Investigation of multi‐layered‐gate electrode workfunction engineered recessed channel (MLGEWE‐RC) sub‐50 nm MOSFET: A novel design

In this paper, a two‐dimensional (2D) analytical sub‐threshold model for a novel sub‐50 nm multi‐layered‐gate electrode workfunction engineered recessed channel (MLGEWE‐RC) MOSFET is presented and investigated using ATLAS device simulator to counteract the large gate leakage current and increased standby power consumption that arise due to continued scaling of SiO₂‐based gate dielectrics. The model includes the evaluation of surface potential, electric field along the channel, threshold voltage, drain‐induced barrier lowering, sub‐threshold drain current and sub‐threshold swing. Results reveal that MLGEWE‐RC MOSFET design exhibits significant enhancement in terms of improved hot carrier effect immunity, carrier transport efficiency and reduced short channel effects proving its efficacy for high‐speed integration circuits and analog design. Copyright © 2008 John Wiley & Sons, Ltd.     

A low‐voltage band‐gap reference circuit with second‐order analyses

A new band‐gap reference (BGR) circuit employing sub‐threshold current is proposed for low‐voltage operations. By employing the fraction of V_BE and the sub‐threshold current source, the proposed BGR circuit with chip area of 0.029mm² was fabricated in the standard 0.18µm CMOS triple‐well technology. It generates reference voltage of 170 mV with power consumption of 2.4µW at supply voltage of 1 V. The agreement between simulation and measurement shows that the variations of reference voltage are 1.3 mV for temperatures from ?20 to 100^°C, and 1.1 mV per volt for supply voltage from 0.95 to 2.5 V, respectively. Copyright © 2010 John Wiley & Sons, Ltd.     

Complete delay modeling of sub‐threshold CMOS logic gates for low‐power application

In this paper, the propagation delay of a complementary metal‐oxide semiconductor (CMOS) inverter circuit in sub‐threshold regime has been analyzed thoroughly with respect to variable loads, rise and fall time of input, device dimensions and temperature, without neglecting the significant drain induced barrier lowering (DIBL) and body bias effects. In particular, sub‐threshold slope factor and current strength have been modeled with respect to temperature, which would be efficacious for the analysis of sub‐threshold circuit as temperature plays an important role in propagation delay. Transistor stacking has also been modeled considering variation in threshold voltage, sub‐threshold slope factor and DIBL coefficient owing mainly to fluctuation in doping levels. The CMOS inverter delay model together with transistor stacking model has been incorporated in the analysis of propagation delays of NAND and NOR gates. Extensive simulations have been performed under 45 and 22 nm CMOS technology using simulation program with integrated circuit emphasis (SPICE) to ensure the correctness of the analysis. Simulation shows that this model is applicable for the analysis of digital sub‐threshold circuit in sub‐90 nm technology. Copyright © 2015 John Wiley & Sons, Ltd.     

Low‐leakage sub‐threshold 9 T‐SRAM cell in 14‐nm FinFET technology

A novel sub‐threshold 9 T Static Random Access Memory (SRAM) cell designed and simulated in 14‐nm FinFET technology is proposed in this paper. The proposed 9 T‐SRAM cell offers an improved access time in comparison to the 8 T‐SRAM cell. Furthermore, an assist circuit is proposed by which the leakage current of the proposed SRAM cell is reduced by 20% when holding ‘0’ and an equal leakage current during hold ‘1’ in comparison to the 8 T‐SRAM cell. The proposed circuit improves the access time by 40% in comparison to the 8 T‐SRAM cell without any degradation in write and read noise margins, as well. The maximum operating frequency of the proposed SRAM cell is 1.53 MHz at V_DD = 270 mV. Copyright © 2016 John Wiley & Sons, Ltd.     

