Effect of the filler size and content on the thermomechanical properties of particulate aluminum nitride filled epoxy composites

Polymer matrix composites based on brominated epoxy as the matrix and aluminum nitride (AlN) particles as the filler were prepared. The influences of the size, content, and size distribution of AlN on the thermomechanical properties, including the glass‐transition temperature (T_g), coefficient of thermal expansion (CTE), dynamic storage modulus (E′), dynamic loss modulus (E″), and loss factor (tan δ), of the composites were investigated by thermomechanical analysis and dynamic mechanical analysis. There was a total change trend for T_g; that is, T_g of the composites containing nano‐aluminum nitride (nano‐AlN; 50 nm) was lower than that of the micro‐aluminum nitride (micro‐AlN; 2.3 μm) filled composites, especially at high nano‐AlN contents. The T_g depression of the composites containing nano‐AlN was related to the aggregation of nano‐AlN and voids in the composites. On the other hand, the crosslink density of the epoxy matrix decreased for nano‐AlN‐filled composites, which also resulted in a T_g depression. The results also show that E′ and E″ increased, whereas tan δ and CTE of the composites decreased, with increasing the AlN content or increasing nano‐AlN fraction at the same AlN content. These results indicate that increasing the interfacial areas between AlN and the epoxy matrix effectively enhanced the dynamic modulus and decreased CTE. In addition, at a fixed AlN content of 10 wt %, a low E′ of pre‐T_g (before T_g temperature) and high T_g were observed at the smaller weight ratio of nano‐AlN when combinations of nano‐AlN plus micro‐AlN were used as the filler. This may have been related to the best packing efficiency at that weight ratio when the bimodal filler was used. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Synthesis and Thermomechanical Behavior of (Qua)ternary Thiol-ene(/acrylate) Copolymers

The objective of this work is to characterize and understand the structure-to-thermomechanical property relationship in thiol-ene and thiol-ene/acrylate copolymers in order to complement the existing studies on the kinetics of this polymerization reaction. Forty-one distinct three- and four-part mixtures were created with systematically varied functionality, chemical structure, type and concentration of crosslinker. The resulting polymers were subjected to dynamic mechanical analysis and tensile testing at their respective glass transition temperature, T_g, to quantify and understand their thermomechanical properties. The copolymer systems exhibited a broad range of T_g, rubbery modulus – E_r and failure strain. The addition of a difunctional high-T_g acrylate to several three-part systems increased the resultant T_g and E_r. Higher crosslink densities generally resulted in higher stress and lower strain at failure. The tunability of the thermomechanical properties of these copolymer systems is discussed in terms of inherent advantages and limitations in light of pure acrylate systems.     

Relationships between thermally induced residual stresses and architecture of epoxy‐amine model networks

The capability of epoxy‐amine resins to develop residual stresses was studied as a function of temperature and network architecture. These residual stresses were induced while cooling epoxy‐glass bilayers from temperatures higher than the network glass transition temperature, T_g. This behavior was the result of the marked differences (α_r − α_g), in linear thermal expansion coefficient of the two components, as evidenced by the measurement of α_r for the epoxy networks under study. Various network architectures were selected, resulting from variation of (1) the chemical nature of both epoxide and curing agent, (2) the nature and relative amount of the chain‐extensor agent, and (3) the stoichiometric ratio. Three ranges of cooling temperature were observed systematically: first, the range of temperatures above T_g, where no stress has been detected, then an intermediate temperature range (from T_g to T*), where stresses develop quite slowly, and finally, the low temperature range (T < T*), where a linear increase in stress accompanies the decrease of temperature. The two latter regimes were quantitatively characterized by the extent, T_g − T*, of the first one and by the slope, SDR, of the second one. T_g − T* values were shown to be governed by the T_g of the network: the higher the T_g, the larger the gap between T_g and T*. This result was interpreted by accounting for the variation of relaxation rate at T_g from one network to the other. It was also shown that a semiempirical relationship holds between SDR and T_g: SDR decreases monotonically as T_g increases. By inspecting the effects of network architecture in more details, it turned out that SDR is governed by the Young's moduli, E_r(T − T_g), of the epoxy resins in the glassy state: the lower E_r(T − T_g), the lower SDR in a series of homologous networks. As E_r(T − T_g) values are known to be related to the characteristics of the secondary relaxation β, which depends, in turn, on crosslink density, SDR values were finally connected to the amplitude of the β relaxation processes. This finding was corroborated by the measurements on an antiplasticized dense network. Finally, data relative to thermoplastic‐filled networks showed that the addition of thermoplastic reduces the development of residual stresses, whatever the system, is homogeneous or biphasic. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 75: 638–650, 2000     

