Minority carrier diffusion length in LPE InxGa1−xP: N layers (x < 0.01)

Minority carrier diffusion length In_xGa_1?xP LPE layers has been measured using the electron beam method. It has been found that this parameter significantly changes with the composition of the alloy. The measured relationship proves that minority carrier mobility in In_xGa_1?xP alloys with low indium content strongly depends on the alloy composition. It is suggested that alloy scattering may be responsible for this behaviour. The effect of doping the In_xGa_1?xP LPE layers with nitrogen has also been investigated. Results indicate that carrier mobility drops when the nitrogen concentration exceeds certain limits and this most probably can be ascribed to carrier scattering on the nitrogen centers.     

Investigation of graded InxGa1−xP buffer by Raman scattering method

The compositional changes of In_xGa_1−xP graded buffer inserted between GaP substrate and subsequently grown In_0.36Ga_0.64P homojunction LED structure were investigated by Raman spectroscopy. The indium content of In_xGa_1−xP interlayers was increased in eight steps with thickness of 300 nm and constant compositional change Δx_In between the steps. The properties of In_xGa_1−xP graded buffer along the structure cross-section have been studied by Raman back scattering method and the changes in GaP LO and TO phonons were investigated. Raman shift of 13 cm⁻¹ in GaP-like LO₁ phonon was measured on beveled [100]surface for compositional change of In_xGa_1−xP layer in the range of 0<x_In<0.32. The measurements on the cleaved edge of the sample in [011] direction revealed a strong TO phonon at 366 cm⁻¹ and weak LO phonon peak at 405 cm⁻¹ in GaP substrate. By reaching the graded In_xGa_1−xP region the intensity of TO phonon decreases and appearance of considerable TO₁ phonon shift up to 350 cm⁻¹ for In content x_In=0.16 was observed. For upper graded layers with x_In from 0.16 to 0.24 the position of GaP-like TO₁ was constant and can be ascribed to relaxation of lattice mismatched thin In_xGa_1−xP graded upper layers in the structure.     

Electron transport in two dimensional electron gas formed at the heterojunction of AlxGa(1−x)N/GaN at microwave frequencies

Transport properties of the two dimensional electron gas (2DEG) formed at the interface of AlGaN/GaN heterostructure ranging from 20 K to 300 K has been investigated theoretically considering the various scattering mechanisms like the acoustic, the piezo, the surface roughness, the alloy, the polar optical phonon and the dislocation scattering. The dc mobility is found to remain constant up to 150 K and then it decrease sharply with further increase in temperature. The ac mobility is also found to decrease with increase in the temperature. The real part of ac mobility, i.e. μ_r decreases with the increase in the frequency very fast initially and then gradually attains a steady value. The imaginary part of the ac mobility μ_im initially increases with the increase in the frequency and then decreases after reaching the maximum value. The value of the ac mobility reduces quite reasonably as the 2D carrier concentration increases at lower range of the frequency. At the carrier concentration of 5 × 10¹⁷ m⁻², the ac mobility remains constant through a wide range of frequencies. With the increase in the dislocation densities, the values of the ac mobility are found to decrease at the lower range of frequencies. The thermo electric power is positive at the 2D carrier concentration of 5 × 10¹⁶ m⁻², the value of which increases with the increase in the temperature and gradually attains a steady value. But the thermoelectric power at n_2D of 10¹⁷ m⁻² is found to be negative in the value. The value of ZT is found to increase with the temperature and attains the maximum value of 0.007 at 150 K and the value of ZT then decreases with increase in the temperature.     

Alloy splitting of Te-DX in AlxGa1−xAs analysis using the deep level transient spectroscopy technique

The paper reports on a deep level transient spectroscopy analysis of Te-related DX centers in Al_xGa_1−xAs with aluminum composition x=0.40. As was shown from experimental results, the state energy of this trap shows a microscopic structure due to an alloy effect. A theoretical analysis based on a multi-step scheme has been made to explain the electron emission from a multiconfigurate center. Using this model, we derived the binding energies of the splitted Te-DX states in the alloy material studied.     