Wide‐band aperture array using a four‐channel manifold‐type planar multiplexer and digital 2‐D IIR filterbank

Emerging wide‐band communications and spectrum‐sensing systems demand support for multiple electronically scanned beams while maintaining a frequency independent, constant far‐field beam width. Realizing existing phased‐array technology on a digital scale is computationally intensive. Moreover, digitizing wide‐band signals at Nyquist rate requires complex high‐speed analog‐to‐digital converters (ADCs), which is challenging for real developments driven by the current ADC technology. A low‐complexity alternative proposed in this paper is the use of radio‐frequency (RF) channelizers for spectrum division followed by sub‐sampling of the RF sub‐bands, which results in extensive reduction of the necessary ADC operative frequency. The RF‐channelized array signals are directionally filtered using 2‐D digital filterbanks. This mixed‐domain RF/digital aperture array allows sub‐sampling, without utilizing multi‐rate 2‐D systolic arrays, which are difficult to realize in practice. Simulated examples showing 14–19 dB of rejection of wide‐band interference and noise for a processed bandwidth of 1.6 GHz are demonstrated. The sampling rate is 400 MHz. The proposed VLSI hardware uses a single‐phase clock signal of 400 MHz. Prototype hardware realizations and measurement using 65‐nm Xilinx field‐programmable gate arrays, as well as Cadence RTL synthesis results including gate counts, area‐time complexity, and dynamic power consumption for a 45‐nm CMOS circuit operating at B _DC = 1.1 V, are presented. Copyright © 2016 John Wiley & Sons, Ltd.     

Noise‐immune dual‐rail dynamic circuit for wide fan‐in gates in asynchronous designs

Dual‐rail dynamic logic circuits can provide inverting and noninverting outputs, especially for asynchronous designs, to implement complicated gates at the cost of approximately doubling the area and power consumption. In this paper, a new dual‐rail dynamic circuit is proposed which has lower die area consumption and higher noise immunity without dramatic speed degradation for even wide fan‐in gates for asynchronous circuits. The main idea in the proposed circuit is that voltage due to the current of the pulldown network (PDN) is compared with the reference voltage to provide two complementary outputs. The reference voltage almost corresponds to the leakage current of the PDN with all transistors being off. The proposed circuit is compared with conventional dual‐rail circuits such as differential domino logic and differential cross‐coupled domino logic. Simulation results for 32‐bit‐wide OR gates designed using high‐performance 16‐nm predictive technology model demonstrate significant performance advantages such as 66% power reduction and at least 2.86× noise‐immunity improvement at the same delay compared to the differential domino circuits. © 2012 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.     

Potential‐based threshold voltage and subthreshold swing models for junctionless double‐gate metal‐oxide‐semiconductor field‐effect transistor with dual‐material gate

On the basis of quasi‐two‐dimensional solution of Poisson's equation, an analytical threshold voltage model for junctionless dual‐material double‐gate (JLDMDG) metal‐oxide‐semiconductor field‐effect transistor (MOSFET) is developed for the first time. The advantages of JLDMDG MOSFET are proved by comparing the central electrostatic potential and electric field distribution with those of junctionless single‐material double‐gate (JLSMDG) MOSFET. The proposed model explicitly shows how the device parameters (such as the silicon thickness, oxide thickness, and doping concentration) affect the threshold voltage. In addition, the variations of threshold voltage roll‐off, drain‐induced barrier lowering (DIBL), and subthreshold swing with the channel length are investigated. It is proved that the device performance for JLDMDG MOSFET can be changed flexibly by adjusting the length ratios of control gate and screen gate. The model is verified by comparing its calculated results with those obtained from three‐dimensional numerical device simulator ISE. Copyright © 2015 John Wiley & Sons, Ltd.     

Design and analysis of power‐CMOS‐gate‐based switched‐capacitor DC–DC converter with step‐down and step‐up modes

A unified multi‐stage power‐CMOS‐transmission‐gate‐based quasi‐switched‐capacitor (QSC) DC–DC converter is proposed to integrate both step‐down and step‐up modes all in one circuit configuration for low‐power applications. In this paper, by using power‐CMOS‐transmission‐gate as a bi‐directional switch, the various topologies for step‐down and step‐up modes can be integrated in the same circuit configuration, and the configuration does not require any inductive elements, so the IC fabrication is promising for realization. In addition, both large‐signal state‐space equation and small‐signal transfer function are derived by state‐space averaging technique, and expressed all in one unified formulation for both modes. Based on the unified model, it is all presented for control design and theoretical analysis, including steady‐state output and power, power efficiency, maximum voltage conversion ratio, maximum power efficiency, maximum output power, output voltage ripple percentage, capacitance selection, closed‐loop control and stability, etc. Finally, a multi‐stage QSC DC–DC converter with step‐down and step‐up modes is made in circuit layout by PSPICE tool, and some topics are discussed, including (1) voltage conversion, output ripple percentage, and power efficiency, (2) output robustness against source noises and (3) regulation capability of converter with loading variation. The simulated results are illustrated to show the efficacy of the unified configuration proposed. Copyright © 2003 John Wiley & Sons, Ltd.     

