Ball Mill Synthesis of Bulk Quaternary Cu<Subscript>2</Subscript>ZnSnSe<Subscript>4</Subscript> and Thermoelectric Studies

In this work, quaternary chalcogenide Cu₂ZnSnSe₄ (CZTSe) was synthesized using a mechanochemical ball milling process and its thermoelectric properties were studied by electrical resistivity, Seebeck coefficient, and thermal conductivity measurements. The synthesis process comprises three steps viz., wet ball milling of the elemental precursors, vacuum annealing, and densification by hot pressing. The purpose of this is to evaluate the feasibility of introducing wet milling in place of vacuum melting in solid state synthesis for the reaction of starting elements. We report the structural characterization and thermoelectric studies conducted on samples that were milled at 300 rpm and 500 rpm. X-ray diffraction (XRD) analysis showed the existence of multiple phases in the as-milled samples, indicating the requirement for heat treatment. Therefore, the ball milled powders were cold pressed and vacuum annealed to eliminate the secondary phases. Annealed samples were hot pressed and made into dense pellets for further investigations. In addition to XRD, energy dispersive spectroscopy (EDS) studies were performed on hot pressed samples to study the composition. XRD and EDS studies confirm CZTSe phase formation along with ZnSe secondary phase. Electrical resistivity and Seebeck coefficient measurements were done on the hot pressed samples in the temperature range 340–670 K to understand the thermoelectric behaviour. Thermal conductivity was calculated from the specific heat capacity and thermal diffusivity values. The thermoelectric figure of merit zT values for samples milled at 300 rpm and 500 rpm are ～0.15 and ～0.16, respectively, at 630 K, which is in good agreement with the values reported for solid state synthesized compounds.     

Thermoelectric Properties of Cu-doped Bi<Subscript>0.4</Subscript>Sb<Subscript>1.6</Subscript>Te<Subscript>3</Subscript> Prepared by Hot Extrusion

Cu_0.003Bi_0.4Sb_1.6Te₃ alloys were prepared by using encapsulated melting and hot extrusion (HE). The hot-extruded specimens had the relative average density of 98%. The (00l) planes were preferentially oriented parallel to the extrusion direction, but the specimens showed low crystallographic anisotropy with low orientation factors. The specimens were hot-extruded at 698 K, and they showed excellent mechanical properties with a Vickers hardness of 76 Hv and a bending strength of 59 MPa. However, as the HE temperature increased, the mechanical properties degraded due to grain growth. The hot-extruded specimens showed positive Seebeck coefficients, indicating that the specimens have p-type conduction. These specimens exhibited negative temperature dependences of electrical conductivity, and thus behaved as degenerate semiconductors. The Seebeck coefficient reached the maximum value at 373 K and then decreased with increasing temperature due to intrinsic conduction. Cu-doped specimens exhibited high power factors due to relatively higher electrical conductivities and Seebeck coefficients than those of undoped specimens. A thermal conductivity of 1.00 Wm^?1 K^?1 was obtained at 373 K for Cu_0.003Bi_0.4Sb_1.6Te₃ hot-extruded at 723 K. A maximum dimensionless figure of merit, ZT _max = 1.05, and an average dimensionless figure of merit, ZT _ave = 0.98, were achieved at 373 K.     

Preparation and Thermoelectric Characterization of SiC-B<Subscript>4</Subscript>C Composites

SiC-B₄C composites with various values of SiC-to-B₄C ratio and grain size were fabricated by pressureless sintering. This paper presents the results of current investigations of this composite material. This includes the parameters of manufacture (shrinkage, density, and open porosity), thermoelectric properties (electrical and thermal conductivity, and thermopower), and material characterization (x-ray diffraction, scanning electron microscopy, oxidation resistance, and thermal expansion). The results indicate high potential of this composite as an alternative material for thermoelectric applications at high temperatures. The Seebeck coefficient of the composite was higher than that of the single-component materials B₄C and SiC and reached 400 μV/K at 500°C.     

