Synthesis and characterization of copolyimides with high solubility

A series of copolyimides were prepared from various diamines (polysiloxane and isophorone units) with aromatic tetracarboxylic dianhydrides via a two‐step (thermal imidization) method. The monomers and polymers were produced in high yields, and the copolyimides containing Si? O? C bonds and asymmetric meta catenation in the polymer backbone exhibited good solubility. The glass‐transition temperatures (T_g's) of all the copolyimides were found to be 201–262 and 215–258°C by differential scanning calorimetry (DSC) and dynamic mechanical analysis, respectively. Thermogravimetric analyses indicated that the polymers were fairly stable up to 502–578°C (10 wt % loss in N2) and 490–574°C (10 wt % loss in air). The char yields at 800°C in N2 and air atmospheres were 26–59 and 20–53%, respectively. The copolymerization results, determined with 1H‐NMR and DSC, indicated a random copolymer. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 1963–1970, 2003     

Polyimides derived from 1,4‐bis [3‐oxy‐(N‐aminophthalimide)] benzene

A novel diamine, 1,4‐bis [3‐oxy‐(N‐aminophthalimide)] benzene (BOAPIB), was synthesized from 1,4‐bis [3‐oxy‐(N‐phenylphthalimide)] benzene and hydrazine. Its structure was determined via IR, ¹H NMR, and elemental analysis. A series of five‐member ring, hydrazine‐based polyimides were prepared from this diamine and various aromatic dianhydrides via one‐step polycondensation in p‐chlorophenol. The inherent viscosities of these polyimides were in the range of 0.17–0.61 dL/g. These polymers were soluble in polar aprotic solvents and phenols at room temperature. Thermogravimetric analysis (TGA) showed that the 5% weight‐loss temperatures of the polyimides were near 450°C in air and 500°C in nitrogen. Dynamic mechanical thermal analysis (DMTA) indicated that the glass‐transition temperatures (T_gs) of these polymers were in the range of 265–360°C. The wide‐angle X‐ray diffraction showed that all the polyimides were amorphous. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Preparation and characterization of poly(silyl ester)s containing 2,2‐bis(p‐dimethylsiloxy‐phenyl)propane units in the polymer backbones

The two poly(silyl ester)s containing 2,2‐bis(p‐dimethylsiloxy‐phenyl)propane units in the polymer backbones have been prepared via polycondensation reaction of di‐tert‐butyl adipate and di‐tert‐butyl fumarate with 2,2‐bis(p‐chloro dimethylsiloxy‐phenyl)propane to give tert‐butyl chloride as the condensate. The polymerizations were performed under nitrogen at 110°C for 24 h without addition of solvents and catalysts to obtain the poly(silyl ester)s with weight average molecular weights typically ranging from 5000 to 10,000 g/mol. Characterization of the poly(silyl ester)s included ¹H NMR and ¹³C NMR spectroscopies, infrared spectroscopy, ultraviolet spectroscopy, differential scanning calorimetry, thermogravimetric analysis (TGA), gel permeation chromatography, and Ubbelohde viscometer. The glass transition temperatures (T_g) of the obtained polymers were above zero because of the introducing 2,2‐bis(p‐dimethylsiloxy‐phenyl)propane units in the polymer backbones. The TGA/DTG results showed that the obtained poly(silyl ester)s were stable up to 180°C and the residual weight percent at 800°C were 18 and 9%, respectively. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 1937–1942, 2006     

Preparation of Transparent Polyimides Derived from cis‐ and trans‐Dicyclohexyl‐3,3′,4,4′‐tetracarboxylic Dianhydrides

Two series of alicyclic polyimides composed of cis‐ and trans‐dicyclohexyl‐3,3′,4,4′‐tetracarboxylic dianhydrides (DCDAs) and aromatic diamines were prepared. All cis‐polymers could be readily prepared both in a one‐step method and a two‐step method. However, a two‐step method is preferably applied in the preparation of trans‐polymers, because in a one‐step method the trans‐configuration is partially lost at higher temperatures. These polyimide solutions could be cast into tough and flexible films, which were characterized by inherent viscosity, GPC, DSC, TGA measurements, and UV‐vis spectroscopy. The glass transition temperatures (T_g's) of the polymers were in the range of 210–270°C and the 5% weight loss temperatures were around 480°C for all PIs prepared. The optical transmittances of these films were more than 80% at 350 nm for ca. 15 μm thickness.     

