Loop-based inductance extraction and modeling for multiconductor on-chip interconnects

An efficient extraction and modeling methodology for self and mutual inductances within multiconductors for on-chip interconnects is investigated. The method is based on physical layout considerations and current distribution on multiple return paths, leading to loop inductance and resistance. It provides a lumped circuit model suitable for timing analysis in any circuit simulator, which can represent frequency-dependent characteristics. This novel modeling methodology accurately provides the mutual inductance and resistance as well as self terms within a wide frequency range without using any fitting algorithm. Measurement results for single and coupled wires within a multiconductor system, fabricated using 0.13 and 0.18 /spl mu/m CMOS technologies, confirm the validity of the proposed method. Our methodology can be applicable to high-speed global interconnects for post-layout as well as prelayout extraction and modeling.     

CMOS design and analysis of low-voltage signaling methodology for energy efficient on-chip interconnects

This paper provides a comparative study of the low-voltage signaling methodologies in terms of delay, energy dissipation, and energy delay product (energy×delay), and sensitivity technology process variations, and noise. We also present the design of two symmetric low-swing driver-receiver pairs for driving signals on the global interconnect lines. The key advantage of the proposed signaling schemes is that they require only one power supply and threshold voltage, hence significantly reducing the design complexity. The proposed signaling schemes were implemented on 1.0 V CMOS technology, for signal transmission along a wire-length of 10 mm. When compared with other counterpart symmetric and asymmetric low-swing signaling schemes, the proposed schemes perform better in terms of delay, energy dissipation and energy×delay.     

Differential current-sensing for on-chip interconnects

This paper presents a differential current-sensing technique as an alternative to existing circuit techniques for on-chip interconnects. Using a novel receiver circuit, it is shown that, delay-optimal current-sensing is a faster (20% on an average) option as compared to the delay-optimal repeater insertion technique for single-cycle wires. Delay benefit for current-sensing increases with an increase in wire width. Unlike repeaters, current-sensing does not require placement of buffers along the wire, and hence, eliminates any placement constraints. Inductive effects are negligible in differential current-sensing. Current-sensing also provides a tighter bound on delay with respect to process variations. However, current-sensing has some drawbacks. It is power inefficient due to the presence of static-power dissipation. Current-sensing is essentially a low-swing signaling technique, and hence, it is sensitive to full swing aggressor noise.     

A unified RLC model for high-speed on-chip interconnects

In this paper, we propose a compact on-chip interconnect model for full-chip simulation. The model consists of two components, a quasi-three-dimensional (3-D) capacitance model and an effective loop inductance model. In the capacitance model, we propose a novel concept of effective width (W/sub eff/) for a 3-D wire, which is derived from an analytical two-dimensional (2-D) model combined with a new analytical "wall-to-wall" model. The effective width provides a physics-based approach to decompose any 3-D structure into a series of 2-D segments, resulting in an efficient and accurate capacitance extraction. In the inductance model, we use an effective loop inductance approach for an analytic and hierarchical model construction. In particular, we show empirically that high-frequency signals (above multi-GHz) propagating through random signal lines can be approximated by a quasi-TEM mode relationship, leading to a simple way to extract the high-frequency inductance from the capacitance of the wire. Finally, the capacitance and inductance models are combined into a unified frequency-dependent RLC model, describing successfully the wide-band characteristics of on-chip interconnects up to 100 GHz. Non-orthogonal wire architecture is also investigated and included in the proposed model.     

A multiconductor transmission line methodology for global on-chip interconnect modeling and analysis

This paper describes a methodology for global on-chip interconnect modeling and analysis using frequency-dependent multiconductor transmission lines. The methodology allows designers to contain the complexity of series impedance computation by transforming the generic inductance and resistance extraction problem into one of per-unit-length parameter extraction. This methodology has been embodied in a CAD tool that is now in production use by interconnect designers and complementary metal oxide semiconductor (CMOS) process technologists.     

