Flexibility of p–n Junction Formation from SWIR to LWIR Using MBE-Grown Hg(1–x)CdxTe on Si Substrates

In this paper, we show the versatility of using molecular-beam epitaxy (MBE) for the growth of the mercury cadmium telluride (HgCdTe) system. Abrupt composition profiles, changes in doping levels or switching doping types are easily performed. It is shown that high-quality material is achieved with Hg_(1–x)Cd _x Te grown by MBE from a cadmium mole fraction of x = 0.15 to x = 0.72. Doping elements incorporation as low as 10¹⁵ cm⁻³ for both n-type and p-type material as well as high incorporation levels >10¹⁸ cm⁻³ for both carrier types were achieved. X-ray curves, secondary-ion mass spectrometry (SIMS) data, Hall data, the influence of doping incorporation with cadmium content and growth rate, etch pit density (EPD), composition uniformity determined from Fourier-transform infrared (FTIR) transmission spectro- scopy, and surface defect maps from low to high x values are presented to illustrate the versatility and quality of HgCdTe material grown by MBE. All data presented in this work are from layers grown on silicon (112) substrate.     

N- type doping of gallium antimonide and aluminum antimonide grown by molecular beam epitaxy using lead telluride as a tellurium dopant source

Lead telluride was used as a “captive” source of tellurium (Te) for the n-type doping of gallium antimonide (GaSb) and aluminum antimonide (AlSb)grown by molecular beam epitaxy. Controllable carrier concentrations from 1.2 x 10¹⁶ to 1.6 x 10¹⁸ cm^-3 were obtained. High room-temperature Hall mobilities of 4200 cm²/V · s were measured for the low-doped GaSb samples. In the growth temperature range of interest, doping ef-ficiencies are approximately 50% of those in GaAs. For GaSb, SIMS data show that the Te incorporation decreases significantly at growth temperatures above 500° C. How-ever, in AlSb, there is no significant reduction in the incorporation of Te up to at least 650° C. In contrast, the Te incorporation into AlSb decreases at low temperatures. There is also some evidence of surface segregation in AlSb. Contrary to other doping studies, increasing the Sb : Ga flux ratio was found to reduce the Te incorporation.     

An Initial Investigation of Nitrogen Doping of Wide-Bandgap HgCdTe During Molecular-Beam Epitaxy Using Ar/N Plasmas

An initial investigation of the use of atomic nitrogen for controlled p-type doping of wide-bandgap Hg_0.3Cd_0.7Te (x = 0.7) is reported. Mixtures of argon and nitrogen, ranging in nitrogen concentration from 0.1% to 100%, have been utilized to demonstrate well-controlled nitrogen incorporation in the 10¹⁶ cm⁻³ to 10²⁰ cm⁻³ range using total gas flow rates of 0.3 sccm to 4.0 sccm and radiofrequency (RF) powers of 100 W to 400 W. Nitrogen doping exhibits several desirable attributes including abrupt turn-on and turn-off and minimal sensitivity to variations in growth temperature and HgCdTe composition, with no negative effects on HgCdTe dislocation density and morphology. Preliminary electrical measurements indicate primarily n-type behavior in the 10¹⁴ cm⁻³ to 10¹⁵ cm⁻³ range in as-grown x = 0.7 HgCdTe and CdTe films doped with nitrogen at 10¹⁸ cm⁻³ to 10²⁰ cm⁻³ concentrations, while ZnTe films have exhibited p-type electrical activity with hole concentrations approaching 10²⁰ cm⁻³.     

Electrical activity,mode of incorporation and distribution coefficient of group V elements in Hg1−xCdxTe grown from tellurium rich liquid phase epitxial growth solutions

Hg_1−xCd_xTe films were grown liquid phase epitaxially from tellurium rich solutions containing up to 10 at. % of the group V elements P, As, Sb, and Bi. Chemical analysis of the Te growth solutions and the films was carried out in conjunction with extensive Hall effect measurements on the films subsequent to various annealing treatments under Hg rich and Te rich conditions. Despite the presence of a large concentration of the group V elements in the Te source solution, the maximum concentration of these elements incorporated into the liquid phase epitaxially grown Hg_1-xCd_xTe appears to vary from <10¹⁵cm⁻³ for Bi up to 10¹⁷cm⁻³ for phosphorus and As implying a distribution coefficient varying from <10⁻⁵ for Bi up to 10⁻³ for P at growth temperature of ∼500° C. This low value of the distribution coefficient for group V elements for growths from Te rich solutions contrasts with the moderately high values reported in the literature to date for growth from Hg rich solutions as well as pseudobinary solutions (Bridgman growth). The widely differing distribution coefficients and hence the solubility of the group V elements for Hg rich and Te rich liquid phase epitaxial solutions is explained on the basis that the activity coefficient of the group V elements in Te rich solutions is probably orders of magnitude lower than it is in Hg rich solutions. Finally, the results of the anneals at 200° C under Hg saturated conditions with and without a 500° C Hg saturated preanneal have indicatedn top conversion in many of the films attesting to the amphoteric behavior of the group V elements in LPE grown Hg_1−xCd_xTe(s) similar to the previously reported behavior of P in bulk grown Hg_0.8Cd_0.2Te.     

