氮气反应溅射制备软X射线Co/Ti多层膜

针对"水窗"波段(280~540eV)对多层膜反射镜的应用需求,在Ti的L吸收边(452.5eV)附近,优化设计了Co/Ti多层膜的膜系结构。计算了不同界面粗糙度条件下的反射率,结果显示,界面粗糙度对多层膜反射率有较大影响。采用直流磁控溅射方法在超光滑硅基片上制备了Co/Ti多层膜,通过将氮气引入原有的溅射气体氩气中作为反应气体,明显减小了制备的多层膜的界面粗糙度。利用X射线掠入射反射实验和透射电子显微镜测试了多层膜结构,并在北京同步辐射装置(BSRF)3W1B实验站测量了不同氮气浓度下多层膜的反射率。结果显示,氮气含量为5%的溅射气体制备的多层膜样品反射率最高,即将纯氩气溅射制备得到的反射率9.5%提高到了12.0%。得到的结果表明,将氮气加入反应溅射气体可以有效改善Co/Ti多层膜的性能。     

沉积温度对磁控溅射Ti/TiN多层膜光学和电学性能的影响

采用直流反应磁控溅射法于不同温度下在Si(111)基底上制备了Ti/TiN多层膜,采用X射线衍射仪和原子力显微镜对膜的物相和表面形貌进行了分析,研究了沉积温度对膜结构及其光学、电学性能的影响。结果表明:不同沉积温度下制备的Ti/TiN多层膜均由钛和TiN相组成,多层膜与单层TiN膜一样,其表面粗糙度随沉积温度的升高而减小,电阻率随沉积温度的升高显著降低;其表面形貌则比单层膜更加致密和均匀;多层膜红外反射率与其电阻率有关,当电阻率减小时,红外反射率增大。     

氮气反应溅射制备Co/Sb多层膜研究

针对"水窗"波段(280~540eV)对多层膜反射镜的应用需求,在Sb的M5吸收边(525.5eV)附近,选择Co和Sb作为该能点的多层膜材料组合,优化设计膜系结构。采用直流磁控溅射方法制备了Co/Sb多层膜,通过在溅射气体氩气中引入氮气作为反应气体,多层膜界面粗糙度明显减小。利用X射线掠入射反射(GIXRR)测试多层膜结构,并在北京BSRF同步辐射3W1B实验站测量了反应溅射前后的多层膜反射率(SXR),结果表明:氮气含量为25%时的界面粗糙度最小,反射率从无反应溅射的7.2%提高到11.7%。     

非极化中子超镜用NiC薄膜制作技术研究

NiC/Ti中子超镜是一种高性能的中子多层膜光学元件,NiC纳米薄膜的制作是实现NiC/Ti多层膜的关键技术。基于Ni和C的直流磁控溅射方法,提出了一种NiC联合溅射靶材的实现方法,并制作了NiC单层膜样品。X射线光电子能谱的测量结果表明:用联合溅射靶材制作的NiC薄膜中Ni和C的原子数比与理论预期相吻合;基于X射线光电子能谱测试得到的Ni、C原子数比,通过构建Ni_(86)C_(14)的模型,可以很好地对掠入射X射线反射测试结果进行理论拟合。该研究可为进一步开展NiC/Ti中子超镜的制作提供参考。     

Si含量对TaN/TiSiN纳米多层膜结构和性能的影响

采用磁控溅射技术在304不锈钢和硬质合金刀片上交替沉积TaN、TiSiN层,制备不同Si含量的TaN/TiSiN纳米多层膜.通过X射线衍射仪、扫描电子显微镜、纳米压痕仪、原子力显微镜和摩擦磨损试验机等仪器的测试结果来表征其微观结构、硬度、表面粗糙度及摩擦学等性能.不同Si含量的TaN/TiSiN纳米多层膜均在(200)晶面呈现择优取向,并且衍射峰随着Si含量的增加向右偏移,当Si含量为10％时,衍射峰的偏移量最大.随着Si含量的增加,TaN/TiSiN纳米多层膜的硬度先升高后降低,当Si含量为10％时,硬度最大,达到25.8 GPa.表面粗糙度值随着Si含量的增加先减小后增大,随后又减小,当Si含量为15％时,TaN/TiSiN纳米多层膜的表面最光滑,表面粗糙度值最小,为Ra 2.34 nm.摩擦系数和主切削力均随着Si含量的增加先减小后增大,当Si含量为15％时,摩擦系数最小,耐磨性能最好,主切削力最小;研究结果表明,掺入适量的Si元素可以有效地提高TaN/TiSiN纳米多层膜的硬度、耐磨性能和切削性能.     

