Effect of surface encapsulation and As4 overpressure on Si diffusion and impurity-induced layer disordering in GaAs,AlxGa1-xAs,and AlxGa1-xAs-GaAs quantum well heterostructures

Data are presented demonstrating that the surface encapsulant and the As₄ overpressure strongly affect Si diffusion in GaAs and Al_xGa_1-xAs, and thus are important parameters in impurity-induced layer disordering. Increasing As₄ overpressure results in anincrease in diffusion depth in the case of GaAs, and adecrease in diffusion depth for Al_xGa_1-xAs. In addition, the band-edge exciton is observed in absorption on an Al_xGa_1-xAs-GaAs superlattice that is diffused with Si and is converted to bulk crystal Al_yGa_1-yAs via impurity-induced layer disordering. In contrast, the exciton is not observed in absorption on GaAs diffused with Si in spite of the high degree of compensation. These data indicate that the Si diffusion process, and the properties of the diffused material, are different for GaAs and for Al_xGa_1-xAs-GaAs superlattices converted into uniform Al_yGa_1-yAs (0 ≤y ≤x ≤ 1) via impurity-induced layer disordering with the amphoteric dopant Si.     

Comparative study on the influence of Al component at GaAlAs layer for GaAs/AlGaAs photocathode

We designed two transmission-mode GaAs/AlGaAs photocathodes with different AlxGa_1-xAs layers, one has an Al_xGa_1-xAs layer with the Al component ranging from 0.9 to 0, and the other has a fixed Al component 0.7. Using the first-principle method, we calculated the electronic structure and absorption spectrum of Al_xGa_1-xAs at x=0, 0.25, 0.5, 0.75 and 1, calculation results suggest that with the increase of the Al component, the band gap of Al_xGa_1-xAs increases. Then we activated the two samples, and obtained the spectral response curves and quantum efficiency curves; it is found that sample 1 has a better shortwave response and higher quantum efficiency at short wavelengths. Combined with the band structure diagram of the transmission-mode GaAs/AlGaAs photocathode and the fitted performance parameters, we analyze the phenomenon. It is found that the transmission-mode GaAs/AlGaAs photocathode with variable Al component and various doping structure can form a two-stage built-in electric field, which improves the probability of shortwave response photoelectrons escaping to the vacuum. In conclusion, such a structure reduces the influence of back-interface recombination, improves the shortwave response of the transmission-mode photocathode.     

Role of Si-doped Al<Subscript>0.3</Subscript>Ga<Subscript>0.7</Subscript>As layers in the high-frequency conductivity of GaAs/Al<Subscript>0.3</Subscript>Ga<Subscript>0.7</Subscript>As heterostructures under conditions of the quantum hall effect

The complex high-frequency conductivity of GaAs/Al_0.3Ga_0.7As heterostructures that are δ-doped and modulation-doped with silicon was investigated by acoustic methods under conditions of the integer quantum Hall effect. Both the real (σ₁) and imaginary (σ₂) parts of the complex conductivity σ(ω, H)=σ_i?iσ₂ were determined from the dependences of the absorption and velocity of surface acoustic waves on magnetic field. It is shown that, in the heterostructures with electron density n_s=(1.3–7)×10¹¹ cm^?2 and mobility μ=(1–2)×10⁵ cm²/(V s), the high-frequency conductivity near the centers of the Hall plateau is due to electron hopping between localized states. It is established that, with filling numbers 2 and 4, the conductivity of the Al_0.3Ga_0.7As:Si layer efficiently shunts the high-frequency hopping conductivity of the two-dimensional interface layer. A method of separating the contributions of the interface and Al_0.3Ga_0.7As:Si layers to the hopping conductivity σ(ω, H) is developed. The localization length of electrons in the interface layer is determined on the basis of the nearest neighbor hopping model. It is shown that, near the centers of the Hall plateau, both σ(ω, H) and n_s depend on the cooling rate of a GaAs/Al_0.3Ga_0.7As sample. As a result, the sample “remembers” the cooling conditions. Infrared light and static strain also change both σ(ω, H) and n_s. We attribute this behavior to the presence of two-electron defects (so-called DX^? centers) in the Al_0.3Ga_0.7As:Si layer.     

