纸基RFID标签天线印刷工艺参数的优化试验

材料与制作工艺造成的成本过高是RFID标签普及化应用的障碍。应用导电银浆与丝网印刷技术,可以解决RFID标签的低成本化问题。本文以丝网印刷技术在纸基材上印刷导电银浆而制作出RFID标签天线,研究了丝网印刷天线的工艺参数,讨论了工艺参数对制作RFID标签性能的影响,并通过优化试验对刮板施加给网版的压力,印刷速度,导电银浆固化温度与时间等制作工艺参数进行优化,得出最佳工艺参数,并制作出满足电阻特性的RFID标签天线。     

卷到卷丝网印刷RFID天线的工艺优化研究

采用卷到卷全自动丝网印刷机,在纸基材上印刷导电银浆制作RFID(电子标签)天线。通过正交优化实验研究了刮板与网版的承印角度、刮板压力、刮板移动速度和固化温度等四个可控因素对天线印刷工艺稳定性的影响。利用金相显微镜观察了导电银浆线路的表面效果与切片效果。优化结果得到最佳工艺参数,制作出满足电阻要求的RFID天线。     

基于UV-LIGA技术的微注塑金属模具的工艺研究

介绍了一种新颖的微注塑模具的制作方法———无背板生长法,它是利用负性厚SU-8光刻胶,通过低成本的UV-LIGA表面微加工工艺,直接在金属基板上电铸镍图形而制作完成的。讨论了SU-8胶与基底的结合特性以及几种去除SU-8胶的有效方法,所制作的微注塑模具已用于微注塑加工中。无背板生长工艺的突出优点是微电铸时间短、模具质量高,而且还适合于制作其他微机械组件,是目前MEMS领域中比较有发展前途的加工方法。     

电引发法制作PCB线路的研究

介绍一种电引发化学镀的方法制造印刷电路板(PCB)。首先是在非导电的PET基材上丝印碳粉或碳浆的图形,其次对转移的图形以电引发化学镀的方式沉积上铜或其他金属。电引发过程中,使用直流电源,电压约为3V～5V。以惰性材料作阳极,以导电性良好的材料作阴极,用阴极接触导电图形引发化学镀过程。上述方法的优点有:①起镀速度快,镀层均匀;②工艺简单,容易操作;③镀层与绝缘基材的结合力优良。     

利用催化性金属硫族化物的直接电镀工艺

概述了在非导体基材表面上形成金属硫族化物催转化涂覆导电层,然后电镀金属的非导体直接电镀工艺,特别适用于印制板制造。     

纳米导电油墨在纸电池中的最新应用进展

<正>纸电池指的是用纸张或薄膜基材作为载体,使用导电油墨(主要作为电极)印刷的超薄电池。纸电池的终端产品包括有源或半有源型的RFID标签、标签传感器、智能卡、智能包装、医用电子药贴等。全球纸电池市场规模在2015年有望超过56亿美元。美国斯坦福大学的材料科学家崔易利用将单壁碳纳米管导电墨水涂在普通复印纸上,再连接上正负电     

电子屏的未来

目前中国电子书行业从硬件阅读器来看,基本与国外保持一致,以电子墨水技术为主要卖点,显示特性接近普通纸张,并且具有节能、可弯曲等优点,是代替纸质书籍的理想工具。该产业链中,上游的电子纸基材生产,技术壁垒最高,能够量产的主要是E—ink公司,SiPix公司的微杯技术也具有一定的竞争力。     

喷墨印制导电墨水研究进展

喷墨印制电子技术是一种无接触式、无压力、无需印版的电子产品制造技术。因具有制造速度快、环境友好、工艺过程简单、成本低、功能多样化、基材适用性广以及定位精确等特点受到人们的广泛关注,成为电子制造产业发展的新方向。导电墨水作为导电图形的基础材料,是印制电子技术发展的瓶颈,直接影响着电子产品的性能及质量。本文介绍了喷墨印制用导电墨水的导电机理、物理参数,以及碳系和银系墨水、液体金属墨水等的最新研究进展,并分析了导电墨水在RFID、PCB电路、太阳能电池、有机发光二极管、薄膜晶体管等领域的应用概况。分析表明,目前导电墨水的制备技术已取得一定进步,但相关的制备理论不成熟,缺乏优良的助剂和价格适宜的喷墨印制设备,未来急需开发具有低处理温度、高稳定性的喷墨印制导电墨水。     