Optically transparent aromatic poly(ester imide)s with low coefficients of thermal expansion. 2: Effect of the introduction of alkyl‐substituted p‐biphenylene units

A series of ester‐linked tetracarboxylic dianhydrides (TA‐X) were synthesized from trimellitic anhydride chloride and 4,4′‐biphenol analogs containing different numbers and positions of methyl substituents. Aromatic poly(ester imide)s (PEsIs) were polymerized from TA‐Xs and 2,2′‐bis(trifluoromethyl)benzidine to investigate the film properties systematically. A significant substituent effect on the target properties (T_g, optical transparency, the linear coefficient of thermal expansion (CTE) and ductility) was observed. A PEsI containing 2,2′,3,3′,5,5′‐hexamethyl‐substituted p‐biphenylene units was chemically imidized in a homogeneous state. It was highly soluble at room temperature, even in less hygroscopic non‐amide solvents such as cyclopentanone (CPN), and provided a stable CPN solution with a high solid content. The CPN‐cast PEsI film was almost colorless as suggested from the rather low yellowness index (3.2), high light transmittance at 400 nm (71.5%) and very low haze (1.15%). This PEsI film also had a high T_g (294 °C, determined by thermomechanical analysis) in addition to a low CTE (21.7 ppm K^?1), moderate film ductility and very low water uptake. A structural modification of the PEsI by copolymerization with a tetracarboxylic dianhydride with a rigid/linear structure was effective in further reducing the CTE while maintaining the other excellent target properties. Thus, some of the PEsIs developed in this work are promising candidates as novel plastic substrates for use in image display devices. © 2017 Society of Chemical Industry     

Stress relaxation behavior of biaxially oriented poly(ethylene terephthalate)

The stress relaxation behavior of biaxially oriented semicrystalline poly(ethylene terephthalate) was studied by thermomechanical analysis. Experimental techniques were developed for thin films. Relaxation moduli were measured as a function of stress, time, and temperature. The relaxation modulus was shown to be independent of stress over the range tested. Rate of loss of the relaxation modulus was found to be a nonlinear function of time and temperature up to about 100°C, encompassing the T_g for the polymer. Over the temperature range of 100–120°C it was primarily temperature-dependent. An empirical time—temperature superposition showed that significant losses in modulus can occur at very short times. At temperatures above the T_g these losses can result in significantly reduced film physical properties.     

Mechanical properties of films prepared from model high‐glass‐transition‐temperature/low‐glass‐transition‐temperature latex blends

The mechanical properties of films prepared from model high‐glass‐transition‐temperature (T_g)/low‐T_g latex blends were investigated with tensile testing and dynamic mechanical analysis. Polystyrene (PS; carboxylated and noncarboxylated) and poly(n‐butyl methacrylate‐co‐n‐butyl acrylate) [P(BMA/BA); noncarboxylated] were used as the model high‐T_g and low‐T_g latexes, respectively. Carboxyl groups were incorporated into the PS latex particles to alter their surface properties. It was found that the presence of carboxyl groups on the high‐T_g latex particles enhanced the Young's moduli and the yield strength of the PS/P(BMA/BA) latex blend films but did not influence ultimate properties, such as the stress at break and maximum elongation. These phenomena could be explained by the maximum packing density of the PS latex particles, the particle–particle interfacial adhesion, and the formation of a “glassy” interphase. The dynamic mechanical properties of the latex blend films were also investigated in terms of the carboxyl group coverage on the PS latex particles; these results confirmed that the carboxyl groups significantly influenced the modulus through the mechanism of a glassy interphase formation. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 2788–2801, 2002     

