Electron transport in unipolar heterostructure transistors with quantum dots in strong electric fields

A model for the explaining specific features of the electron transport in strong electric fields in the quantum-dot unipolar heterostructure transistor (AlGaAs/GaAs/InAs/GaAs/InAs) is presented. It is shown that the two-step shape of the output current-voltage characteristic I _D (V _D ) and the anomalous dependence of the drain current I _D on the gate voltage V _G are caused by the ionization of quantum dots in the strong electric field at the drain gate edge. The ionization of quantum dots sets in at the drain voltage V _D that exceeds the V_D1 value, at which the I _D (V _D ) dependence is saturated (the first step of the I-V characteristic). With the subsequent increase in V _D , i.e., for V _D >V_D1, the I _D (V _D ) dependence has a second abrupt rise due to the ionization of quantum dots, and then, for V _D =V_D2>V_D1, the current I _D is saturated for the second time (the second step in the current-voltage characteristic). It is suggested to use this phenomenon for the determining the population of quantum dots with electrons. The model presented also describes the twice-repeated variation in the sign of transconductance g _m =dI _D /dV _G as a function of V _G .     

<Emphasis Type="Italic">C-V</Emphasis> and <Emphasis Type="Italic">I-V</Emphasis> characteristics of ultrathin-oxide MOS structures: Identification and analysis

For an NMOS structure with 3.7-nm-thick oxide, dynamic I-V characteristics are digitally measured by applying an upward and a downward gate-voltage ramp. An averaging procedure is employed to deduce the tunneling (active) current component and the quasi-static C-V characteristic (CVC). Analyzing the depletion segment of the CVC provides reliable values of the semiconductor doping level, the oxide capacitance and thickness, and the sign and density of oxide-fixed charge, as well as estimates of the dopant concentration in the poly-Si region. These data are used to identify the Ψ_s(V _g), V _i(V _g), and I _t(V _i) characteristics, where Ψ_s is the n-Si surface potential, V _i is the voltage drop across the oxide, V _g is the gate voltage, and I _t is the tunneling current; the gate-voltage range explored extends to prebreakdown fields (～13 MV cm^?1). The results are obtained without recourse to fitting parameters and without making any assumptions as to the energy spectrum of electrons tunneling from the n-Si deep-accumulation region through the oxide. It is believed that experimental I _t-V _i and Ψ_s-V _g characteristics will provide a basis for developing a theory of tunneling covering not only the degeneracy and size quantization of the electron gas in the semiconductor but also the nonclassical profile of the potential barrier to electron tunneling associated with the oxide-fixed charge.     

Electronic Processes in CdIn<Subscript>2</Subscript>Te<Subscript>4</Subscript> Crystals

The results of investigations of electrical, optical, and photoelectric properties of CdIn₂Te⁴ crystals, which were grown by the Bridgman method are presented. It is shown that electrical conductivity is determined mainly by electrons with the effective mass m_n = 0.44m₀ and the mobility 120–140 cm²/(V s), which weakly depends on temperature. CdIn₂Te₄ behaves as a partially compensated semiconductor with the donor-center ionization energy E_d = 0.38 eV and the compensation level K = N_a/N_d = 0.36. The absorption-coefficient spectra at the energy hν < E_g = 1.27 eV are subject to the Urbach rule with a typical energy of 18–25 meV. The photoconductivity depends on the sample thickness. The diffusion length, the charge-carrier lifetime, and the surface-recombination rate are determined from the photoconductivity spectra.     

On the photoconductivity of TlInSe<Subscript>2</Subscript>

The current–voltage (I–V) and photocurrent–light intensity (I _pc –Φ) characteristics and the photoconductivity relaxation kinetics of TlInSe₂ single crystals are investigated. Anomalously long relaxation times (τ ≈ 10³ s) and some other specific features of the photoconductivity are observed, which are explained within the barrier theory of inhomogeneous semiconductors. The heights of the drift and recombination barriers are found to be, respectively, E _dr ≈ 0.1 eV and E _r ≈ 0.45 eV.     

