电流增益截止频率为441 GHz的InGaAs/InAlAs InP HEMT

本文设计并制作了f_T > 400 GHz的In_0.53Ga_0.47As/In_0.52Al_0.48As 铟磷高电子迁移率晶体管（InP HEMT）。采用窄栅槽技术优化了寄生电阻。器件栅长为54.4 nm,栅宽为2 × 50 μm。最大漏极电流I_DS.max为957 mA/mm,最大跨导g_m.max为1265 mS/mm。即使在相对较小的V_DS = 0.7 V下,电流增益截止频率f_T达到了441 GHz,最大振荡频率f_max达到了299 GHz。该器件可应用于太赫兹单片集成放大器和其他电路中。     

基于再生长欧姆接触工艺的220 GHz InAlN/GaN 场效应晶体管

本文在蓝宝石衬底上研制了具有高电流增益截止频率(f_T)的InAlN/GaN异质结场效应晶体管 (HFETs)。基于MOCVD外延n -GaN欧姆接触工艺实现了器件尺寸的缩小,有效源漏间距(L_sd)缩小至600 nm。此外,采用自对准工艺制备了50 nm直栅。由于器件尺寸的缩小,V_gs= 1 V下器件最大饱和电流(I_ds)达到2.11 A/mm,峰值跨导达到609 mS/mm。小信号测试表明,器件f_T达到220 GHz、最大振荡频率(f_max)达到48 GHz。据我们所知,该f_T值是目前国内InAlN/GaN HFETs器件报道的最高结果。     

InyAl1-yAs线性渐变缓冲层对InP基HEMT材料性能的影响

采用气体源分子束外延（GSMBE）技术,研究了InP衬底上In_yAl_1-yAs线性渐变缓冲层对In_0.66Ga_0.34As/In_yAl_1-yAs高迁移率晶体管（HEMT）材料特性影响。研究了不同厚度和不同铟含量的In_yAl_1-yAs线性渐变缓冲层对材料的表面质量、电子迁移率和二维电子气浓度的影响。结果表明,在300 K（77 K）时,电子迁移率和电子浓度分别为8 570 cm²/（Vs）^-1（23 200 cm²/（Vs）-1）3.255E12 cm^-2（2.732E12 cm^-2）。当In_yAl_1-yAs线性渐变缓冲层厚度为50 nm时,材料的表面形貌得到了很好的改善,均方根粗糙度（RMS）为0.154 nm。本研究可以为HEMT器件性能的提高提供强有力的支持。     

SiNx/SiOxNy叠层结构防潮能力的研究

研究了等离子体增强化学气相沉积(PECVD)工艺参数对SiN_x及SiO_xN_y防潮能力的影响,并测试了SiN_x/SiO_xN_y叠层薄膜的水汽渗透速率(WVTR)。实验结果表明:单层SiN_x薄膜和SiO_xN_y薄膜都存在临界厚度,当膜厚大于临界值时,继续增大厚度不会明显改善薄膜的WVTR。当沉积温度从50℃提高到250℃,SiN_x薄膜的WVTR从0.031g/(m²·day)降至0.010g/(m²·day)。SiO_xN_y沉积时,增大N₂O通入量对薄膜的WVTR影响不明显,但可以有效改善薄膜的弯曲性能。最后,4个SiN_x/SiO_xN_y叠层膜的WVTR下降到了4.4×10-4g/(m²·day)。叠层膜防潮能力的显著提升归因于叠层结构可以有效解耦层与层之间的缺陷,延长水汽渗透路径。     

甚长波碲镉汞红外焦平面探测器

采用砷离子注入p-on-n平面结技术制备了77 K工作温度下截止波长分别为13.23 μm和14.79 μm、像元中心距为25 μm的甚长波640×512探测器,并对其基本性能和暗电流进行了测试和分析。结果表明,对于截止波长为13.23 μm的甚长波640×512（25 μm）,器件量子效率为55%,NETD平均值为21.5 mK,有效像元率为99.81%;对于截止波长为14.79 μm的甚长波640×512（25 μm）,器件量子效率为45%,NETD平均值为34.6 mK,有效像元率为99.28%。这两个甚长波器件在液氮温度下的R₀A分别为19.8 Ω·cm²和1.56 Ω·cm²,达到了“Rule07”经验表达式的预测值,器件噪声主要受散粒噪声限制,显示出了较好的器件性能。     

