基于Linux下USB主机接口设计

在Linux 系统下,基于嵌入式处理器扩展USB主机端口的工作原理,提出了USB主机接口的软硬件设计方案,该系统可增加在某些称重设备的USB主机端口,抛开了PC机,既可作为主机,也可作为外设,与其他OTG设备直接实现点对点通信,实现称重设备系统升级的快捷、方便,系统性能稳定可靠.在实际中该USB主机接口设计取得良好效果.     

USB接口芯片ISP1362及其在SOPC中的应用

ISP1362是Philips公司的一款USB接口芯片,内部有3个USB控制器——主机控制器、设备控制器和OTG控制器,可以设置为USB主机模式、设备模式以及OTG模式,因此具有较强的灵活性,尤其是OTG的工作模式,使得许多设备可以脱离PC机进行数据传输和通信。介绍ISP1362的常用功能,即该芯片作为主机控制器时的使用,并以USB鼠标为例,介绍了他在SOPC中作为USB主机模式的应用,并能试验板的液晶屏上看到其移动的方向,完成了嵌入式系统的外设功能。     

USB On-The-Go工作原理分析和应用研究

USB的传输速度目前已达480Mbps，而USB OTG(On—The—Go)则以其双重强大功能使USB设备摆脱了对PC的完全依赖。USB OTG是USB2．0规范的补充，它可使外设在无主机参与的情况下直接互连以进行通信。文章介绍了USB OTG的工作原理，并在分析了USB OTG的基础上，提出了针对数码相机伴侣问题的一种解决方案。     

USB On-The-Go 工作原理分析和应用研究

USB(Universal Serial Bus)经过了9年发展，已经得到了市场的认可，其传输速度达到了最大480Mb／s的惊人地步，而USB OTG(On-The—Go)的推出更是鼓舞人心，其双重角色的强大功能可以使USB设备摆脱对PC的完全依赖。USB OTG是USB2．0规范的补充，他使外设可以在无主机参与的情况下直接互连进行通信工程。本文简单介绍了USB OTG的工作原理，并分析了现在USB OTG的应用情况，重点针对数码相机伴侣存在的问题，作者提出了自己的解决方案。     

基于i.MX21的USB OTG研究与实现

随着嵌入式系统的深入发展，越来越多的芯片设计公司都将自己的产品向着SOC方向发展，SOC模块首选接口为USB接口，具有使用方便、传输速度快、成本低、稳定性好等特点。目前大部分设备还不能通过USB接口直接通信，新的USBOn-The-Go（OTG）标准正是针对这一情况推出的，USB设备既可以作为主机，也可以作为从机，彼此之间能够互相通信，并根据实际情况协商确定哪个设备作为主机，它将最终结束电脑作为各种电子设备连接纽带的时代。     

互连型微控制器

STM32互连型系列微控制器增加一个全速USB（OTG）接口,使终端产品在连接另一个USB设备时既可以充当USB主机又可充当USB从机。     

飞利浦半导体研发出可进行直接连接的USB On-The-Go样机

<正> 飞利浦半导体日前宣布推出业界首个USB On-The-Go(OTG)样机。该样机符合USB实施论坛(USB ImplementersForum)的USB2.0标准OTG补充条款。 该样机的推出意味着USB主机可直接连接USB外设,并命令其执行以往由USB主机完成的功能。例如,USB OTG的用     

USB总线现状及其未来发展

USB是Universal Serial Bus（通用串行总线，也译为万能总线）的简称，是1995年Compaq等公司为了解决传统总线的不足而推广的一种新型串行通讯标准，近年来在PC领域广为应用。现在PC机均配备有USB接口，流行的操作系统也都支持USB，很多厂商提供USB芯片，外设，USB已进入其发展的黄金时代。与其他总线相比，USB有很多优势，例如速度快，设备安装和配置简单，连接容易，支持热插拔，占用主机资源少，易于扩展等。     

具有片上ADC的48V热插拨控制器

Maxim推USB On-the-Go(OTG)收发器：MAX3301E，非常适合蜂窝电话、PDA以及数码相机等便携式设备。USBOTG是对USB2．0规范的补充，它不需要通过PC主机就可直接连接外围设备。     

通用串行总线（USB）技术规范

通用串行总线(USB,Universal Serial Bus)用于计算机与外设之间的数据交换。USB允许外设在主机和其它外设工作时进行连接、配置、使用及迁移。即所谓“即插即用”。应用USB总线可以减少PC机上过多的I/O端口,而以一个串行通道取代,使PC机与外设之间连接更容易。它已成为PC接口标准之一。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks