High‐efficiency solar cells on phosphorus gettered multicrystalline silicon substrates

Measurements of the dislocation density are compared with locally resolved measurements of carrier lifetime for p‐type multicrystalline silicon. A correlation between dislocation density and carrier recombination was found: high carrier lifetimes (>100 µs) were only measured in areas with low dislocation density (<10⁵ cm⁻²), in areas of high dislocation density (>10⁶ cm⁻²) relatively low lifetimes (<20 µs) were observed. In order to remove mobile impurities from the silicon, a phosphorus diffusion gettering process was applied. An increase of the carrier lifetime by about a factor of three was observed in lowly dislocated regions whereas in highly dislocated areas no gettering efficiency was observed. To test the effectiveness of the gettering in a solar cell manufacturing process, five different multicrystalline silicon materials from four manufacturers were phosphorus gettered. Base resistivity varied between 0·5 and 5 Ω cm for the boron‐ and gallium‐doped p‐type wafers which were used in this study. The high‐efficiency solar cell structure, which has led to the highest conversion efficiencies of multicrystalline silicon solar cells to date, was used to fabricate numerous solar cells with aperture areas of 1 and 4 cm². Efficiencies in the 20% range were achieved for all materials with an average value of 18%. Best efficiencies for 1 cm² (20·3%) and 4 cm² (19·8%) cells were achieved on 0·6 and 1·5 Ω cm, respectively. This proves that multicrystalline silicon of very different material specification can yield very high efficiencies if an appropriate cell process is applied. Copyright © 2006 John Wiley & Sons, Ltd.     

Thermal oxidation for crystalline silicon solar cells exceeding 19% efficiency applying industrially feasible process technology

Thermal oxides are commonly used for the surface passivation of high‐efficiency silicon solar cells from mono‐ and multicrystalline silicon and have led to the highest conversion efficiencies reported so far. In order to improve the cost‐effectiveness of the oxidation process, a wet oxidation in steam ambience is applied and experimentally compared to a standard dry oxidation. The processes yield identical physical properties of the oxide. The front contact is created using a screen‐printing process of a hotmelt silver paste in combination with light‐induced silver plating. The contact formation on the front requires a short high‐temperature firing process, therefore the thermal stability of the rear surface passivation is very important. The surface recombination velocity of the fired oxide is experimentally determined to be below S ≤ 38 cm/s after annealing with a thin layer of evaporated aluminium on top. Monocrystalline solar cells are produced and 19·3% efficiency is obtained as best value on 4 cm² cell area. Simulations show the potential of the developed process to approach 20% efficiency. Copyright © 2008 John Wiley & Sons, Ltd.     

Autodiffusion: a novel method for emitter formation in crystalline silicon thin‐film solar cells

The in situ formation of an emitter in monocrystalline silicon thin‐film solar cells by solid‐state diffusion of dopants from the growth substrate during epitaxy is demonstrated. This approach, that we denote autodiffusion, combines the epitaxy and the diffusion into one single process. Layer‐transfer with porous silicon (PSI process) is used to fabricate n‐type silicon thin‐film solar cells. The cells feature a boron emitter on the cell rear side that is formed by autodiffusion. The sheet resistance of this autodiffused emitter is 330 Ω/□. An independently confirmed conversion efficiency of (14·5 ± 0·4)% with a high short circuit current density of (33·3 ± 0·8) mA/cm² is achieved for a 2 × 2 cm² large cell with a thickness of (24 ± 1) µm. Transferred n‐type silicon thin films made from the same run as the cells show effective carrier lifetimes exceeding 13 µs. From these samples a bulk diffusion length L > 111 µm is deduced. Amorphous silicon is used to passivate the rear surface of these samples after the layer‐transfer resulting in a surface recombination velocity lower than 38 cm/s. Copyright © 2006 John Wiley & Sons, Ltd.     