Conversion–temperature–property diagram for a liquid dicyanate ester/high-Tg polycyanurate thermosetting system

The effects of conversion and temperature on the dynamic mechanical properties (at ≈ 1 Hz) of a dicyanate ester/polycyanurate thermosetting system are investigated after cure using torsional braid analysis (TBA). Extent of conversion is measured by T_g. The isothermal glassy-state modulus at measurement temperatures below the glass transition temperature of the monomer (T_g0) decreases with increasing conversion. The isothermal modulus at temperatures above T_g0 passes through a maximum due to competition between increase in the isothermal glassy-state modulus at the measurement temperature due to the vitrification process during cooling and the aforementioned decrease in the modulus with increasing conversion, which is considered to be due primarily to steric constraints in the developing network. The maximum in the isothermal modulus is associated with the boundary between the glass and glass transition regions. The experimental results are summarized in a conversion (T_g)–temperature–property diagram, the T_gTP diagram, which is a framework for understanding relationships between transitions and material properties for thermosetting systems. © 1994 John Wiley & Sons, Inc.     

Evaluation of new 3‐mercaptopropionate thiols for thiol‐ene photopolymerization coatings using experimental design

Three 3‐mercaptopropionate thiols, 1,6‐Hexane bis(3‐mercaptopropionate) (HD‐SH), trans‐1,4‐Cyclohexanedimethyl bis(3‐mercaptopropionate) (CHDM‐SH), and 4,4′‐Isopropylidenedicyclohexane bis(3‐mercaptopropionate) (HBPA‐SH) were formulated with 1,3,5‐triallyl‐1,3,5‐triazine‐2,4,6(1H,3H,5H)‐trione (TATATO) and photoinitiator. The formulations were photopolymerized via thiol‐ene photopolymerization. A ternary experimental design was employed to elucidate the influence the three thiols on the thermomechanical and coatings properties of thiol‐ene photopolymerizable materials. Tensile strength, tensile modulus, elongation‐to‐break, glass transition temperature (T_g), and crosslink density (XLD) were investigated. Coating properties including pencil hardness, pull‐off adhesion, MEK double rubs, and gloss were also investigated. Relative reaction conversion was determined by photo differential scanning calorimeter (PDSC). Thiol‐ene photopolymerizable materials containing HBPA‐SH resulted in improving tensile strength, tensile modulus, T_g, and pencil hardness but lowering of crosslink density and relative conversion. This was attributed to steric and rigidity of the double cycloaliphatic structure. The inclusion of CHDM‐SH into the systems resulted in the synergistic effect on elongation‐to‐break and pull‐off adhesion. The HD‐SH generally resulted in a diminution of thermomechanical and coating properties, but improved the crosslink density. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Anionic copolymers of octanelactam with laurolactam (nylon-8/12)—IV. Dynamic thermomechanical and mechanical properties

The thermomechanical and the mechanical properties of a recent series of copolyamides of octanelactam (OL) and laurolactam (LL) (nylon-8/nylon-12) were studied. The glass transition temperature (T_g) and melting point (T_m) were determined with dynamic mechanical thermal analyser, and compared to those obtained with differential scanning calorimetry and the activation energy for glass transition was calculated. The copolyamides showed a minimum for tensile strength, yield stress, stress at 100% and modulus and a maximum for elongation at break at the composition 60/40 (OL/LL) which has the lowest crystallinity. Young's modulus against % elongation showed the classification of copolyamides in two groups (rich in OL or LL, respectively).     

Rheological characterization of 4,4′-bis(diethylamino)benzophenone-functionalized polybutadienes with low and medium vinyl content

An experimental study was undertaken to investigate the thermomechanical properties of a certain epoxy/amine configuration. The basic structure of all the epoxies was the same—DGEBA—and the curing agent used was PACM 20. By varying the epoxy prepolymer molecular weight and the stoichiometry between epoxy and amine, a range of different epoxy networks were produced. Glass transition temperatures were evaluated by using differentil scanning calorimetry (DSC). Modulus values as well as an alternative T_g determination were provided by dynamic mechanical analysis (DMA). Coefficients of thermal expansion were obtained from thermomechanical analysis (TMA). The tensile tests conducted at room and elevated temperatures provided additional modulus data along with the yield point, tensile strength, and elongation at break data. Property vs. stoichiometry curves exhibited a maximum for the glass transition temperature and the over the T_g modulus at the stoichiometric point. On the other hand, the under T_g modulus showed a minimum at the stoichiometric point. The results of the yield strength show remarkable similarity with the results of the modulus. Strength and elongation at break do not show clear trends, but a much different behavior is exhibited between room and elevated temperatures. © 1996 John Wiley & Sons, Inc.     

