金刚石工具钻削加工工程陶瓷孔的实验研究

金刚石工具钻削加工工程陶瓷孔时的材料去除率随着工具转速、磨粒直径以及外载荷的增大而增大；随着材料自身硬度和断裂韧性的升高而降低。本篇实验研究了各主要加工参数与材料去除率及孔加工质量的关系。1实验条件1．1实验设备和工件材料实验设备是利用CA6140车床改装而成的。工具使用专用夹具装夹后，利用三爪卡盘装夹于机床的主轴上。工件材料选用99．5％的Al2O3工程陶瓷。1．2金刚石工具的选择1．2．1金刚石磨料粒度的选择金刚石工具中金刚石磨料的粒度直接影响工程陶瓷材料的加工表面质量和加工效率。通常磨料粒度越粗，加工效率越高…     

金刚石工具钻削加工工程陶瓷孔的研究（Ⅰ）

本文对金刚石工具钻削加工工程陶瓷孔进行了研究。理论分析了材料去除机理，建立了钻削加工工程陶瓷孔时的材料去除率模型。由公式得出：材料去除率随着载荷、磨粒直径和工具转速的增大而增大，随着工件材料断裂韧性和硬度的升高而降低，并实验验证了理论推导的去除率公式。     

磨料射流铣削工艺参数优化

目的对表面粗糙度和材料去除率作为输出参数的磨料水射流铣削45#钢过程进行研究,旨在寻找最优加工参数。方法对射流去除材料机理进行了分析,设计并进行了以磨料粒度、射流压力、横向进给距离、靶距为加工工艺参数的田氏正交实验。采用Minitab对不同实验参数组合下磨料水射流加工45#钢的表面粗糙度、材料去除效率进行了数据分析,并从材料去除机理方面,对4种加工工艺参数对于铣削表面质量和材料去除效率的影响程度和影响趋势,以及各因素之间的交互作用进行了分析。结果对射流铣削面表面粗糙度影响较显著的因素是横向进给距离,射流压力次之;对于材料去除效率,磨料粒径的影响最显著,横向进给距离次之。结论综合材料去除效率和表面粗糙度值,选出最优加工参数:磨料粒径2000目,射流压力120~160 MPa,喷嘴横移距离1.0~1.5 mm,靶距约30 mm。     

弹性基体软固结磨料磨具的材料去除机理

基于弹性磨具的磨抛工艺为硬脆材料超精密加工效率与加工质量的兼顾平衡提供了新的解决思路,但其磨抛过程的材料去除机理尚未明确。为研究弹性磨抛过程中的材料去除行为,以硅橡胶作为磨具基体材料,混合微米级金刚石磨料制备弹性基体软固结磨料磨具,利用有限元仿真分析方法研究弹性基体软固结磨粒的受力状态,结合接触力学与运动学分析建立考虑单颗磨粒磨损行为与有效磨粒数量的材料去除模型,通过石英玻璃试件的弹性磨抛加工试验验证预测模型的准确性。结果表明：石英玻璃试件的材料去除率随着磨抛压力、主轴转速、磨具偏角的增大而显著增加,而磨料粒径对其影响程度较小;当工艺参数组合为磨料粒径100μm、磨抛压力7 N、主轴转速1 500 r/min、磨具偏角20°时,经60 min磨抛后,工件已加工表面粗糙度由1.069μm降至0.089μm,材料去除率为8.893×10⁸μm³/min;该试验条件下,建立的材料去除模型预测准确度相比Preston经典模型提高36.7%。研究成果可为实现硬脆材料的确定性材料去除提供技术支持和理论依据。     

球形固结磨料磨头研磨TC4钛合金的工艺探索

TC4钛合金是典型的难加工材料,在传统加工中存在难切削、工件表面易烧伤等问题。采用自行设计的球形固结磨料磨头开展TC4钛合金研磨实验,探索不同粒径、磨料种类及研磨工艺参数对TC4钛合金研磨材料去除率及表面质量的影响,分析研磨的材料去除机理,优化研磨工艺。发现20～30 μm碳化硅磨粒的研磨效果最佳,优化后的工艺方案为磨头转速2000 r/min,研磨夹角30°,研磨时间10 s。在此工艺参数下研磨材料去除率为22.2 mg/min,工件表面粗糙度R_a值为0.7 μm,兼顾了对材料去除效率和表面质量的要求。      

