CMOS工艺兼容的热电堆红外探测器

提出了一种CMOS工艺兼容的、并采用XeF2气体干法刻蚀工艺释放的热电堆红外探测器.探测器包括硅基体、框架、热电堆、支撑臂、红外吸收层、刻蚀开口等.作为红外吸收层的氧化硅/氮化硅复合介质膜具有多种形状的腐蚀开口,使用各向同性的干法刻蚀从正面刻蚀衬底释放器件.探测器尺寸为2 mm×2 mm,由20对多晶硅-铝热电偶组成,串联电阻16～18 kΩ.释放后的器件特性响应率13～15 V/W,探测率(1.85～2.15)×107 cmHz1/2/W,时间常数20～25ms.     

一种与CMOS工艺兼容的热电堆红外探测器

报道了一种与CMOS工艺兼容的微机械热电堆红外探测器。提出了具有一对热电偶的两层悬浮结构,其占空因子达到80%以上,并采用P/N多晶硅作为热电偶材料,黑硅作为吸收层材料。给出了器件的工作原理,对性能优化与制作的工艺流程进行了分析,结合所选材料的基本参数,得到了优化后的结构尺寸。通过理论计算,可以获得响应率大于1000 V/W,探测率大于1×108cmHz1/2W-1,时间常数小于40ms,噪声等效温差小于30mK的性能优良的热电堆红外探测器。该器件的吸收层位于结构中的顶层,金属布线位于底层,便于与后续电路集成。单元大小为25 m×25 m,有利于制作非制冷红外焦平面阵列。     

单片集成CMOS电阻真空传感器

设计了一种工作在恒电压模式的、微热板结构的单片集成电阻真空传感器芯片.提出了一种以CMOS集成电路中的介质层与钝化层为结构层、栅多晶硅为牺牲层、第二层多晶硅为加热电阻的微传感器单芯片集成工艺模式,制定了相应的工艺流程.采用0.6μm CMOS数模混合集成电路工艺,结合牺牲层腐蚀技术实现了单片集成真空传感器的加工,测试结果显示该芯片能够测量2～105Pa范围内的气压大小,且输出电压范围可调,验证了单片集成工艺的可行性.     

单片集成CMOS电阻真空传感器

设计了一种工作在恒电压模式的、微热板结构的单片集成电阻真空传感器芯片.提出了一种以CMOS集成电路中的介质层与钝化层为结构层、栅多晶硅为牺牲层、第二层多晶硅为加热电阻的微传感器单芯片集成工艺模式,制定了相应的工艺流程.采用0.6μm CMOS数模混合集成电路工艺,结合牺牲层腐蚀技术实现了单片集成真空传感器的加工,测试结果显示该芯片能够测量2～10^5Pa范围内的气压大小,且输出电压范围可调,验证了单片集成工艺的可行性.     

一种用于生物检测的半导体电场效应传感器

设计了一种简化的铝栅MOS半导体器件制作工艺流程,用6张掩模版成功制作出了基于表面电场效应原理的生物检测硅芯片传感器,采用SiO2-Si3N4复合栅介质层及耗尽型器件结构,以增强器件的识别与检测灵敏度。该传感器与常规铝栅MOS晶体管相比,去除了介质层表面的栅极导电层,代之以自组装技术制作生物薄膜并辅以栅参考电极作为控制栅极。用所制作的硅芯片传感器检测了相关生物蛋白质的电流响应,给出了该电流响应与器件沟道长度和沟道电阻及生物蛋白浓度等参数的关系,得到了较为满意的检测数据,达到了预期的基于表面电场效应的硅传感器制作和生物检测的目的。     

高深宽比深隔离槽的刻蚀技术研究

体硅集成MEMS器件中的一个非常重要的技术就是微结构与电路部分的电隔离和互连.由于体硅工艺与传统CMOS工艺不兼容,所以形成高深宽比的深隔离槽(宽约3 μm,深20～100 μm)是体硅集成中急待解决的工艺难题.本文采用MEMS微加工的DRIE(Deep Reactive Ion Etching)技术、热氧化技术和多晶硅填充技术,形成了高深宽比的深电隔离槽(宽3.6 μm,深85 μm).还提出了一种改变深槽形状的方法,使深槽的开口变大,以利于多晶硅的填充,避免了空洞的产生.     

