共查询到20条相似文献,搜索用时 125 毫秒
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形变铜基原位复合材料是高强度高导电性铜合金的研究热点和发展方向之一,其突出的特点是具有超高的强度和良好的电导率。综述了铜基原位复合材料的研究现状,介绍了该类材料的制备工艺、组织演变、强化导电机理和性能特点,重点对其强化机理作了论述,并对该类材料的发展方向作了展望。 相似文献
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非连续增强铜基复合材料的研究现状 总被引:3,自引:0,他引:3
非连续增强铜基复合材料具有很高的导电、导热性能,以及优异的摩擦磨损特性和较高的高温力学性能,是导电、导热、耐磨、减摩等领域的理想材料。本文综述了非连续增强铜基复合材料的研究现状,介绍了该类材料的设计原理以及力学、摩擦磨损、导电导热等性能,回顾了材料的制备工艺,指出了各种工艺的优缺点,最后阐述了非连续增强铜基复合材料的发展方向。 相似文献
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高强度导电铜基复合材料 总被引:51,自引:1,他引:50
高强度导电铜基复合材料是一类很有应用潜力的功能材料,本文综述了该类材料的国内外研究现状,并对其设计原理,制备工艺及性能进行了介绍,最后阐述了该类材料的发展方向。 相似文献
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Günter Wirth 《Materialwissenschaft und Werkstofftechnik》1976,7(2):50-62
Metalmatrix Composites for High Temperatures . Developmental features are shown of fiber reinforced metal matrix composites with high-temperature strength and their problems of application in gas turbine blades with the most severe mechanical, chemical and thermal service conditions. Stability and strength at high temperatures are discussed in general as well as fabrication problems and properties of composites with separately produced fibers and ?in-situ”? composites out of directionally solidified eutectics. Advantages and disadvantages of the different approaches are compared. 相似文献
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采用粉末冶金法,通过“湿法混合”、放电等离子烧结和热挤压相结合的三步工艺分别制备了石墨烯纳米片(GNP)增强铜基复合材料(GNP-Cu)和GNP-Ni增强铜基复合材料(GNP-Ni/Cu)。通过物相组成和显微组织表征,并结合致密度、电导率和力学性能测试,结果表明:GNP和Ni的含量(质量分数)分别为0.2%和1.5%的GNP-Ni/Cu复合材料,其显微硬度和屈服强度比纯Cu分别提高了38%和50%、比0.2GNP/Cu复合材料分别提高了14.0%和11.6%。这些结果表明,Ni的添加改善了GNP与Cu的界面结合,使GNP-Ni/Cu复合材料的力学性能显著提高。GNP的载荷传递强化和热失配强化以及Ni的固溶强化,是材料力学性能提高的主要原因。 相似文献
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SiCp/MoSi2原位反应高温热压复合工艺的研究 总被引:1,自引:0,他引:1
王含英 《材料科学与工程学报》2006,24(4):603-606
运用乙醇湿法混合和氩气保护原位反应高温热压方法制备了不同配比的SiCp/MoSi2复合材料,研究了原位生成的SiC颗粒对MoSi2基体材料显微结构和室温力学性能的影响.结果表明:原位反应高温热压制备SiCp/MoSi2的工艺是可行的,反应生成的适量SiC颗粒细化了基体晶粒,改善了其力学性能;与该工艺下制备的纯MoSi2相比,含40vol%SiCp的SiCp/MoSi2复合材料室温抗弯强度提高了260%,含50vol%SiCp的SiCp/MoSi2复合材料室温断裂韧性提高了50%;该种工艺的强化机制为细晶强化和弥散强化,韧化机制为细晶韧化. 相似文献
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Niranjanmurthi L Choi BC Park JM Lim KT 《Journal of nanoscience and nanotechnology》2012,12(1):754-759
Composite materials of multi-walled carbon nanotubes (MWNTs) and a conducting polymer, poly(3-thiophene boronic acid) (PTBA) were prepared by in-situ oxidative polymerization of TBA in the presence of MWNTs and potassium dichromate. The MWNTs which were previously surface functionalized with acid chloride groups were reacted with TBA using a simple "chemical grafting" technique. It was observed that the nanotubes were dispersed uniformly in the pi-conjugated polymer matrix and entrapped by the polymer. The conductivity of the composites was higher than that of the pure polymer from a conventional four-probe technique, which indicates that the fabrication of MWNTs into the polymer matrix significantly improves the conductivity of the polymer due to the intrinsic properties of MWNTs. 相似文献
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Particle reinforced metals are developed as heat sink materials for advanced thermal management applications. Metal matrix composites combine the high thermal conductivity of a metal with a low coefficient of thermal expansion of ceramic reinforcements. SiC and carbon diamond particle reinforced aluminum offer suitable thermal properties for heat sink applications. These composites are produced by liquid metal infiltration of a densely packed particle preform. Wettability, interface bonding strength and thermal mismatch are critical for void formation which leads to thermal fatigue damage under operation. The evolution of voids in AlSiC and AlCD has been studied by in-situ high resolution synchrotron tomography during matrix solidification. Large irregularly shaped matrix voids form during eutectic solidification. These voids help alleviate thermal expansion mismatch stresses by visco-plastic matrix deformation during cooling to RT after solidification, if sufficient interface bonding strength is assumed. 相似文献
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真空压力浸渗法制备SiCp/Al的研究 总被引:4,自引:0,他引:4
用真空压力浸渗法制备了SiCp/Al复合材料,研究表明,这种工艺的优点是制备的SiP/Al复合材料颗粒含量高,热膨胀系数低且可调整,如能提供精密模具,该工艺对于开发SiP/Al复合材料作为一析兴电子封装材料是极具竞争力的。研究还发现,将真空压力浸渗法制备的颗粒含量的复合材料过重熔稀释可制成颗粒含量适中、气孔率低、无氧化夹杂和界面反应的最终复合材料,与复合铸造法制备的同样材料相比,这种材料具有低的气 相似文献