汽车CFRP结构件涂层去除机理研究

目的 实现汽车碳纤维增强树脂基复合材料(CFRP)结构件表面有机涂层的高效无损去除。方法 选择可回收密胺类塑料制备磨料，提出了用气射流携带并高速喷射加工的新方法。通过单因素控制试验和数值模拟相结合的方法，在0.3 MPa射流压力下用500μm的磨料对涂装聚氨酯涂层的CFRP试样进行冲蚀，借助SEM和超景深三维显微镜观察冲蚀形貌。为了阐明涂层的去除机理，建立了基于能量守恒定律的微切削和重复变形模型，分析了塑性磨料的颗粒速度和撞击工件的接触应力，定量分析了磨料在0.3MPa射流压力下的涂层去除量。研究了磨料形状、旋转和回弹对冲蚀机理的影响。结果 当冲蚀角为30°时，涂层的材料去除量最大，去除率为5.8×10⁴ g/s，表现为延性冲蚀行为。此时的冲蚀机理为微耕犁和微切削，随着冲蚀角的增大，材料去除量降低。当冲蚀角为90°时，去除率为1.2×10⁴ g/s，冲蚀机理为重复塑性变形去除。尖角磨料以集中应力冲击涂层，磨损后的磨料(可循环15次)以分布应力冲击涂层。与正向旋转相比，磨料自身的反向旋转对涂层的去除量更大，大粒径磨料的回弹导致了不完整的切削路径...     

磨料对磁流变工作液性能及加工效果的影响

本文研究了磁流变工作液中添加磨料种类、含量、粒度对其性能的影响,以及对磁流变效应微砂轮加工效果的影响。结果表明:添加磨料对磁流变效应的影响程度以氧化铈、碳化硅、金刚石、氧化铝的顺序增大,随着添加磨料含量增加、粒度增大,磁流变效应均被削弱。磁流变效应微砂轮加工微沟槽过程中,添加磨料对微砂轮加工性能的影响受到添加磨料对磁流变效应和磁流变效应微砂轮加工性能正反两方面的影响而出现最优加工效果。当磨料含量为3%时沟槽的宽度、深度和材料去除率都达到最大;当磨料粒度为W3.5时,加工沟槽的宽度最大;当磨料粒度为W7时,加工沟槽的深度和材料去除率最大。     

冲蚀角对碳纤维增强树脂复合材料(CFRP)蒙皮涂层去除及重涂附着力的影响

为解决飞机CFRP蒙皮涂层高效去除问题,改善重涂涂层附着力,采用塑性磨料射流加工方法对CFRP蒙皮损伤涂层去除,通过分析单颗磨料的速度和冲击力,研究不同冲蚀角度下磨料对涂层的冲蚀行为,探究塑性磨料射流冲蚀角对表面形貌、去除机制、材料去除率、接触角与表面自由能及重涂涂层的附着力方面的影响。结果表明：塑性磨料对涂层的冲蚀机理为塑性变形去除,在30°～70°冲蚀角下,磨料对涂层的冲蚀模式为滑擦、耕犁和切削。随着冲蚀角的增加,颗粒的切向分力减小,法向分力增加,法向冲蚀的冲蚀模式为剪切和挤压变形去除材料去除率递减。在所选冲蚀角范围内,当冲蚀角为30°时,聚氨酯涂层的材料去除率最大。随着冲蚀角的改变,表面粗糙度、润湿性和表面自由能发生变化,当冲蚀角为70°时,重涂后的涂层附着力较好,较初始涂层附着力提高28%左右。研究成果可为飞机CFRP蒙皮涂层的高效去除及附着力的改善提供参考。     

聚集体金刚石磨料研磨加工性能研究

为实现蓝宝石等硬脆材料的高效率、低表面粗糙度研磨加工,提出利用陶瓷结合剂和微细金刚石磨料(粒径3μm)烧结制成聚集体金刚石磨料(平均粒径30μm)进行研磨加工新工艺。通过与3μm和30μm等2种单晶金刚石磨料对蓝宝石基片进行研磨加工对比实验,系统研究聚集体金刚石磨料的研磨性能。结果表明：聚集体金刚石磨料具有较高的材料去除率,相同条件下聚集体金刚石磨料加工15 min时材料去除率为1.127μm/min;聚集体金刚石磨料具有较好的加工稳定性,研磨120 min时材料去除率为0.483μm/min,相比于加工15 min时下降57.14%,而3μm单晶金刚石磨料则下降78.02%;聚集体金刚石磨料与3μm单晶金刚石磨料研磨蓝宝石的表面粗糙度相近,分别为R_a 9.45 nm和R_a 8.75 nm,远低于30μm单晶金刚石磨料的R_a 246 nm。聚集体金刚石磨料能实现低加工表面粗糙度和高材料去除率的机理可以归纳为：多磨粒微刃产生去除作用可以获得低表面粗糙度,同时具有自锐性,提高材料去除效率并保证加工过程的稳定。     

