Surface and subsurface formation mechanism of SiCp/Al composites under ultrasonic scratching

Rotary ultrasonic machining (RUM) is an effective method of high-quality and high-efficiency machining for advanced composites. However, the machining mechanism and kinematic characteristics of ultrasonic machining of SiC particles-reinforced aluminum matrix (SiC_p/Al) composites are yet unclear, limiting the applications of RUM in composites machining. In this study, a rotary ultrasonic vibration-assisted scratch (RUVAS) test was designed for the high-volume fraction of SiC_p/Al composites. The kinematic and scratch force model of RUVAS was developed to describe the scratch process of SiC_p/Al. Both RUVAS and conventional scratch (CS) tests were performed under various scratch speeds on SiC_p/Al. The scratch trajectory was divided into three modes: continuous, semi-continuous, and intermittent. We observed the formation of different surface morphology under different modes. The scratch force difference between RUVAS and CS was insignificant when the scratch speed is high, which indicated that the effect of ultrasonic vibration diminished at a high speed when the ultrasonic frequency was fixed. When assisted by ultrasonic vibration, the scratch morphology of SiC_p/Al indicated that the matrix has undergone significant plastic deformation. While the hard SiC particles tended to be ruptured and pressed into the plastic matrix, this mechanism can effectively suppress the initiation and propagation of cracks, which is beneficial to reducing the stress influence zone, healing the surface defects, and improving the surface integrity. The subsurface morphology indicates that the subsurface damage under CS and RUVAS mainly includes particle cracking, matrix tearing, and interface failure. Our experimental result shows that ultrasonic vibration can effectively reduce the subsurface damage of SiC_p/Al composites, bringing insight into fundamental mechanisms of ultrasonic machining and providing guidance for the vibration-assisted processing of SiC_p/Al composites.     

Finite element analysis and experimental investigation of ultrasonic testing of internal defects in SiCp/Al composites

Revealing the interactions of sound waves with both SiC particles and internal defects is crucial for facilitating the detectability of internal defect features in SiCp/Al by using ultrasonic testing (UT). In the present work, we demonstrate the feasibility of UT of internal flat-bottom holes with diameters ranging from 0.2 mm to 2 mm in SiCp/Al composites through the combination of finite element (FE) simulations and experiments. Specially, a 2D FE model of UT of SiCp/Al with consistent geometrical features of SiC particles with experimental one is established, the accuracy of which is validated by theoretical and experimental characterizations of P-wave velocity and ultrasonic attenuation coefficient of SiCp/Al. Subsequently, the propagation behavior of sound waves in the SiCp/Al specimen with pre-existing defects under UT, in particular the impact of defect boundary on the scattering behavior of sound waves, is revealed in detail by FE simulations and also validated by corresponding experiments. Furthermore, the UT limit of detectable size of the internal defects is revealed jointly by FE simulations and experiments, based on which a correlation map between defect size and echo signal amplitude is established. Current study provides theoretical and practical guidance for the UT of internal defects in SiCp/Al composites.     

Experimental study on laser assisted ultrasonic elliptical vibration turning (LA-UEVT) of 70% SiCp/Al composites

SiC_p/Al composites are more and more used in aerospace, military industry and other industries. However, the surface integrity of materials is poor, and the cutting force is large as the anisotropy of materials in the traditional machining (TM) process, which hinders the application of ceramic particle reinforced metal matrix composites. With the requirement of high dimensional accuracy, high efficiency and low damage for materials in these fields, non-traditional machining technology has become a research hotspot. Laser assisted machining (LAM) is a non-contact special machining method. Its advantages in machining SiC_p/Al composites have been proved by experiments, but there are still processing defects such as thermal cracks. Therefore, to further improve the machining quality of 70% SiC_p/Al composites with high volume fraction, a new machining method combining ultrasonic elliptical vibration turning (UEVT) and laser heating assisted turning (LAT) is proposed. High frequency intermittent machining and the adjustment of laser temperature influence on materials can be realized by adjusting the ultrasonic amplitude. Combining the characteristics of the two processing techniques, the feasibility study of the new machining method was studied by turning experiments. In this paper, compared with TM and LAT, the removal mechanism of materials and the effects of different laser heating temperatures and ultrasonic vibration on cutting force, surface quality, subsurface damage and chip morphology are explored. The results show that LA-UEVT can effectively reduce the cutting force and surface roughness, improve the plastic removal ability, and inhibit surface and subsurface damage. And the material removal process is mainly in the form of small particle crushing and particle pressing, which improves the stability of cutting force in the cutting process.     