Effect of silica nanoparticle size on toughening mechanisms of filled epoxy

The addition of silica nanoparticles (23 nm, 74 nm, and 170 nm) to a lightly crosslinked, model epoxy resin, was studied. The effect of silica nanoparticle content and particle size on glass transition temperature (T_g), coefficient of thermal expansion (CTE), Young's modulus (E), yield stress (σ), fracture energy (G_IC) and fracture toughness (K_IC), were investigated. The toughening mechanisms were determined using scanning electron microscopy (SEM), transmission electron microscopy (TEM) and transmission optical microscopy (TOM). The experimental results revealed that the addition of silica nanoparticles did not have a significant effect on T_g or the yield stress of epoxy resin, i.e. the yield stress and T_g remained constant regardless of silica nanoparticle size. As expected, the addition of silica nanoparticles had a significant impact on CTE, modulus and fracture toughness. The CTE values of nanosilica-filled epoxies were found to decrease with increasing silica nanoparticle content, which can be attributed to the much lower CTE of the silica nanoparticles. Interestingly, the decreases in CTE showed strong particle size dependence. The Young's modulus was also found to significantly improve with addition of silica nanoparticles and increase with increasing filler content. However, the particle size did not exhibit any effect on the Young's modulus. Finally, the fracture toughness and fracture energy showed significant improvements with the addition of silica nanoparticles, and increased with increasing filler content. The effect of particle size on fracture toughness was negligible. Observation of the fracture surfaces using SEM and TOM showed evidence of debonding of silica nanoparticles, matrix void growth, and matrix shear banding, which are credited for the increases in toughness for nanosilica-filled epoxy systems. Shear banding mechanism was the dominant mechanism while the particle debonding and plastic void growth were the minor mechanisms.     

Properties of a reactive‐graphitic‐carbon‐nanofibers‐reinforced epoxy

Our previous studies showed that herringbone graphitic GNFs surface‐derivatized with reactive linker molecules bearing pendant primary amino functional groups capable of binding covalently to epoxy resins. Of special importance, herringbone GNFs derivatized with 3,4′‐oxydianiline (GNF‐ODA) were found to react with neat butyl glycidyl ether to form mono‐, di‐, tri‐, and tetra‐glycidyl oligomers covalently coupled to the ODA pendant amino group. The resulting reactive GNF‐ODA (butyl glycidyl)_n nanofibers, r‐GNF‐ODA, are especially well suited for reactive, covalent incorporation into epoxy resins during thermal curing. Based on these studies, nanocomposites reinforced by the r‐GNF‐ODA nanofibers at nanofiber loadings of 0.15–1.3 wt% were prepared. Flexural property of cured r‐GNF‐ODA/epoxy nanocomposites were measured through three‐point‐bending tests. Thermal properties, including glass transition temperature (T_g) and coefficient of thermal expansion (CTE) for the nanocomposites, were investigated using thermal mechanical analysis. The nanocomposites containing 0.3 wt% of the nanofibers gives the highest mechanical properties. At this 0.3‐wt% fiber loading, the flexural strength, modulus and breaking strain of the particular nanocomposite are increased by about 26, 20, and 30%, respectively, compared to that of pure epoxy matrix. Moreover, the T_g value is the highest for this nanocomposite, 14°C higher than that of pure epoxy. The almost constant change in CTEs before and after T_g, and very close to the change of pure epoxy, is in agreement with our previous study results on a chemical bond existing between the r‐GNF‐ODA nanofibers and epoxy resin in the resulting nanocomposites. POLYM. COMPOS., 28:605–611, 2007. © 2007 Society of Plastics Engineers     