超声波加工工程陶瓷孔的研究

对超声波加工工程陶瓷孔进行了研究 ,分析了材料去除机理 ,建立了超声波加工工程陶瓷孔时的材料去除率模型。由公式知 :材料去除率随静载荷、工具振幅、磨粒直径的增大而增大 ,随着材料断裂韧性和硬度的升高而降低 ,并实验验证了理论推导的材料去除率公式     

振动辅助固结磨料抛光氟化钙晶体

为了改善氟化钙晶体加工后的表面质量、提高加工时的材料去除率,提出了振动辅助固结磨料抛光氟化钙晶体的加工方法。利用振动与固结磨料抛光有效结合,采用正交实验研究加工工艺参数对材料去除率和表面质量的影响。结果表明:振动辅助固结磨料抛光氟化钙晶体的最优工艺参数为转速40 r/min,振动频率40 kHz,抛光液pH值9,转速比0.95;在最优参数下抛光氟化钙晶体的材料去除率为324 nm/min,表面粗糙度S_a值为1.92 nm;与无振动辅助的固结磨料抛光相比,材料去除率提高了57%,表面粗糙度降低了35%。研究表明:振动辅助能够利用空化作用及规律化间歇性接触,在固结磨料抛光中提高材料去除率及表面质量。      

金刚石砂带超精密研磨细长脆硬材料的工艺参数研究

基于线性磁带开放协议的第三代磁头的关键部件之一是一种由复合脆硬材料组成的具有特殊外形轮廓的微小细长杆件,由于其长径比大,弯曲变形要求严,使得加工较为困难。本文用固着磨料研磨方法进行外形轮廓研磨,通过测量工件的直线度误差、材料去除率和表面粗糙度,研究研磨压力、速度、磨料粒度以及夹紧力等工艺参数对研磨质量和效率的影响。结果表明,当研磨压力为4.59kPa、速度80次/min、夹紧力9.8N、用粒径1μm的金刚石砂带时效果最优,同时表明工件变形随研磨压力及夹紧力的增大而增大。     

小直径磨棒磨削加工TiC颗粒增强钢基复合材料GT35

为探究TiC颗粒增强钢基复合材料GT35合理的加工参数和冷却润滑条件,研究其对切削力、表面质量及刀具磨损的影响规律,采用小直径磨棒以侧面磨削方式开展试验。结果表明：干磨削会引起磨棒烧伤,极压磨削油的润滑效果优于水基合成磨削液的;磨棒在极压磨削油润滑下,磨削工件12 min后进入稳定磨损状态,其主要磨损形式为磨粒破碎、磨粒磨耗和磨粒脱落;主轴转速对切削力的影响大于进给速度的,且转速越高,切削力越小;工件表面粗糙度主要与磨棒磨粒出露高度的平整度有关,受加工参数的影响较小。用小直径磨棒磨削加工GT35材料时,应选择极压磨削油润滑,高主轴转速、中速进给的加工方式,以获得良好的刀具寿命、工件加工表面质量及适当的加工效率。     

Contents

The attempts of researchers to obtain accurate and high-quality surfaces have led to the invention of new methods of finishing. Magnetic abrasive finishing (MAF) is a relatively new type in which magnetic field is used to control the abrasive tools. Surfaces of moulds, for instance, are among those which require very high-surface smoothness. Usually, this type of part has freeform surfaces. In this study, the effect of magnetic abrasive process parameters on finishing freeform surfaces of aluminium parts has been examined. This method was achieved through a combination of the magnetic abrasive process and computer numerical control. The use of a simple hemisphere to be joined on the flat area of the magnet as well as spark machining for forming a sphere at the end of a magnet were performed during experimentation. Gap, rotational speed of the machining head, amount of abrasive powder and feed rate were among the parameters that were tested in experiments. The design of experiments is based on the response surface methodology. Significant parameters and the regression equations governing the process were also determined. The impact of intensity of the magnetic field was obtained using MAXWELL finite element software. In the MAF process, magnetic abrasives play the role of cutting tools. However, the magnetic abrasives are not easily available as these are produced by special techniques such as sintering method, adhesive based, plasma based or gel based. This study presents the basic polishing characteristics of the magnetic abrasives produced by the mechanical alloying process. After the mechanical alloying process fine magnetic abrasives are obtained, in which the abrasive particles adhere to the base metal matrix without any bonding material. In this study, investigation was performed only on the convex area of workpiece. Optimum parameters are gap size of 0.5?mm, feed rate of 10?mm?min^?1 rotational speed of 2100?rev?min^?1 and powder amount of 1.75?g. To help understand the effectiveness of the MAF process, scanning electron microscopy and atomic force microscopy of the machined surfaces have been carried out.     