SiCp/Al复合材料的自发熔渗机理

以Mg为助渗剂,采用液态铝自发熔渗经氧化处理的SiC粉体压坯的方法,制备出高增强体含量的SiCp/Al复合材料.通过考察铝液在SiC粉体压坯中的渗入高度与温度、时间的关系来研究铝液的熔渗机理,并对SiCp/Al复合材料进行X射线衍射、能量散射谱和金相分析.结果表明:在熔渗前沿发生的液-固界面化学反应促进两相润湿,毛细管力导致铝液自发渗入到SiC多孔陶瓷中;熔渗高度与时间呈抛物线关系.熔渗激活能为166 kJ/mol,这表明渗透过程受界面反应控制.经氧化处理的SiC粉体均匀地分布在金属基体中,其轮廓清晰.在SiCp/Al复合材料中未发现Al4C3的存在.     

Investigation on ultrasonic vibration-assisted femtosecond laser polishing of C/SiC composites

This paper proposed a novel ultrasonic vibration-assisted femtosecond laser polishing method for C/SiC composites. The effect of near-field convection enhancement of ultrasonic vibration can improve the cooling of ablated particles and reduce their tendency of bonding to the material surface, reducing surface oxidation and improving the machined surface quality, removal depth and material removal rate. Through optimizing defocusing distance and scanning speed, a specific relationship between ultrasonic amplitude, pulse energy density, and spot overlap rate was established, obtaining a smooth and flat surface without defects. The residual stress of carbon fibers was investigated, and found that the coupling effect of ultrasonic energy and laser energy fields can enhance the residual compressive stress of carbon fibers. The formation of typical features of fiber fracture and pulling-out, banded pits, voids and deposition, was explained. This paper proposes new research ideas for better understanding of the removal mechanism of C/SiC composites using ultrasonic vibration-assisted femtosecond laser.     

Efficient and slurryless ultrasonic vibration assisted electrochemical mechanical polishing for 4H–SiC wafers

This paper proposes a slurryless, highly efficient polishing method called ultrasonic vibration assisted electrochemical mechanical polishing (UAECMP) to realize 4H–SiC wafers with subnanometer surface roughness. UAECMP involves using ultrasonic vibration to simultaneously assist anodic oxidation of the SiC surface and mechanical removal of the generated oxide layer. The performance of UAECMP was evaluated by experiments and theoretical analyses. For a 4H–SiC (0001) surface, UAECMP achieved a material removal rate (MRR) of 14.54 μm/h, which was 4.5 times greater than that of ordinary electrochemical mechanical polishing (ECMP) and 290 times greater than that of mechanical polishing. Ultrasonic vibration increased the anodic oxidation rate by introducing local transient strain to the SiC surface and increasing the temperatures of the polishing area and electrolyte. The effect increased with the amplitude of the ultrasonic vibration. However, increasing the ultrasonic vibration amplitude also increased the surface roughness due to the large fluctuations of polishing marks caused by the grinding stone and SiC surface impact and the increasing residual oxide. Therefore, we propose a high-efficiency and -quality polishing process for SiC wafers that combines UAECMP and ECMP. The proposed polishing process may help simplify the existing manufacturing process for SiC wafers.     

Study of material removal mechanisms in grinding of C/SiC composites via single-abrasive scratch tests

As one of the ceramic matrix composites (CMCs), carbon fiber-reinforced silicon carbide matrix (C/SiC) composites are promising materials used in various engineering applications owing to their superior properties. Precision surface grinding has been widely applied in the machining of CMC composites; however, the material removal mechanisms of C/SiC composites have not been fully elucidated yet. To reveal the material removal mechanisms in the grinding of chemical vapor infiltration-fabricated C/SiC composites, novel single-abrasive scratch tests were designed and conducted in two typical cutting directions. The experimental parameters, especially the cutting speed, conformed to the actual grinding process. The results show that the grinding parameters (feed rate, spindle speed, depth of cut, and cutting direction) have significant influences on the grinding forces, surface integrity, and affected subsurface region. The tangential force is in general larger than the normal force at the same cutting depth. Furthermore, both the tangential and normal forces in the longitudinal cutting direction are larger than those in the transverse cutting direction. The impacts and abrasive actions at the tool tip mainly caused the material removal. The predominant material removal mode is brittle fracture in the grinding of unidirectional C/SiC composites, because the damage behaviors of the C/SiC composites are mainly the syntheses of matrix cracking, fiber breakage, and fiber/matrix interfacial debonding. These results are rationalized based on the composite properties and microstructural damage features.     