Effect of Sputtered ZnO Layers on Behavior of Thin-Film Transistors Deposited at Room Temperature in a Nonreactive Atmosphere

In this work we present the electrical characterization of ZnO-based thin-film transistors fabricated at room temperature. The ZnO films were deposited by radiofrequency magnetron sputtering at variable argon pressure (3 mTorr to 10 mTorr) at room temperature. The sputtered ZnO films were polycrystalline with hexagonal structure and electrical resistivity ranging from 10¹ Ω cm to 10⁸ Ω cm for films deposited from 3 mTorr to 10 mTorr. The trend in the electrical behavior of the devices was found to be due to the variation of the electron concentration of the ZnO films. The devices with better performance showed a field-effect mobility of 2.9 cm²/Vs, threshold voltage of 20 V, I _on/I _off ≈ 10⁶, and electrical resistivity of ~10⁸ Ω cm. In addition, linear behavior of I _on/I _off with deposition pressure was observed. The lowest I _on/I _off ratio (~2) was calculated for devices with ZnO layers deposited at 3 mTorr, and the highest ratio (~10⁶) for devices processed at 10 mTorr. Hall-effect measurements were performed on ZnO films showing the lowest resistivity. The layer grown at 3 mTorr showed a Hall mobility of μ _H = 8.9 cm²/Vs and carrier concentration of n = 4.2 × 10¹⁶ cm⁻³ with resistivity of ρ = 31.8 Ω cm. For films deposited at 5 mTorr, the Hall mobility, carrier concentration, and resistivity were μ _H = 7.9 cm²/Vs, n = 3.4 × 10¹⁶ cm⁻³, and ρ = 38.4 Ω cm, respectively. Films deposited at 8 mTorr and 10 mTorr could not be measured due to their high resistance.     

Energy spectrum of n-type Pb1−x SnxTe (x=0.22) bombarded by neutrons

The effect of hydrostatic pressure (P⩽12 kbar) on the electrical properties of n-type Pb_1−x Sn_xTe (x=0.22) bombarded by electrons (T≈300 K, E=6 MeV, Φ=7.7×10¹⁷ cm⁻²) has been investigated. The restructuring of the energy spectrum of electronirradiated alloys under pressure has been investigated. The parameters of a model of the energy spectrum of charge carriers in electron-irradiated n-type Pb_1−x Sn_xTe (x=0.22) have been determined on the basis of the experimental data obtained. Fiz. Tekh. Poluprovodn. 31, 1021–1023 (August 1997)     

Growth and characterization of GaSb bulk crystals with low acceptor concentration

GaSb bulk single crystals with low acceptor concentration were grown from a bismuth solution by the traveling heater method. The result is isoelectronic doping by Bi which gives a variation of the opto-electronic properties as a function of grown length as well as a pronounced microscopic segregation. Photoluminescence spectra at 4K show a decrease of the natural acceptor during growth, which is confirmed by Hall measurements. The electrical properties of this isoelectronic doped GaSb are hole concentrations and mobilities of N_A − N_D = 1.7 × 10¹⁶ cm⁻³ and μ = 870 cm²Vs at room temperature and N_A-N_D = 1 × 10¹⁶ cm⁻³ and μ = 4900 cm²/Vs at 77K, respectively. The lowest p-type carrier concentration measured at 300K is N_A − N_D = 3.3 × 10¹⁵ cm⁻³     

Electrodeposition and Thermoelectric Characteristics of Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript> and Sb<Subscript>2</Subscript>Te<Subscript>3</Subscript> Films for Thermopile Sensor Applications

A thermopile sensor was processed on a glass substrate by electrodeposition of n-type bismuth telluride (Bi-Te) and p-type antimony telluride (Sb-Te) films. The n-type Bi-Te film electrodeposited at −50 mV in a 50 mM electrolyte with a Bi/(Bi + Te) mole ratio of 0.5 exhibited a Seebeck coefficient of −51.6 μV/K and a power factor of 7.1 × 10⁻⁴ W/K² · m. The p-type Sb-Te film electroplated at 20 mV in a 70 mM solution with an Sb/(Sb + Te) mole ratio of 0.9 exhibited a Seebeck coefficient of 52.1 μV/K and a power factor of 1.7 × 10⁻⁴ W/K² · m. A thermopile sensor composed of 196 pairs of the p-type Sb-Te and the n-type Bi-Te thin-film legs exhibited sensitivity of 7.3 mV/K.     

