17.8-percent efficiency polycrystalline silicon solar cells

A substantial increase to 17.8% in the efficiency of cast polycrystalline solar cells was achieved by incorporating phosphorus pretreatment and rear aluminium treatments into the passivated emitter solar cell (PESC) sequence. The deleterious effects of grain boundaries and defects were nullified to such an extent that the performance of cells produced on the less-expensive polycrystalline material of medium grain size matched the performance of those fabricated on expensive semiconductor-grade substrates. Surface texturing of polycrystalline solar cells by novel approaches appears feasible, with a corresponding 5% relative performance increase anticipated, as observed with crystalline cells     

High efficiency inversion layer solar cells on polycrystalline silicon by the application of silicon nitride

Plasma enhanced CVD silicon nitride is introduced for the fabrication of inversion layer solar cells on p-type polycrystalline silicon. The same high interface quality as obtained for Si-nitride on monocrystalline silicon could also be achieved for polycrystalline silicon. This includes high interface charge densities up to 6.6 × 10¹²cm^-2and high UV sensitivity of the cells. For 4-cm²polycrystalline metal-insulator-semiconductor inversion layer (MIS/IL) solar cells active area efficiencies up to 13.4 percent (12.3-percent total area efficiency) under AM1 illumination could be reached, the highest values yet reported for polycrystalline silicon inversion layer solar cells on a total area basis. For the coprocessed MIS/IL cells on monocrystalline 0.7-ω. cm p-Si     

High efficiency polycrystalline silicon solar cells by continuous plasma deposition and laser recrystallization

Solar cells of up to 12% efficiency have been fabricated on laser recrystallized fine grain polycrystalline silicon films produced by high pressure plasma (hpp) aided hydrogen reduction of trichlorosilane. The hpp system was operated in a continual mode to produce microcrystalline silicon films continually using finite size temporary molybdenum substrates. The major improvement over previous devices of this type is in the elimination of oxygen contamination during laser recrystallization. This resulted in a reduction in the dark excess junction current and improvement in minority carrier diffusion length. The devices are found to be diffusion limited, with diffusion current coefficients in the range of 3 × 10^-12to 5 × 10^-12A/cm²when the base resistivity was 0.4 to 0.5 Ω-cm p-type.     

Optimised antireflection coatings for planar silicon solar cells using remote PECVD silicon nitride and porous silicon dioxide

Silicon nitride (SiN) films fabricated by remote plasma‐enhanced chemical vapour deposition (RPECVD) have recently been shown to provide an excellent electronic passivation of silicon surfaces. This property, in combination with its large refractive index, makes RPECVD SiN an ideal candidate for a surface‐passivating antireflection coating on silicon solar cells. A major problem of these films, however, is the fact that the extinction coefficient increases with increasing refractive index. Hence, a careful optimisation of RPECVD SiN based antireflection coatings on silicon solar cells must consider the light absorption within the films. Optimal optical performance of silicon solar cells in air is obtained if the RPECVD SiN films are combined with a medium with a refractive index below 1·46, such as porous SiO₂. In this study, the dispersion of the refractive indices and the extinction coefficients of RPECVD SiN, porous SiO₂, and several other relevant materials (MgF₂, TiO_x, ZnS, B270 crown glass, soda lime glass, ethylene vinyl acetate and resin as used in commercial photovoltaic modules) are experimentally determined. Based on these data, the short‐circuit currents of planar silicon solar cells covered by RPECVD SiN and/or porous SiO₂ single‐ and multi‐layer antireflection coatings are numerically maximised for glass‐encapsulated as well as non‐encapsulated operating conditions. The porous SiO₂/RPECVD SiN‐based antireflection coatings optimised for these applications are shown to be universally suited for silicon solar cells, regardless of the internal blue or red response of the cells. Copyright © 1999 John Wiley & Sons, Ltd.     

