气垫缓冲包装在冰箱上的应用

本文系统的研究了气柱线密度、气柱直径、气柱压力对气垫缓冲包装系统缓冲复原性能的影响,并将气垫缓冲包装与EPS、蜂窝纸板进行了对比。气垫缓冲包装因其卓越的性能是取代EPS和蜂窝纸板作为冰箱包装侧条的必然趋势。     

缓冲包装设计的理论探讨

本文以可发性聚苯乙烯发泡材料（EPS）为研究对象，在理论上探讨缓冲包装的可靠性、合理性，给缓冲结构优化设计提供理论依据。     

防震缓冲包装及泡沫塑料的应用

减缓外来冲击，保护产品是缓冲包装的目的。根据流通条件有效地确定物品的脆值。选用合适的缓冲包装材料是防震缓冲包装设计的三大要素，聚乙烯，聚苯乙烯泡沫塑料是性能较好的材料，其成本低，加工方便，化学稳定性好，透湿率低，良好的吸震性受到广泛的应用。运用Ｃ～δｍ曲线可以设计出适用的缓冲衬垫，使产品得到较好的包装效果。     

LZZQB6—10电流互感器的缓冲包装设计

缓冲包装是随着塑料工业的发展而兴起的一种新型的包装方法,它是利用聚苯乙烯泡沫塑料等缓冲材料,根据被包装产品的形状特点制出相应的模型,对产品加以保护,以减少产品在流通过程中受到冲击,振动等外力作用,这种方法正广泛地应用于电气、仪     

冰箱缓冲包装优化设计研究

本文以一款三门冰箱为例,论述了采用目前较为科学的缓冲包装设计六步法,结合CAD/CAE包装设计软件及缓冲材料测试设备,对包装系统进行优化设计的方法。通过本方法使该冰箱包装系统成本降低24.82%,产品平台实现通用化,并最终建立冰箱包装系统模块化设计平台,对其他冰箱包装设计具有很大的指导意义。     

大冰箱包装系统缓冲设计研究

本文采用缓冲包装设计六步法,结合CAD/CAE包装设计软件及缓冲材料测试设备,对一款大冰箱包装系统进行优化设计。优化设计后使该冰箱包装系统成本降低27.15%,统一了9款产品2套包装系统,实现了包装系统通用化,并最终建立大冰箱包装系统模块化设计平台,对其它冰箱包装设计具有很大的指导意义。     

一种新型用于同步整流的时变缓冲网络

本文以单阶隔离非调整型DC-DC总线变流器为例详细分析了同步整流电路在热插拔过程中同步整流管的电压应力情况,并针对在此过程中所产生的高电压尖峰给出了理论和实验分析。同时,为了克服此种同步整流管在热插拔高电压尖峰的问题,本文提出了一种高效率的具有时变电容的缓冲网络,并给出了设计思路和方法。基于这种具有时变电容器的缓冲网络,本文对此时变概念进行了推广,提出了其他若干种时变缓冲网络单元,以适应于更广泛的应用场合。最后,在一个1/4砖48V-12V/300W总线变流器上对设计原理进行了验证,试验结果有效地验证了本文所提出的设想     

EPP缓冲材料性能分析及其在家电包装上的应用

发泡聚丙烯（EPP）材料具有良好的压缩强度、力学性能、优异的回复性,并且可实现在家电产品包装上的循环利用。利用电子扫描显微镜、电子万能试验机、零跌落试验机、变频式模拟振动台和斜面冲击试验机对比了EPP和发泡聚苯乙烯（EPS）的微观泡孔形貌,拉伸强度、压缩强度、永久压缩强度并且验证了两种材料的循环使用可行性,结果表明,同等密度下EPP材料的拉伸强度均高于EPS,压缩强度与EPS材料接近,制件耐久性是EPS的5倍以上。经过试验验证了EPP材料产品包装具有优异防护效果,在家电包装行业的应用前景广泛。     

厨下式超滤净水器的瓦楞纸板缓冲结构设计

本文以一款厨下式超滤净水器为研究对象,在确定其流通环境、产品参数及脆值的基础上,以瓦楞纸板为缓冲材料对其进行缓冲包装设计,并对所设计结构进行校核、实验验证,证明该纸卡具有良好的保护功能,同时因其易加工、成本低、符合环保要求等优点,可被广泛使用。     

一种新的灵活实用的操作票专家系统

介绍了一个结合实际网络研制的地区电网调度操作票专家系统 ,提出了将电网结构数据库和知识库同推理机分离的思想。该系统采用框架知识表示法 ,将知识库与电网拓扑结构数据库均做成了外部数据库的形式进行存储。另外 ,还提出根据操作前电网的运行状态 (初态 )和操作后电网的运行状态 (终态 )进行开票的思想。基于上述思想开发的调度操作票专家系统 ,对于电网结构以及知识库的修改和扩充是非常方便的 ,并且 ,开出的操作票既保证了准确性 ,又具有高度的灵活性     

一种新的灵活实用的操作票专家系统

介绍了一个结合实际网络研制的地区电网调度操作票专家系统,提出了将电网结构数据库和知识库同推理机分离的思想.该系统采用框架知识表示法,将知识库与电网拓扑结构数据库均做成了外部数据库的形式进行存储.另外,还提出根据操作前电网的运行状态(初态)和操作后电网的运行状态(终态)进行开票的思想.基于上述思想开发的调度操作票专家系统,对于电网结构以及知识库的修改和扩充是非常方便的,并且,开出的操作票既保证了准确性,又具有高度的灵活性.     

