临界变形量冷轧高纯铝在退火过程中的晶粒粗化行为

采用离线原位电子背散射衍射技术研究了经10%(厚度减缩量)临界变形量冷轧高纯铝(99.99%)样品在退火过程中的晶粒粗化行为。结果表明,平均晶粒尺寸为40μm的原始晶粒组织经临界变形量冷轧再经480℃退火15 min后,形成了平均晶粒尺寸为200μm的粗晶组织;这种粗晶组织并非由新晶核的广泛长大而形成,而主要是由取向为{611}106和{611}616原始晶粒的快速长大而导致。     

退火工艺对电铸铜组织和织构的影响

采用SEM和EBSD研究了电铸铜在不同温度退火后的微观组织、晶粒取向以及特殊晶界的变化规律。结果表明:电铸铜退火前组织细小,平均晶粒尺寸约为2μm,随退火温度的升高,晶粒逐渐增大,650℃退火后,平均晶粒尺寸达到9.6μm;电铸铜主要存在{110}、{001}、{111}三种织构,{110}织构组分含量最多,退火处理有利于形成{001}织构,随退火温度的升高,{110}、{111}织构逐渐减少;电铸铜中存在大量分布取向差为60°的∑3共格孪晶界,电铸完成后,{001}晶粒相对较大,并且周围∑3晶界较少;较低温度退火时,{001}晶粒由于自身晶粒之间晶界易迁移而长大,在650℃退火时,大尺寸的{001}取向晶粒吞并周围其它取向晶粒而长大。     

形变退火后铁素体不锈钢的晶界组成及腐蚀特性

采用电子背散射和SEM技术研究了经85％冷轧的铁索体不锈钢在1000℃退火过程中晶粒组织、取向织构和晶界取向差的变化规律以及晶界的腐蚀特性.结果表明,退火初期晶粒长大不显著;当退火时间达到2h时,晶粒长大,平均晶粒尺寸达到65 μm,同时晶粒的{100} 织构明显增强,由此导致的小角度晶界比例提高.晶界腐蚀实验表明,小角度晶界具有较高的晶界腐蚀抗力.     

等径角挤压和单向轧制高纯Al再结晶晶界面的取向分布

选用经多向锻造和再结晶退火的晶粒组织均匀(平均晶粒尺寸为20 mm)且取向均匀的高纯Al(99.99%)为原料,将2组平行样品分别进行等效应变e≈2的等径角挤压(ECAP)和单向轧制(DR)变形后,再经360℃再结晶退火8~90 min,利用基于体视学原理和电子背散射衍射技术(EBSD)的五参数分析法(FPA)对比研究了不同变形方式对高纯Al退火再结晶晶界面取向分布的影响.结果表明,经变形及360℃退火后,2组样品中其再结晶晶界面主要取向于低能稳定的{111},并主要对应于以111为转轴的大角度扭转晶界.ECAP与DR样品退火后的主要差异在于,前者再结晶晶界面取向于{111}的过程较迟缓;后者再结晶晶界面比较容易取向于{111}.分析指出,DR变形更容易使高纯Al再结晶晶面取向于低能稳定的{111},更有益于晶界特征分布的优化.这与DR变形形成的110//ND织构导致其再结晶退火过程中晶粒容易长大有关.     

一次再结晶取向硅钢中第二相粒子局部密度与晶界的关系

采用场发射扫描电镜(FESEM)结合电子背散射衍射技术(EBSD)对一次再结晶取向硅钢中的Goss晶粒、黄铜晶粒及其周边相邻晶粒在晶界附近1μm范围内尺寸大于40 nm的Mn S第二相粒子的局部密度与相应晶界的关系进行了统计分析。结果表明:900℃再结晶退火后,Goss晶粒周边出现频次较高的晶粒取向分别为{112}111、{111}110、{411}148和{111}112,其中有利于Goss晶粒异常长大的{111}110、{111}112和{411}148取向出现频次之和占总量的57.7%;黄铜取向晶粒周边出现频次较高的则为{111}110、{112}111、{111}112和{411}148,其中{111}110、{111}112和{411}148出现频次占总量的68.7%;Mn S第二相粒子的局部密度差随晶界组合不同而变化,其中Goss-{111}110组合的最大。     