Study on axial-feed mirror finish grinding of hard and brittle materials in relation to micron-scale grain protrusion parameters

An axial-feed mirror finish grinding of hard and brittle materials is proposed by controlling grain protrusion parameters. In this grinding, the grinding wheel feed is along the wheel axial direction rather than in the traditional wheel cutting direction. The objective is to understand how micron-scale grain protrusion parameters influence ductile-mode grinding and ultimately to realize efficient mirror finish grinding using a coarse diamond grinding wheel. In this study, the grain tip truncation (GT-truncation) was performed after dressing to improve grain protrusion topography. First, a formation model of axial-feed ground surface was constructed to analyze the effect of grain protrusion parameters and grinding parameters on the critical cutting depth transferred from brittle-mode removal to ductile-mode removal; then GC dressing and GT-truncation of #180 diamond grinding wheel were experimentally performed to investigate surface roughness and ductile-mode grinding behavior with reference to grinding parameters and grain protrusion parameters; finally, a truncated coarser #60 diamond grinding wheel was employed for mirror finish grinding to observe active grain number and grain protrusion angle. Theoretical analysis shows that this ductile-mode grinding is dominated by active grain number, active grain protrusion angle, wheel rotating speed and axial-feed speed, but it does not depend on the depth of cut assumed to be less than the grain protrusion height. Experimental results indicate that the GT-truncation may increase active grain number and grain protrusion angle for ductile-mode grinding when the axial-feed speed decreases to some extent. Moreover, the micro tip radius of diamond grain also influences the ground surface. It is confirmed that by increasing active grain number and grain protrusion angle synchronously, a truncated #60 diamond grinding wheel can be applied for efficient mirror finish grinding of the SiC ceramic plate at the axial-feed speed of 50 mm/min and the tool path interval of 0.1 mm.     

Experimental investigations into forces during magnetorheological fluid based finishing process

Magnetorheological fluid based finishing process is a fine finishing process that has been applied to a large variety of brittle materials, ranging from optical glasses to hard crystals. Under the influence of a magnetic field, the carbonyl iron particles (CIPs) and non-magnetic polishing abrasive particles remove material from the surface being polished. Knowledge of forces acting is important to understand the mechanism of material removal. A dynamometer and virtual instrumentation are used to on-line record the normal force and tangential force acting on the workpiece through the magnetorheological (MR) fluid. A full factorial design of experiments is used to plan the experiments and ANOVA to correlate the forces and process parameters. The selected process parameters (volume concentration of CIPs and abrasives, working gap, and wheel rotation) are varied over a range to measure forces during experimentation. The maximum contribution is made by a working gap on the forces developed on the workpiece surface followed by CIP concentration while the least contribution is noticed by the wheel speed.     

Microstructural and Mechanical Characteristics of Aluminum Alloy AA5754 Friction Stir Spot Welds

In the present investigation, friction stir spot welding on annealed aluminum alloy AA5754 sheets was performed. The influences of the tool rotational speed and tool stirring (dwell) time on the weld structure and static strength of welds were evaluated. The results revealed that the width of the completely metallurgical-bonded region increases with the increasing tool rotational speed and/or the dwell time up to certain levels. Increasing such parameters beyond these levels slightly reduces the width of the bonding region. The stirred zone exhibited higher microhardness than that of the base material. The tensile-shear force was found to increase with the increasing tool rotational speed and/or dwell time up to a certain level (9s). Higher tool rotational speeds and/or prolonged dwell times slightly reduce(s) the tensile-shear force.     