High efficiency screen printed bifacial solar cells on monocrystalline CZ silicon

We present industrialized bifacial solar cells on large area (149 cm²) 2 cm CZ monocrystalline silicon wafers processed with industrially relevant techniques such as liquid source BBr₃ and POCl₃ open‐tube furnace diffusions, plasma enhanced chemical vapor deposition (PECVD) SiN_x deposition, and screen printed contacts. The fundamental analysis of the paste using at boron‐diffused surface and the bifacial solar cell firing cycle has been investigated. The resulting solar cells have front and rear efficiencies of 16.6 and 12.8%, respectively. The ratio of the rear J_SC to front J_SC is 76.8%. It increases the bifacial power by 15.4% over a conventional solar cell at 20% of 1‐sun rear illumination, which equals to the power of a conventional solar cell with 19.2% efficiency. We also present a bifacial glass–glass photovoltaic (PV) module with 30 bifacial cells with the electrical characteristics. Copyright © 2010 John Wiley & Sons, Ltd.     

Collection efficiency in amorphous silicon solar cells

A simple relation is presented for the field assisted collection efficiency for amorphous silicon solar cells, assuming zero geminate recombination. The ratio of the collection efficiency under forward biasing condition to short circuited condition is computed. It is found to agree reasonably well with the experimentally observed values.     

Stack system of PECVD amorphous silicon and PECVD silicon oxide for silicon solar cell rear side passivation

A stack of hydrogenated amorphous silicon (a‐Si) and PECVD‐silicon oxide (SiO_x) has been used as surface passivation layer for silicon wafer surfaces. Very good surface passivation could be reached leading to a surface recombination velocity (SRV) below 10 cm/s on 1 Ω cm p‐type Si wafers. By using the passivation layer system at a solar cell's rear side and applying the laser‐fired contacts (LFC) process, pointwise local rear contacts have been formed and an energy conversion efficiency of 21·7% has been obtained on p‐type FZ substrates (0·5 Ω cm). Simulations show that the effective rear SRV is in the range of 180 cm/s for the combination of metallised and passivated areas, 120 ± 30 cm/s were calculated for the passivated areas. Rear reflectivity is comparable to thermally grown silicon dioxide (SiO₂). a‐Si rear passivation appears more stable under different bias light intensities compared to thermally grown SiO₂. Copyright © 2008 John Wiley & Sons, Ltd.     

Novel profiled thin-film polycrystalline silicon solar cells onstainless steel substrates

In order to obtain higher conversion efficiencies while keeping the manufacturing cost low in thin-film PV technologies, a possible low bandgap material is amorphous silicon germanium. Although record efficiencies in excess of 15% have been reported for triple-junction solar cells comprising these alloys, concerns regarding the stability and quality of this material still need to be overcome. Another approach is the introduction of thin-film micro- or polycrystalline silicon with a band gap of 1.1 eV, deposited at a temperature that is low enough to allow cheap, “foreign” carrier materials. Apart from the application of a modified PECVD method utilizing frequencies in the VHP domain, the hot wire CVD (HWCVD) method appears a particularly promising technique for the deposition of high-quality thin-film intrinsic or doped poly-Si. In this contribution, special attention will be paid to the latest developments in the application of hot-wire deposited silicon thin films in solar cells. By implementing a profiled hydrogen-diluted HWCVD growth scheme that produces a thin small-grained seed layer on top of a thin n-layer, we have been able to obtain fast polycrystalline growth of the intrinsic layer of an n-i-p solar cell. An efficiency of 4.41% is obtained and the fill factor is 0.607. The current density is close to 20 mA/cm² for an i-layer that is only 1.22 μm thick. The cell is deposited on plain stainless steel and thus does not comprise a back reflector     

High efficiency UMG silicon solar cells: impact of compensation on cell parameters

