首页 | 本学科首页   官方微博 | 高级检索  
相似文献
 共查询到20条相似文献,搜索用时 171 毫秒
1.
PPS/Al_2O_3导热复合材料的性能及其应用   总被引:3,自引:1,他引:2  
以微米级三氧化二铝(Al2O3)为导热填料,制备了聚苯硫醚(PPS)/Al2O3导热复合材料,研究了硅烷偶联剂表面改性对PPS/Al2O3复合材料力学性能和导热性能的影响.研究表明,硅烷偶联剂时Al2O3的表面改性提高了PPS/Al2O3导热复合材料的力学性能,且材料的热导率随着Al2O3含量的增加而增大,当Al2O3的质量分数为70%时,未改性和改性Al2O3填充PPS导热复合材料的热导率分别达到2.279 W/(m·K)和2.392 W/(m·K),后者的热导率在Al2O3含量较高时偏离Agari理论曲线.SEM分析表明,改性Al2O3在PPS中分散均匀,两者结合紧密.经应用研究表明,PPS/改性Al2O3质量比为40/60的导热复合材料完全可满足发动机零部件、高耐热电子元器件对材料导热与力学性能的要求.  相似文献   

2.
采用乙烯一醋酸乙烯a共聚物和无机导热填料制备聚合物基导热绝缘复合材料,概述了以逾渗理论为基础的热导率计算模型,并应用所制备的导热绝缘复合材料讨论了逾渗模型的准确性。结果表明,SiC填充的复合材料具有较好的导热性能;填料体积分数达0.5时,复合材料的热导率可达1.86 W/(m0K)。研究表明,简单地运用逾渗理论在预测导热复合材料体系的热导率方面准确性不足,需要进一步考虑实际填料粒子分布与理论假设的差异以及界面相的存在等因素的影响。  相似文献   

3.
以硅烷偶联剂改性的氧化铝为导热填料,聚酰亚胺改性环氧树脂为基体,通过高温模压法制备了Al2O3填充聚酰亚胺/环氧导热玻纤复合材料,研究Al2O3和聚酰亚胺含量对复合材料热性能、力学性能和介电性能的影响。结果表明,复合材料的热导率随着纳米Al2O3粒子含量的增加而增加。当Al2O3粒子的填充量为50%时,复合材料的热导率可达1.239W/(m.K)。复合材料冲击强度和弯曲强度随粒子含量的增加呈先增加后降低趋势,当Al2O3粒子的填充量为20%时,材料的冲击强度为376.3kJ/m2,弯曲强度为912.6MPa。聚酰亚胺改性的复合材料具有较好的介电性能、热稳定性和耐热老化性。  相似文献   

4.
聚合物基复合材料导热模型及热导率方程的研究   总被引:6,自引:0,他引:6  
王亮亮 《中国塑料》2005,19(12):12-14
根据导热填料在聚合物基体中的分布,提出了导热聚合物基复合材料两相体系的“海岛-网络”模型;并结合逾渗理论及其在导电复合材料中的应用,建立了导热复合材料的逾渗热导率方程。实验证明,该模型及热导率方程符合实际而且适用于高含量填充型导热聚合物基复合材料热导率的预测。  相似文献   

5.
《塑料》2016,(2)
采用熔融共混的方法,通过无机粒子填充HDPE/POE共混体系制备复合材料。研究了Al粉、Al_2O_3粉、石墨(GP)这3种单一填料以及Al_2O_3/GP、Al/GP共2种复配填料对复合材料的导热导电和流变性能的影响。流变性能表明复合材料的动态模量随着石墨含量的增加而增加,且复合材料的损耗因子(tanδ)逐渐减小。当石墨含量(质量分数)为33%和50%时,复合材料的损耗因子小于1,复合材料内填料形成了网络结构。由于形成了导热导电通路,复合材料的热导率和电导率都得到明显提高。将含量为50%的石墨填充到HDPE/POE基体中,HDPE/POE/GP的导热率是1.8 W/(m·K),是HDPE/POE的5.3倍。  相似文献   