A fuzzy logic‐controlled SMES for damping shaft torsional oscillations of synchronous generator

This paper presents a fuzzy logic control scheme for the superconducting magnetic energy storage (SMES) based on a PWM voltage source converter and a two‐quadrant chopper using an insulated‐gate‐bipolar‐transistor (IGBT) to dampen turbine‐generator shaft torsional oscillations. Simulation results of balanced faults in a single machine connected to an infinite bus system show that the proposed fuzzy logic‐controlled SMES is effective in damping shaft torsional oscillations of synchronous generators (GENs). © 2006 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.     

Impact of high‐κ gate dielectric and other physical parameters on the electrostatics and threshold voltage of long channel gate‐all‐around nanowire transistor

High‐κ gate‐all‐around structure counters the Short Channel Effect (SCEs) mostly providing excellent off‐state performance, whereas high mobility III–V channel ensures better on‐state performance, rendering III–V nanowire GAAFET a potential candidate for replacing the current FinFETs in microchips. In this paper, a 2D simulator for the III–V GAAFET based on self‐consistent solution of Schrodinger–Poisson equation is proposed. Using this simulator, capacitance–voltage profile and threshold voltage are characterized, which reveal that gate dielectric constant (κ) and oxide thickness do not affect threshold voltage significantly at lower channel doping. Moreover, change in alloy composition of In_xGa_1‐xAs, channel doping, and cross‐sectional area has trivial effects on the inversion capacitance although threshold voltage can be shifted by the former two. Although, channel material also affects the threshold voltage, most sharp change in threshold voltage is observed with change in fin width of the channel (0.005 V/nm for above 10 nm fin width and 0.064 V/nm for sub‐10 nm fin width). Simulation suggests that for lower channel doping below 10²³ m⁻³, fin width variation affects the threshold voltage most. Whereas when the doping is higher than 10²³ m⁻³, both the thickness and dielectric constant of the oxide material have strong effects on threshold voltage (0.05 V/nm oxide thickness and 0.01 V/per unit change in κ). Copyright © 2014 John Wiley & Sons, Ltd.     

Development of gate drive circuit for next‐generation ultrahigh‐speed switching devices

This paper describes a gate drive circuit which is capable of driving an ultrahigh‐speed switching device and of suppressing high‐frequency noise caused by its high dV/dt ratio of 104 V/μs order. SiC (silicon carbide)‐based power semiconductor devices are very promising as next‐generation ultrahigh‐speed switching devices. However, one of their application problems is how to drive them with less high‐frequency noise without sacrificing their ultrahigh‐speed operation capability. The paper proposes a new gate drive circuit specialized for such devices, which charges and discharges the input capacitance of the device by using an impulse voltage generated by inductors. This ultrahigh‐speed switching operation causes a high‐frequency common‐mode noise current in the gate drive circuit, which penetrates an isolated power‐supply transformer due to the parasitic capacitance between the primary and the secondary windings. In order to overcome this secondary problem, a toroidal multicore transformer is also proposed in the paper in order to reduce the parasitic capacitance drastically. By applying the former technique, the turn‐on time and turn‐off time of the power device were shortened by 50% and by 20%, compared with a conventional push‐pull gate drive circuit, respectively. In addition, the latter technique allows reduction of the peak common‐mode noise current to 25%, compared with the use of a conventional standard utility power‐supply transformer. © 2011 Wiley Periodicals, Inc. Electr Eng Jpn, 176(4): 52–60, 2011; Published online in Wiley Online Library ( wileyonlinelibrary.com ). DOI 10.1002/eej.21124     

Novel current‐source multilevel inverter driven by single gate drive power supply