High-k TixSi1−xO2 thin films prepared by co-sputtering method

We report on high-k Ti_xSi_1−xO₂ thin films prepared by RF magnetron co-sputtering using TiO₂ and SiO₂ targets at room temperature. The Ti_xSi_1−xO₂ thin films exhibited an amorphous structure with nanocrystalline grains of 3-30 nm having no interfacial layers. The XPS analyses indicate that stoichiometric TiO₂ phases in the Ti_xSi_1−xO₂ films increased due to stronger Ti-O bond with increasing TiO₂ RF powers. In addition, the electrical properties of the Ti_xSi_1−xO₂ films became better with increasing TiO₂ RF powers, from which the maximum value of the dielectric constant was estimated to be ∼30 for the samples with TiO₂ RF powers of 200 and 250 W. The transmittance of the Ti_xSi_1−xO₂ films was above 95% with optical bandgap energies of 4.1-4.2 eV. These results demonstrate a potential that the Ti_xSi_1−xO₂ thin films were applied to a high-k gate dielectric in transparent thin film transistors as well as metal-oxide-semiconductor field-effect transistors.     

AlxGa1-xAs/GaAs异质结中电子迁移率的压力效应

对Al_xGa_1-xAs/GaAs半导体单异质结系统,引入有限高势垒与考虑导带弯曲的真实势，同时计入电子对异质结势垒的隧穿，利用变分法和记忆函数方法讨论在界面光学声子和体纵光学声子的散射下，异质结界面附近电子迁移率随温度的变化关系及其压力效应.结果显示：电子迁移率随温度、压力的增加而减小；且两种声子的散射作用均随压力增强，界面光学声子的变化幅度更大.因此，在讨论压力的情形下，界面光学声子的作用不容忽略.     

Remote phonon and surface roughness limited universal electron mobility of In0.53Ga0.47As surface channel MOSFETs

The inversion layer electron mobility in n-channel In_0.53Ga_0.47As MOSFET’s with HfO₂ gate dielectric with several substrate impurity concentrations (∼1 × 10¹⁶ cm⁻³ to ∼1 × 10¹⁸ cm⁻³) and various surface preparations (HF surface clean, (NH₄)₂S surface clean and PECVD a-Si interlayer with a HfO₂ gate dielectric) have been studied. The peak electron mobility is observed to be strongly dependent on the surface preparation, but the high field mobility is observed to be almost independent of the surface preparation. A detailed analysis of the effective mobility as a function of electric field, substrate doping, and temperature was used to determine the various mobility components (surface roughness, phonon, and coulombic scattering limited mobility components). For the substrates with high doping concentration, the electron mobility at low vertical electric field is dominated by Coulomb scattering from the substrate dopants, whereas, for lower substrate doping the Coulombic scattering is dominated by the disorder induced gap states. Low temperature measurements were used to determine the surface roughness scattering and phonon components. The results show that room temperature mobility of In_0.53Ga_0.47As surface channel MOSFETs with HfO₂ gate dielectric at high electric field is limited primarily by remote phonons whereas the Al₂O₃ gate dielectric is limited by surface roughness scattering.     

Grown junction GaAs solar cells with a thin graded band-gap AlxGa1−xAs surface layer

Liquid phase epitaxial growth techniques were used to fabricate (n)GaAs:Sn-(p)GaAs:Ge-(p)Al_xGa_1?xAs:Ge heterostructure solar cells. Graded band-gap Al_xGa_1?xAs layers with thicknesses between 1500 and 2500 Å were prepared by isothermal growth from an undersaturated solution. Spectral response measurements show that the resulting built-in electric field at the surface of the solar cell reduces the surface recombination velocity and improves the collection efficiency.     

X-ray metrology for high-k atomic layer deposited HfxZr1−xO2 films

Hafnium-based dielectrics are the most promising material for SiO₂ replacement in future nodes of CMOS technology. While devices that utilize HfO₂ gate dielectrics suffer from lower carrier mobility and degraded reliability, our group has recently reported improved device characteristics with a modified Hf_xZr_1−xO₂ [R.I. Hegde, D.H. Triyoso, P.J. Tobin, S. Kalpat, M.E. Ramon, H.-H. Tseng, J.K. Schaeffer, E. Luckowski, W.J. Taylor, C.C. Capasso, D.C. Gilmer, M. Moosa, A. Haggag, M. Raymond, D. Roan, J. Nguyen, L.B. La, E. Hebert, R. Cotton, X.-D. Wang, S. Zollner, R. Gregory, D. Werho, R.S. Rai, L. Fonseca, M. Stoker, C. Tracy, B.W. Chan, Y.H. Chiu, B.E. White, Jr., in: Technical Digest - International Electron Devices Meet, vol. 39, 2005, D.H. Triyoso, R.I. Hegde, J.K. Schaeffer, D. Roan, P.J. Tobin, S.B. Samavedam, B.E. White, Jr., R. Gregory, X.-D. Wang, Appl. Phys. Lett. 88 (2006) 222901]. These results have lead to evaluation of X-ray reflectivity (XRR) for monitoring high-k film thickness and control of Zr addition to HfO₂ using measured film density. In addition, a combination of XRR and spectroscopic ellipsometry (SE) is shown to be a fast and non-intrusive method to monitor thickness of interfacial layer between high-k and the Si substrate.     