6.
以聚乙烯醇缩丁醛(PVB)为基材,选用粒径分别为1~3μm、10μm和30 nm的Al2O3为导热填料,三乙二醇二-2-乙基己酸酯(3GO)为增塑剂,通过熔融共混法制备了PVB/Al2O3导热绝缘复合材料;研究了Al2O3的表面处理、添加量和粒径对复合材料的导热绝缘性能和力学性能的影响。结果表明,在所考察的三种表面处理剂γ-(2,3-环氧丙氧基)丙基三甲氧基硅烷(KH-560)、钛酸正丁酯(TC)和硬脂酸(SA)及其用量范围内,用质量分数为1.0%的KH-560对Al2O3粒子进行表面处理是较佳的处理方法;在三种粒径不同的Al2O3导热填料中,粒径1~3μm的Al2O3较有利于改善PVB/Al2O3复合材料的导热性能;PVB/Al2O3复合材料的热导率随Al2O3用量的增加而升高;当1~3μm的Al2O3用量为85 phr,即体积分数为18.6%时,复合材料的热导率为0.407 W/(m.K),是不含Al2O3的PVB的1.91倍;当这一Al2O3的用量为70 phr(体积分数15.9%)时,所制得的PVB/Al2O3复合材料具有较好的综合性能,其热导率为0.375 W/(m.K),体积电阻率为1.65×1012Ω.m,拉伸强度为21.4 MPa,断裂伸长率为265%。根据Agrai理论模型进行的数据分析表明,当Al2O3用量大于25 phr(体积分数6.3%)时,随着Al2O3用量的进一步增加,PVB/Al2O3复合材料中的Al2O3粒子形成了部分连续的导热链。  相似文献   

7.
以SiC粉及铝合金(3%Mg(质量分数)、5%Mg、7%Mg、10%Mg)为主要原料,采用无压浸渗工艺制备得到了SiC/Al复合材料。表征了SiC/Al复合材料的物相组成、显微结构、力学性能及热导率,研究了合金中Mg含量对SiC/Al复合材料结构组成、力学及热学性能的影响。结果表明:制备得到的SiC/Al复合材料主晶相均为SiC与Al。适量Mg的引入有助于改善铝合金与SiC颗粒间的浸渗性能,能有效促进SiC/Al复合材料的界面反应。其中引入5%Mg样品的显微结构较为致密,综合性能较优,其气孔率为0.13%,体积密度为2.94 g/cm3,抗弯强度为(366.36±14.37) MPa,断裂韧性为(9.2±0.27) MPa·m1/2,热导率为178.81 W/(m·K)。  相似文献   

8.
采用低密度聚乙烯(PE-LD)为基体材料,石墨、Al N为导热填充材料,通过双辊混炼、模压制备了导热复合材料,并对该复合材料的导热性能、力学性能、热行为进行了分析。结果表明,随着石墨或Al N含量的增加,PE-LD/石墨复合材料和PE-LD/Al N复合材料的热导率逐渐增大;PE-LD/石墨复合材料的热导率高于PE-LD/Al N复合材料的热导率。当石墨与Al N的总质量分数为50%、石墨与Al N的质量比为4∶1时,PE-LD/石墨/Al N复合材料的拉伸强度、弯曲强度均达到最大值,分别为12.8,17.15 MPa;此时PE-LD/石墨/Al N复合材料的热导率达到最大值,为0.618 W/(m·K),略低于添加质量分数50%的石墨时的PE-LD/石墨复合材料的热导率[0.634 W/(m·K)];当石墨与Al N质量比为1∶4时,PE-LD/石墨/Al N复合材料的热导率为0.488 W/(m·K),高于只添加质量分数50%Al N的PE-LD/Al N复合材料的热导率[0.410 W/(m·K)]。当石墨和Al N总质量分数为50%时,随着Al N含量的增加,PE-LD的结晶度增大。  相似文献   

9.
以Al2O3、Si3N4、BN、SiO2和AlN五种无机填料作为环氧树脂(EP)灌封胶的导热填料,研究了填料的种类、粒径大小和颗粒形态等对EP灌封胶热导率的影响。结果表明:EP灌封胶的热导率随着导热填料用量的增加而增大;当φ(BN)=35%(相对于总体积而言)时,相对最大热导率为2.12 W/(m·K),其值约为EP基体的10倍。填料粒子的几何特征对EP灌封胶的导热性能具有较大的影响;当Al2O3粒径为48μm时,EP灌封胶的相对最大热导率为1.3 W/(m·K);填料粒子过大或过小都会降低EP灌封胶的导热性能。层片状填料粒子可以获得较大的堆积密度,在EP灌封胶中能有效形成导热通道,增加其热导率。  相似文献   

10.
以SiC粉及铝合金(3%Mg(质量分数)、5%Mg、7%Mg、10%Mg)为主要原料,采用无压浸渗工艺制备得到了SiC/Al复合材料。表征了SiC/Al复合材料的物相组成、显微结构、力学性能及热导率,研究了合金中Mg含量对SiC/Al复合材料结构组成、力学及热学性能的影响。结果表明:制备得到的SiC/Al复合材料主晶相均为SiC与Al。适量Mg的引入有助于改善铝合金与SiC颗粒间的浸渗性能,能有效促进SiC/Al复合材料的界面反应。其中引入5%Mg样品的显微结构较为致密,综合性能较优,其气孔率为0.13%,体积密度为2.94 g/cm3,抗弯强度为(366.36±14.37)MPa,断裂韧性为(9.2±0.27)MPa·m1/2,热导率为178.81 W/(m·K)。  相似文献   