Efficiency (>15%) for thin‐film epitaxial silicon solar cells on 70 cm2 area offspec silicon substrate using porous silicon segmented mirrors

We report on the beneficial use of embedded segmented porous silicon broad‐band optical reflectors for thin‐film epitaxial silicon solar cells. These reflectors are formed by gradual increase of the spatial period between the layer segments, allowing for an enhanced absorption of low energy photons in the epitaxial layer. By combining these reflectors with well‐established solar cell processing by photolithography, a conversion efficiency of 15·2% was reached on 73 cm² area, highly doped offspec multicrystalline silicon substrates. The corresponding photogenerated current densities (J_sc) were well above 31 mA/cm² for an active layer of only 20 µm. Copyright © 2010 John Wiley & Sons, Ltd.     

Stack system of PECVD amorphous silicon and PECVD silicon oxide for silicon solar cell rear side passivation

A stack of hydrogenated amorphous silicon (a‐Si) and PECVD‐silicon oxide (SiO_x) has been used as surface passivation layer for silicon wafer surfaces. Very good surface passivation could be reached leading to a surface recombination velocity (SRV) below 10 cm/s on 1 Ω cm p‐type Si wafers. By using the passivation layer system at a solar cell's rear side and applying the laser‐fired contacts (LFC) process, pointwise local rear contacts have been formed and an energy conversion efficiency of 21·7% has been obtained on p‐type FZ substrates (0·5 Ω cm). Simulations show that the effective rear SRV is in the range of 180 cm/s for the combination of metallised and passivated areas, 120 ± 30 cm/s were calculated for the passivated areas. Rear reflectivity is comparable to thermally grown silicon dioxide (SiO₂). a‐Si rear passivation appears more stable under different bias light intensities compared to thermally grown SiO₂. Copyright © 2008 John Wiley & Sons, Ltd.     

Performance enhancement of multicrystalline silicon solar cells and modules using double‐layered SiNx:H antireflection coatings

Silicon nitride coating deposited by the plasma‐enhanced chemical vapor deposition method is the most widely used antireflection coating for crystalline silicon solar cells. In this work, we employed double‐layered silicon nitride coating consisting of a top layer with a lower refractive index and a bottom layer (contacting the silicon wafer) with a higher refractive index for multicrystalline silicon solar cells. An optimization procedure was presented for maximizing the photovoltaic performance of the encapsulated solar cells or modules. The dependence of their photovoltaic properties on the thickness of silicon nitride coatings was carefully analyzed. Desirable thicknesses of the individual silicon nitride layers for the double‐layered coatings were calculated. In order to get statistical conclusions, we fabricated a large number of multicrystalline silicon solar cells using the standard production line for both the double‐layered and single‐layered antireflection coating types. On the cell level, the double‐layered silicon nitride antireflection coating resulted in an increase of 0.21%, absolute for the average conversion efficiency, and 1.8 mV and 0.11 mA/cm² for the average open‐circuit voltage and short‐circuit current density, respectively. On the module level, the cell to module power transfer factor was analyzed, and it was demonstrated that the double‐layered silicon nitride antireflection coating provided a consistent enhancement in the photovoltaic performance for multicrystalline silicon solar cell modules than the single‐layered silicon nitride coating. Copyright © 2015 John Wiley & Sons, Ltd.     

20.1%‐efficient crystalline silicon solar cell with amorphous silicon rear‐surface passivation

We have developed a crystalline silicon solar cell with amorphous silicon (a‐Si:H) rear‐surface passivation based on a simple process. The a‐Si:H layer is deposited at 225°C by plasma‐enhanced chemical vapor deposition. An aluminum grid is evaporated onto the a‐Si:H‐passivated rear. The base contacts are formed by COSIMA (contact formation to a‐Si:H passivated wafers by means of annealing) when subsequently depositing the front silicon nitride layer at 325°C. The a‐Si:H underneath the aluminum fingers dissolves completely within the aluminum and an ohmic contact to the base is formed. This contacting scheme results in a very low contact resistance of 3.5 ±0.2 mΩ cm² on low‐resistivity (0.5 Ω cm) p‐type silicon, which is below that obtained for conventional Al/Si contacts. We achieve an independently confirmed energy conversion efficiency of 20.1% under one‐sun standard testing conditions for a 4 cm² large cell. Measurements of the internal quantum efficiency show an improved rear surface passivation compared with reference cells with a silicon nitride rear passivation. Copyright © 2005 John Wiley & Sons, Ltd.     