Modified Interface Properties of Au/<Emphasis Type="Italic">n</Emphasis>-type GaN Schottky Junction with a High-<Emphasis Type="Italic">k</Emphasis> Ba<Subscript>0.6</Subscript>Sr<Subscript>0.4</Subscript>TiO<Subscript>3</Subscript> Insulating Layer

The interface properties of a Au/n-GaN Schottky junction (SJ) were modified by placing a high-k barium strontium titanate (Ba_0.6Sr_0.4TiO₃) insulating layer between the Au and n-GaN semiconductor. The surface morphology, chemical composition, and electrical properties of Au/Ba_0.6Sr_0.4TiO₃ (BST)/n-GaN metal/insulator/semiconductor (MIS) junctions were explored by atomic force microscopy, energy-dispersive x-ray spectroscopy, current–voltage (I–V) and capacitance–voltage (C–V) techniques. The electrical results of the MIS junction are correlated with the SJ and discussed further. The MIS junction exhibited an exquisite rectifying nature compared to the SJ. An average barrier height (BH) and ideality factors were extracted to be 0.77 eV, 1.62 eV and 0.92 eV, 1.95 for the SJ and MIS junction, respectively. The barrier was raised by 150 meV for the MIS junction compared to the MS junction, implying that the BH was effectively altered by the BST insulating layer. The BH values extracted by I–V, Cheung’s and Norde functions were nearly equal to one another, indicating that the techniques applied here were dependable and suitable. The frequency-dependent properties of the SJ and MIS junction were explored and discussed. It was found that the interface state density of the MIS junction was smaller than the SJ. This implies that the BST layer plays an imperative role in the decreased N_SS. Poole–Frenkel emission was the prevailed current conduction mechanism in the reverse-bias of both the SJ and MIS junction.     

Structural and Electrical Properties of Ag/<Emphasis Type="Italic">n</Emphasis>-TiO<Subscript>2</Subscript>/<Emphasis Type="Italic">p</Emphasis>-Si/Al Heterostructure Fabricated by Pulsed Laser Deposition Technique

We have investigated the structural and electrical characteristics of the Ag/n-TiO₂/p-Si/Al heterostructure. Thin films of pure TiO₂ were deposited on p-type silicon (100) by optimized pulsed laser ablation with a KrF-excimer laser in an oxygen-controlled environment. X-ray diffraction analysis showed the formation of crystalline TiO₂ film having a tetragonal texture with a strong (210) plane as the preferred direction. High purity aluminium and silver metals were deposited to obtain ohmic contacts on p-Si and n-TiO₂, respectively. The current–voltage (I–V) characteristics of the fabricated heterostructure were studied by using thermionic emission diffusion mechanism over the temperature range of 80–300 K. Parameters such as barrier height and ideality factor were derived from the measured I–V data of the heterostructure. The detailed analysis of I–V measurements revealed good rectifying behavior in the inhomogeneous Ag/n-TiO₂/p-Si(100)/Al heterostructure. The variations of barrier height and ideality factor with temperature and the non-linearity of the activation energy plot confirmed that barrier heights at the interface follow Gaussian distributions. The value of Richardson’s constant was found to be 6.73 × 10⁵ Am^?2 K^?2, which is of the order of the theoretical value 3.2 × 10⁵ Am^?2 K^?2. The capacitance–voltage (C–V) measurements of the heterostructure were investigated as a function of temperature. The frequency dependence (Mott–Schottky plot) of the C–V characteristics was also studied. These measurements indicate the occurrence of a built-in barrier and impurity concentration in TiO₂ film. The optical studies were also performed using a UV–Vis spectrophotometer. The optical band gap energy of TiO₂ films was found to be 3.60 eV.     