Providing a cushion for wireless healthcare application development

Recent advances in the electronics industry and wireless communication have enabled the evolution of innovative application domains. Smaller embedded processors and systems have allowed a new level of mobile communication and interaction in everyday life. In particular, the expansion of broadband wireless services and the advancement of handheld technology have allowed for real-time patient monitoring in locations where not previously possible. Low-cost sensors and wireless systems can now create a constantly vigilant and pervasive monitoring capability at home, work, and in conventional point-of-care environments (e.g., primary care physician offices, outpatient clinics, and rehabilitation centers). A large research community (e.g., the UCLA Wireless Health Institute) and a nascent industry is beginning to connect medical care with technology developers, vendors of wireless and sensing hardware systems, network service providers, and enterprise data management communities. Wearable devices focusing on personal health, rehabilitation, and early disease detection are now being prototyped. All of this has led to the new notion of "wireless healthcare."     

Microelectronic packaging for retinal prostheses.

An innovative parylene-based high-density chip-level integrated interconnect (CL-I/sup 2/) packaging system for retinal implants id discussed. The implications of this CL-I/sup 2/ technology for retinal prosthesis packaging effort are far-reaching. This technology obviates the need for a technician to create electrical and mechanical connections one by one. Instead, the technology is limited only by standard photolithography and standard microfabrication techniques, providing the capability for a reduction of an order of magnitude or more in the center-to-center pad distances that can be accommodated in the process. High-density electrode arrays are thereby feasible, because the fabrication process places no limit on the number of output pads that can reasonably be connected to the array.     

A plasma device for increasing the hydrophilicity of paper products

The treatment of various materials using low-temperature gas–discharge plasma to clean their surface or change their structure is rather promising because of the generation of particles that react with molecules of impurities or base material. In addition, the molecules of the surface layer of material are exposed to the influence of ultraviolet and soft X-ray radiation generated in the cathode layer of the discharge. Only the volumetric gas–discharge can guarantee a high degree of uniformity of the material surface treatment. To increase the intensity of the plasma-chemical reactions, it is effective to increase the frequency of the supplied voltage of a discharge reactor or to use the pulse–periodic power-supply mode. The pulse frequency should be coordinated with the typical frequency of the plasma chemical reactions. Experimental installations that have a discharge reactor as their main element showed successful performance for the modification of the volumetric structure of a thin paper tape to increase its hydrophilicity.     

电力系统实时相角测量高速数据采集卡设计

为实时相角测量装置开发了基于Compact PCI总线的高速数据采集卡。采用多路模拟量同步采样方式，在采样触发环节引入数字锁相环，使采集卡在电网频率改变时能自适应调节采样频率，实现每周期等相位触发采样，提高了采样精度。采集卡数据传输总线采用Compact PCI总线．使系统具备了可热插拔、易于扩展和通用性强等特点。在QNX实时操作系统平台上开发了数据采集软件，提高了数据采集系统的实时性。     

城市变电站软弱地基换填垫层法处理技术

六盘水市110kV某新建城市变电站,站址位于六盘水市钟山区,场地多为淤泥或杂填土,厚度在0m到3m之间,为明显的软弱土地基,现以该变电站地基处理方案为例,讨论城市变电站软弱地基换填垫层法处理技术。     

The flip-chip approach for millimeter wave packaging

A particularly critical issue in this regard is module packaging, i.e., the way to assemble and connect several monolithic microwave integrated circuits (MMICs) in a multichip environment in order to build the millimeter-wave front-end. The requirements on the packaging scheme are obvious: the interconnects should provide good millimeter-wave performance (primarily meaning: low reflections and low insertion loss) and, at the same time, they should allow for low-cost fabrication. Among the multichip packaging techniques available, the flip-chip approach is considered to be the most promising candidate to meet these requirements.     

上游气垫调压室系统过渡过程的计算

我国气垫调压室技术的应用正在起步。本文以一室一管三机的布置为例 ,建立了描述系统小幅度过渡过程的状态方程组 ,分析了它的特性。导出了调压室结点水击和涌浪的联合计算式。据所提出的理论公式 ,编制了计算大、小幅度过渡过程的程序 ,通过简单算例 ,检验了程序的正确性