一种2 V, 9 μA, 15 × 10-6/℃高电源抑制CMOS带隙电压基准源

通过分析带隙电压基准源的PSR,发现运放的PSR为1时,基准电压将具有很高的PSR。基于该思想,在带隙电压基准源中引入PSR提高电路,实现一种低功耗、低温度系数、高电源抑制能力的带隙电压基准源。该带隙电压基准源采用TSMC0．6μm、两层POLY、两层金属的CMOS工艺实现,芯片面积为0．0528mm^2。测试结果表明：其最大工作电流为9μA;在2～5V工作电压下温度系数为15×10^-8／℃;线调整率为50μV／V;100kHz的PSR为-70dB。仿真与测试结果验证了该方法的有效性。     

一种应用于13.56MHz无源RFID标签芯片的带隙基准电压源

在传统带隙结构基础上,实现了一种适用于13.56MHz无源RFID标签芯片的带隙基准电压源。电路设计采用SMIC 0.18μm混合信号CMOS工艺实现,测试结果显示,电源电压输入范围在4.0~11.0V时,基准源输出电压为1.165±0.004V,7V电源电压、-40~100°C温度范围内,温漂系数为18.3×10-6°C,启动时间为6.8μs。     

一种新型偏置电路的CMOS亚阈型电压基准源

文章设计了一种工作在亚闽值状态下的CMOS电压基准源,分析了MOSFET工作在亚闽区的电压和电流限定条件。电压基准源可提供与工艺基本无关近似零温度系数的基准电压。为了提高电路的电源抑制比,该电路采用了共源共栅电流镜结构。该结构采用了一种新型的偏置电路．使得电流镜各级联管均工作在饱和区边缘而不脱离饱和区,提高输出电压摆幅,得到有较高恒流特性的基准电流。该电路采用0,6μmCMOS工艺,通过Spectra仿真,可工作在2V电压下,输出基准电压1.4V,温度系数为17×10^-6（V／℃）。     

一个低压高阶曲率补偿的CMOS带隙基准电压源的设计

运用带隙基准的基本原理,采用0.6μm的CMOS工艺,对一个低压高阶曲率补偿的高性能CMOS带隙基准电压源进行研究,并结合所提出电路给出了高阶曲率补偿的数学表达式。Cadence软件仿真结果显示:电源电压最低可为1.2 V,在-20~100℃温度范围内,输出电压为0.6 V,温度系数为9.1 ppm/℃,即基准输出电压随温度变化不超过±0.1%。低频(f=1 kHz)时PSRR为-78 dB。在室温电源电压为1.2 V时总功耗约为38μW。整个带隙基准电压源具有良好的综合性能。     

高电源电压抑制比基准电压源的设计

在此通过对带隙基准电压源电路进行建模分析,针对逆变电路的中低频使用环境,设计了一个应用于高压逆变器电路中的高电源电压抑制比,低温度系数的带隙基准电压源。该电路采用1μm,700 V高压CMOS工艺,在5 V供电电压的基础上,采用一阶温度补偿,并通过设计高开环增益共源共栅两级放大器来提高电源电压抑制比,同时使用宽幅镜像电流偏置解决因共源共栅引起的输出摆幅变小的问题。基准电压源正常输出电压为2.394 V,温度系数为8 ppm/℃,中低频电压抑制比均可达到-112 dB。     

应用于A/D转换器中的基准电压源的设计

基准电压源是A／D转换器中非常重要的模块，它的稳定性直接影响着A／D转换器的性能。在TSMC0.18μm/3.3V N-well CMOS工艺条件下，温度系数可达十几个ppm／C。在频率等于100kHz时，PSRR达到54dB，功耗只有0．25mW。     

非带隙低功耗低温漂CMOS电压基准电路设计

通过Vth与VT(热电压)相互补偿原理,提出一种新型非带隙CMOS电压基准源,其输出基准电压具有极低温度系数.采用0.34μmFoundry18工艺模型和Candance Spectre EDA工具对电路进行模拟验证,获得以下结果:输出电压为552.845mV(T=27℃,VDD=3.3V),温度系数为1.98ppm/℃(-30℃℃～+130℃),功耗为21.85μw.电源电压从2.5V变到4.5V,输出电压的变化为0.15％(相对于VDD=3.3V时的输出).该电压基准源可望应用于高精度、低功耗IC系统的设计研发.     

一种用于高压PMOSFET驱动器的电压跟随电路

通常PMOSFET栅源电压为-20~20 V,而用于GaN功率放大器的高压PMOSFET驱动器,其工作电压为28~50 V,因此需要一种新型电路结构来保证PMOSFET栅源电压工作在额定范围。设计了一种新型电压跟随电路,采用新型多环路负反馈结构,核心电路主要为电压基准单元、减法器单元、误差放大器单元和采样单元,可产生稳定的跟随电压。该电路具有宽电源电压范围、高输出稳定性以及低温度漂移等特性。基于0.5μm BCD工艺对电路进行流片,测试结果表明,采用该电路的驱动器芯片,其电源电压为15~50 V,输出电压变化量约为0.6 V,在-55~125℃温度范围内,电压漂移量约为0.12 V,满足大多数PMOSFET栅源电压的应用要求。     

一种高温度稳定性的GaN基准电压源设计

基于宽带隙、高饱和电子漂移速率、高击穿场强等材料特性优势,GaN高电子迁移率晶体管(HEMT)在高频大功率器件领域发展前景广阔。在集成电路中,基准电压源是为其他电路模块提供稳定参考电压的关键功能模块。基于0.5μm BCD GaN HEMT工艺,提出了一种GaN基准电压源的设计方案。Cadence Spectre仿真结果显示,该GaN基准电压源在-40～150℃范围内可实现2.04 V的稳定电压输出,温度系数为3.7×10^-6/℃。在室温27℃下,当电源电压由5 V增至20 V时,输出电压的线性灵敏度为0.13%/V。该GaN基准电压源具有高温度稳定性,后续可与不同的GaN基电路模块组合构成功能丰富的GaN基集成电路。     

一种高PSR CMOS带隙基准电路设计

为了降低芯片电路功耗,电源电压需要不断的减小,这将导致电源噪声对基准电压产生严重影响。为此针对这一问题进行相关研究,采用SMIC 0.18μm工艺,设计出一种低功耗、低温度系数的高PSR带隙基准电压源。仿真结果表明,该设计带隙基准源的PSR在50 kHz与100 kHz分别为-65.13 dB和-53.85 dB;在2⁶ V电源电压下,工作电流为30μA,温度系数为30.38 ppm/℃,电压调整率为71.47μV/V。该带隙基准适用于在低功耗高PSR性能需求的LDOs电路中应用。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.