This paper proposes a novel current‐source multilevel inverter, which is based on a current‐source half‐bridge topology. Multilevel inverters are effective for reducing harmonic distortion in the output voltage and the output current. However, the multilevel inverters require many gate drive power supplies to drive switching devices. The gate drive circuits using a bootstrap circuit and a pulse transformer can reduce the number of the gate drive power supplies, but the pulse width of the output PWM waveform is limited. Furthermore, high‐speed power switching devices are indispensable to create a high‐frequency power converter, but various problems, such as high‐frequency noise, arise due to the high dv/dt rate, especially in high‐side switching devices. The proposed current‐source multilevel inverter is composed of a common emitter topology for all switching devices. Therefore, it is possible to operate it with a single power supply for the gate drive circuit, which allows stabilizing the potential level of all the drive circuits. In this paper, the effectiveness of the proposed circuit is verified through experimental results. © 2008 Wiley Periodicals, Inc. Electr Eng Jpn, 166(2): 88–95, 2009; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/eej.20475     

Noise‐tolerant dynamic CMOS circuits design by using true single‐phase clock latching technique

In this paper, a true‐single‐phase clock latching based noise‐tolerant (TSPCL‐NT) design for dynamic CMOS circuits is proposed. A TSPCL‐NT dynamic circuit can isolate and filter noise before the noise enters into the dynamic circuit. Therefore, it cannot only greatly enhance the noise tolerance of dynamic circuits but also release the signal contention between the feedback keeper and the pull‐down network effectively. As a result, noise tolerance of dynamic circuits can be improved with lower sacrifice in power consumption and operating speed. In the 16‐bit TSPCL‐NT Manchester adder, the average noise threshold energy can be enhanced by 3.41 times. In the meanwhile, the power‐delay product can be improved by 5.92% as compared with the state‐of‐the art 16‐bit XOR‐NT Manchester adder design under TSMC 90 nm CMOS process. Copyright © 2014 John Wiley & Sons, Ltd.     

A numerical model for the oscillation frequency,the amplitude and the phase‐noise of MOS‐current‐mode‐logic ring oscillators

This paper presents a new model for the frequency of oscillation, the oscillation amplitude and the phase‐noise of ring oscillators consisting of MOS‐current‐mode‐logic delay cells. The numerical model has been validated through circuit simulations of oscillators designed with a typical 130 nm CMOS technology. A design flow based on the proposed model and on circuit simulations is presented and applied to cells with active loads. The choice of the cell parameters that minimize phase‐noise and power consumption is addressed. Copyright © 2009 John Wiley & Sons, Ltd.     

An analytical model of triple‐material double‐gate metal–oxide–semiconductor field‐effect transistor to suppress short‐channel effects

This paper presents an analytical subthreshold model for surface potential and threshold voltage of a triple‐material double‐gate (DG) metal–oxide–semiconductor field‐effect transistor. The model is developed by using a rectangular Gaussian box in the channel depletion region with the required boundary conditions at the source and drain end. The model is used to study the effect of triple‐material gate structure on the electrical performance of the device in terms of changes in potential and electric field. The device immunity against short‐channel effects is evaluated by comparing the relative performance parameters such as drain‐induced barrier lowering, threshold voltage roll‐off, and subthreshold swing with its counterparts in the single‐material DG and double‐material DG metal–oxide–semiconductor field‐effect transistors. The developed surface potential model not only provides device physics insight but is also computationally efficient because of its simple compact form that can be utilized to study and characterize the gate‐engineered devices. Furthermore, the effects of quantum confinement are analyzed with the development of a quantum‐mechanical correction term for threshold voltage. The results obtained from the model are in close agreement with the data extracted from numerical Technology Computer Aided Design device simulation. Copyright © 2015 John Wiley & Sons, Ltd.     

Novel quantum‐dot cellular automata implementation of flip‐flop and phase‐frequency detector based on nand‐nor‐inverter gates

CMOS technology faces fundamental challenges such as frequency and power consumption due to the impossibility of further reducing dimensions. For these reasons, researchers have been thinking replacement of this technology with other technologies such as quantum‐dot cellular automata (QCA) technology. Many studies have been done to design digital circuits using QCA technology. Phase‐frequency detector (PFD) is one of the main blocks in electrical and communication circuits. In this paper, a novel structure for PFDs in QCA technology is proposed. In the proposed design, the novel D flip‐flop (D‐FF) with reset ability is used. The D‐FF is designed by the proposed D latch which is based on nand‐nor‐inverter (NNI) and an inverter gate. This proposed D latch has 22 cells and 0.5 clock cycle latency and 0.018‐μm² area. The inverter gate of the D‐FF has output signal with high polarization level and lower area than previous inverters, and the NNI gate of the D‐FF is a universal gate. The proposed PFD has 141 cells, 0.17‐μm² occupied area, and two clock cycle latency that is smaller compared with PFD and is based on common inverter and majority gates.     