Thermoelectric Properties of Chevrel-Phase Sulfides M<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Mo<Subscript>6</Subscript>S<Subscript>8</Subscript> (M: Cr,Mn, Fe,Ni)

Chevrel-phase sulfides M _x Mo₆S₈ (M, Cr, Mn, Fe, Ni; x: 1.3, 2.0) were prepared by reacting appropriate amounts of M, Mo, and MoS₂ powders. The samples were then consolidated by pressure-assisted sintering to fabricate dense compacts. While Cr_1.3Mo₆S₈ crystallized in a triclinic structure, Mn_1.3Mo₆S₈, Fe_1.3Mo₆S₈, and Ni_2.0Mo₆S₈ crystallized in a hexagonal structure. The Seebeck coefficient, electrical resistivity, and thermal conductivity of the sintered samples were measured over the temperature range of 300 K to 973 K. All the samples exhibited a positive Seebeck coefficient. The Seebeck coefficient, electrical resistivity, and thermal conductivity of M_1.3Mo₆S₈ (M: Cr, Mn, Fe) were almost identical and increased with temperature. However, the corresponding values and temperature dependent behavior of Ni_2.0Mo₆S₈ were different from those of M_1.3Mo₆S₈ (M: Cr, Mn, Fe). For Ni_2.0Mo₆S₈, as temperature increased, the Seebeck coefficient and thermal conductivity increased while the electrical resistivity decreased. The highest value of the thermoelectric figure of merit (0.17) was observed in Cr_1.3Mo₆S₈ at 973 K.     

Preparation and Thermoelectric Properties of Nanoporous Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript>-Based Alloys

n-Type nanoporous Bi₂Te₃-based thermoelectric materials with different porosity ratios have been prepared by spark plasma sintering (SPS). The microstructure and phase morphology have been analyzed by x-ray diffraction (XRD) and field-emission scanning electron microscopy (FESEM), and the thermoelectric properties of the SPS samples have been measured. Experimental results show that the nanoporous structures lying in the sheet layers and among the plate grains of the Bi₂Te₃ bulk material can lead to an increase in the Seebeck coefficient and a decrease in the thermal conductivity, thus leading to an enhanced figure of merit.     

Thermoelectric Properties of NdGd<Subscript>1+<Emphasis Type="Italic">x</Emphasis></Subscript>S<Subscript>3</Subscript> Prepared by CS<Subscript>2</Subscript> Sulfurization

Ternary rare-earth sulfides NdGd_1+x S₃, where 0 ≤ x ≤ 0.08, were prepared by sulfurizing Ln₂O₃ (Ln = Nd, Gd) with CS₂ gas, followed by reaction sintering. The sintered samples have full density and homogeneous compositions. The Seebeck coefficient, electrical resistivity, and thermal conductivity were measured over the temperature range of 300 K to 950 K. All the sintered samples exhibit a negative Seebeck coefficient. The magnitude of the Seebeck coefficient and the electrical resistivity decrease systematically with increasing Gd content. The thermal conductivity of all the sintered samples is less than 1.9 W K⁻¹ m⁻¹. The highest figure of merit ZT of 0.51 was found in NdGd_1.02S₃ at 950 K.     

Thermoelectric properties of Bi<Subscript>2</Subscript>Te<Subscript>2.4</Subscript>Se<Subscript>0.6</Subscript> solid solutions of different particle-size composition

The thermoelectric properties of n-type Bi₂Te_2.4Se_0.6 solid solution prepared by the vacuum hot pressing of powder mixtures with different particle sizes are investigated. The powders were prepared by the mechanical grinding of ingots and melt spinning. The microstructure and fracture pattern of a sample cleavage surface are analyzed using scanning electron microscopy and optical microscopy. The thermoelectric characteristics (the Seebeck coefficient, electrical conductivity, and thermal conductivity) are measured at room temperature and in the temperature range of 100–700 K.     

Thermoelectric Properties of In<Subscript>0.3</Subscript>Ga<Subscript>0.7</Subscript>N Alloys

We report on the experimental investigation of the potential of InGaN alloys as thermoelectric (TE) materials. We have grown undoped and Si-doped In_0.3Ga_0.7N alloys by metalorganic chemical vapor deposition and measured the Seebeck coefficient and electrical conductivity of the grown films with the aim of maximizing the power factor (P). It was found that P decreases as electron concentration (n) increases. The maximum value for P was found to be 7.3 × 10⁻⁴ W/m K² at 750 K in an undoped sample with corresponding values of Seebeck coefficient and electrical conductivity of 280 μV/K and 93␣(Ω cm)⁻¹, respectively. Further enhancement in P is expected by improving the InGaN material quality and conductivity control by reducing background electron concentration.     