Synthesis and characterization of hyperbranched poly(silyl ester)s

Hyperbranched poly(silyl ester)s were synthesized via the A₂ + B₄ route by the polycondensation reaction. The solid poly(silyl ester) was obtained by the reaction of di‐tert‐butyl adipate and 1,3‐tetramethyl‐1,3‐bis‐β(methyl‐dicholorosilyl)ethyl disiloxane. The oligomers with tert‐butyl terminal groups were obtained via the A₂ + B₂ route by the reaction of 1,5‐dichloro‐1,1,5,5‐tetramethyl‐3,3‐diphenyl‐trisi1oxane with excess amount of di‐tert‐butyl adipate. The viscous fluid and soft solid poly(silyl ester)s were obtained by the reaction of the oligomers as big monomers with 1,3‐tetramethyl‐1,3‐bis‐β(methyl‐dicholorosilyl)ethyl disiloxane. The polymers were characterized by ¹H NMR, IR, and UV spectroscopies, differential scanning calorimetry (DSC), and thermogravimetric analysis (TGA). The ¹H NMR and IR analysis proved the existence of the branched structures in the polymers. The glass transition temperatures (T_g's) of the viscous fluid and soft solid polymers were below room temperature. The T_g of the solid poly(silyl ester) was not found below room temperature but a temperature for the transition in the liquid crystalline phase was found at 42°C. Thermal decomposition of the soft solid and solid poly(silyl ester)s started at about 130°C and for the others it started at about 200°C. The obtained hyperbranched polymers did not decompose completely at 700°C. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 3430–3436, 2006     

Thermal decomposition kinetics of thermotropic liquid crystalline polyesterimides

We investigated the thermal decomposition behavior of three groups of polyesterimides that had been synthesized from different compositions of monomers that were added in different. We characterized these polymers with thermogravimetric analysis (TGA) and calculated the apparent activation energy (E_a) associated with the thermal decomposition process by the Ozawa method. The results showed that the E_a of the polyesterimides was correlated with the length of the methylene spacer and the content of the 4,4′‐dihydroxybenzophenone monomer. The polyesterimide with four methylene spacers in the main chain had a higher E_a than that with six methylene spacers. The polyesterimide with a higher 4,4′‐dihydroxybenzophenone content provided better thermal stability. The E_a of the polyesterimides also depended on the sequence in which the monomers were added during the copolycondensation process. The E_a of these polyesterimides followed the order: p‐hydroxybenzoic acid added first > p‐hydroxybenzoic acid mixed 4,4′‐dihydroxybenzophenone adding > 4,4′‐dihydroxybenzophenone added first. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 98: 2467–2472, 2005     

Synthesis and characterization of ternary‐copolymer of soluble fluorinated polyimides based on 1,4‐bis (4‐amino‐2‐trifluoromethylphenoxy) benzene

A series of novel ternary‐copolymer of fluorinated polyimides (PIs) were prepared from 1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)benzene (pBATB), commercially available aromatic dianhydrides, and aromatic diamines via a conventional two‐step thermal or chemical imidization method. The structures of all the obtained PIs were characterized with FTIR, ¹H‐NMR, and element analysis. Besides, the solubility, thermal stability, mechanical properties, and moisture uptakes of the PIs were investigated. The weight‐average molecular weight (M_w) and the number‐average molecular weight (M_n) of the PIs were determined using gel‐permeation chromatography (GPC). The PIs were readily dissolved not only in polar solvents such as DMF, DMAc, and NMP, but also in some common organic solvents, such as acetic ester, chloroform, and acetone. The glass transition temperatures of these PIs ranged from 201 to 234°C and the 10% weight loss temperatures ranged from 507 to 541°C in nitrogen. Meanwhile, all the PIs left around 50% residual even at 800°C in nitrogen. The GPC results indicated that the PIs possessed moderate‐to‐high number‐average molecular weight (M_n), ranging from 9609 to 17,628. Moreover, the polymer films exhibited good mechanical properties, with elongations at break of 8–21%, tensile strength of 66.5–89.8 MPa, and Young's modulus of 1.04–1.27 GPa, and low moisture uptakes of 0.54–1.13%. These excellent combination properties ensure that the polymer could be considered as potential candidates for photoelectric and microelectronic applications. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Thermal and dynamic mechanical properties of polyethylene glycol/quartz composites for phase change materials