自还原体系银导电墨水的制备与低温印制导电图形的研究

总结了开发一种简便快捷的可印制在挠性基板上于低温条件实现烧结形成高导电性线路的自还原型银导电墨水的制备方法。该导电墨水通过混合二乙醇胺溶液和银氨溶液制备得到。印制在塑料基材上后,在75℃下固化形成导电线路。这是因为在碱性环境与高于50℃的温度下,二乙醇胺可分解生成甲醛并自发地与银氨溶液发生反应。随后还原出银原子并让其吸附在基材上形成银薄膜。用该方法印制得到的银线其导电率可达到金属银导电率的20％,通过继续改进可应用于各种印制电子技术中。     

文献与摘要（141）

导电油墨多重应用进展和沉积平台
　　Advances in Conductive Inks Across Multiple Applications and Deposition Platforms
　　印制电子（PE）在过去的几年中有了很大发展,相关的材料、图形形成技术和产品应用不断出新。文章叙述PE用材料的要求与变化,包括导电油墨和绝缘基材,银油墨仍然是主角,还有低成本的碳油墨;基材有常规的PI、PET和PEN外,新引入聚碳酸酯（PC）、聚醚砜（PES）、聚醚醚酮（PEEK）等。加工技术上着重于网版印刷和成卷生产（R2R）,达到细线条和高效率。应用领域方面原有的薄膜开关、传感器等在扩大,并进入薄膜光伏。织物等新应用。     

Metal foundation construction to consolidate electroplated structures for successful removal of SU-8 mould

For integrating thick microstructures with microfabricated circuitry on the same chip, a metal foundation method to consolidate adhesion of the electroplated microstructures to the substrate for successful removal of SU-8 mould is proposed. Along with multilevel interconnections microfabrication or other required metal deposition, the metal foundations are constructed and then tamped by interlevel dielectric. With metal foundations formed along with fabrication of interconnections and thin film electrodes, the electroplated Ni structures of an electrostatically levitated rotational microgyro, with thickness of 200 /spl mu/m after lapping the whole wafer, are successfully released by removing the SU-8 mould using the fuming sulphuric acid oxidising method.     

集成电极的PDMS-玻璃微流控芯片的制备

微流控芯片在分析化学和生物检测方面有着广阔的应用前景。对集成电极的PDMS-玻璃微流控芯片的制备工艺进行了研究与分析。最终使用SU-8快速制备阳模,使用PDMS转移图形得到具有微流控通道的PDMS盖片;在玻璃基板上加工Pt电极,除了需要外露的部分电极外,其他部分以薄层PDMS保护,得到电极基板;将PDMS盖片与电极基板半固化键合制得同时具有加热和温度传导电极以及CE高压电极的PDMS-玻璃芯片。ANSYS模拟分析证明加热芯片热惯性小,加热时温度分布效果好。     

Investigation of pattern coating on mould roller in roller-reversal imprint process

In order to prepare large area micropatterns with certain profile (certain aspect ratio) on kinds of substrates, especially on flexible substrate, a novel roller-reversal imprint (RRI) process is proposed, which starts with pattern coating of an ink (mostly a liquefied electronics materials, such as a semiconductor polymer) on a mould roller and ends with transferring the ink already patterned on the roller to the substrate. One of the critical challenges in RRI process is ensuring ink pattern coating and full filling to the microcavities on mould roller, which is one of the preconditions to achieve the pattern transferred on substrate with precise profile. In this paper, an ink coating model is established to reveal the ink filling situations versus different profile of microcavities on mould roller. Simulations show that, in the coating process, as the contact angle of ink on mould increasing, three basic filling situations, i.e., full filling, partial filling, and non-filling, will occur. In order to demonstrate the requirement of full filling, critical contact angle for full filling is proposed to distinguish the full filling and partial filling, and it is deeply dependant on the cross-sectional parameters (such as linewidth and the aspect ratio) of microcavities on mould roller. The critical contact angle is the watershed between full filling and partial filling, so it can be used as a guideline to choose the appropriate match between the surface energy of ink and mould to achieve full filling in RRI process. Experiments prove that the ink filling model and its simulation results are basically right, the cross-sectional parameters of microcavities on mould play great important roles to the critical contact angle, and only when the actual contact angle is smaller than the corresponding critical value, full filling can be obtained.     