Preparation and fracture behavior of bionic layered SiCp/Al composites by tape casting and pressure infiltration

In this study, the bioinspired laminated composites with alternating soft Al layers and hard SiCp/Al were fabricated through the tape casting followed by pressure infiltration. In-situ bending and digital image correlation technology (DIC) analysis were carried out on the laminated composites. The results showed that the uniform layers of SiCp/Al and Al were obtained with the thickness of 30 μm and 10 μm, respectively. The interfaces between layers had an intimated combination. The bending deformation process of the laminated composites could be divided into three stages, i.e., crack initiation, crack stable diffusion and crack propagation instability. During deformation, the laminated structure changed the state of strain and strain distribution, further restricted the development of the crack, and the whole materials presented a stepped fracture. This study provides support for preparation and fracture process analysis of biomimetic layered composites prepared by tape casting.     

Thermal effects on removal mechanism of monocrystal SiC during micro-laser assisted nanogrinding process

As a hard-brittle material, research into efficient processing methods of monocrystalline SiC with low damage has attracted a lot of attention. In this paper, removal behavior of monocrystalline SiC using micro-laser assisted method is analyzed using molecular dynamics method. This enables an in-depth theoretical analysis of thermal effects on material removal mechanism for 3C–SiC during nanogrinding process. Taking average laser pulse intensity as a variable, the micro deformation mechanism and machinability under the micro-laser assisted method are analyzed in detail. The results show that laser irradiation can directly affect material removal rate and subsurface damage depth of 3C–SiC. The results of this work significantly improve the understanding of the feasibility of micro-laser assisted method and its optimization for 3C–SiC.     

半固态搅拌制SiC颗粒增强镁基复合材料过程的数值模拟

采用商用的计算流体动力学(CFD)计算软件Fluent对SiC颗粒增强镁基复合材料搅拌过程进行动态模拟,研究了不同搅拌速度、搅拌时间及温度对于SiCp/AZ91(SiC颗粒增强镁合金AZ91)组织的影响。研究结果表明,搅拌时间和搅拌速度对于SiCp/AZ91材料成品质量有显著的影响,搅拌速度的增加有助于SiC颗粒的分散,但速度过快导致液面起伏较大,大量气体进入镁液中,最终使成品中气孔较多。而在搅拌时间方面,当时间较短时,SiC颗粒未充分与合金液混合,因此出现大片SiC颗粒团聚现象。随着搅拌时间的延长,团聚的颗粒逐渐向镁合金液中均匀分散,当搅拌时间为15 min时,SiC固相颗粒与镁合金液所组成的混合相最为均匀,此时继续延长搅拌时间,其固相颗粒的宏观均匀性并未发生进一步变化。根据模拟和试验的结果得出最佳的搅拌时间为15 min,搅拌速度为300 r/min。     

SiC改性C/C复合材料的制备及其烧蚀性能

采用超声波震荡法将SiC微粉添加到二维针刺碳毡预制体中,利用热梯度化学气相浸渗工艺沉积热解碳制备了SiC改性碳纤维增强碳基(carbon fiber reinforced catbon,C/C)复合材料.借助x射线衍射与扫描电子显微镜检测和观察材料的微观结构,利用氧-乙炔烧蚀实验测试材料的抗烧蚀性能.结果表明:SiC微...     

二硼化锆基超高温陶瓷的制备及性能

用碳化硅(SiC)颗粒增韧二硼化锆(ZrB2)陶瓷,在氩气流中热压烧结温度为1 950℃、保温1 h,20 MPa压力下成功制备出了致密的ZrB2/SiCp复合材料.ZrB2/SiCp复合材料的致密度随着SiC颗粒添加量的增加而增加.当SiC颗粒的体积分数(下同)为15%时,相对致密度达到100%.ZrB2/SiCp复合材料的抗弯强度和断裂韧性都随着SiC添加量的增加成上升趋势,当SiC颗粒的添加量在15%时同时达得最大值,分别为646 MPa和8.52 MPam·m1/2.SiCp的添加还提高了ZrB2/SiCp复合材料的耐氧化烧蚀性能.     