High efficiency solar cells have been fabricated with wafers from an n‐type Czochralski grown (Cz) ingot using 100% Upgraded Metallurgical‐Grade (UMG) silicon feedstock. The UMG cells fabricated with a passivated emitter and rear totally diffused (PERT) structure have an independently confirmed cell efficiency of 19.8%. This is the highest efficiency reported for a cell based on 100% UMG silicon at the time of publication. The current and power losses are analysed as a function of measured material parameters, including carrier mobility, lifetime and the presence of the boron–oxygen defect. Dopant compensation is shown to reduce both the minority carrier lifetime and mobility, which significantly affects both the current and voltage of the device. Copyright © 2015 John Wiley & Sons, Ltd.     

High efficiency triple junction thin film silicon solar cells with optimized electrical structure

We report on improving the performance of pin‐type a‐Si:H/a‐SiGe:H/µc‐Si:H triple‐junction solar cells and corresponding single‐junction solar cells in this paper. Based on wet‐etching sputtered aluminum‐doped zinc oxide (ZnO:Al) substrates with optimized surface morphologies and photo‐electrical material properties, after adjusting individual single‐junction solar cells utilized in triple‐junction solar cells with various optimization techniques, we pay close attention to the optimization of tunnel recombination junctions (TRJs). By means of the optimization of individual a‐Si:H/a‐SiGe:H and a‐SiGe:H/µc‐Si:H double‐junction solar cells, we compensated for the open circuit voltage (V_oc) loss at the a‐Si:H/a‐SiGe:H TRJ by adopting a p‐type µc‐Si:H layer with a low activation energy. By combining the optimized single‐junction solar cells and top/middle, middle/bottom TRJs with little electrical losses, an initial efficiency of 15.06% was achieved for pin‐type a‐Si:H/a‐SiGe:H/µc‐Si:H triple‐junction solar cells. Copyright © 2014 John Wiley & Sons, Ltd.     

Impurity gettering of polycrystalline solar cells fabricated from refined metallurgical-grade silicon

A damage-gettering technique is described which reduces the impurity content in grown crystals and enhances cell performance of diffused solar cells. Crystalline ingots were Czochralski-grown from an acid-leached metallurgical-grade source. Damage gettering was performed by preparing a mechanically damaged layer on the wafer back surface and subsequent annealing. Optimum annealing conditions were investigated as a function of ambient gas species, temperature, and time. In an O2ambient, the fill factor of the cells degraded to 0.25, while cell performance was greatly improved by annealing in N2. Conversion efficiency tends to increase with annealing time at higher temperatures. Maximum conversion efficiencies attained for mono- and polycrystalline solar cells fabricated from MG-Si are 9.8 and 7.7 percent, respectively. Light current-voltage characteristics and the leakage-current variations with depth were analyzed. It was found that impurity gettering begins at the wafer surfaces and proceeds gradually into the bulk regions.     

The properties of polycrystalline silicon solar cells with controlled titanium additions

By coupling the results of electrical measurements, such as spectral response, lighted and dark I-V determinations, and deep-level-transient spectroscopy with optical and laser scan photomicroscopy, we have evaluated the effects of grain boundaries and impurities on silicon solar cells. Titanium which produces two deep levels,E_{v} + 0.30andE_{c} - 0.26eV, in silicon, degrades cell performance by reducing bulk lifetime and thus cell short-circuit current. Electrically active grain boundaries induce carrier recombination in the bulk as well as in the depletion region of the solar cell. Experimental data imply a small but measurable segregation of titanium into some grain boundaries of the polycrystalline silicon containing high Ti concentration (2 × 10¹⁴cm^-3). However for the titanium-contaminated polycrystalline material used in this study, solar cell performance is dominated by the electrically active titanium concentration in the grains. Microstructural impacts on the devices are of secondary importance.     