Polyethylene glycol (PEG)/quartz (denoted as BP/Q) composites have been investigated as candidates of phase change materials (PCMs) due to their thermomechanical properties around the glass transition temperature as well as thermal properties between 30 and 600 °C. Quartz (q-SiO₂) powders were extracted from local sand in Tanah Laut, Pelaihari, South Kalimantan, Indonesia. The composites were prepared by dispersing q-SiO₂ powders in the PEG matrix followed by the wet mixing process. The thermal properties of the composites were characterized using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA), while the thermomechanical properties were examined using a dynamic mechanical analyzer (DMA) in a three-point bending mode around the PEG glass transition temperature range (−100–50°C). The morphology and interface bonding were investigated using scanning electron microscopy (SEM) and transmission electron microscopy (TEM). From the DSC measurement, the endothermic peak of the composites showed a shift of approximately 7–12 °C toward higher temperatures than that of the pure polymer. The melting enthalpy values (ΔH_m) of the BP/Q composites covered the required PCM application range, that is, between 139 and 182 J/g. The TGA of the composites showed that thermal degradation occurs in the range of 250–450 °C. We found that solid–solid PCMs (ssPCMs) were successfully fabricated with the addition of 10 and 20 wt% q-SiO₂. From DMA characterization, the BP/Q 20 wt% composite exhibited the maximum E’ and the minimum energy dissipation (E”). Its E’ value was approximately 250 MPa more than that of the pure PEG. The glass transition (T_g) temperatures of PEG and BP/Q composites (5, 10, and 20 wt%) were around −24.5, −19.1, −17.1, and − 5.3 °C, respectively. In addition, the E” and tan δ values decreased with q-SiO₂ filler content. Furthermore, the Cole-Cole plots of the BP/Q composites revealed a better interfacial bonding between the q-SiO₂ and the PEG matrix in the composites with higher silica content. A compact morphology was shown by the BP/Q 20 wt% composite due to high silica concentration. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 48130.     

Synthesis and characterization of new soluble poly(ester‐imide)s containing noncoplanar 2,2′‐dimethyl‐4,4′‐biphenylene unit

A new diimide–diacid chloride (3) containing a noncoplanar 2,2′‐dimethyl‐4,4′‐biphenylene unit was synthesized by treating 2,2′‐dimethyl‐4,4′‐diamino‐biphenylene with trimellitic anhydride followed by refluxing with thionyl chloride. Various new poly(ester‐imide)s were prepared from 3 with different bisphenols by solution polycondensation in nitrobenzene using pyridine as hydrogen chloride quencher at 170°C. Inherent viscosities of the poly(ester‐imide)s were found to range between 0.31 and 0.35 dL g^?1. All of the poly(ester‐imide)s, except the one containing pendent adamantyl group 5e, exhibited excellent solubility in the following solvents: N,N‐dimethylformamide, tetrahydrofuran, tetrachloroethane, dimethyl sulfoxide, N,N‐dimethylacetamide, N‐methyl‐2‐pyrrolidinone, m‐cresol, o‐chlorophenol, and chloroform. The polymers showed glass‐transition temperatures between 166 and 226°C. The 10% weight loss temperatures of the poly(ester‐imide)s, measured by TGA, were found to be in the range between 415 and 456°C in nitrogen. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 2486–2493, 2004     

Preparation and properties of polyimides based on bis[3,5‐dimethyl‐4‐(4‐aminophenoxy)phenyl]methane

A series of polyimide (PI) thin films were synthesized based on bis[3,5‐dimethyl‐4‐(4‐aminophenoxy)phenyl]methane and conventional aromatic dianhydrides. The structures and properties of the thin films were measured with Fourier transform infrared, NMR, thermogravimetric analysis, dynamic mechanical analysis, and impedance analysis. The PI films exhibited glass‐transition temperatures in the range of 211–300°C and possessed initial thermal decomposition temperature reaching up to 457–482°C in air and 461–473°C in nitrogen. Some PI films had high solubility in organic solvents such as 1‐methyl‐2‐pyrrolidinone, N,N‐dimethylformamide, N,N‐dimethylacetamide, dimethyl sulfoxide, m‐cresol, tetrahydrofuran, and CHCl₃. The mechanical properties of these films were also examined. The dielectric constants of the films were in the range of 2.8–3.3 at 25°C. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 1265–1270, 2007     