Luminescent properties of BexCd1−xSe thin films

We report photoluminescence (PL) study of Be_xCd_1−xSe epitaxial layers (x<0.21) grown by molecular beam epitaxy on InP substrates. Continuous wave PL spectra are taken within a 4.2-300 K temperature range. We observe an anomalous ‘s-shaped’ temperature dependence of emission energy and a severe decrease of emission intensity with the increase of temperature. We explain an ‘s-shaped’ temperature dependence of emission energy by exciton localization in the potential minima at low temperatures followed by thermal activation at higher temperatures. We attribute low emission intensity at high temperatures to exciton dissociation and electron/hole migration to non-radiative recombination centers.     

Ge-doped InxGa1−xAs p−n junctions

The amphoteric properties of Ge in the In_xGa_1?xAscrystals grown by liquid-phase epitaxy are reported. It was found from the Hall measurements that when x < 0·1, the Ge-doped In_xGa_1?xAs was p-type, and when x > 0.1,it was n-type . At the vicinity of x = 0.1, therefore, the In_xGa_1?xAs p?n junction could be made by one growth process. The electrical and photoelectric characteristics of that junction were investigated. The distribution of Ge concentration at the p?n junction, which was obtained from the C-V characteristics, depended on the doping concentrations of Ge. This dependence can be interpreted by analyzing a modified Longini-Green equation. The spectral responses of both photovoltaic effect and electroluminescence showed that in In_0.1Ga_0.9As, Ge atoms gave rise to a heavy compensation effect, and introduced a conduction band tail of states and two kinds of acceptor levels located ～ 20and～ 100meV above the valence band edge.     

Characterization of CMOS sub-65 nm metallic contact by laser scattering: Thermal stability of Ni(Si1−xGex)

Very efficient in particles detection, light scattering also offers fast non-invasive full-mapping wafer surface state. This sensitivity was used in the case of germano-silicide process development. As a matter of fact, we report on haze measurement performances, compared to the usual methods used to investigate thermal stability of Ni(Si_1−xGe_x), such as sheet resistance (SR), X-ray diffraction (XRD) and scanning electron microscopy (SEM). We observed defectivity related to thermal agglomeration and Ge-segregation of Ni(Si_1−xGe_x) on strain Si_1−xGe_x (x ? 30%) by haze measurement (like SEM observations) earlier than SR measurement. Moreover, we noticed that a high Ge content affects at lower temperature the stability of Ni(Si_1−xGe_x) with a segregation phenomena.     

Leakage currents and dielectric breakdown of Si1−x−yGexCy thermal oxides

A detailed study of the leakage currents and dielectric wear-out of thermal oxides grown on Si_1−xGe_x, Si_1−yC_y and Si_1−x−yGe_xC_y epilayers to determine their quality and reliability for Si_1−x−yGe_xC_y MOS technology is presented. After applying electrical stress to the samples, we have determined the conduction mechanisms and the dependence of leakage currents upon epilayer composition (Ge and C content). Conduction takes place mainly via Fowler-Nordheim tunneling injection. Ge and C introduce traps in the oxide which assist injection and thus lower the effective height of the tunneling barrier. We have also monitored the oxide reliability, focusing on time-dependent dielectric breakdown (TDDB). The nature of trapped charge in the oxide depends on the initial epilayer composition. We have found that the formation of defects induced by the presence of C leads to extrinsic oxide failure. While the presence of Ge in the oxide does not seem to introduce significant differences with respect to Si breakdown statistics, C in the oxide truly modifies the statistical profile.     

Impact of strain relaxation of AlmGa1−mN layer on 2-DEG sheet charge density and current voltage characteristics of lattice mismatched AlmGa1−mN/GaN HEMTs

An accurate charge control model to investigate the effect of aluminum composition, strain relaxation, thickness and doping of the Al_mGa_1−mN barrier layer on the piezoelectric and spontaneous polarization induced 2-DEG sheet charge density, threshold voltage and output characteristics of partially relaxed Al_mGa_1−mN/GaN HEMTs is proposed. The strain relaxation of the barrier imposes an upper limit on the maximum 2-DEG density achievable in high Al content structures and is critical in determining the performance of lattice mismatched Al_mGa_1−mN/GaN HEMTs. The model incorporates the effects of field dependent mobility, parasitic source/drain resistance and velocity saturation to evaluate the output characteristics of Al_mGa_1−mN/GaN HEMTs. Close proximity with published results confirms the validity of the proposed model.     