Effects of Cooling Rate on Thermoelectric Properties of <Emphasis Type="Italic">n</Emphasis>-Type Bi<Subscript>2</Subscript>(Se<Subscript>0.4</Subscript>Te<Subscript>0.6</Subscript>)<Subscript>3</Subscript> Compounds

A series of Bi₂(Se_0.4Te_0.6)₃ compounds were synthesized by a rapid route of melt spinning (MS) combined with a subsequent spark plasma sintering (SPS) process. Measurements of the Seebeck coefficient, electrical conductivity, and thermal conductivity were performed over the temperature range from 300 K to 520 K. The measurement results showed that the cooling rate of melt spinning had a significant impact on the transport properties of electrons and phonons, effectively enhancing the thermoelectric properties of the compounds. The maximum ZT value reached 0.93 at 460 K for the sample prepared with the highest cooling rate, and infrared spectrum measurement results showed that the compound with lower tellurium content, Bi₂(Se_0.4Te_0.6)₃, possesses a larger optical forbidden gap (E _g) compared with the traditional n-type zone-melted material with formula Bi₂(Se_0.07Te_0.93)₃. Our work provides a new approach to develop low-tellurium-bearing Bi₂Te₃-based compounds with good thermoelectric performance.     

Beneficial Effect of S-Filling on Thermoelectric Properties of S<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Co<Subscript>4</Subscript>Sb<Subscript>11.2</Subscript>Te<Subscript>0.8</Subscript> Skutterudite

In this work, Te-doped and S-filled S _x Co₄Sb_11.2Te_0.8 (x = 0.1, 0.15, 0.2, 0.25, 0.3, 0.4) skutterudite compounds have been prepared using solid state reaction and spark plasma sintering. Thermoelectric measurements of the consolidated samples were examined in a temperature range of 300–850 K, and the influences of S-addition on the thermoelectric properties of S _x Co₄Sb_11.2Te_0.8 skutterudites are systematically investigated. The results indicate that the addition of sulfur and tellurium is effective in reducing lattice thermal conductivity due to the point-defect scattering caused by tellurium substitutions and the cluster vibration brought by S-filling. The solubility of tellurium in skutterudites is enhanced with sulfur addition via charge compensation. The thermal conductivity decreases with increasing sulfur content. The highest figure of merit, ZT = 1.5, was obtained at 850 K for S_0.3Co₄Sb_11.2Te_0.8 sample, because of the low lattice thermal conductivity.     

Thermoelectric Properties of Ca-Filled CoSb<Subscript>3</Subscript>-Based Skutterudites Synthesized by Mechanical Alloying

Ca _z Co_4−x (Fe/Mn) _x Sb₁₂ skutterudites were prepared by mechanical alloying and hot pressing. The phases of mechanically alloyed powders were identified as γ-CoSb₂ and Sb, but they were transformed to δ-CoSb₃ by annealing at 873 K for 100 h. All specimens had a positive Hall coefficient and Seebeck coefficient, indicating p-type conduction by holes as majority carriers. For the binary CoSb₃, the electrical conductivity behaved like a nondegenerate semiconductor, but Ca-filled and Fe/Mn-doped CoSb₃ showed a temperature dependence of a degenerate semiconductor. While the Seebeck coefficient of intrinsic CoSb₃ increased with temperature and reached a maximum at 623 K, the Seebeck coefficient increased with increasing temperature for the Ca-filled and Fe/Mn-doped specimens. Relatively low thermal conductivity was obtained because fine particles prepared by mechanical alloying lead to phonon scattering. The thermal conductivity was reduced by Ca filling and Fe/Mn doping. The electronic thermal conductivity was increased by Fe/Mn doping, but the lattice thermal conductivity was decreased by Ca filling. Reasonable thermoelectric figure-of-merit values were obtained for Ca-filled Co-rich p-type skutterudites.     

