT film grown at 600 °C is higher than that grown at 550 °C which could be attributed to the enhancement of the crystalline orientation, crystallinity, and microstructure of the film.     

Controlling the crystallinity and roughness of atomic layer deposited titanium dioxide films

The surface roughness of thin films is an important parameter related to the sticking behaviour of surfaces in the manufacturing of microelectomechanical systems (MEMS). In this work, TiO2 films made by atomic layer deposition (ALD) with the TiCl4-H2O process were characterized for their growth, roughness and crystallinity as function of deposition temperature (110-300 degrees C), film thickness (up to approximately 100 nm) and substrate (thermal SiO2, RCA-cleaned Si, Al2O3). TiO2 films got rougher with increasing film thickness and to some extent with increasing deposition temperature. The substrate drastically influenced the crystallization behaviour of the film: for films of about 20 nm thickness, on thermal SiO2 and RCA-cleaned Si, anatase TiO2 crystal diameter was about 40 nm, while on Al2O3 surface the diameter was about a micrometer. The roughness could be controlled from 0.2 nm up to several nanometers, which makes the TiO2 films candidates for adhesion engineering in MEMS.     

Low-temperature growth of nanostructured diamond films

Nanostructured diamond films are grown on a titanium alloy substrate using a two-step deposition process. The first step is performed at elevated temperature (820 degrees C) for 30 min using a H2/CH4/N2 gas mixture to grow a thin (approximately 600 nm) nanostructured diamond layer and to improve film adhesion. The remainder of the deposition involves growth at low temperature (< 600 degrees C) in a H2/CH4/O2 gas mixture. The continuation of the smooth nanostructured diamond film growth during low-temperature deposition is confirmed by in situ laser reflectance interferometry, atomic force microscopy, micro-Raman spectroscopy, and surface profilometry. Similar experiments performed without the initial nanostructured diamond layer resulted in poorly adhered films with a more crystalline appearance and a higher surface roughness. This low-temperature deposition of nanostructured diamond films on metals offers advantages in cases where high residual thermal stress leads to delamination at high temperatures.     

Al2O3/TiO2 multilayer passivation layers grown at low temperature for flexible organic devices

In this study, the permeability of passivation layers consisting of aluminum oxide (Al2O3) and titanium oxide (TiO2) was examined. The films were deposited on poly(ether sulfone) (PES) substrates via electron cyclotron resonance atomic layer deposition (ECR-ALD) at various deposition temperatures. The optimum plasma power and deposition temperature were investigated through measurements of the refractive index and packing density of the Al2O3 and TiO2 films. A buffer layer/multilayer structure was proposed in this study to improve the passivation barrier performance. A low water vapor transmission rate (WVTR) of approximately 5 x 10(-3) g/m2 x day was achieved with two Al2O3/TiO2 stacks with thicknesses of 40 nm deposited at 80 degrees C. Based on the Arrhenius rate equation, the activation energy of water vapor transmission through different passivation structures was examined. The activation energies of Al2O3, Al2O3/TiO2, and two Al2O3/TiO2 stacks with thicknesses of 40 nm were 51.8, 63.9, and 74.7 kJ/mol, respectively.     

LaAlO_3顶层对Pb(Zr,Ti)O_3薄膜微结构和性能的影响

利用脉冲激光沉积(PLD)法,在LaAlO3(LAO)基片上外延生长了高质量的PbZr0.52Ti0.48O3(PZT)薄膜。通过增加10nm厚的LAO顶层,所制备PZT薄膜的铁电剩余极化(Pr)由28.8μC/cm2增加为55.1μC/cm2。通过对微结构分析,表明薄膜电学性能的增强主要来源于LAO顶层对PZT薄膜表面形貌的优化。另外,与Pr不同,随LAO顶层厚度的增加,PZT薄膜的矫顽场单调增加。     

Laser damage properties of TiO2/Al2O3 thin films grown by atomic layer deposition

Research on thin film deposited by atomic layer deposition (ALD) for laser damage resistance is rare. In this paper, it has been used to deposit TiO(2)/Al(2)O(3) films at 110 °C and 280 °C on fused silica and BK7 substrates. Microstructure of the thin films was investigated by x-ray diffraction. The laser-induced damage threshold (LIDT) of samples was measured by a damage test system. Damage morphology was studied under a Nomarski differential interference contrast microscope and further checked under an atomic force microscope. Multilayers deposited at different temperatures were compared. The results show that the films deposited by ALD had better uniformity and transmission; in this paper, the uniformity is better than 99% over 100 mm Φ samples, and the transmission is more than 99.8% at 1064 nm. Deposition temperature affects the deposition rate and the thin film microstructure and further influences the LIDT of the thin films. As to the TiO(2)/Al(2)O(3) films, the LIDTs were 6.73±0.47 J/cm(2) and 6.5±0.46 J/cm(2) at 110 °C on fused silica and BK7 substrates, respectively. The LIDTs at 11 °C are notably better than 280 °C.