Changes in effective work function of HfxRu1−x alloy gate electrode

Effective work function (?_m,eff) values of Hf_x Ru_1−x alloy gate electrodes on SiO₂ metal-oxide-semiconductor (MOS) capacitors were carefully examined to assess whether the ?_m,eff was determined by the crystalline structure or the composition of the Hf_xRu_1−x alloy. X-ray diffraction results indicated that the crystalline structures of Hf_xRu_1−x alloy were divided into hexagonal-Ru, cubic-HfRu or hexagonal-Hf with the increase of Hf content. The ?_m,eff values could be controlled continuously from 4.6 to 4.0 eV by changing the Hf content. The experimental ?_m,eff value showed a good agreement with theoretical results considering the compositional ratio of pure Hf and Ru. These results suggest that the ?_m,eff of Hf_xRu_1−x alloy gates on SiO₂ MOS capacitors is dominantly determined by the Hf_xRu_1−x composition rather than the crystalline structure.     

InxGa1−xN refractive index calculations

The growth of In_xGa_1−xN Wurtzite structure is a well established fact. It permits to design optoelectronic devices such as laser diodes or LEDs, from the near ultraviolet to the infrared light spectrum. This sweeps indeed, the whole of the visible spectrum and, hence, appears to be very useful to the recent development of liquid crystal display screens, or designing photodiodes and perhaps solar cells (after studying their energetical efficiencies). Nevertheless, refractive indices of In_xGa_1−xN structure have not been studied.The refractive index of such structures is increasing from the GaN refractive index to the InN one, with therefore, a bowing of the curve due to the lattice mismatch between these two constituting binary alloys.The index is, in a certain range of the “n(x)” characteristic, less than the GaN one. This seems to be particularly interesting in the integrated optics domain or optical waveguides realization, because the growth of GaN is easier than the growth of In_xGa_1−xN.     

Study of Shubnikov-de Haas oscillations and measurement of hole effective mass in compressively strained InXGa1−XSb quantum wells

In_XGa_1−XSb has the highest hole mobility amongst all III-V semiconductors which can be enhanced further with the use of strain. The use of confinement and strain in In_XGa_1−XSb quantum wells lifts the degeneracy between the light and heavy hole bands which leads to reduction in the hole effective mass in the lowest occupied band and an increase in the mobility. We present magnetotransport measurements on compressively strained In_XGa_1−XSb and GaSb quantum wells. Hall-bar and Van de Pauw structures were fabricated and Shubnikov-de Haas oscillations in the temperature range of T = 2-10 K for magnetic fields of B = 0-9 T were measured. The reduction of effective hole mass with strain was quantified. These results are in excellent agreement with modeling results from band structure calculations of the effective hole mass in the presence of strain and confinement.     

Anomalous light sensitivity of organometallic VPE AlxGa1−xAs

The capacitance of Al_0.3Ga_0.7As p-n junctions grown by organometallic vapor phase epitaxy at 690°C with V/III flux ratio of ～20 is found to be extremely light-sensitive. The light sensitivity is shown to be caused by the presence of two dominant hole traps having energy levels at 0.87 and 0.74 eV above the valence band. The traps were studied by three different schemes of DLTS measurements. The traps could be annealed out by post-growth annealing at 650°C for 1 hr in a hydrogen atmosphere.     

Effects of high doping on the bandgap bowing for AlxGa1−xN

This paper gives the composition dependence of the bandgap energy for highly doped n-type Al_xGa_1−xN. We report results of the bowing parameter obtained using a random simulation. Three groups of Al_xGa_1−xN semiconductors were considered and which are distinguishable by their non degenerate or degenerate character in the doping density (10¹⁷?N_D?10²⁰ cm⁻³). A striking feature is the large discrepancy of the bandgap bowing (−2.02?b?2.94 eV), as was demonstrated from our calculations. This suggests that high doping may be a possible cause able to induce the large range of bowing parameters reported for Al_xGa_1−xN alloys.     

The effect of acoustic phonon confinement on electron scattering in GaAs/Al<Subscript>x</Subscript>Ga<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>As superlattices

The relaxation time of quasi-two-dimensional (quasi-2D) electrons in the lowest miniband of the GaAs/Al_0.35Ga_0.65As superlattice is calculated for the case of scattering by acoustic phonons. It is shown that electron scattering is affected only slightly by the quantization of the phonon spectrum in terms of the elasticity theory. The scattering is well described based on the phonon spectrum of the bulk semiconductors that form the superlattice.