Specific thermoelectric properties of lightly doped Bi<Subscript>2</Subscript>(TeSe)<Subscript>3</Subscript> solid solutions

Electrical and thermoelectric properties of a lightly doped n-Bi₂Te_2.7Se_0.3 solid solution have been studied in the temperature range 77–300 K. The results are compared with data for the compound PbTe_0.9Se_0.1 with a similar magnitude of the Seebeck coefficient S at 84 K. Along with lower thermal conductivity, Bi₂Te_2.7Se_0.3 has a higher electrical conductivity σ and a much weaker temperature dependence. As a result, the power coefficient S ²σ in optimal samples begins to decrease only when the density of minority carriers becomes significant. In this case, |S| considerably exceeds the standard value of 200 μV/K. The reduction of the electron density reduces the thermoelectric figure of merit Z at its maximum and slightly lowers the temperature of the maximum; therefore, the expected effect on the average value of Z in the range 77–300 K is absent. Similar behavior is observed in Bi₂Te_2.88Se_0.12, although the effect is less pronounced. The experimental results are discussed taking into account possible changes in the dominant scattering mechanisms, carrier density, and electron energy spectrum. __________ Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 38, No. 7, 2004, pp. 811–815. Original Russian Text Copyright ? 2004 by Konstantinov, Prokof’eva, Ravich, Fedorov, Kompaniets.     

Increase in the Thermoelectric Efficiency of the Disordered Phase of Layered Antiferromagnetic CuCrS<Subscript>2</Subscript>

The thermoelectric figure of merit (ZT) of the layered antiferromagnetic compound CuCrS₂ is further improved with increase in the Cr-vacancy disorder on sintering above 900°C. X-ray photoelectron spectroscopy and x-ray diffraction refinement results for different samples show that the chromium atoms are transferred from the filled layers to the vacant sites between the layers. This atomic disorder increases the electrical conductivity (σ) due to self-doping of the charge carriers and reduces thermal conductivity (κ) due to increase in phonon scattering. The Seebeck coefficient (S) is p-type and remains nearly temperature independent with values between 150 μV/K and 450 μV/K due to electronic doping in different samples.     

Enhancement in Thermoelectric Properties of TiS<Subscript>2</Subscript> by Sn Addition

A series of Sn added TiS₂ (TiS₂:Sn _x ; x = 0, 0.05, 0.075 and 0.1) were prepared by solid state synthesis with subsequent annealing. The Sn atoms interacted with sulfur atoms in TiS₂ and formed a trace amount of misfit layer (SnS)_1+m(TiS_2?δ)_n compound with sulfur deficiency. A significant reduction in electrical resistivity with moderate decrease in the Seebeck coefficient was observed in Sn added TiS₂. Hence, a maximum power factor of 1.71 mW/m-K² at 373 K was obtained in TiS₂:Sn_0.05. In addition, the thermal conductivity was decreased with Sn addition and reached a minimum value of 2.11 W/m-K at 623 K in TiS₂:Sn_0.075, due to the impurity phase (misfit phase) and defects (excess Ti) scattering. The zT values increased from 0.08 in pristine TiS₂ to an optimized value of 0.46 K at 623 K in TiS₂:Sn_0.05.     

Thermoelectric Characterization of Zone-Melted and Quenched Zn<Subscript>4</Subscript>Sb<Subscript>3</Subscript>

Because of its complex structure, Zn₄Sb₃ exhibits relatively low thermal conductivity. This, in combination with large values of the Seebeck coefficient and moderate to high electrical conductivity, makes the material especially interesting for thermoelectric application in temperatures up to 400°C. The phase purity and thermal stability of Zn₄Sb₃ are major issues for its thermoelectric performance and are strongly dependent on the synthesis method, atmosphere, density, and grain size. Therefore, Zn₄Sb₃ was prepared by both zone melting and quenching in this study, and pressed samples from crushed powders of three different grain sizes were compared. The effect of thermal cycling was studied, along with repeated structural analysis and Seebeck mapping. It was found that zone melting leads to improved thermal stability regarding decomposition via Zn loss, which finally may result in the formation of ZnSb. Larger grain size seems to reduce the degradation, because of lower concentration of grain boundaries, thus hindering diffusion inside the material.     

Thermoelectric Properties of Zr<Subscript>3</Subscript>Mn<Subscript>4</Subscript>Si<Subscript>6</Subscript> and TiMnSi<Subscript>2</Subscript>

The Seebeck coefficient, electrical resistivity, and thermal conductivity of Zr₃Mn₄Si₆ and TiMnSi₂ were studied. The crystal lattices of these compounds contain relatively large open spaces, and, therefore, they have fairly low thermal conductivities (8.26 Wm⁻¹ K⁻¹ and 6.63 Wm⁻¹ K⁻¹, respectively) at room temperature. Their dimensionless figures of merit ZT were found to be 1.92 × 10⁻³ (at 1200 K) and 2.76 × 10⁻³ (at 900 K), respectively. The good electrical conductivities and low Seebeck coefficients might possibly be due to the fact that the distance between silicon atoms in these compounds is shorter than that in pure semiconductive silicon.     