Sealing glass‐ceramics with near‐linear thermal strain,part III: Stress modeling of strain and strain rate matched glass‐ceramic to metal seals

Thermal mechanical stresses of glass‐ceramic to stainless steel (GCtSS) seals are analyzed using finite element modeling over a temperature cycle from a set temperature (T_set) 500°C to ?55°C, and then back to 600°C. Two glass‐ceramics having an identical coefficient of thermal expansion (CTE) at ~16 ppm/°C but very different linearity of thermal strains, designated as near‐linear NL16 and step‐like SL16, were formed from the same parent glass using different crystallization processes. Stress modeling reveals much higher plastic strain in the stainless steel using SL16 glass‐ceramic when the GCtSS seal cools from T_set. Upon heating tensile stresses start to develop at the GC‐SS interface before the temperature reaches T_set. On the other hand, the much lower plastic deformation in stainless steel accumulated during cooling using NL16 glass‐ceramic allows for radially compressive stress at the GC‐SS interface to remain present when the seal is heated back to T_set. The qualitative stress comparison suggests that with a better match of thermal strain rate to that of stainless steel, the NL16 glass‐ceramic not only improves the hermeticity of the GCtSS seals, but would also improve the reliability of the seals exposed to high‐temperature and/or high‐pressure abnormal environments.     

Characterization of highly filled wood flour–polyvinyl chloride composites: Dynamic mechanical and dielectric analysis

Viscoelastic and dielectric properties of composites with polyvinyl chloride as major matrix constituent, ethylene vinyl acetate (EVA) as polymeric plasticizer, and wood flour (WF) and fly ash (FA) as filler have been studied. The effect of variation of WF, FA, and EVA on storage modulus E′, loss modulus E″, and glass transition temperature, T_g has been evaluated using dynamic mechanical analysis (DMA). Effect on permittivity ε′ and conductivity is evaluated using dielectric analysis. The results show considerable influence of constituents of the composite on the properties evaluated. DMA shows that WF contributes to an increase in T_g, E′, and E″ and a decrease in loss tangent, tan δ. The FA content has insignificant effect on these properties. Increasing WF content increases ε′. POLYM. ENG. SCI., 2010. © 2010 Society of Plastics Engineers     

Chemorheology and thermomechanical characteristics of benzoxazine‐urethane copolymers

In this research, processability and some important thermomechanical properties of polybenzoxazine (BA‐a) modified with a highly flexible urethane elastomer (PU) are discussed. This copolymer has been reported to show synergy in its glass transition temperature and some mechanical properties thus provides a fascinating group of high temperature polymers with enhanced flexibility. The results reveal that a processing window of the BA‐a/PU mixtures is widened with the increasing urethane prepolymer fraction, that is, the liquefying temperature is lowered and the gel point shifted to higher temperature with the amount of the PU. Synergism in glass transition temperature (T_g) of this copolymer was clearly confirmed, i.e., T_g's of the BA‐a/PU alloys were significantly greater than those of the parent resins, i.e., BA‐a (T_g = 166°C) and PU (T_g = ? 70°C). In addition, flexural modulus was found to systemically decrease from 5.4 GPa of the neat polybenzoxazine to 2.1 GPa at 40% by weight of the PU. Flexural strength of the alloys also shows a synergistic behavior at the BA‐a/PU ratio of 90/10. Coefficient of thermal expansion of the polymer alloys were also found to show a minimum value at BA‐a/PU = 90/10. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Dynamic mechanical properties of poly(vinyl chloride)–xonotlite composite system

The filler effect of xonotlite (6CaO.6SiO₂.H₂O; needle-shaped) on dynamic mechanical properties, such as storage modulus (E′), loss modulus (E″), and tan δ was studied for the PVC—xonotlite composite system. And the properties of the system containing mechanically or chemically disaggregated particle of xonotlite were compared with those of the system-filled aggregates. The dynamic mechanical properties obviously depends on the dispersion condition of xonotlite particle. The aggregates of xonotlite produces a remarkably high modulus, an increase in T_g, and a decrease in mechanical damping near T_g in the system. On the other hand, the disaggregates, especially the chemical disaggregate one, bring softer or more rubbery properties in these systems. The interaction between matrix and filler was the strongest in the aggregates system and decreases in the order, mechanical disaggregates system, chemical disaggregates system.     

