Thermal and dielectric properties of KH2PO4 at very low temperatures

Specific heat capacity, thermal conductivity and complex dielectric constant of KH₂ PO₄ have been measured to temperatures as low as 0.1 K. An increase of glasslike anomalies of the specific heat and the thermal conductivity after neutron irradiation has been found. After removing of an applied static electric field a logarithmic time dependence of the dielectric constant has been observed.     

Glasslike behaviour of polycrystalline Pb(Sc0.5 Nb0.5)O3 at low temperatures

Thermal conductivity, specific heat capacity and complex dielectric constant of PSN ceramic have been measured from 0.1 K up to 100 K. The thermal conductivity increases after poling of the sample but no influence of an applied electric field on the specific heat and the dielectric constant has been detected. Below 0.3 K a strong decreasing of the density of states has been observed.     

Hot-pressing sintered BN-SiO2 composite ceramics with excellent thermal conductivity and dielectric properties for high frequency substrate

High thermal conductivity and low dielectric constant are the more and more important properties for high-frequency substrate materials to enhance their heat radiation and reduce signal delay. In this work, a series of BN-SiO₂ composite ceramics for high frequency application were successfully synthesized by hot-pressing sintering method. And their structures, thermal and dielectric properties were systematically studied. According to the results, the excellent thermal conductivity with low dielectric constant and low dielectric loss has been obtained in the BN-SiO₂ ceramic. Compared to the pure SiO₂, the sample with 50?wt% BN addition sintered at 1650?℃ exhibited excellent physical properties, including a high thermal conductivity of 6.75?W/m?K which is almost five times higher than that of pure SiO₂ and a low dielectric constant of 3.73. The achieved high thermal conductivity and appropriate dielectric property of the BN-SiO₂ composite ceramic make it a promising candidate for high-frequency substrate application.     

Spherical Aluminum Nitride Fillers for Heat-Conducting Plastic Packages

It is necessary for encapsulants to have not only a suitable coefficient of thermal expansion (CTE) compatible to IC devices and a low dielectric constant to reduce the device propagation delay, but also a high thermal conductivity to dissipate large amounts of heat from power-hungry, high-speed IC and high-density packages. Fillers such as silica have been mixed with polymers to improve their properties. Aluminum nitride (AlN) is considered as an alternative one, because it has a higher theoretical thermal conductivity of ∼320 W/mK¹, a compatible CTE with silicon chips and a low dielectric constant. Commercial AlN fillers are angular in shape, because they are prepared via grinding coarse AlN powders synthesized by direct nitridation of aluminum metal and classification. The angular AlN are not expected to have high fluidity when mixed with polymers and hence low packing density. Recently, we successfully obtained single-crystalline spherical AlN fillers. Furthermore, polymer composites filled with the spherical AlN showed excellent thermal conductivity (>8 W/mK) as encapsulants for dissipating the heat generated in electronic devices.     

Electric Field Effect on Dielectric Constant of Glycine Phosphite

Study of the effect of an external electric field on the dielectric constant in the paraelectric phase of ferroelectric glycine phosphite crystals has been performed. The dielectric constant behavior under the bias external field has been analyzed in the framework of Landau theory. It is shown that the ferroelectric phase transition is of the first order very close to a tricritical point and the calculated value of the thermal hysteresis is ΔT ≅0.1 K.     

Electro-Thermal model of thermal breakdown in multilayered dielectric elastomers

Energy transduction of dielectric elastomers involves minute electrical and mechanical losses, both of which potentially increase the temperature within the elastomer. Thermal breakdown of dielectric elastomers occur when heat generated therein cannot be balanced by heat loss on the surface, which is more likely to occur in stacked dielectric elastomers. In this article an electro-thermal model of a multilayered dielectric elastomer able to predict the possible number of layers in a stack before thermal breakdown occurs is presented. Simulation results show that point of breakdown is greatly affected by an increase in surrounding temperature and applied electric field. Furthermore, if the stack diameter is large, thermal insulation of the cylindrical surface is a valid approximation. Two different expressions for the electrical conductivity are used, and it is concluded that the Frank-Kamenetskii expression is more conservative in prediction of point of breakdown than the Arrhenius expression, except at high surrounding temperature. © 2018 American Institute of Chemical Engineers AIChE J, 65: 859–864, 2019     