11.
以炭黑(CB)为导电填料,填充到2种不相容的高聚物高密度聚乙烯(HDPE)和聚碳酸酯(PC)基体中制备高分子基正温度效应(PTC)材料.研究表明,CB在HIRE中的逾渗阈值约为20%;HDPE/PC/CB三元复合体系形成了双逾渗行为,当HDPE/PC质量比为40/60时,三元复合体系具有较好的PTC及PTC重复性.  相似文献   

12.
2种导电炭黑复合橡胶体系的导热性能研究   总被引:2,自引:0,他引:2  
宋君萍 《弹性体》2012,22(4):19-24
研究了2种导电炭黑复合天然橡胶材料的导热性能随着温度和填料用量的变化规律。结果表明,温度对于导电炭黑复合体系导热性能的影响不大。乙炔黑复合体系具有极高的导热性能,随着炭黑用量的增加,其导热性能优势越加明显。据透射电镜观察填料的微观形态,乙炔黑链枝状结构丰富,聚集体之间以面接触为主,这是其复合橡胶导热性能优异的原因,乙炔黑复合材料的热导率与炭黑体积分数呈线性关系。40B2复合体系的热导率与炭黑体积分数呈现逾渗规律,逾渗阈值在炭黑体积分数8.30%至13.63%之间。据扫描电镜观察复合材料的微观结构,逾渗现象与炭黑在基体内的分布密切相关。为更精确地描述填料用量与复合体系热导率的关系,对2种复合体系的热导率与炭黑的体积分数进行了回归。  相似文献   

13.
Multiwall carbon nanotube reinforced poly (phenylene sulfide) (PPS) nanocomposites were successfully fabricated through melt compounding. Structural, electrical, thermal, rheological, and mechanical properties of the nanocomposites were systematically studied as a function of carbon nanotube (CNT) fraction. Electrical conductivity of the polymer was dramatically enhanced at low loading level of the nanotubes; the electrical percolation threshold lay between 1 and 2 wt % of the CNTs. Rheological properties of the PPS nanocomposites also showed a sudden change with the CNT fraction; the percolation threshold was in the range of 0–0.5 wt % of CNTs. The difference in electrical and rheological percolation threshold was mainly due to the different requirements needed in the carbon nanotube network in different stages. The crystallization and melting behavior of CNT‐filled PPS nanocomposites were studied with differential scanning calorimetry; no new crystalline form of PPS was observed in the nanocomposites, but the crystallization rate was reduced. The thermal and mechanical properties of the nanocomposites were also investigated, and both of them showed significant increase with CNT fraction. For 5 wt % of CNT‐filled PPS composite, the onset of degradation temperature increased by about 13.5°C, the modulus increased by about 33%, and tensile strength increased by about 172%. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009  相似文献   

14.
HID用加成型硅橡胶的制备与研究   总被引:1,自引:0,他引:1  
研究了乙烯基硅油、舍氢硅油、填料体系对加成型硅橡胶综合性能的影响.结果表明,选用不同乙烯基含量的乙烯基硅油及舍氢硅油并用,可以获得较佳的综合力学性能;搭配使用不同粒径的氧化铝,可以使硅橡胶获得良好的导热性能;与缩合型硅橡胶相比,加成型硅橡胶具有更为优异的电性能。  相似文献   

15.
通过溶液法,成功地制备了氧化铝掺杂聚酰亚胺纳米复合薄膜。探讨了Al2O3用量对聚酰亚胺纳米复合薄膜拉伸强度、热性能、电气强度的影响。结果发现,当Al2O3的质量分数达到5%时,整个复合体系的拉伸强度达到最大,相对于聚酰亚胺母体,复合材料的拉伸强度提高了16%;当Al2O3用量较小时,对聚酰亚胺纳米复合薄膜的Td10的影响不大,但当Al2O3的质量分数超过15%时,Td10则随Al2O3用量的增加而下降;同时实验结果表明,Al2O3的引入可以在一定程度上改善其复合体系的电气强度。  相似文献   