一种5083铝合金中晶界面热轧织构的研究

通过电子背散射衍射技术,测定了一种5083铝合金中的热轧织构。结果表明：在结构中的不同位置,织构组分呈现非均匀发展的特点,特别地,晶界面亦呈现取向织构。在样品的中心位置,晶界面趋向于{111}取向,且其数量高出随机晶界50%;同时,在样品的边缘位置,晶界面趋向于{110}与{112} 取向,且其数量高出随机晶界28%。更具体地,小角和大角晶界中均呈现这种晶界面的各向异性分布。     

CGO硅钢各阶段织构遗传继承性的EBSD分析

利用EBSD技术对CGO硅钢热轧、中间退火、脱碳退火及二次再结晶退火组织及织构进行分析,研究了CGO硅钢各阶段加工制备过程中高斯{110}001晶粒的形状、尺寸及分布特点,分析了高斯取向晶粒在各工序过程中的遗传继承性特点。结果表明,CGO硅钢热轧板的次表层存在Goss取向晶粒,历经一次冷轧及中间退火后Goss取向晶粒基本消失,一次再结晶之后Goss织构仍不是主要织构,主要织构为{111}110和{111}112,说明Goss取向晶粒在二次再结晶退火前数量及尺寸上并不占优势,二次再结晶过程中Goss取向晶粒异常长大形成锋锐Goss织构。{111}110和{111}112织构组分的强度在一次冷轧中不断增加,{111}112织构组分的强度在二次冷轧后达到最大而{111}110织构组分是在初次再结晶后变强。     

小变形高温退火对Hastelloy C-276合金晶界特征分布和晶界平面分布的影响

Hastelloy C-276合金经1150℃+30 min固溶处理后,进行不同变形量的冷轧高温退火处理。采用电子背散射(EBSD)技术对退火后的晶界特征分布和晶界面分布进行表征。结果表明,在退火过程中,Σ1小角度晶界比例减小,变形存储能释放,晶界发生迁移,促进了晶界相互作用,从而导致Σ9和Σ27晶界比例增加。与此同时,晶粒发生异常长大并促进了特殊晶界的形成,产生的特殊晶界阻断了大角度晶界的连通性。合金经变形高温退火之后,Σ3晶界分布在{111}晶界面扭转晶界,Σ9晶界分布在[110]晶带倾斜晶界。不同变形条件下,Σ3晶界面与Σ9晶界面分布演变规律不同,原因在于变形退火导致Σ3晶界比例的不同和晶界之间的相互作用的结果。     

基于CSP工艺取向硅钢抑制剂析出及再结晶脱碳退火行为

利用SEM、EBSD和XRD等相关技术,研究了脱碳退火工艺对基于CSP工艺取向硅钢再结晶退火后的组织、晶界特征及析出相的影响。结果表明,脱碳退火5 min后,取向硅钢的再结晶晶粒尺寸较小,晶界特征理想,高能晶界Σ3和Σ9富集在{111}112、{112}1 10和{332}533等有利取向周围,促进了二次再结晶过程中高斯晶粒的形成;退火时间为7 min时,大角度晶界和{111}112、{112}1 10、{332}533等有利取向数量下降,不利于高斯晶粒的形核和长大;经不同脱碳退火工艺(3 min、5 min和7 min),析出相总体呈弥散状态分布,析出物在脱碳退火5 min的析出细小且分布均匀。     

电工钢相变组织中的Σ3和取向梯度现象

将超低碳无取向电工钢冷轧板在g单相区加热,分别在H_2和N_2中使其发生α→γ→α相变,对超低碳无取向电工钢中的相变组织特征进行表征,并对其形成机理进行分析与讨论。结果表明,H_2退火板中形成了强{100}取向单层饼状晶,且{100}取向晶粒的尺寸达到1 mm以上;而N_2退火板表层为近{100}和{110}取向柱状晶,中心层则主要为{111}和{114}取向等轴晶。Σ3晶界普遍出现在发生取向择优的相变组织中,其形成机制与表面效应作用下诱发变体选择时所遵循的K-S关系密切相关;在N2退火板的柱状晶内部出现了近似线性的取向梯度,应为表层晶粒沿板材法向(ND)依靠γ→α相变长大受阻引起的相变应变累积造成的。     