Electrical properties of flexible graphene reinforced polyimide composites

The electrical properties of polyimide and the composite at different volumes fractions were studied in the frequency range 200–20 kHz and in the temperature range 30–200 °C. Increasing the volume fraction of graphene up to 10%, resulted in an extremely large increase in the dielectric constant, which indicates the composites remarkable ability to store electric potential energy under the effect of alternating electric field. An increase in dielectric constant was also observed with increasing temperature and decreasing frequency. The outstanding dielectric properties of polyimide graphene nanocomposites are attributed to the large volume fraction of interfaces in the bulk of the material. The measured increase in dielectric constant with increasing temperature was attributed to the segmental mobility of the polymer chains. The AC conductivity for polyimide and the composites was calculated from the loss factor and a remarkably high conductivity was obtained for the composites due to the formation of conducting paths in the matrix by the graphene sheets. Also this study showed that the thermal conductivity of the composites increased sharply with increasing graphene concentration. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 45372.     

Preparation and dielectric properties of B2O3–Li2O-doped BaZr0.35Ti0.65O3 ceramics sintered at a low temperature

BaZr_0.35Ti_0.65O₃ (BZT) ceramics have been fabricated via a traditional ceramic process at a relatively low sintering temperature using liquid-phase sintering aids B₂O₃ and Li₂O. The dielectric properties of BZT ceramics have been investigated with the emphasis placed on the dielectric properties under an applied dc electric field. The temperature-dependent dielectric constant reveals that the pure BZT and B₂O₃–Li₂O-doped BZT ceramics all have a typical relaxor behavior and diffuse phase transition characteristics. The temperature-dependent dielectric constant under the applied dc electric field shows that the Curie temperature is slightly shifted to higher temperature and the peaks are suppressed and broadened. The dielectric loss is still under 0.005 and tunability is above 20% at an applied dc electric field of 30 kV/cm.     

超支化液晶/Al_2O_3/环氧树脂复合材料电性能研究

采用机械共混及模压成型工艺将Al2O3粉体,含H20哑铃状液晶化合物(HLCP)与环氧树脂(E-51)共混制备了HLCP/EP/Al2O3复合材料。研究了Al2O3含量对材料热稳定性、导电性能、导热性能及热膨胀的影响。结果表明:材料的导热系数、介电常数及热稳定性随Al2O3含量的增加而增大,当Al2O3粉体质量分数达到70%时,材料导热系数是纯环氧树脂的1.7倍;介电损耗、线膨胀系数随Al2O3含量的增加而减小,当Al2O3粉体质量分数为60%时,介电常数为3.71。同时,由于HLCP网格的存在,降低了材料的内耗,提高了复合材料的玻璃化转变温度,增强了电性能。     

Dielectric constant in the incommensurate phase of NH4HSeO4 under electric field

The temperature dependence of the dielectric constant has been measured in NH₄HSeO₄ crystal at bias electric field. It is shown that the temperature of phase transition from the incommensurate to the commensurate phases depends nonlinearly on the applied electric field. Lifshitz point has been reached at field 1.1 MV/m.     

Novel organic–inorganic composites with high thermal conductivity for electronic packaging applications: A key issue review

Significant progress has been made recently in developing the organic–inorganic composites with high thermal conductivity, low dielectric constant, and dielectric loss, for applications in the electronic packaging and substrates. Many studies have shown that some polymers filled with high thermal conductivity and low dielectric loss ceramics are suitable for electronic packaging for device encapsulation. Until now, extensive attentions have been paid to the preparation of polymeric composites with high thermal conductivity and low dielectric loss for the application in electronic packaging. In contrast, the thermal conductivities of these dielectric materials are still not high enough and that might restrict their serviceable range. Herein, we briefly reviewed recent progress in this field and introduced a kind of novel composites with surface insulation modified metal aluminum cores to form multilayer coating structures as fillers in polyimide matrix for electronic applications. This structure can significantly improve the thermal conductivity and dielectric properties of composites and give some insights into the effects of modified fillers of composite materials. Such multilayer core–shell structures should have great potentials for the improvement of nanoparticle‐based fillers and applications of electronic packaging. POLYM. COMPOS., 38:803–813, 2017. © 2015 Society of Plastics Engineers     