硅热电堆探测器件及制作

针对实现红外技术在夜间和一些死角方面应用的视觉辅助系统,把微机械加工技术和制作微细红外吸收膜的工艺应用到CMOS技术中,使热电堆实现了高性能化.利用运用PSG替代层的分离法制作用低压真空蒸镀法成膜的金黑膜,使吸收膜实现了微细化.制作出三种160 μm见方的原型传感器,它们在大气中的灵敏度分别达到300 V/W、149 V/W、60 V/W,响应时间常数达2 ms、0.46 ms、0.27 ms.还利用原型传感器制成了64×32像元焦平面列阵传感器(FPA).     

一种GMOS SnO2气体微传感器的设计

采用TSMC 0.6 μm 1P3M标准CMOS工艺设计了一种检测O2浓度的SnO2气体微传感器.传感器材料是由实验分析及CMOS工艺共同确定,其多晶硅加热电阻温度系数小、功耗低,而SnO2敏感薄膜灵敏度高且稳定性良好,通过软件对器件进行热学模拟仿真并确定了传感器的结构及设计参数.芯片测试结果表明:所设计的MHP悬空结构的传感器反应速度快、抗干扰能力强、具有较高的灵敏度及稳定性,检测O2含量的浓度范围为15%～70%,满足了工艺要求.     

CMOS兼容的微机械热电堆红外探测器的设计

提出了一种与CMOS工艺兼容、高响应率、低噪声的微机械热电堆红外探测器。该结构热电偶数目为两对,材料为P/N型多晶硅,吸收层材料为TiN。采用较少热电偶对的方式来降低噪声,引入共振谐振腔结构来提高红外吸收率。阐述了探测器的基本工作原理,通过仿真得到其重要的性能参数,并给出了器件具体的工艺流程,对器件尺寸进行了优化。理论上,其响应率大于1000 V/W,探测率大于2×108cmHz1/2W-1,噪声等效温差小于20mK,时间常数小于10ms,电阻值小于20k。     

纳米多晶硅薄膜压力传感器制作及特性

给出一种纳米多品硅薄膜压力传感器,采用LPCVD法在衬底温度620℃时制备纳米多晶硅薄膜,基于MEMS技术在方形硅膜不同位置制作由4个薄膜厚度为63.0nm的掺硼纳米多晶硅薄膜电阻构成惠斯通电桥结构,实现对外加压力的检测.实验结果表明.当硅膜厚度75μm时,纳米多晶硅薄膜压力传感器在恒压源5.0V供电时,满量程(160kPa)输出为24.235mV,灵敏度为0.151mV/kPa,精度为0.59%F.S,零点温度系数和灵敏度温度系数分别为-0.124%/℃和-0.108%/℃.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks     

Call for Papers—Feature Topic,Vol.12,No.7,2015

正Information Centric Networking Information-Centric Networking(ICN) is an emerging direction in Future Internet architecture research,gaining significant tractions among academia and industry.Aiming to replace the conventional host-to-host communication model by a data-centric model,ICN treats data content as the first     

JOURNAL OF ELECTRONICS(CHINA)

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NEXT GENERATION WIRELESS NETWORKS–ESPECIALLY THE USE OF MILLI-MICROWAVE BANDS

The global bandwidth shortage of wireless communications has motivated the exploration of the naillimeter wave （ram-wave） frequency spectrum for the next generation wireless communications. Recent advances in RF CMOS technology and high speed baseband signal processing technologies have enabled tile extensive research and development of turn-wave wireless communications. The multi gigabit per second data rate of ram-wave system will lead to applications in many important scenarios, such as WPAN, WLAN,back-haul for cellular system. And the frequency bands include 28 GHz, 38 GHz, 45GHz, 60GHz, E-BAND and even beyond 100 GHz. The propagation and the imitation of the RF circuits design in these frequency bands make the directional antennas be inevitable for mm-wave communications.