Si含量对TaN/TiSiN纳米多层膜结构和性能的影响

采用磁控溅射技术在304不锈钢和硬质合金刀片上交替沉积TaN、TiSiN层,制备不同Si含量的TaN/TiSiN纳米多层膜.通过X射线衍射仪、扫描电子显微镜、纳米压痕仪、原子力显微镜和摩擦磨损试验机等仪器的测试结果来表征其微观结构、硬度、表面粗糙度及摩擦学等性能.不同Si含量的TaN/TiSiN纳米多层膜均在(200)晶面呈现择优取向,并且衍射峰随着Si含量的增加向右偏移,当Si含量为10％时,衍射峰的偏移量最大.随着Si含量的增加,TaN/TiSiN纳米多层膜的硬度先升高后降低,当Si含量为10％时,硬度最大,达到25.8 GPa.表面粗糙度值随着Si含量的增加先减小后增大,随后又减小,当Si含量为15％时,TaN/TiSiN纳米多层膜的表面最光滑,表面粗糙度值最小,为Ra 2.34 nm.摩擦系数和主切削力均随着Si含量的增加先减小后增大,当Si含量为15％时,摩擦系数最小,耐磨性能最好,主切削力最小;研究结果表明,掺入适量的Si元素可以有效地提高TaN/TiSiN纳米多层膜的硬度、耐磨性能和切削性能.     

NiC/Ti中子多层膜的微结构和界面研究

NiC/Ti中子超镜是一种高性能的中子多层膜光学元件,是提升中子导管、聚焦装置等中子光学系统的中子利用率的关键之一。为了提升NiC/Ti中子超镜的性能,本文面向具有不同厚度NiC膜层的NiC/Ti多层膜,分别采用X射线掠入射反射和X射线衍射的方法表征了NiC/Ti多层膜的膜层厚度、界面粗糙度和膜层晶向结构。研究结果表明:随着NiC膜层厚度的增长,除了在较小尺度(≤2.5nm),NiC-on-Ti界面的粗糙度基本保持不变;而Ti-on-NiC界面的粗糙度却呈现出较大的变化。具有不同厚度的NiC膜层的NiC/Ti多层膜的界面粗糙度呈现不对称性的变化,主要原因在于NiC膜层的微结构随着膜层厚度的增长而产生了变化。     

氩气与氮气流量比对磁控溅射法制备TiN薄膜的影响

用直流反应磁控溅射法在Si(100)基底上制备了TiN薄膜,采用X射线衍射仪和原子力显微镜对其结构和形貌进行了表征,利用四探针测试仪测量了TiN薄膜的方块电阻,使用紫外可见分光光度计测定了薄膜反射率;研究了溅射沉积过程中氩气与氮气流量比对TiN薄膜结构及性能的影响.结果表明:在不同氩气与氮气流量比下,所制备薄膜的主要组成相是(200)择优取向的立方相TiN;随着氩气与氮气流量比的增加,薄膜厚度逐渐增大,而表面粗糙度与电阻率先减小后增大;当氩气与氮气流量比为15:1时,薄膜表面粗糙度和电阻率均达到最小值;TiN薄膜的反射率与氩气与氮气流量比的关系不大.     