Diffusion‐free high efficiency silicon solar cells

Traditional POCl₃ diffusion is performed in large diffusion furnaces heated to ~850 C and takes an hour long. This may be replaced by an implant and subsequent 90‐s rapid thermal annealing step (in a firing furnace) for the fabrication of p‐type passivated emitter rear contacted silicon solar cells. Implantation has long been deemed a technology too expensive for fabrication of silicon solar cells, but if coupled with innovative process flows as that which is mentioned in this paper, implantation has a fighting chance. An SiOx/SiN_y rear side passivated p‐type wafer is implanted at the front with phosphorus. The implantation creates an inactive amorphous layer and a region of silicon full of interstitials and vacancies. The front side is then passivated using a plasma‐enhanced chemical vapor deposited SiN_xH_y. The wafer is placed in a firing furnace to achieve dopant activation. The hydrogen‐rich silicon nitride releases hydrogen that is diffused into the Si, the defect rich amorphous front side is immediately passivated by the readily available hydrogen; all the while, the amorphous silicon recrystallizes and dopants become electrically active. It is shown in this paper that the combination of this particular process flow leads to an efficient Si solar cell. Cell results on 160‐µm thick, 148.25‐cm² Cz Si wafers with the use of the proposed traditional diffusion‐free process flow are up to 18.8% with a V_oc of 638 mV, J_sc of 38.5 mA/cm², and a fill factor of 76.6%. Copyright © 2012 John Wiley & Sons, Ltd.     

Highest efficiency rapid thermal processed multicrystalline silicon solar cells

The formation of pn junctions and surface passivation by rapid thermal processing is being proved as a new and competitive method for silicon solar cell production. As the main process mechanisms are enhanced, the total process time at high temperature can be kept in the minute range, for the realization of emitter, back surface field (BSF) and surface passivation. In this work, we demonstrate for the first time that this knowledge, avoiding any in‐situ annealing step acquired on the sc‐Si, can also be applied on industrial mc‐Si (Polix_©) without bulk degradation, leading to a record conversion efficiency of 16·7%. Copyright © 2001 John Wiley & Sons, Ltd.     

Modeling the growth of PECVD silicon nitride films for solar cellapplications using neural networks

Silicon nitride films grown by plasma-enhanced chemical vapor deposition (PECVD) are useful for a variety of applications, including anti-reflection coatings in solar cells, passivation layers, dielectric layers in metal/insulator structures, and diffusion masks, PECVD nitride films are known to contain hydrogen, and defect passivation by hydrogenation enhances efficiency in polycrystalline silicon solar cells. PECVD systems are controlled by many operating variables, including RF power, pressure, gas flow rate, reactant composition, and substrate temperature. The wide variety of processing conditions, as well as the complex nature of particle dynamics within a plasma, makes tailoring Si₃N₄ film properties very challenging, since it is difficult to determine the exact relationship between desired film properties and controllable deposition conditions. In this study, silicon nitride PECVD modeling using neural networks has been investigated. The deposition of Si₃N₄ was characterized via a central composite experimental design, and data from this experiment was used to train optimized feed-forward neural networks using the back-propagation algorithm. From these neural process models, the effect of deposition conditions on film properties has been studied. It was found that the process parameters critical to increasing hydrogenation and therefore enhancing carrier lifetime in polysilicon solar cells are temperature, silane, and ammonia flow rate. The deposition experiments were carried out in a Plasma Therm 700 series PECVD system     

Passivation of defects in polycrystalline silicon solar cells by molecular hydrogen annealing

The paper presents a new technique for passivating grain boundaries and intragrain defects in the polycrystalline silicon material of the solar cells. Enhancement in the minority-carrier diffusion length has been achieved by thermal annealing in molecular hydrogen in previously formed n⁺ p junctions. The annealing temperature dependence of the diffusion length has been studied in the temperature range of 400 to 700° C. The study shows a significant increase in the diffusion length from 21-8/ im to 67-8/ jm by this process. The diffusion length increases with annealing in molecular hydrogen and shows a peak value at 600° C.