Electrical characteristics of low temperature-Al0.3Ga0.7As

In this work, we present electrical characterizations of n⁺ GaAs/low temperature (LT)-Al_0.3Ga_0.7As/n⁺ GaAs resistor structures in which the LT layers are grown at nominal substrate temperatures of 250 and 300°C. The resistivity and V_tfl parameters of these LT-Al_0.3Ga_0.7As layers are compared with those of LT-GaAs and Al_0.3Ga_0.7As grown at a normal growth temperature of 720°C. Low-temperature Al_0.3Ga_0.7As layers exhibit resistivities as high as 10¹² ohm-cm, nearly four orders of magnitude higher than that of LT-GaAs, and V_tfl values as high as 45 V, over twice that of LT-GaAs. We also find that the LT-Al_0.3Ga_0.7As materials grown at 250 and 300°C appear to show opposite and contradictory trends with respect to resistivity and V_tfl. We propose that this result can be explained by residual hopping conduction in the 250°C material. Temperature dependent conductivity measurements confirm the presence of a hopping mechanism in LT-Al_0.3Ga_0.7As grown at 250°C and yield activation energies of 0.77 and 0.95 eV for LT-GaAs and LT-Al_0.3Ga_0.7As, respectively.     

Characteristics of Si3N4/GaAs metal-lnsulator-semiconductor interfaces with coherent Si/Al0.3Ga0.7As interlayers

Si₃N₄/GaAs metal-insulator-semiconductor (MIS) interfaces with Si(10Å)/ Al_0.3Ga_0.7As (20Å) interface control layers have been characterized using capacitance-voltage (C-V) and conductance methods. The structure was in situ grown by a combination of molecular beam epitaxy and chemical vapor deposition. A density of interface states in the 1.1 × 10¹¹ eV^-1 cm^-2 range near the GaAs midgap as determined by the conductance loss has been attained with an ex situ solid phase annealing of 600°C in N₂ ambient. A dip quasi-static C-V demonstrating the inversion of the minority-carrier verifies the decent interface quality of GaAs MIS interface. The hysteresis and frequency dispersion of the MIS capacitors were lower than 100 mV, some of them as low as 50 mV under a field swing of about ±2 MV/cm. The increase of the conductance loss at higher frequencies was observed when employing the surface potential toward conduction band edge, suggesting the dominance of faster traps. Self-aligned gate depletion mode GaAs metal-insulator-semiconductor field-effect transistors with Si/Al_0.3Ga_0.7As interlayers having 3 μm gate lengths exhibited a transconductance of about 114 mS/mm. The present article reports the first application of pseudomorphic Si/ Al_0.3Ga_0.7As interlayers to ideal GaAs MIS devices and demonstrates a favorable interface stability.     

Abruptp- type doping transitions using bis-(cyclopentadienyl)-magnesium in metal-organic vapor phase epitaxy of GaAs

Extremely abrupt p⁺-n doping transitions have been realized in GaAs and AlGaAs grown by metal-organic vapor phase epitaxy using bis-(cyclopentadienyl)-magnesium (Cp₂Mg) as precursor for the Mg p-dopant. The Mg incorporation was found to depend linearly on the Cp₂Mg concentration, in contrast to reports of a supralinear behaviour. Methods for eliminating reactor memory effects are described. Layers doped to about 1 x 10¹⁹ cm^-3 and as thin as 100 nm at 10% of the peak doping have been grown under conditions compatible with growth of high quality Al_0.3Ga_0.7As. Atomic and carrier profiles of ap-plications for heterostructure bipolar transistor structures are presented.     

Classical magnetoresistance measurements in AlxGa1−xAs/GaAs MODFET structures: Determination of mobilities

Classical magnetoresistance techniques have proven to be quite useful for obtaining mobility profiles in GaAs MESFET structures. Here we extend these techniques to Al_xGa_1−xAs/GaAs MODFET structures, which are more complicated because of multi-band conduction effects. A multi-band geometric-magnetoresistance (GMR) theory is developed in the relaxation-time approximation, and average and differential mobility expressions are defined. The magnetic-field dependences of these quantities permit determination of the mobilities associated with the various conducting bands. We apply this analysis to an Al_0.3Ga_0.7As/GaAs MODFET structure and obtain results for μ₀, the lowest subband mobility, μ_1–3, a combination of higher-subband mobilities, and μ_AlG, the mobility in the heavily doped Al_0.3Ga_0.7As layer. Complicating factors such as finite Hall field, energy-dependent relaxation time, parasitic resistance and gate current are also considered.     