抗氢合金J75中低∑CSL晶界的形成与演化

以铁镍基抗氢合金J75为研究对象,采用单步形变热处理和电子背散射衍射(EBSD)技术,研究了低∑CSL晶界的形成和演化过程。结果表明:采用5%预变形+1000℃退火的单步形变热处理方法,可将J75合金中低∑CSL晶界的比例提升至70%以上,形成具有∑3n取向关系的晶粒团簇;退火过程中,低∑CSL晶界比例的提升主要是由于∑3n界面比例的提升,其中∑3占绝大比例。发现一种∑3再生过程,其机制在于:由于∑3ic迁移能力强,在退火过程中与其他∑3相遇会形成∑9晶界,而∑9与∑3相遇,倾向于发生∑9+∑3→∑3,导致∑3的再生;不连续大角度随机晶界(R)与低∑CSL晶界相遇会形成R/∑晶界,当R/∑晶界为低∑CSL晶界时,则构成较多具有低∑CSL晶界的网络,打断了R晶界的连通性。     

CYCLIC DEFORMATION OF COARSE GRAINED POLYCRYSTALLINE PURE Ai——Ⅰ.SLIP CHARACTERISTICS

Comparing with ordinary ploycrystalline materials sized to μm grade,the slip morphology ofthe coarse grained polycrystalline pure Al is characterized by:(1)several slip domains occurin a grain,and in same domain,several slip systems operate at same time or one after anotherintensely,a beautiful and neat slip pattern is forming on the specimen surface;(2)for highΣ-value coincident and random grain boundaries,the grain boundary affecting zone(GBAZ),bout 50—120μm wide,is favourable site to form intergranular crack at early fa-tigue life easily,and migration or slide of the boundaries were often observed.While lowΣ-value near-coincident grain boundaries show a higher degree of slip continuity and straincompatibility than high Σ-value ones.Intergranular crack is not easily nucleated at lowΣ-value near-coincident boundaries;and(3)due to suppression of grain boundary slip attriple grain boundary node,the high Σ-value and random grain boundary among the threeboundaries of tricrystal crack easily during cyclic deformation.     

Microstructural model of intergranular fracture during tensile tests

A microstructural model of intergranular fracture in textured materials is presented. In this model, the material is represented by a two-dimensional microstructure with non-regular polygonal grains which represents material's texture and grain shape measured in experiments or calculated from Monte Carlo simulations. The grain boundary character, grain boundary energy, and fracture stress are assigned to each grain boundary according the grain boundary character distribution. Intergranular fracture susceptibility is analyzed by defining the probability of finding a continuous path along the grain boundaries which are intrinsically susceptible to fracture. In this analysis the orientations of the grain boundary with respect to the applied or residual tensile stress axis is considered. The probability of intergranular fracture for each grain boundary depends on the intergranular fracture resistance, the interface orientation relative to the stress axis, and a value of the tensile stress acting on the grain boundary. The crack arrest distance and the fracture toughness are calculated in terms of the frequency of low-energy grain boundaries, fracture stress of low-energy grain boundary, angle distribution of grain boundary interfaces, and anisotropy of grain shape. The results indicate that the fracture toughness increases and the crack arrest distance decreases dramatically with increasing the frequency of the low-energy grain boundaries. Lowering the grain boundary energy can improve the fracture toughness and decrease the crack arrest distance. The angle distribution of grain boundary interfaces and the grain shape factor are also very effective in controlling the fracture toughness. High fracture toughness of polycrystalline materials is related to the presence of a high frequency of low-energy boundaries which are resistant to fracture. The best fracture toughness for brittle materials can be achieved by controlling the frequencies of the low-energy grain boundaries, the grain boundary character, and the boundary inclination.     

热处理温度对G3合金耐点蚀性能的影响

采用SEM、EDS、TEM等方法研究了不同热处理温度对G3合金组织形态及晶界析出相的影响;进而利用浸泡模拟实验和电化学实验,分析组织变化以及晶界析出相对G3合金耐点蚀性能的影响。结果表明:晶界析出相对G3合金耐点蚀性能起着关键的作用。低温退火时由于G3合金析出相变少,组织均匀性增加,G3合金耐点蚀性能有所增加。而随着退火温度的进一步升高,在晶界生成大量的析出相。析出相的大量生成使得G3合金组织不均匀性增加,同时造成贫Mo区域钝化膜稳定性变差,容易发生局部活化溶解,点蚀敏感性明显增加。     

