Hg在As激活退火中的作用

对原位As4掺杂MBEHgCdTe材料退火前后的电学性质进行了研究.原生样品以及N型退火样品的测试结果显示,随着As掺杂进入HgCdTe的同时,样品中产生了额外的Hg空位,并且在样品中引进了一种N型深能级结构.不同Hg分压下的激活退火结果显示,高温汞压下退火可以获得P型MBE HgCdTe材料.但是,真空退火结果显示As很难被激活.说明在激活退火过程中As在各个格点之间转移时,外界的Hg起重要作用.     

分子束外延P-on-N HgCdTe As扩散调控研究

对分子束外延（MBE）生长的原位As掺杂HgCdTe外延材料的热退火造成的As扩散控制进行研究。在较低的退火温度下获得了As扩散长度可控的HgCdTe材料,易于形成符合设计参数的PN结轮廓,为后续新型焦平面器件的研发提供基础。研究发现,在热退火过程中,原位As掺杂HgCdTe的As浓度的大小和纵向分布随着不同的Hg分压而发生改变。并通过理论计算获得了不同Hg分压下的As扩散系数。同时,通过数值模拟对不同As扩散长度的P-on-N器件结构进行了暗电流模拟,验证了As掺杂结深推进工艺的重要性。     

碲镉汞As掺杂技术研究

对于MBE原位掺杂,HgCdTe的N型掺杂比较容易,而P型掺杂相对来说难度比较大。作为掺杂杂质的As表现出两性掺杂行为,在富Te的条件下生长,As有很大的几率进入到阳离子位置处。而As必须进入Te位才能参与导电,表现为P型。因此,采取了多种方法,现已获得10^16-10^18坤cm^-3掺杂水平的P型材料。在成功实现As的掺杂后,研究人员对激活退火做了一些研究。研究发现,需要在汞压下经过高温退火,As原子才能占据Te位成为受主杂质。对As在碲镉汞中的扩散系数也进行了研究。     

分子束外延锗基碲镉汞薄膜原位砷掺杂研究

报道了基于Ge衬底分子束外延碲镉汞原位As掺杂材料的研究结果,进行了As掺杂碲镉汞薄膜生长的温度控制研究;分析了As束流对材料晶体质量的影响,结合SIMS测试技术得到了As杂质掺杂浓度与束源炉加热温度的关系;并利用傅里叶红外光谱仪、X射线双晶衍射、EPD检测等手段对晶体质量进行了分析表征,结果显示利用MBE方法可以生长出晶体质量良好、缺陷密度低的碲镉汞薄膜;进一步研究了As杂质的激活退火工艺及不同退火条件对材料电学参数的影响。     

As掺杂碲镉汞富碲液相外延材料特性的研究

对富碲液相外延As掺杂碲镉汞(HgCdTe)材料的研究发现,其电学性能存在着不稳定性,材料霍尔参数的实验数据与均匀材料的理论计算结果也不能很好的吻合.通过采用剥层变温霍尔测量和二次离子质谱(SIMS)测试对材料纵向均匀性进行检测的结果显示,外延材料中的As在高温富汞激活退火过程中具有向材料表面扩散的效应,导致在表面形成了高于主体层浓度1～2个量级的高浓度表面层,并导致了AsTe受主的浓度在HgCdTe薄膜中呈非均匀分布.考虑这一效应并采用双层模型的霍尔参数计算方法后,As掺杂HgCdTe液相外延材料的电学行为得到了较好的解释,并较为准确地获得了退火后材料表面层与主体层的受主浓度及受主能级等电学参数.     

液相外延碲镉汞中砷离子注入与激活表征研究

As在HgCdTe材料中具有较小的扩散系数,可以形成较为稳定的结构,广泛应用于HgCdTe的p型掺杂。在p-on-n型碲镉汞红外探测器的制备中As掺杂是重要的制备方法。针对在制备过程中存在无法精确测量As激活率的问题,提出采用低温弱p型退火辅助差分霍尔测试的方法,获得了载流子浓度分布,从而通过与SIMS测试结果对比得到长、中波液相外延HgCdTe样品中As的激活率,并分析了退火等工艺对As掺杂后激活率的影响。     

分子束外延中波红外碲镉汞原位p-on-n技术研究

研究分析了采用MBE技术外延中波碲镉汞薄膜原位p-on-n材料生长结构及掺杂浓度。掌握了MBE碲镉汞原位p-on-n薄膜材料的生长温度、掺杂浓度和p-n结界面的控制技术,研究了原位p-on-n材料杂质的电学激活退火技术。利用傅里叶变换红外透过测试拟合得到了材料的组分、厚度均匀性,利用X-ray双晶衍射测试结果分析了晶体质量,并统计了材料的EPD值。利用SIMS测试分析了材料中杂质分布状况和浓度,对台面器件I-V特性曲线进行了测试分析。     