Threshold voltage modeling for dual‐metal quadruple‐gate (DMQG) MOSFETs

In this paper, a three‐dimensional (3D) model of threshold voltage is presented for dual‐metal quadruple‐gate metal‐oxide‐semiconductor field effect transistors. The 3D channel potential is obtained by solving 3D Laplace's equation using an isomorphic polynomial function. Threshold voltage is defined as the gate voltage, at which the integrated charge (Q_inv) at the ‘virtual‐cathode’ reaches to a critical charge Q_th. The potential distribution and the threshold voltage are studied with varying the device parameters like gate metal work functions, channel cross‐section, oxide thickness, and gate length ratio. Further, the drain‐induced barrier lowering has also been analyzed for different gate length ratios. The model results are compared with the numerical simulation results obtained from 3D ATLAS device simulation results. Copyright © 2015 John Wiley & Sons, Ltd.     

Newly proposed hybrid resonant commutation bridge‐leg link snubber‐assisted three‐phase ZVZCS‐PWM soft‐switching inverter

This paper presents the newly proposed hybrid resonant commutation bridge‐leg link (HRCB) snubber circuit which can achieve zero voltage and zero current soft‐switching commutation for single‐phase and three‐phase voltage source‐type inverter, along with its unique features and operation principle. The circuit parameter design approach for the HRCB snubber circuit and the determination estimating scheme of the gate pulse timing processing which is more suitable and acceptable for single‐phase and space voltage vector modulated three‐phase voltage source inverter using the HRCB snubber circuit are described in this paper. In particular, the three‐phase voltage source soft‐switching inverter associated with the proposed HRCB circuits are evaluated and discussed from simulation and experimental viewpoints. The practical effectiveness of the HRCB snubber‐assisted three‐phase voltage source soft‐switching inverter using IGBT power modules which is based on the instantaneous space voltage vector modulation is clarified on the output voltage waveform, actual efficiency of electromagnetic noise in comparison with three‐phase voltage source‐type conventional hard‐switching inverter. © 2006 Wiley Periodicals, Inc. Electr Eng Jpn, 157(4): 75–84, 2006; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/eej.20111     

An ultra‐thin oxide sub‐1 V CMOS bandgap voltage reference

This paper presents a sub‐1 V CMOS bandgap voltage reference that accounts for the presence of direct tunneling‐induced gate current. This current increases exponentially with decreasing oxide thickness and is especially prevalent in traditional (non‐high‐κ/metal gate) ultra‐thin oxide CMOS technologies (t_ox < 3 nm), where it invalidates the simplifying design assumption of infinite gate resistance. The developed reference (average temperature coefficient, T_{C_AVG}, of 22.5 ppm/°C) overcomes direct tunneling by employing circuit techniques that minimize, balance, and cancel its effects. It is compared to a thick‐oxide voltage reference (T_{C_AVG} = 14.0 ppm/°C) as a means of demonstrating that ultra‐thin oxide MOSFETs can achieve performance similar to that of more expensive thick(er) oxide MOSFETs and that they can be used to design the analog component of a mixed‐signal system. The reference was investigated in a 65 nm CMOS technology with a nominal V_DD of 1 V and a physical oxide thickness of 1.25 nm. Copyright © 2013 John Wiley & Sons, Ltd.     

A framework for high‐speed parallel‐prefix adder performance evaluation and comparison

A new framework is proposed for the evaluation and comparison of high‐speed parallel‐prefix adders. The framework specifies input registers and latches and requires sum feedback for single cycle pipelined operation. Test pattern generation is also specified. A newly revised energy‐efficient 64‐bit carry select adder with distributed mixed valence logic to help reduce fan‐out and wire load is presented. Footless pulsed‐precharge domino and compound domino circuits, and smaller transistors help to reduce area and power. Detailed simulations with 65 nm CMOS models are compared with other parallel‐prefix adders that have been instantiated for comparison. Within this framework, energy reductions of 40% are obtained for the new adder versus two leading Kogge‐Stone designs, and 25% versus a new constant delay logic Sklansky style design, at similar cycle times. Copyright © 2014 John Wiley & Sons, Ltd.