多向锻造和单向轧制304不锈钢高温退火后的晶界面分布

固溶处理后的2组304不锈钢样品分别经应变量ε=2的多向锻造(MF)和单向轧制(DR)后,再经900℃高温退火2—120min.采用电子背散射衍射(EBSD)技术和五参数晶界面分析方法(FPA),研究了样品的晶界特征分布(GBCD)和晶界面分布(GBPD).结果表明,2组样品中∑3~n(n=1,2,3)特殊晶界的比例均不超过45%,并且在退火过程中,非共格∑3晶界逐渐共格化,∑9和∑27晶界比例也随之下降.分别经MF和DR处理后再经120 min退火的样品中,一般大角度晶界(过滤掉Σ3n)一般均以(111)扭转晶界和〈110〉倾侧晶界为主,表明样品中均存在明显的晶界织构(GBT);在某些特定取向差条件下,一般大角度晶界的GBPD在样品中存在显著差异,表明退火之前的加工过程对304不锈钢的GBPD有显著影响.     

In-situ crack propagation observation in fully lamellar Ti-49%Al alloy

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Microscopic study for the behavior of grain boundary using molecular dynamics

In this study, MD simulations have been performed to observe the behavior of a grain boundary in an a-Fe plate under 2-dimensional loading. In MD simulation, the acceleration of every molecule can be achieved from the potential energy and the force interacting between each molecule, and the integration of the motion equation by using the Verlet method gives the displacement of each molecule. Initially, four α-Fe rectangular plates which have different misorientation angles of grain boundary were modeled by using the Johnson potential and Morse potential. We compared the potential energy of the grain boundary system with that of the perfect structure model, which does not have a grain boundary inside. Also, we could obtain the width of the grain boundary by investigating the local potential energy distribution. The tensile loading for each grain boundary model at room temperature was applied and the behavior of the grain boundary was studied. From this study it was clarified that when the Johnson potential is used, the obvious fracture mechanism occurs along the grain boundary. With the Morse potential, the diffusion of the grain boundary appears instead of the grain boundary fracture.     

HREM STUDY OF GRAIN BOUNDARY PHASES IN Fe-Ni-Co-Nb-Ti SUPERALLOY

ＨＲＥＭＳＴＵＤＹＯＦＧＲＡＩＮＢＯＵＮＤＡＲＹＰＨＡＳＥＳＩＮＦｅ－Ｎｉ－Ｃｏ－Ｎｂ－ＴｉＳＵＰＥＲＡＬＬＯＹＲ．Ｍ．Ｗａｎｇ；Ｃ．Ｚ．Ｌｉ；Ｓ．Ｗ．ＺｈａｎｇａｎｄＭ．Ｇ．Ｙａｎ（１）ＩｎｓｔｉｔｕｔｅｏｆＡｅｒｏｎａｕｔｉｃａｌＭａｔｅｒｉａｌ...     

SIMULATIVE INVESTIGATION OF GRAIN BOUNDARIES IN NiAl ALLOY

１ＩＮＴＲＯＤＵＣＴＩＯＮＮｉＡｌａｌｏｙｗｉｔｈａＢ２ｓｔｒｕｃｔｕｒｅｈａｓａｈｉｇｈｍｅｌｔｐｏｉｎｔ（１６３８℃），ｌｏｗｄｅｎｓｉｔｙ（５．８６ｇ／ｃｍ３），ｈｉｇｈｍｏｄｕｌｅ（２９４ＧＰａ）ａｎｄｈｉｇｈｈｅａｔｃｏｎｄｕｃｔｉｏｎｃｏ...     

Al-Zn-Mg-Cu合金在时效过程中η相沿小角晶界的析出序列

采用高分辨透射电子显微镜和高角环形暗场扫描透射电子显微镜结合X射线能谱仪,研究Al-Zn-Mg-Cu合金叩相沿小角晶界的析出序列。试样在135℃分别时效5min到6h。结果表明,η相在小角晶界的析出序列是：SSS→VRC→GPⅡ区→η’→η。基于非平衡晶界偏析和非平衡晶界共偏析理论,在Al-Zn-Mg-Cu合金时效过程中,通过溶质一空位对的扩散,大量的沉淀形成元素偏析到晶界。这种晶界偏析在VRC、GPⅡ区、η’相和η相的形核和生长中起重要作用。