An accurate model for dynamic crosstalk analysis of CMOS gate driven on-chip interconnects using FDTD method

An accurate and time efficient model of CMOS gate driven coupled-multiple interconnects is presented in this paper for crosstalk induced propagation delay and peak voltage measurements. The proposed model is developed using the finite difference time domain (FDTD) technique for coupled RLC interconnects, whereas the alpha power law model is used to represent the transistors in a CMOS driver. As verified by the HSPICE simulation results, the transient response of the proposed model demonstrates high accuracy. Over the random number of test cases, crosstalk induced peak voltage and propagation delay show average errors of 1.1% and 4.3%, respectively, with respect to HSPICE results.     

Electromigration challenges for advanced on-chip Cu interconnects

As technology scales down, the gap between what circuit design needs and what technology allows is rapidly widening for maximum allowed current density in interconnects. This is the so-called EM crisis. This paper reviews the precautions and measures taken by the interconnect process development, circuit design and chip integration to overcome this challenge. While innovative process integration schemes, especially direct and indirect Cu/cap interface engineering, have proven effective to suppress Cu diffusion and enhance the EM performance, the strategies for circuit/chip designs to take advantage of specific layout and EM failure characteristics are equally important to ensure overall EM reliability and optimized performance. To enable future technology scaling, a co-optimization approach is essential including interconnect process development, circuit design and chip integration.     

High-frequency characterization of on-chip digital interconnects

On-chip inductance is becoming increasingly important as technology continues to scale. This paper describes a way to characterize inductive effects in interconnects. It uses realistic test structures that study the effect of mutual couplings to local interconnects, to random lines connected to on-chip drivers, and to typical power and ground grids. The use of S parameters to characterize the inductance allows a large number of lines to be extracted while requiring only a small overhead measurement of dummy open pads to remove measurement parasitics. It also enables direct extraction of the frequency-dependent R, L, G, C parameters. The results are summarized with curve-fitted formulas of inductance and resistance over a wide range of line spacings and line widths. The significance of the frequency dependence is illustrated with transient analysis of a typical repeater circuit in a 0.25-μm technology. A model that captures the frequency dependency of the extracted parameters accurately predicts the performance of a new inductance-sensitive ring oscillator     

High-speed completion detection for current sensing on-chip interconnects

A novel completion detection technique for delay insensitive current sensing on-chip interconnects is presented. The scheme is based on sensing currents on the data wires and comparing the sum of these currents to an appropriately set reference. The goal is to solve the performance bottleneck caused by conventional voltage-mode detection methods. With the channel width of 64 bits, the proposed method is 4.65 times faster and takes 36% less area than the voltage-mode scheme. Furthermore, its speed does not degrade when increasing the channel bit width. It is implemented in a 65 nm CMOS technology.     

Designing fast on-chip interconnects for deep submicrometer technologies

This paper proposes a solution to the problem of improving the speed of on-chip interconnects, or wire delay, for deep submicron technologies where coupling capacitance dominates the total line capacitance. Simultaneous redundant switching is proposed to reduce interconnect delays. It is shown to reduce delay more than 25% for a 10-mm long interconnect in a 0.12-/spl mu/m CMOS process compared to using shielding and increased spacing. The paper also proposes possible design approaches to reduce the delay in local interconnects.     