The pyrolysis behaviors of ternary copolyimide derived from aromatic dianhydride and aromatic diisocyanates

A polyimide (PI) based on benzophenone‐3,3′,4,4′‐tetracarboxylic acid dianhydride, toluene diisocyanate (TDI), and 4,4′‐methylenebis (phenyl isocyanate) (MDI) has been synthesized via a one‐step polycondensation procedure. The resulting PI possessed excellent thermal stability with the glass transition temperature (T_g) 316°C, the 5% weight loss temperature (T_5%) in air and nitrogen 440.4°C and 448.0°C, respectively. The pyrolysis behaviors were investigated with dynamic thermogravimetric analysis (TGA), TGA coupled with Fourier transform infrared spectrometry (TGA–FTIR) and TGA coupled with mass spectrometry (TGA–MS) under air atmosphere. The results of TGA–FTIR and TGA–MS indicated that the main decomposition products were carbon dioxide (CO₂), carbonic oxide (CO), water (H₂O), ammonia (NH₃), nitric oxide (NO), hydrogen cyanide (HCN), benzene (C₆H₆), and compounds containing NH₂, C?N, N?C?O or phenyl groups. The activation energy (E_a) of the solid‐state process was estimated using Ozawa–Flynn–Wall (OFW) method which resulted to be 143.8 and 87.8 kJ/mol for the first and second stage. The pre‐exponential factor (A) and empirical order of decomposition (n) were determined by Friedman method. The activation energies of different mechanism models were calculated from Coats–Redfern method. Compared with the activation energy values obtained from the OFW method, the actual reaction followed a random nucleation mechanism with the integral form g(α) = ?ln(1 ? α). © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40163.     

Polyamides and polyimides prepared from diaminomaleonitrile and their cross-linking to thermally stable resins

Unsaturated cyano-substituted polyamide and polyimides were prepared from the reactions of diaminomaleonitrile with terephthaloyl dichloride and tetracarboxylic dianhydrides such as pyromellitic dianhydride and benzophenone tetracarboxylic dianhydride. The polymers were characterized by inherent viscosity measurements, by FTIR and ¹H-NMR spectroscopy, as well as by DTA and TGA. They were soluble in polar aprotic solvents and certain strong inorganic and organic acids. Upon curing at 300°C for 70 h, cross-linked polymers were obtained that were stable up to 397–426°C in N₂ or air and afforded anaerobic char yield of 56–61% at 800°C. Their glass transition temperatures as determined by the thermal mechanical analysis (TMA) method were 210–249°C. © 1994 John Wiley & Sons, Inc.     

Fabrication and characterization of soluble,high thermal,and hydrophobic polyimides based on 4‐(3,5‐dimethoxyphenyl)‐2,6‐bis(4‐aminophenyl)pyridine

A novel aromatic diamine monomer, 4‐(3,5‐dimethoxyphenyl)‐2,6‐bis(4‐aminophenyl)pyridine (DPAP) was successfully synthesized by 4′‐nitroacetophenone and 3,5‐dimethoxybenzaldehyde as raw material. The structure of DPAP was confirmed by Fourier transform infrared, nuclear magnetic resonance, and mass analysis. A series of polyimides (PIs) were obtained by polycondensation with various dianhydrides via the conventional two‐step method. These PIs showed good solubility in organic solvents. They also presented high thermal stability, the glass transition temperatures (T_g) of polymers were in the range of 325–388 °C, and the temperature at 10% weight loss was in the range of 531–572 °C. Furthermore, these polymers also exhibited outstanding hydrophobicity with the contact angles in the range of 89.1°–93.5°. Moreover, the results of wide‐angle X‐ray diffraction (WAXD) confirmed these polymers showed amorphous structure. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 45827.     