Characterization and thermal degradation of poly(d,l‐lactide‐co‐glycolide) composites with nanofillers

Chemical and thermal characterization of poly(d ,l ‐lactide‐co‐glycolide) (PLGA) composites filled with hydroxyapatite (HA) or carbon nanotubes (CNT) were evaluated by infrared spectroscopy, differential scanning calorimetry, thermogravimetry, and dynamic–mechanical–thermal analysis. The morphology and distribution of the nanoparticles were studied by transmission electron microscopy. The composites were prepared by solvent casting using 30% HA or 1, 3, and 5% of pristine and functionalized CNT as nanoparticles and PLGA 75:25 and PLGA 50:50 as copolymer matrix. The Coats–Redfern and E₂ function methodologies were used to calculate the reaction order and the activation energy (E_a) of the thermal degradation process. It was found that the addition of nanoparticles increased the glass transition temperature (T_g) of the composites. Also, higher degradation temperatures and E_a values were obtained for PLGA–HA composites and compared with the neat copolymer, and the opposite behavior was exhibited by PLGA–CNT composites. The thermal and mechanical properties were highly dependent on the morphology and dispersion of the filler. The functionalization process of CNT promoted, to some extent, a better distribution and dispersion of CNT into the matrix, and these composites exhibited a slight enhancement on storage modulus. On the other hand, PLGA–HA composites showed a good dispersion but no improvement on the storage modulus below T_g. POLYM. ENG. SCI., 2013. © 2012 Society of Plastics Engineers     

Epoxy resin/polyurethane functionally graded material prepared by microwave irradiation

The glass‐transition temperature (T_g) and modulus (E) of graded material in a plastic–elastomer system prepared with layer‐by‐layer casting in connection with microwave curing were studied. Epoxy (EP) resin and polyurethane (PU) were selected as the plastic and elastomer components, respectively. The structure of the functionally graded material (FGM) was such that EP (E = 3.2 GPa, and T_g = 162°C) and PU (E = 0.069 GPa and T_g = ?54°C) were both surfaces, with a stepwise gradient in EP and PU content existing between the two over a thickness of 9 mm. Fourier transform infrared spectroscopy and scanning electron microscopy were used to investigate the PU content and the morphologies of the FGMs separately. Finite element analysis (FEA) was used to simulate the temperature and thermal stress distribution along the graded direction under a steady‐state, nonuniform temperature field. The results of FEA showed that the temperature and thermal stress distribution decreased along the graded direction. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 94: 994–999, 2004     

Reaction kinetics modeling and thermal properties of epoxy–amines as measured by modulated‐temperature DSC. I. Linear step‐growth polymerization of DGEBA + aniline

A mechanistic approach including both reactive and nonreactive complexes can successfully simulate both nonreversing (NR) heat flow and heat capacity (C_p) signals from modulated‐temperature DSC in isothermal and nonisothermal reaction conditions for different mixtures of diglycidyl ether of bisphenol A + aniline. The reaction of the primary amine with an epoxy–amine complex initiates cure (E_1A1 = 80 kJ mol^?1), whereas the reactions of the primary amine (E_1OH = 48 kJ mol^?1) and secondary amine (E_2OH = 48 kJ mol^?1) with an epoxy–hydroxyl complex are rate determining from about 2% epoxy conversion on. The reliability of the proposed mechanistic model was verified by experimental concentration profiles from Raman spectroscopy. When cure temperatures are chosen inside or below the full cure glass‐transition region, vitrification takes place partially or completely, respectively, as can be concluded from the magnitude of the stepwise decrease in C_p. The effect of the epoxy conversion (x) and mixture composition on thermal properties such as the glass‐transition temperature (T_g), the change in heat capacity at T_g [ΔC_p(T_g)], and the width of the glass transition region (ΔT_g) are considered. The Couchman relationship, in which only T_g and ΔC_p(T_g) of both the unreacted and the fully reacted systems are needed, was evaluated to predict the T_g– x relation by using simulated concentration profiles. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 91:2798–2813, 2004