极紫外多层膜基底表面粗糙度综合表征技术

研究用不同清洗方法对硅基底表面粗糙度的影响,首先使用原子力显微镜(AFM)直接测量硅片表面粗糙度;然后,利用直流磁控溅射方法,在相同制备工艺条件下镀制M o/S i多层膜,使用X射线衍射仪(XRD)对多层膜二级衍射峰进行摇摆曲线扫描;最后,利用同步辐射测量多层膜的反射率,间接表征基底的粗糙度。结果表明,超声清洗后镀制的多层膜反射率最高,结论与AFM,XRD等表征方法一致。     

射频磁控反应溅射法制备Y2O3薄膜的工艺研究

采用射频磁控反应溅射法制备氧化钇(Y2O3)薄膜。系统研究了工艺参数对Y2O3薄膜沉积速率的影响规律,使用X射线光电子能谱仪(XPS)分析表征了薄膜的成分。结果表明,Y2O3薄膜的沉积速率随射频功率的增大而增大,在合适的溅射压强下沉积速率呈现极大值,O2/Ar气体流量比和衬底温度的影响不明显,对此从理论上进行了解释。制备的薄膜中Y和O元素的原子浓度基本符合Y2O3的化学计量比。     

磁控溅射Ni56Mn27Ga17合金薄膜的光学反射特性研究

Ni-Mn-Ga磁性形状记忆合金薄膜是非常有用的多功能材料,为考察其光学反射特性,采用磁控溅射技术在单晶硅衬底上沉积了Ni56Mn27Ga17合金薄膜,并对其表面形貌和光学反射特性进行研究。研究结果表明,薄膜的表面粗糙度随退火温度的升高而增大;在300～800nm波长范围内,薄膜反射率均随波长的减小而降低,且薄膜整体谱线范围内的反射率随退火温度的升高而降低。     

Structural and mechanical properties of (Cr,Ni) N single and gradient layer coatings deposited on mild steel by magnetron sputtering

Ternary single and gradient layer (Cr, Ni) N thin films were deposited on the mild steel substrate by unbalanced magnetron sputtering technique in order to evaluate mechanical properties for machine tools and automotive applications. Microstructure, chemical composition, surface morphology and phase analysis were carried out using field emission scanning electron microscopy, energy dispersive X-ray spectroscopy, atomic force microscopy and X-ray diffraction, respectively. Both single and gradient layer of (Cr, Ni) N coatings show a significant increment in mechanical properties such as hardness, adhesion strength and surface roughness along with the reduction of friction coefficient. Mechanical tests revealed that the hardness of the gradient layer increased up to 3.1 times due to the formation of Cr₂N and Ni phase whereas single layer showed the least friction. Single layer CrNiN layer exhibited 27.2% less surface roughness (R_a) in comparison with gradient layer. High values of surface roughness, hardness, thickness and friction could be correlated with high film-to-substrate adhesion (L_c2) for the gradient layer.     

Ni80Cr20合金薄膜制备影响因素的试验研究

利用直流磁控溅射的方法制备Ni80Cr20合金薄膜,以氩气流量、氩气工作压强、溅射功率作为三因素进行正交试验,在溅射时间相同的条件下分别测试了薄膜厚度、表面粗糙度、电阻率并进行了极差分析。分析结果表明:在一定范围内,氩气工作压强与溅射功率对薄膜厚度的影响较大;在氩气工作压强为3.0Pa时,薄膜厚度与溅射功率近似成正比关系;随着氩气流量的增大,Ni80Cr20薄膜厚度呈现先增大后减小的趋势;在氩气流量为50cm~3/min时,薄膜厚度达到最大值;各因素对薄膜表面粗糙度及电阻率影响不明显。     

ECR结合磁控溅射——制备DLC薄膜的新方法

介绍了新型的结合电子回旋共振(ECR)微波等离子体气相沉积与磁控溅射镀膜特点的ECR-650型镀膜系统,并利用该系统通过溅射石墨靶和金属钛靶在不锈钢基底上制备了具有Ti/TiNx/TiNxCy中间层结构的C薄膜。由于镀膜工艺问题,得到的薄膜主要由石墨构成。研究了制备时不同的气压和氩气分压对薄膜表面形貌、硬度等的影响。     

Assessing Nanotribological Performance and Surface Energies of Inconel-ZrN,Cr-ZrN,Nb-ZrN,and ZrN Thin Films

The nanotribological performance for three groups of metal-ZrN, including Inconel-ZrN, Cr-ZrN, Nb-ZrN, and polycrystalline ZrN thin films has been investigated and results were correlated with surface energy evaluations. Metal-ZrN and ZrN thin films were deposited using direct current (DC) unbalanced magnetron sputtering and their elemental composition was investigated using X-ray photoelectron spectroscopy (XPS). Both nanomechanical and nanotribological properties were evaluated using a triboscope interfaced with an atomic force microscope (AFM) and the surface energies were calculated from the contact angle measurements. The present research reports for the first time on the nanowear behavior, surface roughness, and friction coefficients correlated with surface energies of metal-ZrN and ZrN thin films.