Li、Ce掺杂对NBTa-CBN高温压电陶瓷性质的影响研究

采用传统固相反应法制备了Ca_0.5(Na_0.5Bi_0.5)_0.5-3x(Li_0.5Ce_0.5)_3xBi₂TaNb_0.99Mn_0.01O₉(CNBTNM-LC100x)高居里温度(T_C)压电陶瓷。研究了Li、Ce复合离子掺杂对陶瓷结构和电学性质的影响。结果表明,随着Li、Ce掺杂量的增加,CNBTNM-LC100x陶瓷的晶体结构趋于由正交相向四方相转变,压电常数d₃₃逐渐增大,当x＞0.04(x为摩尔分数)时,d₃₃趋于降低。x=0.04时,具有最优的综合电学性能,d₃₃约为15.9 pC/N,600 ℃下直流电阻率ρ约为5.9×10⁵ Ω·cm,介电损耗tan δ(1 MHz)约为7%,T_C约为887 ℃。     

基于Al0.8Sc0.2N压电薄膜MEMS声波器件的研制

该文介绍了一种由5×5个半径为200 μm圆形阵列组成,应用于水听器的高性能压电微机电系统(MEMS)声波器件,尺寸为3 mm×3 mm。采用钪掺杂(质量分数为20%)增强了AlN薄膜的压电系数,并通过双电极结构配置及优化结构尺寸来增强声压作用下的电信号输出,以实现压电MEMS声波器件具有更好的接收灵敏度。声波器件在空气中的接收灵敏度为-166.8 dB(Ref.1 V/μPa),比相同结构基于AlN薄膜的声波器件约高2.6 dB。在50 Hz~3 kHz带宽范围内,器件灵敏度曲线变化小于1.5 dB,具有平坦的声学响应。结果表明,基于Al_0.8Sc_0.2N薄膜的压电MEMS声波器件具有更高的接收灵敏度,经水密封装制成的水听器可应用于管道泄漏探测及海洋噪声监测等工程中。     

在复合衬底γ-Al2O3/Si(001）上生长GaN

采用分子束外延（MBE）生长方法，使用γ-Al₂O₃材料作为新型过渡层，在Si(001）衬底上获得了没有裂纹的GaN外延层，实验结果表明使用γ-Al₂O₃过渡层有效地缓解了外延层中的应力. 通过生长并测试分析几种不同结构的外延材料，研究了复合衬底γ-Al₂O₃/Si (001）生长GaN情况，得到了六方相GaN单晶材料，实现了GaN c面生长. 预铺薄层Al及高温AlN层可以提高GaN晶体质量，低温AlN缓冲层可以改善GaN表面的粗糙度. 为解决Si(001）衬底上GaN的生长问题提供了有益的探索.     

WO3对Rubrene/C70有机太阳能电池性能的改善

研究了WO₃对Rubrene/C₇₀有机太阳能电池 (OSCs)性能的 改善,制备了结构为ITO/WO₃/Rubrene/C₇₀/BCP/Al的OSCs,其中WO₃插入在I TO和Rubrene中间作为阳极修饰层。通过优化WO₃的厚度,研究了WO₃对OSCs性能的改善及其作用机理。实验发现,器件的短路电流Jsc、开路电压V_oc、 填充因子(FF)、光电转换效率(PCE)和串联电阻Rs等性能参数随WO₃厚度的变化呈规律性变化;当 WO₃厚度小于80 nm时,器件PCE随着厚度的增加不断增大;当W O ₃厚大于80 nm时,器件PCE随着厚度的 增加不断减小;当WO₃厚度为80 nm 时,器件PCE达到最高为1.03%, 相应的J sc、V_oc、FF分别为2.81mA·cm－2、 0.83V、43.85%,Rs为45.3Ω·cm²,对比没有WO₃修饰层, 器件的J_sc、V_oc、FF和PCE分别提高了31%、137%、17%,Rs降低了33%。     

30 nm T-gate enhancement-mode InAlN/AlN/GaN HEMT on SiC substratesfor future high power RF applications

The DC and RF performance of 30 nm gate length enhancement mode (E-mode) InAlN/AlN/GaN high electron mobility transistor (HEMT) on SiC substrate with heavily doped source and drain region have been investigated using the Synopsys TCAD tool. The proposed device has the features of a recessed T-gate structure, InGaN back barrier and Al₂O₃ passivated device surface. The proposed HEMT exhibits a maximum drain current density of 2.1 A/mm, transconductance g_m of 1050 mS/mm, current gain cut-off frequency f_t of 350 GHz and power gain cut-off frequency f_max of 340 GHz. At room temperature the measured carrier mobility (μ), sheet charge carrier density (n_s) and breakdown voltage are 1580 cm²/(V·s), 1.9×10¹³ cm^-2, and 10.7 V respectively. The superlatives of the proposed HEMTs are bewitching competitor or future sub-millimeter wave high power RF VLSI circuit applications.     