P-type carbon doping of GaSb

The growth of carbon-doped GaSb by MOVPE has never been reported to our knowledge, despite increasing interest in carbon-doped GaAsSb alloys for heterojunction bipolar transistor applications. In this work, we report the use of carbon tetrachloride (CCl₄) in conjunction with triethylgallium (TEGa) and trimethylantimony (TMSb) to achieve p-type doping levels in GaSb from 5 10¹⁶ cm⁻³ to greater than 10¹⁹ cm⁻³. High resolution x-ray diffraction measurements confirm that the effect of carbon on the lattice parameter is significant for hole concentrations above 1 10¹⁹ cm⁻³ as in the case of GaAs. By introducing controlled low doping levels of carbon into thick homoepitaxial samples, we have succeeded in identifying a carbon-related low temperature photoluminescence band at 795 meV, which we ascribe to band-to-acceptor transitions of carbon acceptors. Temperature-dependent Hall measurements on lightly carbon-doped samples yield somewhat lower binding energies than the spectroscopic data due to impurity banding in the acceptor excited states.     

Growth method,composition, and defect structure dependence of mercury diffusion in CdxHg1–xTe

Mercury radiotracer diffusion results are presented, in the range 254 to 452°C, for bulk and epitaxial Cd_xHg_1–xTe, and we believe this to be the first report for metalorganic vapor phase epitaxy (MOVPE) grown Cd_xHg_1–xTe. For all growth types studied, with compositions of x_Cd=0.2±0.04, the variation of the lattice diffusion coefficient, D_Hg, with temperature, under saturated mercury partial pressure, obeyed the equation: D_Hg=3×10⁻³ exp(−1.2 eV/kT) cm² s⁻¹. It was found to have a strong composition dependence but was insensitive to changes of substrate material or crystal orientation. Autoradiography was used to show that mercury also exploited defect structure to diffuse rapidly from the surface. Dislocation diffusion analysis is used to model defect tails in MOVPE Cd_xHg_1–xTe profiles.     

Super-Large Domain Metal-Induced Radially Crystallized Poly-Si Made Using Ni(NO<Subscript>3</Subscript>)<Subscript>2</Subscript>/NH<Subscript>4</Subscript>OH Mixed Solution

By using an aqueous solution of Ni(NO₃)₂/NH₄OH for formation of Ni media on a-Si, disk-like super-large domain metal-induced radially crystallized (S-MIRC) poly-Si was prepared. The process requires no buffer layer deposition on a-Si. The prepared S-MIRC poly-Si has an average domain size of up to 60 μm, highest hole Hall mobility of 27.1 cm² V⁻¹ s⁻¹, and highest electron Hall mobility of 45.6 cm² V⁻¹ s⁻¹. Poly-Si TFT made on super-large-domain S-MIRC poly-Si had high mobility of ~105.8 cm² V⁻¹ s⁻¹, steep sub-threshold slope of ~1.0 V decade⁻¹, high on/off state current ratio of >10⁷ and low threshold voltage of ~ −6.9 V. A simultaneous Ni-collected and induced crystallization model is proposed to explain the growth kinetics of S-MIRC poly-Si.     

Electrophysical properties of solid solutions of silver in PbTe

The thermopower coefficient α₀ and the electrical conductivity σ of Pb_{1 − x} Ag _x Te solid solutions, where x = (0–0.007), are measured at T = 300 K. The hole concentration p is calculated. All samples are of the p type. With increasing silver content, α₀ decreases, while p and σ increase. For undoped crystals, α₀ = 251.0 μV/K, p = 1.1 × 10¹⁸ cm⁻³, and σ = 165 Ω⁻¹ cm⁻¹. At the silver-solubility limit for x = 0.007, α₀ = 193.8 μV/K, p = 2.3 × 10¹⁸ cm⁻³, and σ = 216 Ω⁻¹ cm⁻¹. The hole concentration in all samples is much lower than the concentration of introduced silver atoms. The hole gas in Pb_{1 − x} Ag _x Te solid solutions is weakly degenerate in the entire silver-concentration range.     