碲镉汞p^＋-on-n长波异质结探测器的研究

报道了HgCdTe p^ -on-o长波异质结焦平面器件的研究结果．采用由分子柬外延(MBE)和原位掺杂技术生长的P^ -on-n异质结材料，通过湿法腐蚀、台面钝化、台面金属化、铟柱制备和互连等工艺，得到了HgCdTe p^ -on-o长波异质结焦平面器件．根据，I-V实验结果和暗电流理论，拟合计算和分析了各种暗电流机制对器件性能的影响．且获得了器件的响应光谱和探测率。     

长波碲镉汞材料As掺杂激活研究

利用离子注入工艺实现长波碲镉汞材料的As掺杂,As作为掺杂介质表现出两性掺杂行为,而As只有占据Te位成为受主才能形成P型碲镉汞材料。通过对砷掺杂碲镉汞材料在汞气氛中进行退火,分析注入退火引起的样品电学性质的变化,对砷激活退火采用的汞压、温度及时间进行了研究,利用霍尔测试和二次离子质谱仪(SIMS)等手段分析激活效果,研究发现,高温富汞热退火可以实现碲镉汞As激活。     

分子束外延CdTe（211）B／Si复合衬底材料

报道了用MBE的方法，在3英寸Si衬底上制备ZnTe／CdTe（211）B复合衬底材料的初步研究结果，该研究结果将能够直接应用于大面积Si基HgCdTe IRFPA材料的生长．经过Si（211）衬底低温表面处理、ZnTe低温成核、高温退火、高温ZnTe、CdTe层的生长研究，用MBE方法成功地获得了3英寸Si基ZnTe／CdTe（211）B复合衬底材料．CdTe厚度大于10μm，XRD FWHM平均值为120arc sec，最好达到100arc sec，无（133）孪晶和其他多晶晶向．     

Low-temperature activation of As in Hg<Subscript>1−x</Subscript>Cd<Subscript>x</Subscript>Te(211) grown on Si by molecular beam epitaxy

The HgCdTe infrared detectors and test structures based on dual or multicolor HgCdTe are desirable for various applications. It is important to control both p-and n-type extrinsic doping in these photovoltaic structures. This paper addresses the issue of activating arsenic as a p-type dopant at temperatures sufficiently low that they will not compromise the integrity of p-n junctions. Midwavelength infrared (MWIR) HgCdTe epilayers were grown by molecular beam epitaxy (MBE) using an In-free type of mounting. The doping was performed by coevaporating arsenic from an elemental solid source during the growth. During postgrowth treatments, we employed a two-step annealing process. During both steps, we used temperatures (300°C, 275°C, and 250°C) that are well below the current standard annealing temperatures. The results suggest that the energy barrier for As transfer from Hg to Te sites can be overcome at 250°C; hence, p doping can be achieved at the temperature of 250°C. The temperature-dependent Hall effect characteristics of the grown samples were measured by the van der Pauw technique with magnetic fields up to 0.4 T.     

As在HgCdTe外延层中的扩散系数

使用二次离子质谱分析(SIMS)方法研究了As在碲镉汞分子柬外延样品中的扩散系数．获得了在240℃．380℃和440℃温度下As在碲镉汞材料中的扩散系数,并发现它与退火过程中Hg的分压有关,且Hg空位对As的扩散有明显的辅助增强作用．研究表明在低温段的240℃／24—48小时的退火中As的扩散非常有限,对样品中As的浓度分布影响不大,而在高温段380℃／16小时和440℃／30分钟退火中,As扩散较为明显,能使原来的PN突变结变缓．综合比较As杂质的电学激活以及As扩散因素,高温段440℃／30分钟的退火条件较理想．     

多层HgCdTe异质外延材料的热退火应力分析

前期研究采用高温热处理方法,获得了抑制位错的最佳退火条件.通过比对实验,发现不同衬底上HgCdTe表面的CdTe钝化层在热处理过程中对位错的抑制作用各有不同.结合晶格失配应力和热应力对不同异质结构进行理论计算,借助X射线摇摆曲线的倒易空间分析,解释了CdTe钝化层对HgCdTe位错抑制的影响作用.     

MBE生长碲镉汞的砷掺入与激活

采用As掺杂和激活技术制备的p+-on-n异质结材料是获得高性能长波碲镉汞红外焦平面器件的关键技术之一,得到了广泛关注.采用变温IV拟合的方法,对不同As掺入浓度与器件结性能相关性进行了分析,发现降低结区内As掺杂浓度可以有效抑制器件的陷阱辅助隧穿电流.拟合结果表明,较高浓度的Nt很可能与高浓度As掺入相关.因此As的稳定均匀掺入和激活被认为是主要技术挑战.实验研究了分子束外延过程中Hg/Te束流比与As掺入效率的关系,发现相对富Hg的外延条件有助于提高As掺杂效率.研究还发现As的晶圆内掺杂均匀性与Hg/Te束流比的均匀性密切相关.对As的激活退火进行了研究,发现在饱和Hg蒸汽压中采用300℃/16h+420℃/1 h+240℃/48 h的退火条件能明显提升碲镉汞中As原子的激活率.     