Synthesis and characterization of novel polyimides derived from 2‐amino‐5‐(4‐aminophenyl)‐thiazole

A new kind of aromatic unsymmetrical diamine monomer containing thiazole ring, 2‐amino‐5‐(4‐aminophenyl)‐thiazole (AAPT), was synthesized. A series of novel polyimides were prepared by polycondensation of AAPT with various aromatic dianhydrides by one‐step polyimidation process. The synthesized polyimides had inherent viscosity values of 0.36–0.69 dL/g and were easily dissolved in highly dipolar solvents. Meanwhile, strong and flexible polyimide films were obtained, which have good thermal and thermo‐oxidative stability with the glass transition temperatures (T_g) of 276.7–346.1°C, the temperature at 5% weight loss of 451–492°C in nitrogen and 422–440°C in air, as well as have outstanding mechanical properties with the tensile strengths of 94–122 MPa, elongations at breakage of 5–18%. These films also had dielectric constants of 3.12–3.38 at 10 MHz. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Semi-aromatic copoly(ether ether amide): Synthesis and properties

A series of semi-aromatic copoly(ether ether amide)s (hydroquinone (HQ) (0%)-HQ (100%)) were synthesized by 1,1-bis(4-hydroxyphenyl)-1-phenylethane (BHPPE), 1,4-benzenediol (HQ) and 1,6-N,N′-bis(4-fuorobenzamide) hexane (BFBH) in this work. The inherent viscosities of copoly(ether ether amide)s were in the range of 0.487–0.769 dl g⁻¹. Following with increase of the content of HQ, the resultant polymers were converted from amorphous to crystalline. The copolymers were found to have high glass transition temperatures (T_g) of 141.4–155.6°C and weight-loss temperature (T_5%) of 423.3–434.3°C. They can be hot-pressed into films with tensile strength of 63.3–87.6 MPa, and storage modulus over 0.8 GPa at about 150°C, indicating good thermal and mechanical property of the obtained copolymers. The results of rheological property showed that the copolymers had good melt flowability and thermal stability. Additionally, the introduction of HQ improved the corrosion resistance of copolymers, the obtained polymers HQ (60%), HQ (80%) and HQ (100%) exhibited better corrosion resistance than that of HQ (0%). Especially, HQ (80%) and HQ (100%) were insoluble in organic polar solvents such as DMSO, DMF because of their crystalline nature, indicating that they had potential to be applied to the corrosion-resistant materials.     

Self‐Generating High‐Temperature Oxidation‐Resistant Glass‐Ceramic Coatings for C–C Composites Using UHTCs

Carbon–carbon (C–C) composites are ideal for use as aerospace vehicle structural materials; however, they lack high‐temperature oxidation resistance requiring environmental barrier coatings for application. Ultra high‐temperature ceramics (UHTCs) form oxides that inhibit oxygen diffusion at high temperature are candidate thermal protection system materials at temperatures >1600°C. Oxidation protection for C–C composites can be achieved by duplicating the self‐generating oxide chemistry of bulk UHTCs formed by a “composite effect” upon oxidation of ZrB₂–SiC composite fillers. Dynamic Nonequilibrium Thermogravimetric Analysis (DNE‐TGA) is used to evaluate oxidation in situ mass changes, isothermally at 1600°C. Pure SiC‐based fillers are ineffective at protecting C–C from oxidation, whereas ZrB₂–SiC filled C–C composites retain up to 90% initial mass. B₂O₃ in SiO₂ scale reduces initial viscosity of self‐generating coating, allowing oxide layer to spread across C–C surface, forming a protective oxide layer. Formation of a ZrO₂–SiO₂ glass‐ceramic coating on C–C composite is believed to be responsible for enhanced oxidation protection. The glass‐ceramic coating compares to bulk monolithic ZrB₂–SiC ceramic oxide scale formed during DNE‐TGA where a comparable glass‐ceramic chemistry and surface layer forms, limiting oxygen diffusion.     

Synthesis and properties of new polymerized monomer reactants matrix resins of pyrrolone–benzimidazole copolymers containing pyridine unit

A series of new polymerized monomer reactants (PMR) matrix resins of poly(pyrrolone‐benzimidazole)s containing a pyridine unit (PPBP) were synthesized by polycondensation of monoethyl ester of cis‐5‐norbornene‐endo‐2,3‐dicarboxylic acid, 2,6‐diphenyl ester pyridinedicarboxylic acid or 3,5‐diphenyl ester pyridinedicarboxylic acid, and diethyl ester of 4,4′‐oxydiphthalic acid with 3,3′‐diaminobenzidine in a mixing solution of anhydrous ethyl alcohol and N‐methylpyrrolidone under given temperature and pressure conditions. The resulting resin solutions showed good solubility in polar organic solvents and stability at room temperature. The corresponding PPBP matrix resin, molded powder, and molded plate were prepared by undergoing amidation, imidization, cyclization, and crosslinking reactions when the reaction temperature was increased from 80 to 350°C, successively; the crosslinking structure was formed by the reverse Diels–Alder reaction at 270–290°C under 50 MPa pressure (2.5–3.5 MPa displayed by the pressure meter). The chemical reactions and properties of the resulting PPBP were studied by means of FTIR, TGA, and DMA methods, and the results indicated that the kinds of PPBP materials retain excellent thermal stability and processability; when the initial decomposition temperature was above 620°C the T_g was at 413.5°C for 3,5‐PPBP‐20 molded plate. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 91: 3981–3990, 2004     