Synthesis and Characterization of <Emphasis Type="Italic">p</Emphasis>-Type Pb<Subscript>0.5</Subscript>Sn<Subscript>0.5</Subscript>Te Thermoelectric Power Generation Elements by Mechanical Alloying

A mechanical alloying (MA) process to transform elemental powders into solid Pb_0.5Sn_0.5Te with thermoelectric functionality comparable to melt-alloyed material is described. The room-temperature doping level and mobility as well as temperature-dependent electrical conductivity, Seebeck coefficient, and thermal conductivity are reported. Estimated values of lattice thermal conductivity (0.7 W m⁻¹ K⁻¹) are lower than some reports of functional melt-alloyed PbSnTe-based material, providing evidence that MA can engender the combination of properties resulting in highly functional thermoelectric material. Though doping level and Sn composition have not been optimized, this material exhibits a ZT value >0.5 at 550 K.     

Electrical and Thermal Conductivity and Conduction Mechanism of Ge<Subscript>2</Subscript>Sb<Subscript>2</Subscript>Te<Subscript>5</Subscript> Alloy

Ge₂Sb₂Te₅ alloy has drawn much attention due to its application in phase-change random-access memory and potential as a thermoelectric material. Electrical and thermal conductivity are important material properties in both applications. The aim of this work is to investigate the temperature dependence of the electrical and thermal conductivity of Ge₂Sb₂Te₅ alloy and discuss the thermal conduction mechanism. The electrical resistivity and thermal conductivity of Ge₂Sb₂Te₅ alloy were measured from room temperature to 823 K by four-terminal and hot-strip method, respectively. With increasing temperature, the electrical resistivity increased while the thermal conductivity first decreased up to about 600 K then increased. The electronic component of the thermal conductivity was calculated from the Wiedemann–Franz law using the resistivity results. At room temperature, Ge₂Sb₂Te₅ alloy has large electronic thermal conductivity and low lattice thermal conductivity. Bipolar diffusion contributes more to the thermal conductivity with increasing temperature. The special crystallographic structure of Ge₂Sb₂Te₅ alloy accounts for the thermal conduction mechanism.     

Crystal Structure and Physical Properties of Skutterudites SrPd4Sn x Sb12−x

A Pd-based skutterudite phase SrPd₄Sn _x Sb_12?x in which the 8c sites of the structure are occupied solely by Pd atoms and with a homogeneity range of 4.3(2) ≤ x ≤ 5.8(2) (wavelength dispersive x-ray spectroscopy) has been synthesized by solid-state reaction then spark-plasma sintering (SPS). It crystallizes as the filled-skutterudite structure type, electronically compensated by substitution of Sn for Sb at framework (24g) positions. The unit cell decreases substantially with increasing nominal and detected Sn content. Magnetization, specific heat, Hall effect, electrical resistivity, thermopower, and thermal conductivity were measured for the SPS-treated samples. SrPd₄Sn _x Sb_12?x is a diamagnetic material. Depending on composition it occurs in the metallic or semiconducting states. Hall effect data show that the type and concentration of most of the carriers depend on the Sn/Sb atomic ratio. The thermal conductivity of SrPd₄Sn _x Sb_12?x is approximately 3.0–5.0 W K^?1 m^?1 at 300 K. The Seebeck coefficient is negative throughout the temperature range covered, reaching approximately ?20 μV K^?1 at 300 K.     

Effect of Cyclic Thermal Loading on the Microstructure and Thermoelectric Properties of CoSb<Subscript>3</Subscript>

The effect of cyclic thermal loading on the microstructure and thermoelectric properties of CoSb₃ was investigated. The microstructures of the samples were characterized by x-ray diffractometry, scanning electron microscopy, energy dispersive x-ray spectrometry and density measurements. The electrical conductivity, the Seebeck coefficient and the thermal conductivity were measured from room temperature to 800 K. Under cyclic thermal loading, antimony partially volatilized from the surface of the sample, and the density obviously decreased. After 2000 cycles, the phase composition of the sample remained stable, and the average grain size did not change significantly. Moreover, the electrical conductivity varied only slightly, except in the low temperature region. The Seebeck coefficient decreased slightly. However, the thermal conductivity changed remarkably with increasing numbers of thermal cycles.