All metal-ZrN thin films showed improved nanotribological performance compared to the polycrystalline ZrN. Results indicate that several of the Inconel-ZrN thin film compositions have both superior nanotribological behavior and good wettability and thus have high potential use for wear resistant applications.     

Analysis of thermal diffusivity of Ti thin film by thermoreflectance and periodic heating technique

Thermal diffusivity of Ti thin film with several hundred nanometers thickness has been measured by means of thermoreflectance (TR) technique and periodic heating using front heating and front detection configuration. Ti thin films were prepared on Si substrates by dc sputtering method. Then thin Mo layers as reflection layers were coated on Ti thin films. Surface of the Mo layer is irradiated by sinusoidally intensity modulated heating laser. Temperature response at the heated area is measured by a probe laser beam with constant intensity, as a TR signal. Phase lag between the phase of TR signal and that of heating laser beam was obtained from 100 kHz to 2.6 MHz. To analyze thermal diffusivity of Ti thin films using the phase lag data, we developed a three-layer analytical model such as Mo coating (100 nm)∕thin film∕semi-infinite substrate. The calculated phase lag using analytical model is in good agreement with the experimental data for the whole frequency range. The thermal diffusivity of two Ti thin films is determined to be 5 × 10(-6) m(2)∕s, which is 53% of the bulk one.     

Surface characteristics and tribology study of metal oxide thin films

Abstract

Microcrystalline high quality undoped ZnO thin films were deposited on Si(100) and Corning 1737F glass substrates by a dc magnetron sputtering system. Surface and mechanical properties of ZnO thin films deposited under different deposition conditions (thickness, deposition rate and plasma composition) were investigated. Atomic force microscopy, nanoindentation techniques and scratch tests have been carried out. The lateral grain radius was between 50 and 160 nm. Surface roughness was found to vary from 1·3 to 10·3. In order to measure the real hardness of ZnO thin films grown on Si(100) and glass Continuous Stiffness Measurement technique was used. The hardness was found to be between 11 and 13 GPa for the polycrystalline ZnO almost five times larger than for the corresponding single crystalline material, while scratch tests verified a film structure, thickness, and surface morphology dependency on the mechanical properties for these metal oxide thin films.     

Fractal characteristics and microstructure evolution of magnetron sputtering Cu thin films

How to describe surface morphology characteristic and microstructure evolution are the hottest researches of current thin film researches.But in traditional characterization of surface morphology,the roughness parameters are scale related.And the microstructure evolution of thin film during post-treatment is usually not considered in detail.To give a better understanding of the roughness of thin films topography,fractal method is carried out.In addition,microstructure evolution of thin films is analyzed based on the crystallography and energy theory.Cu thin films are deposited on Si(100) substrates by magnetron sputtering,and then annealed at different temperatures.Surface topography is characterized by atomic force microscope(AFM).Triangular prism surface area(TPSA) algorithm is used to calculate the fractal dimension of the AFM images.Apparent scale effect exists between the surface morphology roughness and film thickness.Relationship between the fractal dimension and roughness is analyzed by linear regression method and linear relationship exists between fractal dimension and surface roughness root mean square(RMS).Fractal dimension can be characterized as a scale independence parameter to represent the complex degree and roughness level of surface.With the increase of annealing temperature,surface roughness and fractal dimension decrease.But when the annealing temperature exceeds the recrystallization temperature,due to the agglomeration and coalescence of Cu grain,surface roughness and fractal dimension increase.Scale effect and changing regularity of grain growth and shape evolution for different film thickness under different annealing temperatures are analyzed.Based on minimum total free energy,regularity of grain growth and changing is proposed.The proposed research has some theory significance and applicative value of Cu interconnect process and development of MEMS.