Electrical and photoelectric properties of <Emphasis Type="Italic">n</Emphasis>-TiN/<Emphasis Type="Italic">p</Emphasis>-Hg<Subscript>3</Subscript>In<Subscript>2</Subscript>Te<Subscript>6</Subscript> heterostructures

n-TiN/p-Hg₃In₂Te₆ heterostructures are fabricated by depositing a thin n-type titanium nitride (TiN) film onto prepared p-type Hg₃In₂Te₆ plates using reactive magnetron sputtering. Their electrical and photoelectric properties are studied. Dominant charge-transport mechanisms under forward bias are analyzed within tunneling-recombination and tunneling models. The fabricated n-TiN/p-Hg₃In₂Te₆ structures have the following photoelectric parameters at an illumination intensity of 80 mW/cm²: the open-circuit voltage is V_OC = 0.52 V, the short-circuit current is I_SC = 0.265 mA/cm², and the fill factor is FF = 0.39.     

On <Emphasis Type="Italic">g</Emphasis><Subscript>m</Subscript>-boosted follower-amplifier and its novel circuit transformation based mid-band derivations

This brief paper investigates the small-signal mid-band behavior of g _m-boosted follower-amplifiers which has not been explored previously and whose analysis is not available in text-books or any other source. Both g _m-boosted source follower and g _m-boosted emitter follower are considered in the mid-band analysis. A novel circuit/source transformation based “pictorial” technique with progressively simplified circuit diagrams is employed for this mid-band analysis which generally eliminates the need for solving nodal or mesh equations. Final expression is often achieved by inspection of the simplified circuit without the need for circuit analysis. The paper also discusses g _m-boosted BiCMOS follower amplifier using substrate PNP device in a pure CMOS process. The analysis demonstrates that the unity gain accuracy of follower-amplifier can be considerably enhanced using the g _m-boosting technique without sacrificing bandwidth.     

Structural transformations and optical properties of As<Subscript>2</Subscript>S<Subscript>3</Subscript> chalcogenide glasses

The effects of melt temperature T _i and quenching rate V _i on the structure and optical properties of As₂S₃ glasses is studied. It is found that the glass band gap increases with T _i and V _i , whereas a decrease is observed in the glass density, refractive index (from 2.71 to 2.48), and two-photon absorption coefficient (from 0.37 to 0.15 cm/MW), which is accompanied by an increase in the optical-breakdown damage threshold.     

Effect of copper doping on kinetic phenomena in <Emphasis Type="Italic">n</Emphasis>-Bi<Subscript>2</Subscript>Te<Subscript>2.85</Subscript>Se<Subscript>0.15</Subscript>

In single crystals of copper-doped and undoped Bi₂Te_2.85Se_0.15 solid solutions with an electron concentration close to 1 × 10¹⁹ cm^?3, the temperature dependences are investigated for the Hall (R ₁₂₃, R ₃₂₁) and Seebeck (S ₁₁) kinetic coefficients, the electrical-conductivity (σ ₁₁), Nernst-Ettingshausen (Q ₁₂₃), and thermalconductivity (k ₁₁) coefficients in the temperature range of 77–400 K. The absence of noticeable anomalies in the temperature dependences of the kinetic coefficients makes it possible to use the one-band model when analyzing the experimental results. Within the framework of the one-band model, the effective mass of density of states (m _d ≈ 0.8m ₀), the energy gap (ε_g ≈ 0.2 eV), and the effective scattering parameter (r _eff ≈ 0.2) are estimated. The obtained value of the parameter r _eff is indicative of the mixed electron-scattering mechanism with the dominant scattering by acoustic phonons. Data on the thermal conductivity and the lattice resistivity obtained by subtracting the electron contribution according to the Wiedemann-Franz law are presented.     