Nickel silicidation techniques for strained Si1?xGex, Si1?x?yGexCy, and Si1?yCy alloys material-device applications

A nickel silicide process for Si_1-xGe_x, Si_1-x-yGe_xC_y, and Si_1-yC_y alloy materials compatible with Si technology has been developed. Low-resistivity-phase (12–20 μΘ cm) nickel silicides have been obtained for these alloys with different low sheet-resistance temperature windows. The study shows that thin (15–18 nm) silicide layers with high crystalline quality, smooth silicide surface, and smooth interface between silicide and the underlying material are achievable. The technique could be used to combine the benefits of Ni silicide and Si_1-xGe_x, Si_1-x-yGe_xC_y, and Si_1-yC_y alloys. The technique is promising for Si or Si_1-xGe_x, Si_1-x-yGe_xC_y, and Si_1-yC_y alloy-based metal-oxide semiconductor, field-effect transistors (MOSFETs) or other device applications.     

YBa2Cu3-xZnxO7薄膜红外探测器的研究

在对红外探测器进行理论分析的基础上,设计并研制了液氮温度下的Yba2Cu3-xZnxO7薄膜红外探测器,系统地测试了器件的特征参数.最好的结果为:对于波长为10μm,调制频率为f=500Hz,带宽为Δf=1Hz的红外输入辐射Rv(500,10,1)=3587V/W,NEP(500,10,1)=6.5×10-12W/Hz1/2,D*(500,10,1)=7.2×1012cmHz1/2/W,τ(500,10,1)=1.2ms.     

New TIT capacitor with ZrO2/Al2O3/ZrO2 dielectrics for 60 nm and below DRAMs

New ZrO₂/Al₂O₃/ZrO₂ (ZAZ) dielectric film was successfully developed for DRAM capacitor dielectrics of 60 nm and below technologies. ZAZ dielectric film grown by ALD has a mixture structure of crystalline phase ZrO₂ and amorphous phase Al₂O₃ in order to optimize dielectric properties. ZAZ TIT capacitor showed small Tox.eq of 8.5 Å and a low leakage current density of 0.35 fA/cell, which meet leakage current criteria of 0.5 fA/cell for mass production. ZAZ TIT capacitor showed a smaller cap leak fail bit than HAH capacitor and stable leakage current up to 550 °C anneal. TDDB (time dependent dielectric breakdown) behavior reliably satisfied the 10-year lifetime criteria within operation voltage range.     

Excellent performance of gas sensor based on In2O3-Fe2O3 nanotubes

In₂O₃-Fe₂O₃ nanotubes are synthesized by an electrospinning method. The as-synthesized materials are characterized by scanning electron microscope and X-ray powder diffraction. The gas sensing results show that In₂O₃-Fe₂O₃ nanotubes exhibit excellent sensing properties to acetone and formaldehyde at different operating temperatures. The responses of gas sensors based on In₂O₃-Fe₂O₃ nanotubes to 100 ppm acetone and 100 ppm formaldehyde are 25 (240℃) and 15 (260℃), and the response/recovery times are 3/7 s and 4/7 s, respectively. The responses of In₂O₃-Fe₂O₃ nanotubes to 1 ppm acetone (240℃) and formaldehyde (260℃) are 3.5 and 1.8, respectively. Moreover, the gas sensor based on In₂O₃-Fe₂O₃ nanotubes also possesses an excellent selectivity to acetone and formaldehyde.     

Comparison between Pt/TiO2/Pt and Pt/TaOX/TaOY/Pt based bipolar resistive switching devices

Nonvolatile memories have emerged in recent years and have become a leading candidate towards replacing dynamic and static random-access memory devices. In this article, the performances of TiO₂ and TaO₂ nonvolatile memristive devices were compared and the factors that make TaO₂ memristive devices better than TiO₂ memristive devices were studied. TaO₂ memristive devices have shown better endurance performances (10⁸ times more switching cycles) and faster switching speed (5 times) than TiO₂ memristive devices. Electroforming of TaO₂ memristive devices requires~4.5 times less energy than TiO₂ memristive devices of a similar size. The retention period of TaO₂ memristive devices is expected to exceed 10 years with sufficient experimental evidence. In addition to comparing device performances, this article also explains the differences in physical device structure, switching mechanism, and resistance switching performances of TiO₂ and TaO₂ memristive devices. This article summarizes the reasons that give TaO₂ memristive devices the advantage over TiO₂ memristive devices, in terms of electroformation, switching speed, and endurance.     