Front and rear silicon‐nitride‐passivated multicrystalline silicon solar cells with an efficiency of 18.1%

A solar cell process designed to utilise low‐temperature plasma‐enhanced chemical vapour deposited (PECVD) silicon nitride (SiN_x) films as front and rear surface passivation was applied to fabricate multicrystalline silicon (mc‐Si) solar cells. Despite the simple photolithography‐free processing sequence, an independently confirmed efficiency of 18.1% (cell area 2 × 2 cm²) was achieved. This excellent efficiency can be predominantly attributed to the superior quality of the rear surface passivation scheme consisting of an SiN_x film in combination with a local aluminium back‐surface field (LBSF). Thus, it is demonstrated that low‐temperature PECVD SiN_x films are well suited to achieve excellent rear surface passivation on mc‐Si. Copyright © 2002 John Wiley & Sons, Ltd.     

Bifacial silicon solar cells with 21·3% front efficiency and 19·8% rear efficiency

We introduced a triode structure with p–n junctions on both sides into single‐crystalline bifacial silicon solar cells in order to improve solar cell performance. These fabricated bifacial silicon solar cells have an energy conversion efficiency of 21·3% under front 1 sun illumination (the standard 1 kW/m² AM 1·5 global spectrum at 25°C) and 19·8% under rear 1 sun illumination tested at the Japan Quality Assurance Organization. The total of the front and rear conversion efficiencies is the highest ever reported for bifacial silicon solar cells. Copyright © 2000 John Wiley & Sons, Ltd.     

High-efficiency Multicrystalline Silicon Solar Cells using Standard High-temperature,Float-zoned Cell Processing

This paper reports recent results of fabricating multicrystalline silicon solar cells with the standard PERL (passivated emitter, rear locally-diffused) cell high-temperature processing sequence originally developed for float-zoned wafers. One of these multicrystalline silicon cells with a planar front surface demonstrated a 645-mV open-circuit voltage and 18.2% energy conversion efficiency tested at the National Renewable Energy Laboratory and Sandia National Laboratories under the 100 mW cm⁻² AM1.5 global spectrum at 25°C. This is the highest confirmed voltage and one of the highest confirmed conversion efficiencies ever reported to date for a multicrystalline silicon cell. Further optimization of the standard PERL processing and texturing of the cell surfaces is expected to improve the cell efficiency to over 19% in the near future. © 1997 John Wiley & Sons, Ltd.     

Bulk and surface passivation of silicon solar cells accomplished by silicon nitride deposited on industrial scale by microwave PECVD

Bulk and surface passivation by silicon nitride has become an indispensable element in industrial production of multicrystalline silicon (mc‐Si) solar cells. Microwave PECVD is a very effective method for high‐throughput deposition of silicon nitride layers with the required properties for bulk and surface passivation. In this paper an analysis is presented of the relation between deposition parameters of microwave PECVD and material properties of silicon nitride. By tuning the process conditions (substrate temperature, gas flows, working pressure) we have been able to fabricate silicon nitride layers which fulfill almost ideally the four major requirements for mc‐Si solar cells: (1) good anti‐reflection coating (refractive index tunable between 2·0 and 2·3); (2) good surface passivation on p‐type FZ wafers (S_eff<30 cm/s); (3) good bulk passivation (improvement of IQE at 1000 nm by 30% after short thermal anneal); (4) long‐term stability (no observable degradation after several years of exposure to sunlight). By implementing this silicon nitride deposition in an inline production process of mc‐Si solar cells we have been able to produce cells with an efficiency of 16·5%. Finally, we established that the continuous deposition process could be maintained for at least 20 h without interruption for maintenance. On this timescale we did not observe any significant changes in layer properties or cell properties. This shows the robustness of microwave PECVD for industrial production. Copyright © 2005 John Wiley & Sons, Ltd.     

20·5% efficient silicon solar cell with a low temperature rear side process using laser‐fired contacts

The paper presents a rear side structure for crystalline silicon solar cells, which is processed at a maximum temperature of 220°C. Using two different material compositions for electrical and optical needs, the layer system has excellent passivation properties, enhances light trapping and allows for a good ohmic contact. With this structure we achieve an independently confirmed conversion efficiency η=20·5% on a 250 μm thick silicon solar cell. Due to the fact that the maximum process temperature is 220°C, this layer system enables new solar cell concepts. Copyright © 2006 John Wiley & Sons, Ltd.     