Transferring of GaAs microtips using selective wet etching Al0.7Ga0.3As sacrificial layer

GaAs pyramidal microtips were successfully transferred from GaAs substrate to target wafer by a simple technique, i.e., selective wet etching off AlGaAs sacrificial layer. A GaAs/Al_0.7Ga_0.3As/GaAs sandwich structure is firstly formed on GaAs (0 0 1) substrate by metalorganic chemical vapor deposition, and then GaAs pyramidal microtips are grown on the sandwich structure using selective liquid-phase epitaxy. The GaAs microtips are removed from the sandwich structure by selective wet etching Al_0.7Ga_0.3As layer using concentrated HCl solution. Finally, the tips are glued onto the target wafer by a negative photoresist. During this transfer process the tips are completely encapsulated in a positive photoresist to protect against attack. Scanning electron microscopy images show that GaAs tips can be successfully transferred without any damage by this technique. The achievement reported here represents a significant step towards the application of scanning near-field optical microscopy.     

Effect of silicon on relaxation of the crystal lattice in MOCVD–hydride Al<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Ga<Subscript>1 − <Emphasis Type="Italic">x</Emphasis></Subscript>As:Si/GaAs(100) heterostructures

The X-ray diffraction and infrared spectroscopy data for MOCVD-hydride Al _x Ga_{1 − x} As:Si/GaAs(100) heterostructures and homoepitaxial GaAs:Si/GaAs(100) structures doped with Si to a content of up to ∼1 at % are reported. It is shown that, in the homoepitaxial heterostructures, the formation of alloys with Si yields a decrease in the crystal lattice parameters of the epitaxial layer and a negative lattice mismatch with the single-crystal substrate (Δa < 0). At the same time, the formation of quaternary alloys in the Al _x Ga_{1 − x} As:Si/GaAs(100) heterostructures is not accompanied by any pronounced strains in the crystal lattice. By introducing Si into the epitaxial layers of these heterostructures, it is possible to attain complete matching of crystal lattice parameters of the film and substrate in the appropriately chosen technological conditions of growth of the epitaxial layers.     

Transient current spectroscopy and frequency dispersion studies of low temperature GaAs and Al0.3Ga0.7As metal-insulator-semiconductor diodes

Low temperature (LT)-grown GaAs and Al_0.3Ga_0.7As metal-insulator-n⁺-GaAs (MIN) diodes have been fabricated and their electrical properties analyzed. Studies were carried out to evaluate the interfacial quality of the LT layer and the underlying n⁺-GaAs layer using transient current spectroscopy (TCS) and capacitance-frequency (C-f) characterization. TCS studies on LT-GaAs revealed a high concentration of a continuum of states anda dominant electron trap with an activation energy of 0.52eV. In LT-Al_0.3Ga_0.7As, a shallow trap at 0.36eV and two deep level traps at 0.85eV and 1.12eV were observed. Frequency dispersion was observed to be less for LT-GaAs samples with an AlAs barrier layer than without an AlAs barrier layer. However, LT-Al_0.3Ga_0.7As MIN diodes displayed a smaller frequency dispersion than LT-GaAs MIN diodes. Upon further investigation into MISFET devices, it was found that LT-Al_0.3Ga_0.7As MISFET devices had better transconductance frequency dispersion characteristics than LT-GaAs MISFET devices did.     

Drift velocity of electrons in quantum wells of selectively doped In0.5Ga0.5As/AlxIn1 ? xAs and In0.2Ga0.8As/AlxGa1 ? xAs heterostructures in high electric fields

The field dependence of drift velocity of electrons in quantum wells of selectively doped In_0.5Ga_0.5As/Al _x In_{1 − x} As and In_0.2Ga_0.8As/Al _x Ga_{1 − x} As heterostructures is calculated by the Monte Carlo method. The influence of varying the molar fraction of Al in the composition of the Al _x Ga_{1 − x} As and Al _x In_{1 − x} As barriers of the quantum well on the mobility and drift velocity of electrons in high electric fields is studied. It is shown that the electron mobility rises as the fraction x of Al in the barrier composition is decreased. The maximum mobility in the In_0.5Ga_0.5As/In_0.8Al_0.2As quantum wells exceeds the mobility in a bulk material by a factor of 3. An increase in fraction x of Al in the barrier leads to an increase in the threshold field E _th of intervalley transfer (the Gunn effect). The threshold field is E _th = 16 kV/cm in the In_0.5Ga_0.5As/Al_0.5In_0.5As heterostructures and E _th = 10 kV/cm in the In_0.2Ga_0.8As/Al_0.3Ga_0.7As heterostructures. In the heterostructures with the lowest electron mobility, E _th = 2–3 kV/cm, which is lower than E _th = 4 kV/cm in bulk InGaAs.     