Correlation of arsenic incorporation and its electrical activation in MBE HgCdTe

The behavior of arsenic for p-type doping of MBE HgCdTe layers has been studied for various annealing temperatures and arsenic doping concentrations. We have demonstrated that arsenic is in-situ incorporated into HgCdTe layers during MBE growth. The carrier concentration has been measured by the Van der Pauw technique, and the total arsenic concentration has been determined by secondary ion mass spectroscopy. After annealing at 250°C under an Hg over pressure, As-doped HgCdTe layers show highly compensated n-type properties and the carrier concentration is approximately constant (∼mid 10¹⁵ cm⁻³) until the total arsenic concentration in the HgCdTe layers approach mid 10¹⁷ cm⁻³. The source of n-type behavior does not appear to be associated with arsenic dopants, such as arsenic atoms occupying Hg vacancy sites, but rather unidentified structural defects acting as donors. When the total arsenic concentration is above mid 10¹⁷ cm⁻³, the carrier concentration shows a dependence on the arsenic concentration while remaining n-type. We conjecture that the increase in n-type behavior may be due to donor arsenic tetramers or donor tetramer clusters. Above a total arsenic concentration of 1∼2×10¹⁸ cm⁻³, after annealing at 300°C, the arsenic acceptor activation ratio rapidly decreases below 100% with increasing arsenic concentration and is smaller than that after annealing at 450°C. The electrically inactive arsenic is inferred to be in the form of neutral arsenic tetramer clusters incorporated during the MBE growth. Annealing at 450°C appears to supply enough thermal energy to break some of the bonds of neutral arsenic tetramer clusters so that the separated arsenic atoms could occupy Te sites and behave as acceptors. However, the number of arsenic atoms on Te sites is saturated at ∼2×10¹⁸ cm⁻³, possibly due to a limitation of its solid solubility in HgCdTe.     

P-Type doping with arsenic in (211)B HgCdTe grown by MBE

Arsenic incorporation and doping in HgCdTe layers grown by molecular beam epitaxy (MBE) were examined in this paper. Arsenic incorporation into MBE-HgCdTe was carried out in two different ways: (1)ex-situ arsenic ion-implantation on indium-doped n-type HgCdTe layers, and (2) through a new approach called arsenic planar doping. We report onex-situ arsenic diffusion on indiumdoped MBE-HgCdTe layers at 450°C. In the investigated layers, arsenic redistribution occurs with a multi-component character. We obtained a diffusion coefficient of D_As = (1-3) × 10⁻¹³ cm²/s at 450°C. Results of differential Hall and fabricated p-n junctions suggest that during high temperature annealing, arsenic preferentially substitutes into Te sublattices and acts as acceptor impurities. In the second case, arsenic has been successfully incorporated during the MBE growth as an acceptor in the planar doping approach. Withoutex-situ annealing, as-grown layers show up to 50% activation of arsenic during the growth. These results are very promising forin-situ fabrication of infrared devices using HgCdTe material.     

Mode of arsenic incorporation in HgCdTe grown by MBE

The results of arsenic incorporation in HgCdTe layers grown by molecular beam epitaxy (MBE) are reported. Obtained results indicate that arsenic was successfully incorporated as acceptors in MBE-HgCdTe layers after a low temperature anneal. Secondary ion mass spectrometry and Hall effect measurements confirm that arsenic is incorporated with an activation yield of up to 100%. This work confirms that arsenic can be used as an effective dopant of MBE-HgCdTe after a low temperature annealing under Hg-saturated conditions.     

Annealing effect on the P-type carrier concentration in low-temperature processed arsenic-doped HgCdTe

We report the results of annealing effects on the As-doped alloy HgCdTe grown by molecular beam epitaxy (MBE), arsenic (As) diffusion in HgCdTe from Hg-rich solutions at low temperatures, and As ion implantation at room temperature. Hall-effect measurements, secondary ion mass spectrometry and p-on-n test photodiodes were used to characterize the As activation. High As-doping levels (10¹⁷−10¹⁹ cm⁻³) could be obtained using either MBE growth, As diffusion or As ion-implantation. Annealed below 400°C, As doping in HgCdTe shows n-type characteristics, but above 410°C demonstrates that all methods of As doping exhibit p-type characteristics independent of As incorporation techniques. For example, for samples annealed at 436°C (P_Hg≈2 atm), in addition to p-type activation, we observe a significant improvement of p/n junction characteristics independent of the As source; i.e. As doping either in situ, by diffusion, or ion implantation. A study of this As activation of As-doped MBE HgCdTe as a function of anneal temperature reveals a striking similarity to results observed for As diffusion into HgCdTe and implanted As activation as a function of temperature. The observed dependence of As activation on partial pressure of Hg at various temperatures in the range of 250 to 450°C suggests that As acts as an acceptor at high Hg pressure (>1 atm) and as a donor at low Hg pressure (<1 atm) even under Hg-rich conditions.