Glass‐transition temperature based on dynamic mechanical thermal analysis techniques as an indicator of the adhesive performance of vinyl ester resin

Vinyl ester resins are being used extensively as matrices in fiber‐reinforced polymer composite materials, but their use as a structural adhesive has been limited. Initial studies investigating the durability of a vinyl ester as a wood adhesive showed unsatisfactory performance in comparison with other adhesives. In this work, the glass‐transition temperatures (T_g's) of a vinyl ester and a E‐glass/vinyl ester composite material, fabricated by the Composites Pressure Resin Infusion System, were determined with dynamic mechanical thermal analysis. The results indicated that the resin cured under ambient conditions had a much lower T_g (～60°C) than the postcured material (～107°C). This suggested undercuring, that is, incomplete crosslinking, of the resin when it was cured at room temperature. E‐glass/vinyl ester samples, however, showed virtually no difference in T_g between room‐temperature‐cured and postcured samples. The exact reasons for this are not currently known but are thought to be both mechanical and chemical in nature. On the basis of the findings presented in this article, it can be concluded that if this vinyl ester resin is to be used as a structural adhesive, postcuring or formulation to ensure a high degree of crosslinking under ambient conditions is necessary. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 2221–2229, 2005     

Synthesis of soluble and thermally stable polyimides from 3,5‐diamino‐N‐(4‐(8‐quinolinoxy) phenyl) aniline and various dianhydrides

Three novel polyimides (PIs) having pendent 4‐(quinolin‐8‐yloxy) aniline group were prepared by polycondensation of a new diamine with commercially available tetracarboxylic dianhydrides, such as pyromellitic dianhydride, 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride, and bicyclo[2.2.2]‐oct‐7‐ene‐2,3,5,6‐tetracarboxylic dianhydride. These PIs were characterized by FTIR, ¹H NMR, and elemental analysis; they had high yields with inherent viscosities in the range of 0.4–0.5 dl g⁻¹, and exhibited excellent solubility in many organic solvents such as N,N‐dimethyl acetamide, N,N′‐dimethyl formamide, N‐methyl pyrrolidone (NMP), dimethyl sulfoxide, and pyridine. These PIs exhibited glass transition temperatures (T_g) between 250 and 325° C. Their initial decomposition temperatures (T_i) ranged between 270 and 450°C, and 10% weight loss temperature (T₁₀) up to 500°C with 68% char yield at 600°C under nitrogen atmosphere. Transparent and hard polymer films were obtained via casting from their NMP solutions. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Synthesis of highly transparent and heat‐resistant polyimides containing bulky pendant moieties

A new diamine with bulky pendant biphenyl and ortho‐position dimethyl structures, 4,4′‐((1,1′‐biphenyl)‐4‐ylmethylene)bis(2,6‐dimethylaniline), was synthesized via a one‐pot reaction of 4‐biphenyl carboxaldehyde and 2,6‐dimethylaniline. The diamine was employed to polymerize with several dianhydrides via one‐step condensation under high‐temperature conditions. The light yellow or colorless polyimide (PI) films obtained were found to have cut‐off wavelengths in the range 286–358 nm and transmittance over 80% in the visible region (400–780 nm). Meanwhile, these PIs possessed excellent solubility in common organic solvents, even in low‐boiling‐point solvents such as chloroform (CHCl₃), dichloromethane (CH₂Cl₂) and tetrahydrofuran. The glass transition temperatures (T_g) of the PIs were determined to exceed 343 °C, even to 456 °C. All PI films were flexible with a tensile strength of 78–119 MPa, a Young's modulus of 2.0–2.5 GPa and elongation at break of 4.0%–8.2%. Therefore, these colorless PIs can be used as candidate materials for flexible display substrates. © 2019 Society of Chemical Industry