Surface passivation of high‐efficiency silicon solar cells by atomic‐layer‐deposited Al2O3

Atomic‐layer‐deposited aluminium oxide (Al₂O₃) is applied as rear‐surface‐passivating dielectric layer to passivated emitter and rear cell (PERC)‐type crystalline silicon (c‐Si) solar cells. The excellent passivation of low‐resistivity p‐type silicon by the negative‐charge‐dielectric Al₂O₃ is confirmed on the device level by an independently confirmed energy conversion efficiency of 20·6%. The best results are obtained for a stack consisting of a 30 nm Al₂O₃ film covered by a 200 nm plasma‐enhanced‐chemical‐vapour‐deposited silicon oxide (SiO_x) layer, resulting in a rear surface recombination velocity (SRV) of 70 cm/s. Comparable results are obtained for a 130 nm single‐layer of Al₂O₃, resulting in a rear SRV of 90 cm/s. Copyright © 2008 John Wiley & Sons, Ltd.     

Optimizing annealing steps for crystalline silicon solar cells with screen printed front side metallization and an oxide‐passivated rear surface with local contacts

Silicon solar cells that feature screen printed front contacts and a passivated rear surface with local contacts allow higher efficiencies compared to present industrial solar cells that exhibit a full area rear side metallization. If thermal oxidation is used for the rear surface passivation, the final annealing step in the processing sequence is crucial. On the one hand, this post‐metallization annealing (PMA) step is required for decreasing the surface recombination velocity (SRV) at the aluminum‐coated oxide‐passivated rear surface. On the other hand, PMA can negatively affect the screen printed front side metallization leading to a lower fill factor. This work separately analyzes the impact of PMA on both, the screen printed front metallization and the oxide‐passivated rear surface. Measuring dark and illuminated IV‐curves of standard industrial aluminum back surface field (Al‐BSF) silicon solar cells reveals the impact of PMA on the front metallization, while measuring the effective minority carrier lifetime of symmetric lifetime samples provides information about the rear side SRV. One‐dimensional simulations are used for predicting the cell performance according to the contributions from both, the front metallization and the rear oxide‐passivation for different PMA temperatures and durations. The simulation also includes recombination at the local rear contacts. An optimized PMA process is presented according to the simulations and is experimentally verified. The optimized process is applied to silicon solar cells with a screen printed front side metallization and an oxide‐passivated rear surface. Efficiencies up to 18.1% are achieved on 148.8 cm² Czochralski (Cz) silicon wafers. Copyright © 2009 John Wiley & Sons, Ltd.     

Surface passivation of crystalline silicon solar cells: a review

In the 1980s, advances in the passivation of both cell surfaces led to the first crystalline silicon solar cells with conversion efficiencies above 20%. With today's industry trend towards thinner wafers and higher cell efficiency, the passivation of the front and rear surfaces is now also becoming vitally important for commercial silicon cells. This paper presents a review of the surface passivation methods used since the 1970s, both on laboratory‐type as well as industrial cells. Given the trend towards lower‐cost (but also lower‐quality) Si materials such as block‐cast multicrystalline Si, ribbon Si or thin‐film polycrystalline Si, the most promising surface passivation methods identified to date are the fabrication of a p–n junction and the subsequent passivation of the resulting silicon surface with plasma silicon nitride as this material, besides reducing surface recombination and reflection losses, additionally provides a very efficient passivation of bulk defects. Copyright © 2000 John Wiley & Sons, Ltd.     

19% efficient n‐type Czochralski silicon solar cells with screen‐printed aluminium‐alloyed rear emitter

High and stable lifetimes recently reported for n‐type silicon materials are an important and promising prerequisite for innovative solar cells. To exploit the advantages of the excellent electrical properties of n‐type Si wafers for manufacturing simple and industrially feasible high‐efficiency solar cells, we focus on back junction n⁺np⁺ solar cells featuring an easy‐to‐fabricate full‐area screen‐printed aluminium‐alloyed rear p⁺ emitter. Independently confirmed record‐high efficiencies have been achieved on n‐type phosphorus‐doped Czochralski‐grown silicon material: 18·9% for laboratory‐type n⁺np⁺ solar cells (4 cm²) with shadow‐mask evaporated front contact grid and 17·0% for front and rear screen‐printed industrial‐type cells (100 cm²). The electrical cell parameters were found to be perfectly stable under illumination. Copyright © 2006 John Wiley & Sons, Ltd.     