<Emphasis Type="Italic">p</Emphasis><Superscript>+</Superscript>-Si-<Emphasis Type="Italic">n</Emphasis>-CdF<Subscript>2</Subscript> heterojunctions

Boron diffusion and the vapor-phase deposition of silicon layers are used to prepare ultrashallow p⁺-n junctions and p⁺-Si-n-CdF₂ heterostructures on an n-CdF₂ crystal surface. Forward portions of the I–V characteristics of the p⁺-n junctions and p⁺-Si-n-CdF₂ heterojunctions reveal the CdF₂ band gap (7.8 eV), as well as allow the identification of the valence-band structure of cadmium fluoride crystals. Under conditions in which forward bias is applied to the p⁺-Si-n-CdF₂ heterojunctions, electroluminescence spectra are measured for the first time in the visible spectral region.     

Electrical properties of ZnSiAs<Subscript>2</Subscript> irradiated with protons

The electrical properties of p-ZnSiAs₂ irradiated with protons (energy E = 5 MeV, dose D ≤ 2 × 10¹⁷ cm^?2) are studied. Experimental data and results of calculations are used to estimate the limiting position of the Fermi level in the band gap of the irradiated material (at the midgap E _g/2). The thermal stability of radiation defects in the temperature range from 20 to 610°C was analyzed.     

Dielectric Relaxation in Thin Layers of the Ge<Subscript>28.5</Subscript>Pb<Subscript>15</Subscript>S<Subscript>56.5</Subscript> Glassy System

The results of studying dielectric relaxation processes in the Ge_28.5Pb₁₅S_56.5 glassy system are presented. The existence of the non-Debye relaxation process caused by the distribution of relaxors over the relaxation time according to the Cole–Cole model is revealed. The energy and structural parameters are calculated: the activation energy E_p = 0.40 eV and the molecular dipole moment μ = 1.08 D. The detected features are explained within the model according to which the chalcogenide-glass structure is a set of dipoles formed by charged defects such as D⁺ and D^–.     

Performance characteristics of <Emphasis Type="Italic">p</Emphasis>-channel FinFETs with varied Si-fin extension lengths for source and drain contacts

The length of Source/Drain (S/D) extension (L_SDE) of nano-node p-channel FinFETs (pFinFETs) on SOI wafer influencing the device performance is exposed, especially in drive current and gate/S/D leakage. In observation, the longer L_SDEpFinFET provides a larger series resistance and degrades the drive current (I_DS), but the isolation capability between the S/D contacts and the gate electrode is increased. The shorter L_SDE plus the shorter channel length demonstrates a higher trans-conductance (G _m ) contributing to a higher drive current. Moreover, the subthreshold swing (S.S.) at longer channel length and longer L_SDE represents a higher value indicating the higher amount of the interface states which possibly deteriorate the channel mobility causing the lower drive current.     

Special features of charge transport in PbGa<Subscript>2</Subscript>Se<Subscript>4</Subscript> crystals

The current-voltage (I-V) characteristics of PbGa₂Se₄ single crystals grown by the Bridgman-Stockbarger method with a resistivity of 10¹⁰–10¹² Ω cm were measured. The value of the majority carrier mobility μ=14 cm² V^?1 s^?1, calculated by the differential method of analysis of I-V characteristics, makes it possible to evaluate a number of parameters: the carrier concentration at the cathode (n_c0=2.48 cm^?3), the width of the contact barrier d_c=5.4×10^?8 cm, the cathode transparency D _c ^* =10^?5–10^?4 eV, and the quasi-Fermi level E_F=0.38 eV. It is found that a high electric field provides the charge transport through PbGa₂Se₄ crystals in accordance with the Pool-Frenkel effect. The value of the dielectric constant calculated from the Frenkel factor is found to be equal to 8.4.     