复合绝缘导热胶粘剂研究

以增韧的酚醛环氧树脂为基体树脂,氮化铝、氮化硼、氧化铝混杂粒子为导热填料制备了-新型绝缘导热胶粘剂。研究了填料用量对胶粘剂热导率、热阻、介电常数、体积电阻率等性能的影响,发现填料用量为40％时胶粘剂的热导率为O．99 W／mK,热阻为0．70℃／W,介电常数6,体积电阻率4．6×1012Ω·cm,20℃、200℃、250℃下的剪切强度分别为13．0MPa、10．0MPa、5．65MPa。研究结果表明该胶具备良好的电绝缘及力学性能,可以长期在150℃温度下使用,与不加导热填料的相同胶粘剂相比,具有良好的导热能力。     

Adhesion of small particles in electric fields

We discuss experiments performed with an atomic force microscope that has been modified so that an electric field can be applied across a dielectric particle attached to a cantilever. The modified microscope is used to measure the attractive (before contact) and adhesion (after contact) forces for micrometer-sized dielectric particles. From these measurements, the relative contributions of the nonelectrostatic forces and the electrostatic forces to adhesion can be quantified. Surface conductivity is observed to change the particle's attraction to the surface. In large electric fields, the electrostatic forces dominate the particle's adhesion.     

Filling effect on the structural,electrical, and magnetic properties of PVAc/Co composites

Polyvinyl‐acetate/‐cobalt (PVAc/Co) composite films were prepared using a casting technique. The structural and physical properties were studied using X‐ray diffraction (XRD), differential scanning calorimetry (DSC), Fourier transform infrared (FTIR) spectroscopy, dielectric measurements, direct current magnetic susceptibility (χ_dc), and electron spin resonance (ESR). The XRD patterns revealed that the incorporation of Co particles increases the amorphization of PVAc and Co oxide formations. The DSC results suggest that the thermal properties obviously improved. Frequency and filler concentration dependence of the dielectric constant (ε′) and AC conductivity (σ_AC) were measured at room temperature in the frequency range 20 Hz to 3 MHz of pure PVAc and PVAc/Co composite films. The dielectric constant shows usual dielectric dispersion behavior. The dielectric constant and AC conductivity increased with the increase in Co content. The variation of σ_AC is attributed to hopping of polarons and bipolarons in the composites. The filling level dependence of the effective magnetic moment (μ_eff) has been evaluated. The ESR spectra exhibit a peak of an increasing depth as Co content increases. The control of thermal stability, dielectric and magnetic moment of the composites films is interesting for applications such as electric and magnetic sensors. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Determination of Temperature‐Dependent Heat Conductivity and Thermal Diffusivity of Waste Glass Melter Feed

The cold cap is a layer of reacting glass batch floating on the surface of melt in an all‐electric continuous glass melter. The heat needed for the conversion of the melter feed to molten glass must be transferred to and through the cold cap. Since the heat flux into the cold cap influences the rate of melting, the heat conductivity is a key property of the reacting feed. We designed an experimental setup consisting of a large cylindrical crucible with an assembly of thermocouples (TC) that monitors the evolution of the temperature field while the crucible is heated at a constant rate. Then we used two methods to calculate the heat conductivity and thermal diffusivity of the reacting feed: the approximation of the temperature field by polynomial functions and the finite‐volume method (FVM) coupled with least‐squares analysis. Up to 680°C, the heat conductivity of the reacting melter feed was represented by a linear function of temperature.     