Silicon solar cells based on all‐laser‐transferred contacts

Crystalline silicon solar cells based on all‐laser‐transferred contacts (ALTC) have been fabricated with both front and rear metallization achieved through laser induced forward transferring. Both the front and rear contacts were laser‐transferred from a glass slide coated with a metal layer to the silicon substrate already processed with emitter formation, surface passivation, and antireflection coating. Ohmic contacts were achieved after this laser transferring. The ALTC solar cells were fabricated on chemically textured p‐type Cz silicon wafers. An initial conversion efficiency of over 15% was achieved on a simple cell structure with full‐area emitter. Further improvements are expected with optimized laser transferring conditions, front grid pattern design, and surface passivation. The ALTC process demonstrates the advantage of laser processing in simplifying the solar cell fabrication by a one‐step metal transferring and firing process. Copyright © 2013 John Wiley & Sons, Ltd.     

Development of concentrator modules with dome‐shaped Fresnel lenses and triple‐junction concentrator cells

The status of the development of a new concentrator module in Japan is discussed based on three arguments, performance, reliability and cost. We have achieved a 26·6% peak uncorrected efficiency from a 7056 cm² 400 × module with 36 solar cells connected in series, measured in house. The peak uncorrected efficiencies of the same type of the module with 6 solar cells connected in series and 1176 cm² area measured by Fraunhofer ISE and NREL are reported as 27·4% and 24·8% respectively. The peak uncorrected efficiency for a 550× and 5445 cm² module with 20 solar cells connected in series was 28·9% in house. The temperature‐corrected efficiency of the 550 × module under optimal solar irradiation condition was 31·5 ± 1·7%. In terms of performance, the annual power generation is discussed based on a side‐by‐side evaluation against a 14% commercial multicrystalline silicon module. For reliability, some new degradation modes inherent to high concentration III‐V solar cell system are discussed and a 20‐year lifetime under concentrated flux exposure proven. The fail‐safe issues concerning the concentrated sunlight are also discussed. Moreover, the overall scenario for the reduction of material cost is discussed. Copyright © 2005 John Wiley & Sons, Ltd.     

Passivating thin bifacial silicon solar cells for industrial production

A scheme for passivating thin multi‐crystalline silicon solar cells compatible to mass production is presented. Wafers with a thickness of 180 µm were processed into solar cells. The otherwise severe bowing has been avoided by reduced aluminium coverage on the rear surface. The process scheme includes a silicon nitride firing through step for conventional screen printed contacts, where a silicon nitride layer on the rear surface acts as surface passivation layer and enables a gain in efficiency of 0.6% [abs.]. Copyright © 2007 John Wiley & Sons, Ltd.     

17.6% efficient tricrystalline silicon solar cells with spatially uniform texture

Up to now solar cells fabricated on tricrystalline Czochralski‐grown silicon (tri‐Si) have shown relatively low short‐circuit current densities of about 31–33 mA/cm² because the three {110}‐oriented grains cannot effectively be textured by commonly used anisotropic etching solutions. In this work, we have optimised a novel chemical texturing step for tri‐Si and integrated it successfully into our solar cell process. Metal/insulator/semiconductor‐contacted phosphorus‐diffused n⁺p junction silicon solar cells with a silicon‐dioxide‐passivated rear surface and evaporated aluminium contacts were manufactured, featuring a spatially uniform surface texture over all three grains on both cell sides. Despite the simple processing sequence and cell structure, an independently confirmed record efficiency of 17.6% has been achieved. This excellent efficiency is mainly due to an increased short‐circuit current density of 37 mA/cm² obtained by substantially reduced reflection and enhanced light trapping. Copyright © 2003 John Wiley & Sons, Ltd.