A digital calibration algorithm for implementing accurate on-chip resistors

A digital calibration algorithm that provides a systematic method for implementing accurate integrated resistors without compromising linearity or noise performance is described. The technique uses a single external resistor as a reference to implement multiple, different valued integrated resistors without requiring any accurate reference voltage. The algorithm provides a method to calibrate several on-chip resistors without replicating the calibration circuit, and it can achieve an arbitrary accuracy limited only by the external resistor’s accuracy and mismatch errors. Terminations for two high speed wire line transceivers are implemented using the algorithm and simulations and measurements results show adequate performance across process, temperature, and supply voltage. Ayman A. Fayed was born Egypt, in 1975. He received the B.Sc. degree from the Electronics and Communications Department, Cairo University, Cairo, Egypt in 1998, and the M.Sc. and Ph.D. degrees from The Ohio State University, Columbus, in 2000 and 2004 respectively. Since 2002, he has been with Texas Instruments Inc. as an analog and mixed-signal circuit designer. He has been a key contributor to TI#x2019;s high-speed wire line transceivers product line. He has been awarded two US patents in the field. His research interests include mixed-signal CMOS circuit design for high-speed wire line transceivers, adaptive equalization, and power management systems. Mohammed Ismail has over 20 years experience of R&D in the fields of analog, RF and mixed signal integrated circuits. He has held several positions in both industry and academia and has served as a corporate consultant to nearly 30 companies in the US, Europe and the Far East. His current interest lies in research involving digitally programmable/configurable fully integrated radios with focus on low voltage/low power first-pass solutions for 3G and 4G wireless handhelds. He publishes intensively in this area and has been awarded 11 patents. He has co-edited and coauthored several books including a text on Analog VLSI Signal and Information Processing, (McGraw Hill). His last book (2004) is entitled CMOS PLLs and VCOs for 4G wireless, Springer. He co-founded ANACAD Egypt (now part of Mentor Graphics, Inc.) and Spirea AB, Stockholm (now Firstpass Semiconductors AB), a developer of CMOS radio and mixed signal IPs for handheld wireless applications. Dr. Ismail has been the recipient of several awards including the US National Science Foundation Presidential Young Investigator Award, the US Semiconductor Research Corp Inventor Recognition Awards in 1992 and 1993, and a Fulbright/Nokia fellowship Award in 1995. He is the founder of the International Journal of Analog Integrated Circuits and Signal Processing, Springer and serves as the Journal’s Editor-In-Chief. He has served as Associate Editor for many IEEE Transactions, was on the Board of Governors of the IEEE Circuits and Systems Society and is the Founding Editor of “The Chip” a Column in The IEEE Circuits and Devices Magazine. He is a Fellow of IEEE. He obtained his BS and MS degrees in Electronics and Communications from Cairo University, Egypt and the PhD degree in Electrical Engineering from the University of Manitoba, Canada.     

SPICE compatible modelling of on-chip coupled interconnects

On-chip coupled interconnect lines are modelled using measured S-parameters. The physical consistency between single and coupled line model parameters are maintained in the proposed methodology. The SPICE compatible model is validated in both the frequency and the time domain using copper and ultra low-kappa coupled interconnects.     

Silicon oxynitride integrated waveguide for on-chip optical interconnects applications

This work explores the microfabrication technology for realizing miniature waveguide structure for on-chip optical interconnects applications. Thick oxynitride films were prepared by plasma enhanced chemical vapor deposition (PECVD) with N₂O, NH₃ and SiH₄ precursors. The composition and the bonding structure of the oxynitride films were investigated with Fourier transform infrared spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS), and secondary ion mass spectroscopy. Results showed that the silicon oxynitride deposited with gas flow rates of NH₃/N₂O/SiH₄ = 10/400/10 (sccm) has favorable properties for integrated waveguide applications. The refractive index of this layer is about 1.5 and the layer has comparative low densities of O–H and N–H bonds. The hydrogen bonds can be further eliminated with high temperature annealing of the as-deposited film in nitrogen ambient and the propagation loss can be reduced significantly with thermal annealing. An integrated miniature waveguide with cross-section of 2 μm × 3 μm was realized with the proposed technology. The waveguide is able to transmit signal in either TE or TM mode with propagation loss <0.6 dB/cm (at 1550 nm) and bending radius of about 6 μm.     