具有界面依赖光致发光的双层WS2/Ga2O3异质结的能带工程(英文)

利用垂直WS₂/Ga₂O₃异质结构中异质界面诱导了反常的光致发光(PL)发射。垂直堆栈的WS₂/Ga₂O₃异质界面使其形成了II型能带结构,导致与Ga₂O₃层接触的底层WS₂的PL强度下降。而异质界面的强耦合作用也影响了双层WS₂中的同质层间相互作用,使得上层WS₂出现反常的PL增强。这种堆栈新型二维异质结构为定制目标能带结构并控制其光子和电子行为提供一种新的手段。     

Electrodepositing ZnxMnyOz alloys from zinc oxide to manganese oxide

Electrodeposition has emerged as a practical and simple method to synthesise semiconductor materials under different forms, thin films or nanostructured layers. This work reports on the cathodic electrodeposition of ZnMnO thin layers using both zinc and manganese chlorides as precursors. The composition of thin films can be varied from binary zinc oxide to manganese oxide varying the Mn/(Mn+Zn) ratio between 0 and 1. The composition of Zn_xMn_yO_z films was obtained by energy dispersive spectroscopy. Zn_1−xMn_xO films with Mn/Zn ratio less than 10% exhibit a crystalline wurtzite structure typical of ZnO fully oriented in the (0 0 2) direction. Higher Mn content leads to deformation of the ZnO lattice and the wurtzite structure is no longer maintained. X-ray photoelectron spectroscopy points out that Mn₃O₄ tends to be deposited when a high Mn/Zn ratio is used in the starting solution. Magnetic measurements on films with Mn/(Zn+Mn) ratio near 1 reveal magnetic characteristics similar to Mn₃O₄ compounds. The transmission spectra of Zn_xMn_yO_z show the typical absorption edge of crystalline ZnO while the wurtzite structure is maintained and it shifts to higher wavelengths when Mn content increases.     

共沉淀法制备Y2O2SO4:Eu3+荧光粉及其光致发光研究

采用商业Y(NO3)3·6H2O、Eu(NO3)3·6H2O、(NH4)2SO4和NaOH为实验原料,通过共沉淀法制备了Y2O2SO4:Eu3+荧光粉。利用热分析(DTA-TG-DTG)、傅里叶变换红外(FT-IR)光谱、X射线衍射(XRD)、扫描电子显微镜(SEM)和光致发光(PL)光谱等手段对合成的粉体进行了表征。结果表明,当(NH4)2SO4引入到反应体系中时,前驱体具有非晶态结构,且在空气气氛中800℃煅烧2h能转化为单相的Y2O2SO4粉体,该Y2O2SO4粉体呈准球形,粒径范围分布在0.5~1.0μm之间,团聚较严重。PL光谱分析表明,在270nm紫外光激发下,Y2O2SO4:Eu3+荧光粉呈红光发射,主发射峰位于620nm,归属于Eu3+的5D0→7F2跃迁。Eu3+的猝灭浓度是5 mol%,其对应的荧光寿命为1.22 ms。另外,当(NH4)2SO4未引入到反应体系中时,采用类似的方法合成了Y2O3:Eu3+荧光粉,并对Y2O2SO4:Eu3+和Y2O3:Eu3+荧光粉的PL性能进行了比较。     

Investigation of Ta2O5/SiO2/4H-SiC MIS capacitors

Tantalum pentoxide (Ta₂O₅) deposited by pulsed DC magnetron sputtering technique as the gate dielectric for 4H-SiC based metal-insulator-semiconductor (MIS) structure has been investigated. A rectifying current-voltage characteristic was observed, with the injection of current occurred when a positive DC bias was applied to the gate electrode with respect to the n type 4H-SiC substrate. This undesirable behavior is attributed to the relatively small band gap of Ta₂O₅ of around 4.3 eV, resulting in a small band offset between the 4H-SiC and Ta₂O₅. To overcome this problem, a thin thermal silicon oxide layer was introduced between Ta₂O₅ and 4H-SiC. This has substantially reduced the leakage current through the MIS structure. Further improvement was obtained by annealing the Ta₂O₅ at 900 °C in oxygen. The annealing has also reduced the effective charge in the dielectric film, as deduced from high frequency C-V measurements of the Ta₂O₅/SiO₂/4H-SiC capacitors.