Effect of processing technology on structural stability of SiC/SiBCZr ceramic matrix composites

SiC/SiBCZr composites were prepared through polymer impregnation and pyrolysis process using the second generation SiC fibers as raw material. The effects of surface substrate removal, secondary densification, and deposition coating on the structure, mechanical properties, and high temperature stability of SiC/SiBCZr composites were investigated. Results showed that the porosity of SiC/SiC composites could be greatly diminished by the optimized treatment process, and the surface of SiC/SiBCZr composites is uniformly filled into the pores by β-SiC particles, thereby achieving the sealing effect. Meanwhile, the as-prepared SiC/SiBCZr composites had excellent high temperature structural stability. At the later stage of oxidation reaction, borosilicate oxidation products with moderate fluidity, fluid lava form and self repairing function generated from ceramic matrix can effectively inhibit the oxidation reaction and improve the high temperature structural stability of SiC/SiBCZr composites. The above-mentioned high temperature structural stability provided the foundation and technical support for improving the service life and expanding the application of SiC/SiBCZr composites.     

Interconnected SiC–Si network reinforced Al–20Si composites fabricated by high pressure solidification

The microstructures and mechanical properties of the interconnected SiC–Si network reinforced Al–20Si composites solidified under high pressures were investigated. The results demonstrate that the complete interconnected SiC–Si network can be obtained by high pressure solidification, and the connected micron-sized pores are uniformly distributed in the interconnected SiC–Si network. The compressive strength and microhardness of the SiC/Al–20Si composites solidified under 3 GPa were 723 MPa and 229 HV_0.05, respectively. Furthermore, the fracture process of SiC/Al–20Si composites was studied by in situ TEM tensile testing. The result shows that the crack first initiated and propagated at the Al/Si interface under an external load, and the SiC particles in the interconnected SiC–Si network can effectively hinder the crack propagation, thus enhancing the strength.     

温度及表面金属化对铝基复合材料与可伐合金真空钎焊的影响

采用Al63-Cu22-Ti5-Si10钎料,研究了55%SiCp/6063Al复合材料和可伐合金之间的真空钎焊工艺,分析了钎焊温度和复合材料表面镀层材料对接头抗剪强度和显微硬度的影响规律,并对接头的显微组织进行了研究。结果表明钎焊温度和复合材料表面镀层对接头的力学性能影响很大,在同样的焊接参数下,复合材料表面镀铜的试样,其抗剪强度要高于无镀层和镀镍的试样,镀铜试样的最高抗剪强度为92.8 MPa。当钎焊温度从560℃增加到580℃时,接头的抗剪强度逐渐降低再上升,经过不同表面处理的试样均在钎焊温度为560℃时达到最大抗剪强度。钎焊温度相同时,镀铜试样的显微硬度均最高,而镀镍试样的显微硬度最低。焊缝组织致密,没有出现孔洞和未润湿等钎焊缺陷,钎焊完成后,接头中镀层被钎料取代而消失。在保温时间为30 min、真空度6.5×10-3 Pa条件下,采用Al63-Cu22-Ti5-Si10钎料,55%SiCp/6063Al复合材料与可伐合金真空钎焊合理钎焊温度为560℃,合理镀层为镀铜。     

SiC particle reinforced Al matrix composites brazed on aluminum body for lightweight wear resistant brakes

Aluminum alloys are well known light-weight alloys and very interesting materials to optimize the strength/weight ratio in order to reduce automotive vehicle weight, fuel consumption and CO₂ emissions; unfortunately, they are also relatively soft and therefore cannot be used for high wear applications.The aim of this work was to develop an aluminum alloy brake disc with wear-resistant SiC particle reinforced aluminum matrix composites (SiC/Al) joined on to its surface.Different approaches based on brazing or shrink fitting joining technologies were used to join SiC/Al to the aluminum alloy surface.A functional graded structure was built by brazing thin layers of aluminum matrix composites reinforced with progressively higher amount of SiC particles by using a Zn–Al based alloy as joining material. Several samples were prepared by shrink fitting and brazing: 40 mm x 40 mm x 10 mm samples and a 100 mm diameter brake disc with 68% SiC particle reinforced Al matrix surface and aluminum alloy A365 body. Tribological tests demonstrated that an aluminum alloy brake disc with wear-resistant SiC particle reinforced aluminum matrix composites (SiC/Al) brazed on its surface is a promising technical opportunity.     