Solid-State Synthesis of Te-Doped Mg<Subscript>2</Subscript>Si

Te-doped Mg₂Si (Mg₂Si:Te _m , m = 0, 0.01, 0.02, 0.03, 0.05) alloys were synthesized by a solid-state reaction and mechanical alloying. The electronic transport properties (Hall coefficient, carrier concentration, and mobility) and thermoelectric properties (Seebeck coefficient, electrical conductivity, thermal conductivity, and figure of merit) were examined. Mg₂Si was synthesized successfully by a solid-state reaction at 673 K for 6 h, and Te-doped Mg₂Si powders were obtained by mechanical alloying for 24 h. The alloys were fully consolidated by hot-pressing at 1073 K for 1 h. All the Mg₂Si:Te _m samples showed n-type conduction, indicating that the electrical conduction is due mainly to electrons. The electrical conductivity increased and the absolute value of the Seebeck coefficient decreased with increasing Te content, because Te doping increased the electron concentration considerably from 10¹⁶ cm⁻³ to 10¹⁸ cm⁻³. The thermal conductivity did not change significantly on Te doping, due to the much larger contribution of lattice thermal conductivity over the electronic thermal conductivity. Thermal conduction in Te-doped Mg₂Si was due primarily to lattice vibrations (phonons). The thermoelectric figure of merit of intrinsic Mg₂Si was improved by Te doping.     

Pb<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>Sn<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Te Alloys: Application Considerations

The search for alternative energy sources is at the forefront of applied research. In this context, thermoelectricity, i.e., direct conversion of thermal into electrical energy, plays an important role, particularly for exploitation of waste heat. Materials for such applications should exhibit thermoelectric potential and mechanical stability. PbTe-based compounds include well-known n-type and p-type compounds for thermoelectric applications in the 50°C to 600°C temperature range. This paper is concerned with the mechanical and transport properties of p-type Pb_0.5Sn_0.5Te:Te and PbTe<Na> samples, both of which have a hole concentration of ∼1 × 10²⁰ cm⁻³. The ZT values of PbTe<Na> were found to be higher than those of Pb_0.5Sn_0.5Te:Te, and they exhibited a maximal value of 0.8 compared with 0.5 for Pb_0.5Sn_0.5Te:Te at 450°C. However, the microhardness value of 49 H_V found for Pb_0.5Sn_0.5Te:Te was closer to that of the mechanically stable n-type PbTe (30 H_V) than to that of PbTe<Na> (71 H_V). Thus, although lower ZT values were obtained, from a mechanical point of view Pb_0.5Sn_0.5Te:Te is preferable over PbTe<Na> for practical applications.     

Growth of high-quality GaSb by metalorganic vapor phase epitaxy

The growth of nominally undoped GaSb layers by atmospheric pressure metalorganic vapor phase epitaxy on GaSb and GaAs substrates is studied. Trimethylgallium and trimethylantimony are used as precursors for the growth at 600°C in a horizontal reactor. The effect of carrier gas flow, V/III-ratio, and trimethylgallium partial pressure on surface morphology, electrical properties and photoluminescence is investigated. The optimum values for the growth parameters are established. The carrier gas flow is shown to have a significant effect on the surface morphology. The optimum growth rate is found to be 3–8 μm/ h, which is higher than previously reported. The 2.5 μm thick GaSb layers on GaAs are p-type, having at optimized growth conditions room-temperature hole mobility and hole concentration of 800 cm² V⁻¹ s⁻¹ and 3·10¹⁶ cm^-3, respectively. The homoepitaxial GaSb layer grown with the same parameters has mirror-like surface and the photoluminescence spectrum is dominated by strong excitonic lines.     

Lpe growth of Hgl−xCdxTe using conventional slider boat and effects of annealing on properties of the epilayers

The epitaxial layers of Hg_1−xCd_xTe (0.17≦×≦0.3) were grown by liquid phase epitaxy on CdTe (111)A substrates using a conventional slider boat in the open tube H₂ flow system. The as-grown layers have hole concentrations in the 10¹⁷− 10¹⁸ cm⁻³ range and Hall mobilities in the 100−500 cm²/Vs range for the x=0.2 layers. The surfaces of the layers are mirror-like and EMPA data of the layers show sharp compositional transition at the interface between the epitaxial layer and the substrate. The effects of annealing in Hg over-pressure on the properties of the as-grown layers were also investigated in the temperature range of 250−400 °C. By annealing at the temperature of 400 °C, a compositional change near the interface is observed. Contrary to this, without apparent compositional change, well-behaved n-type layers are obtained by annealing in the 250−300 °C temperature range. Sequential growth of double heterostructure, Hg_l−xCd_xTe/Hg_l−yCd_yTe on a CdTe (111)A substrate was also demonstrated.     