基于响应面法的钛合金Halbach阵列增强磁流变抛光工艺参数优化

目的 提高钛合金磁流变抛光的表面质量和抛光效率。方法 用Halbach磁场阵列强化磁场,通过载液盘与磁铁反向旋转来增强磁流变抛光效率,使抛光头拥有更强的恢复性与自锐性。通过仿真模拟和实际测量对比研究Halbach阵列与N-S阵列的磁场分布和磁场梯度。依照试验结果描述抛光剪切力、表面粗糙度与表面微观形貌随时间的变化规律。采用响应面法优化载液盘转速、磁铁转速和加工间距等3个工艺参数,建立剪切力和表面粗糙度的拟合方程数学预测模型,并对其中的不显著项进行优化。结果 在响应面交互作用分析中,工艺参数对剪切力的影响的大小顺序为加工间距、磁铁转速、载液盘转速;对表面粗糙度影响的大小顺序为载液盘转速、磁铁转速、加工间距。根据不同的需求,确定选定范围内的工艺参数组合,需要快速去除材料时,使剪切力趋于最大值的工艺参数组合为载液盘转速227 r/min,磁铁转速64 r/min,加工间距0.1 mm,通过20 min抛光后得到了表面粗糙度Sa为34.911 nm的光滑表面。抛光过程中,钛合金抛光所受剪切力τ为0.812 N。需要最优表面质量时,使表面粗糙度值趋于最小值的工艺参数组合为载液盘转速300 r/min,磁铁转速150 r/min,加工间距0.1 mm,通过20 min抛光后得到了表面粗糙度Sa为26.723 nm的光滑表面。抛光过程中,钛合金抛光所受剪切力τ为0.796 N。结论 Halbach阵列拥有较高的磁场强度和富有空间变化的磁感线,能够使磁流变液中的磁链呈现出更多的姿态变化。根据响应面法优化后的剪切力和表面粗糙度预测模型,预测结果与验证试验结果相差很小,预测模型的准确度与可信度较高。     

磨粒刻划单晶SiC的SPH与FEM耦合仿真分析

目的 进一步理解金刚石线锯加工硬脆晶体材料的去除特性.方法 采用SPH与FEM耦合算法,分析磨粒刻划单晶碳化硅工件过程中的材料去除动态响应,研究不同磨粒压入深度与几何形状条件对磨粒接触力、工件刻划表面形貌与应力分布的影响规律,分析磨粒恒定深度刻划与变深度刻划两种方式下磨粒刻划工件材料的动态响应.结果 磨粒接触力的各方向分量均随刻划时间发生波动,其中x与z轴方向的磨粒接触力随时间的变化趋势相近,平稳刻划时段的磨粒接触力均值拟合方程分别为fx=3.0956h2.7264,fz=11.3813h2.6214.磨粒压入深度是影响刻划过程中工件刻划截面形貌及应力分布的主要因素.相较于圆锥体磨粒,球体磨粒刻划后的工件材料截面形貌更粗糙,但工件材料的变形及损伤层深度更小.在磨粒变深度刻划方式下,随着磨粒压入深度的增加,刻划过程中的工件材料发生了脆塑转变.结论 在保证材料去除率的条件下,需降低磨粒压入深度,以降低磨粒接触力,获得更平整的工件表面刻划形貌与更低的等效应力.     

MPCVD多晶金刚石片的研磨均匀性分析

在游离磨料研磨过程中,研磨的驱动方式及工艺参数等直接影响加工后工件的平面度和表面粗糙度。为了探究基于旋摆式驱动的游离磨料研磨工艺参数对MPCVD多晶金刚石片平整化的影响,建立旋摆式驱动平面研磨过程中的单磨粒运动学模型,根据实际研磨过程采用多磨粒随机分布模型进行计算机仿真计算,引入多磨粒轨迹的均匀性离散系数对磨粒轨迹均匀性进行分析。结果表明:当转速比取值等于0.5时,磨粒轨迹离散系数最大;当转速比小于等于0.5时,离散系数与转速比为正相关;研磨盘摆动弧线的弦长大于金刚石片直径时,磨粒相对于整个金刚石片表面的运动轨迹分布较为均匀;计算机仿真计算得到了研磨最优参数,并通过2英寸MPCVD多晶金刚石片研磨试验验证了仿真结果的有效性。研磨后金刚石片表面PV值为2.4 μm,表面粗糙度R_a达到139 nm,材料去除率d_MRR为10.1 μm/h。