In situ reaction synthesis and characterization of Ti3Si(Al)C2/SiC composites

The reaction route, microstructure, and properties of Ti₃Si(Al)C₂/SiC composites with 5–30 vol.% SiC content prepared by in situ hot pressing/solid–liquid reaction synthesis process are investigated. In contrast to monolithic Ti₃Si(Al)C₂, the SiC particle-reinforced composites exhibit higher elastic modulus, Vickers hardness, fracture toughness, improved wear, and oxidation resistance, but have a slight loss in flexural strength. The improvement in the properties is mainly ascribed to the contribution of SiC particles, and the strength degradation is due to the residual tensile stresses in the matrix.     

Contact/scratch-induced surface deformation and damage of copper-graphite particulate composites

The elastoplastic surface deformation and damage under frictional sliding contact of copper-graphite particulate composites with Cu-content ranging from 0 to 40 vol% are examined in indentation and scratch tests using a load controlled test system. The contact areas in indentation and scratch tests are estimated with the Field-Swain approximation. The characteristic material parameters of the elastic modulus E′, yield stress Y, interfacial shear strength s, and the scratch resistance are discussed in relation to the Cu-content of the composites. The microscopic mechanisms and processes for the surface deformation and damage induced by frictional sliding contact are also examined. With the increase in the normal contact load, the scratch-induced surface deformation and damage are transiently followed with the sequential four stages: (I) the elastoplastic grooving, (II) plastic plowing, (III) microcracking, and (IV) the inter- and intra-fractures and chipping of graphite particles. The Cu-content in the composite plays the key role in controlling the characteristic contact pressures for these transitional deformation/damage processes.     

Abrasive Wear Characteristics of Silicon Carbide Particle Reinforced Zinc Based Composite

Herein, abrasive wear characteristics of SiCp dispersed zinc-aluminum based composites have been analyzed under high-stress condition. The wear tests were conducted on a Pin-on-Disc machine at a constant linear velocity of 1.57 m/s in the applied load range of 1-7 N while the abrasive platform used is 600 grit emery paper. A matrix alloy was also characterized under identical conditions to assess the influence of the dispersoid (SiC) particle on the wear behaviour. Wear rate, frictional heating and friction coefficient are the focused parameters of the study. The base alloy used has a dendrite structure comprising of α-dendrites surrounded by an α + η eutectoid and metastable ε phase in interdendritic regions. The composite shows similar features to those of the base alloy except the additional presence of the reinforcing SiC particles. The wear rate and friction coefficient decrease with increase in abrading distance while a reverse trend was observed in the case of frictional heating which gradually increases with the increase in abrading distance. Incorporation of SiC particles improves the wear resistance of the matrix alloy and increasing the percentage of SiC increases the frictional heating and reduces the friction coefficient of the test material. The wear mechanism has been understood through SEM examination of wear surface, subsurface, debris particles and degraded abrasive grit papers.     

Material removal mechanism and grinding force modelling of ultrasonic vibration assisted grinding for SiC ceramics

In this paper, a varied-depth nano-scratch test of single grain is carried out on a nano indentation system. The critical depth of the elastic-plastic transition for SiC ceramics is 7.27 nm, as calculated by Hertz contact theory, and the critical depth of the brittle-to-ductile transition is 76.304 nm, as measured by AFM and SEM. Based on the varied-depth nano scratch test and the grain trajectory of ultrasonic vibration assisted grinding (UVAG), a theoretical model of the normal grinding force is acquired using the material removal in unit time as a bridge. The single factor experiment illustrates that the grinding force increases with the increase of the grinding depth, feed rate, and amplitude, while it decreases with the increase of the spindle speed. The contrast experiment results show that UVAG is beneficial for improving the surface quality and reducing the subsurface damage depth compared with common grinding (CG). A four-level and four-factor orthogonal experiment is designed, on the basis of which theoretical model of the normal grinding force for SiC ceramics is obtained using genetic algorithm. The tangential grinding force is obtained from the normal grinding force using the least square method. The experimental results show that the theoretical model is reliable.