Planar p-on-n HgCdTe FPAs by Arsenic Ion Implantation

This paper reviews recent developments in the characterization of planar p-on-n photodiodes fabricated from long- and mid-wavelength Hg_1−x Cd _x Te at␣the Electronics and Information Technology Laboratory (LETI). The Hg_1−x Cd _x Te epitaxial layers were grown by both liquid-phase and molecular-beam epitaxy. Planar p-on-n photodiodes were fabricated by arsenic implantation into an indium-doped Hg_1−x Cd _x Te base layer. Electro-optical characterization on these p-on-n photodiodes showed low leakage currents (shunt resistance > 10 GΩ) and mean R ₀ A values comparable to the state of the art, i.e., equal to 5000 Ω cm² at λ _c = 9.3 μm (λ _c: cutoff wavelength). Results of focal-plane arrays operating in both the long-wavelength infrared (IR) and middle-wavelength IR bands are reported, with noise equivalent delta temperature and responsivity values at λ _c = 9.3 μm in excess of 99.64%. These results demonstrate the viability and technological maturity of both material growth and device processing.     

Component Overpressure Growth and Characterization of High-Resistivity CdTe Crystals for Radiation Detectors

Spectrometer-grade CdTe single crystals with resistivities higher than 10⁹ Ω cm have been grown by the modified Bridgman method using zone-refined precursor materials (Cd and Te) under a Cd overpressure. The grown CdTe crystals had good charge-transport properties (μτ _e = 2 × 10⁻³ cm² V⁻¹, μτ _h = 8 × 10⁻⁵ cm² V⁻¹) and significantly reduced Te precipitates compared with crystals grown without Cd overpressure. The crystal growth conditions for the Bridgman system were optimized by computer modeling and simulation, using modified MASTRAPP program, and applied to crystal diameters of 14 mm (0.55′′), 38 mm (1.5′′), and 76 mm (3′′). Details of the CdTe crystal growth operation, structural, electrical, and optical characterization measurements, detector fabrication, and testing using ²⁴¹Am (60 keV) and ¹³⁷Cs (662 keV) sources are presented.     

MBE growth and characterization of in situ arsenic doped HgCdTe

We report the results of in situ arsenic doping by molecular beam epitaxy using an elemental arsenic source. Single Hg_1−xCd_xTe layers of x ∼0.3 were grown at a lower growth temperature of 175°C to increase the arsenic incorporation into the layers. Layers grown at 175°C have shown typical etch pit densities of 2E6 with achievable densities as low as 7E4cm⁻². Void defect densities can routinely be achieved at levels below 1000 cm⁻². Double crystal x-ray diffraction rocking curves exhibit typical full width at half-maximum values of 23 arcsec indicating high structural quality. Arsenic incorporation into the HgCdTe layers was confirmed using secondary ion mass spectrometry. Isothermal annealing of HgCdTe:As layers at temperatures of either 436 or 300°C results in activation of the arsenic at concentrations ranging from 2E16 to 2E18 cm⁻³. Theoretical fits to variable temperature Hall measurements indicate that layers are not compensated, with near 100% activation after isothermal anneals at 436 or 300°C. Arsenic activation energies and 77K minority carrier lifetime measurements are consistent with published literature values. SIMS analyses of annealed arsenic doping profiles confirm a low arsenic diffusion coefficient.     

MOVPE growth of InPSb/InAs heterostructures for mid-infrared emitters

We investigated the growth of InPSb on GaSb or InAs by low pressure (20 mbar) metalorganic vapor phase epitaxy (MOVPE). Trimethylindium, triethylantimony, and phosphine were used as starting materials. High resolution x-ray diffraction, photoluminescence at 10K, Hall measurements at 300 and 77K as well as scanning electron microscopy and scanning tunneling electron microscopy investigations were carried out to verify the layer properties. Lattice-matched InPSb layers on InAs substrate grown at 520°C show mirror-like surfaces and sharp x-ray peaks. N-type doping of InP_0.69Sb_0.31 was carried out with H₂S and p-type doping was achieved with DEZn. Maximum electron concentrations of 2×10¹⁹ cm⁻³ and hole concentrations exceeding 10¹⁸ cm⁻³ were obtained after annealing in N₂ ambient. The thermal stability of InPSb was studied during annealing experiments carried out at 500°C up to 30 min. The compositional integrity of the lattice proves to be stable and the InAs/InPSb interface can be improved. Multiple quantum well structures, pn-junction diodes and the two-dimensional electron gas at the InPSb/InAs/InPSb quantum wells were investigated to demonstrate the properties of the material.