Near speed-of-light signaling over on-chip electrical interconnects

The propagation limits of electrical signals for systems built with conventional silicon processing are explored. A design which takes advantage of the inductance-dominated high-frequency regime of on-chip interconnect is shown capable of transmitting data at velocities near the speed of light. In a 0.18-/spl mu/m six-level aluminum CMOS technology, an overall delay of 283 ps for a 20-mm-long line, corresponding to a propagation velocity of one half the speed of light in silicon dioxide, has been demonstrated. This approach offers a five times improvement in delay over a conventional repeater-insertion strategy.     

Experimental validation of crosstalk simulations for on-chip interconnects using S-parameters

Since the design of advanced microprocessors is based on simulation tools, accurate assessments of the amount of crosstalk noise are of paramount importance to avoid logic failures and less-than-optimal designs. With increasing clock frequencies, inductive effects become more important, and the validity of assumptions commonly used in simulation tools and approaches is unclear. We compared accurate experimental S-parameters with results derived from both magneto-quasi-static and full-wave simulation tools for simple crosstalk structures with various capacitive and inductive couplings, in the presence of parallel and orthogonal conductors. Our validation approach made possible the identification of the strengths and weaknesses of both tools as a function of frequency, which provides useful guidance to designers who have to balance the tradeoffs between accuracy and computation expenses for a large variety of cases     

Skin effect of on-chip copper interconnects on electromigration

A simple model is derived to evaluate skin effect of on-chip copper interconnects on electromigration. The result gives the range of frequency in which skin effect on electromigration need to be taken into consideration.     

Enhanced transmission characteristics of on-chip interconnects withorthogonal gridded shield

On-chip interconnects over an orthogonal grid of grounded shielding lines on the silicon substrate are characterized by full-wave electromagnetic simulation. The analysis is based on a unit cell of the periodic shielded interconnect structure. It is demonstrated that the shielding structure may help to significantly enhance the transmission characteristics of on-chip interconnects particularly in analog and mixed-signal integrated circuits with bulk substrate resistivity on the order of 10 Ω-cm. Simulation results for the extracted R, L, G, C transmission line parameters show a significant decrease in the frequency-dependence of the distributed shunt capacitance as well as decrease in shunt conductance with the shielding structure present, while the series inductance and series resistance parameters are nearly unaffected. An extension of the equivalent circuit model for the shunt admittance of unshielded on-chip interconnects to include the effects of shielding is also presented     

A methodology for the calculation of stress migration in die-level interconnects

An analytic methodology is presented for the examination of stress migration in the built up interconnect structures on integrated circuit die. The methodology uses finite element analysis combined with a presumed diffusion mechanism to define a vacancy accumulation site and to characterize the flux of vacancies. This physics-based approach accounts for the effects of time, temperature, material systems and interconnect geometry on stress migration. The method should be generally applicable to a wide range of interconnect structures and will find utility in the design of stress migration tolerant designs as well as in failure analysis.Through examples, stress migration within copper lines and vias with low-k and SiO₂ dielectrics is examined. The methodology predicts increased vacancy fluxes with increases in exposure time, line width and temperatures within the range studied. A fundamental mechanism suggesting heightened vacancy fluxes with a low-k dielectric over a SiO₂ dielectric is described. Finally, the methodology is exercised to demonstrate that the apparent activation energy obtained through stress migration testing of built up interconnect structures may not correspond with the governing diffusion mechanism.     

A low impedance receiver for power efficient current mode signalling across on-chip global interconnects

In this work we propose a low impedance receiver for on-chip high speed current-mode signalling over global interconnect. The receiver provides a very low input impedance even with a low quiescent power. The low input impedance helps to get high link bandwidth without any passive terminator. Moreover, the receiver has high transimpedance gain over a large bandwidth. This facilitates in reducing the signalling current by 6.7 times compared to a passive termination. A test chip has been fabricated in 0.18 μm CMOS process to test the topology with a prototype global interconnect having a length of 10 mm. Power consumption of the transceiver for a data rate of 2.5 Gbps data is 2 mW. This gives an energy efficiency of 0.8 pJ/b.