Electric field and shearing stress effects on roshelle salt dielectric spectrum parametres

Dispersion of ε* dielectric complex permittivity of Roshelle Salt (RS) poly-domain crystals has been investigated in ultralow frequency range of weak sinusoidal electric field. Two Cole-Cole type ε* dispersion regions were found in RS polar phase. Effects of applied constant electric field and shering stress on the parametres of these ε* dispersion regions and their temperature dependences have been analysed. The values of electric field, shearing stress and activation energy of electric polarization relaxation for both dispersion regions have been determined.     

Polyarylene ether nitrile/divinyl siloxane-bisbenzocyclobutene composite films: Curing reaction and thermal/mechanical/dielectric properties

Polymer dielectrics, are commonly used as insulating materials for electronic products. Light weight, good mechanical properties and high thermal conductivity are important properties. However, electrical and thermal parameters are interrelated, and it is challenging to have a dielectric polymer that is also resistant to high temperatures and high thermal conductivity. Hence, high-performance composite films were prepared by the method of post-solid phase chemical reaction using polyarylene ether nitrile (PEN) and divinyl siloxane-bisbenzocyclobutene (BCB) as raw materials. First, parameters of the curing reaction were determined by rheological and activation energy calculations. Then, through adjusting the content of BCB resin and treatment temperature, the performance of PEN/BCB composites could be tuned. Thermal properties have been studied by differential scanning calorimetry, dynamic mechanical analysis, thermal gravimetric analysis, and hot-disk method. Here, the PEN/BCB composite electric insulating materials with outstanding thermal performance (T_g: 208–400°C, T_5%: 469–544°C, thermal conductivity: 1.270–2.215 W/m K). Besides, its mechanical and dielectric properties were investigated in detail. It is noteworthy that the tensile strength of composite film can exceed a maximum of 130 MPa, which is 23.19% higher compared to the untreated one. Also, PEN/BCB composites own low dielectric constant (2.27–4.08 at 1 KHz), and the relationship between frequency or a wide temperature range and dielectric constant/loss is stable. Thus, it has a greater potential for applications in electronics in high-temperature environments.     

应用马丁─侯状态方程计算含氨气体混合物的物性参数

本文将马丁—侯状态方程用于计算气体混合物的恒压热容、粘度和导热系数．含氨气体混合物的恒压热容为理想气体混合物热容与真实气体混合物剩余热容之和，根据剩余粘度法计算粘度，剩余导热系数法计算导热系数．三种压力，不同温度条件下气体混合物恒压热容、粘度和导热系数的计算结果表明：计算值与实验值相吻合．并分别拟合了合成氨生产三种工艺含氨气体混合物恒压热容、粘度、导热系数的计算式。     

On the thermal conductivity of granular materials

Stationary heat transfer in a granular material consisting of a continuous medium containing spherical granules of other substances is considered under the assumption that the spatial distribution of granules is random. The effective thermal conductivity characterizing macroscopic heat transfer in such a material is expressed as a certain function of the conductivities and volume fractions of the medium and dispersed substances.For reasons of mathematical analogy all the results obtained for the thermal conductivity are valid while computing the effective diffusivity of some admixture in granular materials as well as for evaluation of the effective electric conductivity or the mean dielectric and magnetic permeabilities of granular conductors and dielectrics.     

Studies on thermal degradation kinetics and dielectric properties of polyether imide foam/nanosilica-based nanocomposites

ABSTRACT

In this paper, polyether imide (PEI) having properties such as a high glass transition temperature of 216°C, high heat resistance, high flame resistance, low smoke generation and a high melting point within the range of 400°C, having low thermal conductivity and low dielectric constant was chosen to be a polymeric foam. Water vapor-induced phase separation method was used to prepare PEI foams. PEI foams were reinforced with nano-silica (weight 1, 3 and 5%) in order to alter the dielectric properties, thermal conductivity and degradation kinetics of foamed polymer. The tested samples showed a reduction in dielectric constant than that of solid PEI but at a higher loading, it showed a higher value due to threshold percolation and a reduction in thermal conductivity was observed for foamed PEI. From thermogravimetric analysis, we can conclude that PEI with 3% filler loading showed better thermal stability compared to other PEI foam compositions.