雷达微波盒体等温精密挤压数值模拟研究

以雷达微波壳体为研究对象,采用刚粘塑性有限元法对其等温挤压过程进行了数值模拟,获得了成形过程中金属流动规律和应力分布状态,预测成形过程中可能存在的缺陷。在此基础上,通过数值模拟分析得到了优化的毛坯形状。通过与实验结果对比,模拟结果和实验结果一致,进一步验证数值模拟结果的可靠性与有效性。     

微细加工新技术—LIGA技术

LIGA技术是近几年才开展起来的一门新技术,是微细加工的一种新方法。本文对这一技术,从简单工艺过程到每个具体工序环节都详细、深入地进行了介绍。LIGA技术是由光刻、电铸、塑铸三个环节组成,尤刻以同步辐射深度X光曝光为主。由于同步辐射X光有非常好的平行性、极高的辐射强度、连续的光谱,使这项技术能够制造出高宽比大到100、厚度可达几百微米、结构侧壁平行线偏差在亚微米范围内的微米级三维立体结构。通过电铸、塑铸就可将这一结构转换成金属或塑料的微结构产品。 这项技术在短短几年的发展过程中,已制造出电机、齿轮、发动机、涡轮、联杆、单色器、光纤联接器、电联接器、喷嘴、泵、阀、加速度传感器等微型结构与器件,被认为是将对下一世纪带来重大影响的一门新技术。     

A new process of grid structure formation for end point detection during substrate thinning of transit time devices

The influence of u.v. exposure on developed positive resist pattern followed by hard baking and etching at low temperature has been utilized in the present work to produce grid structures without using metal pattern mask during substrate thinning of transit time devices. The present process eliminates one step of metallization which is required in the conventional method, and this reduces the overall cost of fabrication. The process reported in this paper can be used in selective etching of silicon in other areas of device fabrication as well.     

Two-Step curing method for demoulding in UV nanoimprint lithography

In the UV nanoimprint lithography (UV NIL), it is obvious that the resist curing process is dependent on the UV dose, therefore three states of the resist pattern, i.e., uncuring, undercuring and full-curing may occur due to an inadequate curing control method. Also the demoulding force, which can influence the pattern transferring fidelity, is largely determined by the resist-curing degree. For acquiring high pattern transferring fidelity with small demoulding force, a new demoulding method is proposed in this paper. Through an analysis of the three different pattern transferring results, i.e. rounded-feature replication, fine replication, and scooped-feature replication, which may be induced by the different resist-curing degree and the relative demoulding force, it is found that the resist-curing degree is a critical factor which affects the pattern transferring fidelity. In addition, when the resist-curing degree is too low or too high, either the imprint mould may be stained or the microstructures on the mould can be damaged, which will adversely affect the subsequent imprints in a step-and-repeat process. A new demoulding method is presented, which consists of two UV exposures. The first UV exposure is done before demoulding to under-cure the resist pattern so that the demoulding force can be reduced while maintain a short-time pattern stability. The second UV exposure follows the demoulding to full-cure the resist so as to produce a sufficient rigidity in the pattern. It is experimentally shown that this new demoulding method leads to high pattern fidelity and a small demoulding force while minimizing the mould containments or microstructures damage on it.     

High‐efficiency GaInP/GaAs/GaInNAs solar cells grown by combined MBE‐MOCVD technique

Triple‐junction GaInP/GaAs/GaInNAs solar cells with conversion efficiency of ~29% at AM0 are demonstrated using a combination of molecular beam epitaxy (MBE) and metal‐organic chemical vapor deposition (MOCVD) processes. The bottom junction made of GaInNAs was first grown on a GaAs substrate by MBE and then transferred to an MOCVD system for subsequent overgrowth of the two top junctions. The process produced repeatable cell characteristics and uniform efficiency pattern over 4‐inch wafers. Combining the advantages offered by MBE and MOCVD opens a new perspective for fabrication of high‐efficiency tandem solar cells with three or more junctions. Copyright © 2016 John Wiley & Sons, Ltd.     

以氮化铝陶瓷为基板的倒扣封装工艺研究

研究了以氮化铝为基板的倒扣封装的工艺。详细比较了氮化铝的各种金属化工艺。分别研究化学镀与激光诱导淀积实现金属化的方法。测量表明两种方法制备的金属层与氮化铝的粘附力均大于 10 MPa。同时对这两种方法的特点与适用范围进行概述