Work Function Tuning and Doping Optimization of 22-nm HKMG Raised SiGe/SiC Source–Drain FinFETs

The basic requirements on process design of extremely scaled devices involve appropriate work function and tight doping control due to their significant effect on the threshold voltage as well as other critical electrical parameters such as drive current and leakage. This paper presents a simulation study of 22-nm fin field-effect transistor (FinFET) performance based on various process design considerations including metal gate work function (WF), halo doping (N _halo), source/drain doping (N _sd), and substrate doping (N _sub). The simulations suggest that the n-type FinFET (nFinFET) operates effectively with lower metal gate WF while the p-type FinFET (pFinFET) operates effectively with high metal gate WF in 22-nm strained technology. Further investigation shows that the leakage reduces with increasing N _halo, decreasing N _sd, and increasing N _sub. Taguchi and Pareto analysis-of-variance approaches are applied using an L₂₇ orthogonal array combined with signal-to-noise ratio analysis to determine the best doping concentration combination for 22-nm FinFETs in terms of threshold voltage (V _t), saturation current (I _on), and off-state current (I _off). Since there is a tradeoff between I _on and I _off, the design with the nominal-is-best V _t characteristic is proposed, achieving nominal V _t of 0.259 V for the nFinFET and ?0.528 V for the pFinFET. Pareto analysis revealed N _halo and N _sub to be the dominant factor for nFinFET and pFinFET performance, respectively.     

Effect of thallium doping on the mobility of electrons in Bi<Subscript>2</Subscript>Se<Subscript>3</Subscript> and holes in Sb<Subscript>2</Subscript>Te<Subscript>3</Subscript>

The Shubnikov–de Haas effect and the Hall effect in n-Bi_2–xTl_xSe₃ (x = 0, 0.01, 0.02, 0.04) and p-Sb_2–xTl_xTe₃ (x = 0, 0.005, 0.015, 0.05) single crystals are studied. The carrier mobilities and their changes upon Tl doping are calculated by the Fourier spectra of oscillations. It is found shown that Tl doping decreases the electron concentration in n-Bi_2–xTl_xSe₃ and increases the electron mobility. In p-Sb_2–xTl_xTe₃, both the hole concentration and mobility decrease upon Tl doping. The change in the crystal defect concentration, which leads to these effects, is discussed.     

Study of RF transistor with submicron T-shaped gate fabricated by nanoimprint lithography

The results devoted to the development of a method for creating an RF transistor, in which a T-shaped gate is formed by nanoimprint lithography, are presented. The characteristics of GaAs p-HEMT transistors have been studied. The developed transistor has a gate “foot” length of the order of 250 nm and a maximum transconductance of more than 350 mS/mm. The maximum frequency of current amplification f _t is 40 GHz at the drain-source voltage V _DS = 1.4 V and the maximum frequency of the power gain f _max is 50 GHz at V _DS = 3 V.     

Electrical properties of Zinc-Tin diarsenide (ZnSnAs<Subscript>2</Subscript>) irradiated with H<Superscript>+</Superscript> ions

The results of studying the electrical properties and isochronous annealing of p-ZnSnAs₂ irradiated with H⁺ ions (energy E = 5 MeV, dose D = 2 × 10¹⁶ cm^?2) are reported. The limiting electrical characteristics of irradiated material (the Hall coefficient R _H (D)_lim ≈ ?4 × 10³ cm³ C^?1, conductivity σ (D)_lim ≈ 2.9 × 10^?2 Ω^?1 cm^?1, and the Fermi level position F _lim ≈ 0.58 eV above the valence-band top at 300 K) are determined. The energy position of the “neutral” point for the ZnSnAs₂ compound is calculated.     

Model Development for Current–Voltage and Transconductance Characteristics of Normally-off AlN/GaN MOSHEMT

In this paper, an AlN/GaN-based MOSHEMT is proposed, in accordance to this, a charge control model has been developed analytically and simulated with MATLAB to predict the characteristics of threshold voltage, drain currents and transconductance. The physics based models for 2DEG density, threshold voltage and quantum capacitance in the channel has been put forward. By using these developed models, the drain current for both linear and saturation models is derived. The predicted threshold voltage with the variation of barrier thickness has been plotted. A positive threshold voltage can be obtained by decreasing the barrier thickness which builds up the foundation for enhancement mode MOSHEMT devices. The predicted I_d–V_gs, I_d–V_ds and transconductance characteristics show an excellent agreement with the experimental results and hence validate the model.