Study of grown-in defects and effect of thermal annealing in Al0.3Ga0.7As and GaAs LPE layers

Studies of the grown-in deep-level defects in the undoped n-Al_xGa_1-xAs (x = 0.3) and GaAs epitaxial layers prepared by the liquid phase epitaxy (LPE) techniques have been made, using DLTS, I-V and C-V measurements. The effect of 300 °C thermal annealing on the grown-in defects was investigated as a function of annealing time. The results showed that significant reduction in these grown-in defects can be achieved via low temperature thermal annealing process. The main electron and hole traps observed in the Al_0.3Ga_0.7As LPE layer were due to the E_c-0.31 eV and E_v+0.18 eV level, respectively, while for the GaAs LPE layer, the electron traps were due to the E_c-0.42 and 0.60 eV levels, and the hole traps were due to E_v+0.40 and 0.71 eV levels. Research supported in part by the Air Force Wright Aeronautical Laboratories, Aeropropulsion Lab., Wright Patterson Air Force Base, Ohio, subcontract through SCEEE, contract F33615-81-C-2011, task-4, and in part by AFOSR grant no. 81-0187.     

Properties of Ge-doped GaAs and Alx Ga1−xAs,Sn-doped Alx Ga1−xAs and Si-Te-doped GaAs

In order to better understand the electrical and optical properties of GaAs and Al_xGa_1-x As used in making double heterojunction lasers, we have studied the Hall coefficient, resistivity and photoluminescence behavior of doped epitaxial samples of these materials. In particular, we report results on Ge-doped GaAs and Al_x Ga_1-x As, Sn-doped Al_xGa_1-x As and Si-Te-doped GaAs single crystal layers which were grown on GaAs substrates by the liquid phase epitaxial method. The effects of impurities in the solution on the carrier concentration, mobility, photoluminescence spectra and possible recombination processes in these layers are discussed.     

Persistent photo-conductance and photoquenching of selectively doped Al0.3Ga0.7As GaAs/heterojunctions

The dependence on photon energy of the persistent photoconductivity (PPC) in selectively doped high mobility Al_0.3Ga_0.7As—GaAs heterostructures has been measured at temperatures below 80 K. A decrease in conductivity due to light exposure at one wavelength after exposure to light at another wavelength — photo-quenching — is also found. It is concluded that deep centers in GaAs and AlGaAs other than the DX center in AlGaAs are mainly responsible for PPC.     

分子束外延生长的GaAs-AlxGa1-xAs多层异质结构中的“精细低维调制条纹”的观察

应用透射式电子显微镜观察了GaAs-Al_xGa_1-xAs多层异质结结构中的“精细低维调制条纹”。在邻近GaAs-Al_xGa_1-xAs超晶格层的缓冲层中和与这缓冲层邻近的GaAs-Al_xGa_1-xAs超晶格层的小区域中发现了等宽度的“精细低维调制条纹”,其宽度为9.1Å的GaAs条纹,12Å的Al_xGa_1-xAs条纹。文中介绍了用显微密度计获得的这些条纹的密度分布结果。同时还给出了GaAs-Al_xGa_1-xAs 多层异质结结构的晶格像和用X射线能量散射谱技术获得的成分定量分析结果。     

Photoluminescence studies of In0.7Al0.3As/In0.75Ga0.25As/In0.7Al0.3As metamorphic heterostructures on GaAs substrates

The influence of the design of the metamorphic buffer of In_0.7Al_0.3As/In_0.75Ga_0.25As metamorphic nanoheterostructures for high-electron-mobility transistors (HEMTs) on their electrical parameters and photoluminescence properties is studied experimentally. The heterostructures are grown by molecular-beam epitaxy on GaAs (100) substrates with linear or step-graded In _x Al_{1 ? x} As metamorphic buffers. For the samples with a linear metamorphic buffer, strain-compensated superlattices or inverse steps are incorporated into the buffer. At photon energies ?ω in the range 0.6–0.8 eV, the photoluminescence spectra of all of the samples are identical and correspond to transitions from the first and second electron subbands to the heavy-hole band in the In_0.75Ga_0.25As/In_0.7Al_0.3As quantum well. It is found that the full width at half-maximum of the corresponding peak is proportional to the two-dimensional electron concentration and the luminescence intensity increases with increasing Hall mobility in the heterostructures. At photon energies ?ω in the range 0.8–1.3 eV corresponding to the recombination of charge carriers in the InAlAs barrier region, some features are observed in the photoluminescence spectra. These features are due to the difference between the indium profiles in the smoothing and lower barrier layers of the samples. In turn, the difference arises from the different designs of the metamorphic buffer.     

Hall and photoluminescence studies of effects of the thickness of an additional In0.3Ga0.7As layer in the center of In0.15Ga0.85As/Al0.25Ga0.75As/GaAs high electron mobility transistors

In order to reduce the noise and carrier–donor scattering and thereby increase the carrier mobility of the pseudomorphic AlGaAs/InGaAs high electron mobility transistors (pHEMTs), we have grown Al_0.25Ga_0.75As/In_0.15Ga_0.85As/In_0.3Ga_0.7As/GaAs pHEMTs with varied In_0.3Ga_0.7As thickness, and studied the effects of the In_0.3Ga_0.7As thickness on the electron mobility and sheet density by Hall measurements and photoluminescence measurements. We calculated the electron and hole subbands and obtained good agreement between calculated and measured PL energies. It was found that the additional In_0.3Ga_0.7As layer could be used to reduce the carrier–donor scattering, but due to the increased interface roughness as the In_0.3Ga_0.7As layer becomes thicker, the interface scattering reduced the electron mobility. An optimal thickness of the In_0.3Ga_0.7As was found to be 2 nm.     

Vegard’s law and superstructural phases in Al<Subscript>x</Subscript>Ga<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>As/GaAs(100) epitaxial heterostructures

The lattice constants of Al_xGa_1?x As epitaxial alloys with various AlAs (x) contents are determined for AlxGa_1?xAs/GaAs(100) heterostructures grown by MOC-hydride epitaxy using X-ray diffractometry and an X-ray back-reflection method. An ordered AlGaAs₂ (superstructural) phase is found in epitaxial heterostructures with x ≈ 0.50. The lattice constant of this phase is smaller than the lattice constants of an Al_0.50Ga_0.50As alloy and GaAs single-crystal substrate.     

InxGa1−xAs ohmic contacts to n-type GaAs with a tungsten nitride barrier

Significant reduction of the contact resistance of In_0.7Ga_0.3As/Ni/W contacts (which were previously developed by sputtering in our laboratory) was achieved by depositing a W₂N barrier layer between the Ni layer and W layer. The In_0.7Ga_0.3 As/Ni/W₂N/W contact prepared by the radio-frequency sputtering technique showed the lowest contact resistance of 0.2 Ωmm after annealing at 550°C for 10 s. This contact also provided a smooth surface, good reproducibility, and excellent thermal stability at 400°C. The polycrystalline W₂N layer was found to suppress the In diffusion to the contact surface, leading to improvement of the surface morphology and an increase in the total area of the In_xGa−As between metal and the GaAs substrate. These improvements are believed to reduce the contact resistance.     

In0.2Ga0.8As/GaAs quantum well laser with C doped cladding and ohmic contact layers

Carbon doping in Al_xGa_1−xAs was achieved using different approaches. The moderate growth temperature of 650°C was employed to grow C bulk-doped Al_xGa_1−xAs with a high Al mole fraction. The hole-density was altered using different V/III ratios. The trimethylaluminum (TMAl) was used as an effective C δ-doping precursor for growth of C δ-doped pipi doping superlattices in Al_xGa_1−xAs. the average hole-density of C δ-doped pipi superlattices was greater than 2−3 × 10¹⁹ cm⁻³. Zn-free GRINSCH In_0.2Ga_0.8As/GaAs laser structures were then grown using the C bulk-doped Al_xGa_1−xAs and C δ-doped pipi superlattice as a cladding and ohmic contact layer, respectively. The ridge waveguide laser diodes were fabricated and characterized to verify flexibility of these two doping approaches for device structures.