16.
This work is concerned with the preparation and characterization of composite materials prepared by compression molding of a mixture of aluminum flakes and nylon 6 powder. The electrical conductivity, density, hardness and morphology of composites were investigated. The electrical conductivity of the composites is < 10−11 S/cm unless the metal content reached the percolation threshold, beyond which the conductivity increased markedly by as much as 1011. The volume fraction of conductive filler at the percolation threshold was calculated from experimental data, by fits to functions predicted by the percolation theory. Decreasing the average particle diameter of filler leads to increased percolation threshold (it varies from 23 to 34 vol% for the three different fillers studied) and decreased maximal conductivity of composites. The density of the composites was measured and compared with values calculated assuming different void levels within the samples. Furthermore, it is shown that for certain sizes of particle filler, the hardness decreases initially with the increase of metal concentration, possibly because of poor surface contact with the nylon matrix, but, starting from a certain value, there is a hardness increase. For the smallest particle filler, the hardness of samples is not influenced by the presence of the filler.  相似文献   

17.
Commercial multi-walled carbon nanotubes (CNT) were functionalized by oxidation with HNO3, to introduce oxygen-containing surface groups, and by thermal treatments at different temperatures for their selective removal. The obtained samples were characterized by adsorption of N2 at -196°C, temperature-programmed desorption and determination of pH at the point of zero charge. CNT/poly(vinylidene fluoride) composites were prepared using the above CNT samples, with different filler fractions up to 1 wt%. It was found that oxidation reduced composite conductivity for a given concentration, shifted the percolation threshold to higher concentrations, and had no significant effect in the dielectric response.  相似文献   

18.
Block copolymer‐type polysiloxane was synthesized to investigate the influence of metal oxide addition on the dispersity of metal particles in a polysiloxane/metal composite. The metal oxide was introduced in a newly synthesized polysiloxane to improve the electrical and thermal conductivities of the polysiloxane/metal composite. The composite containing the metal oxide showed better dispersion than the composite without the metal oxide. The electrical conductivity displayed a typical percolation threshold behavior. The composite containing the metal oxide showed a slightly lower critical concentration (φc) than the composite without. The thermal conductivity of the composite increased considerably with the concentration of the filler. Thermal conductivity was used to calculate thermal interconnectivity, and the composite containing metal oxide showed an enhanced thermal interconnectivity. POLYM. COMPOS., 31:1669–1677, 2010. © 2010 Society of Plastics Engineers.  相似文献   

19.
The thermal conductivity of boron nitride (BN)‐filled poly(butylene terephthalate) (PBT) was investigated as a function of particle size, aspect ratio, surface area, surface chemistry, and concentration of BN as well as composite processing methods and conditions. In the low filler concentration region, a larger BN surface area resulted in lower thermal conductivity of the composites as a result of phonon scattering at interfaces. In the high filler concentration region the ease in forming filler networks, as reflected by the aspect ratio of BN, played a more dominant role. A percolation‐like behavior was observed when BN networks were formed while the thermal conductivity at close vicinity of the percolation threshold was not completely governed by the scaling law of classic percolation theory. High shear force employed in extrusion was effective in dispersing BN agglomerates into fine platelets while also inducing PBT degradation. When a low screw speed was used in extrusion followed by injection molding, the samples exhibited significantly lower thermal conductivity, which may be attributed to flow‐induced orientation of BN platelets in the direction perpendicular to the heat flow, relatively low concentration of filler at sample surfaces (skin‐core effect), and agglomeration of the BN platelets. POLYM. COMPOS. 26:778–790, 2005. © 2005 Society of Plastics Engineers  相似文献   

20.
Metal‐polymer composites based on polyethylene (PE), polyoxymethylene (POM), polyamide (PA) and a PE/POM blend as matrix and dispersed iron (Fe) as filler have been prepared by extrusion of the appropriate mechanical mixtures, and their electrical conductivity, dielectric properties and thermal conductivity have been investigated. The filler spatial distribution is random in the PE‐Fe, POM‐Fe and PA‐Fe composites. In the PE/POM‐Fe composite the polymer matrix is two‐phase and the filler is contained only in the POM phase, resulting in an ordered distribution of dispersed Fe in the volume of polymer blend. The transition through the percolation threshold ?c is accompanied by a sharp increase of the values of conductivity σ, dielectric constant ε′ and dielectric loss tangent tan δ. The critical indexes of the equations of the percolation theory are close to the theoretical ones in the PE‐Fe and POM‐Fe composites, whereas they take unusually high values in the PE/POMFe composite. Thus, t in the equation σ ~ (φ – φc)t is 2.9–3.0 in the systems characterized by random distribution of dispersed filler and 8.0 in the PE/POM‐Fe system. The percolation threshold φc depends on the kind of polymer matrix, becoming 0.21, 0.24, 0.29 and 0.09 for the composites based on PE, POM, PA and PE/POM, respectively. Also the thermal parameters of the PE/POM‐Fe composite are different from those of all other composites. A model explaining the unusual electrical characteristics of the composite based on the polymer blend (PE/POM‐Fe) is proposed, in agreement with the results of optical microscopy.  相似文献   

设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号