SiGe HBT工艺宽带功率放大器

A novel broadband power amplifier fabricated in 0.13 m SiGe HBT technology is realized.The pseudo-differential structure is proposed to avoid the influence of the bonding wire due to the AC virtual ground created at the common emitter node.A compensated matching technique is adopted in interstage matching to expand bandwidth.A multi-stage broadband matching technique is used in an input/output matching network to offer broadband impedance matching,which ensures maximum power transfer.An adaptive bias circuit could improve linearity and efficiency in wide output power level.With 2.5 V power supply,the measured results achieve 96% 3-dB bandwidth(517-1470 MHz),27.2 dB power gain,26.9 dBm maximum output power,19.7 dBm output 1 dB compression point,and 26.7% power added efficiency.     

A low-power ka-band Voltage-controlled oscillator implemented in 200-GHz SiGe HBT technology

An integrated low-power low phase-noise Ka-band differential voltage-controlled oscillator (VCO) is developed in a 0.12-/spl mu/m 200-GHz silicon-germanium heterojunction bipolar transistor technology. The use of line inductors instead of transmission lines is demonstrated to be feasible in LC-tuned resonators for Ka-band applications. This VCO can operate from a supply voltage of 1.6-2.5 V. A single-sideband phase noise of -99 dBc/Hz at 1-MHz offset from the carrier frequency of 33 GHz is achieved, together with a VCO figure-of-merit of -183.7 dBc/Hz. The frequency tuning constant of the VCO in the linear regime is -0.547 GHz/V.     

Ultrahigh-performance 8-GHz SiGe power HBT

This letter has demonstrated the state-of-the-art SiGe power heterojunction bipolar transistors (HBTs) operating at 8 GHz. In a common-base configuration, a continuous wave output power of 27.72 dBm with a concurrent power gain of 12.19 dB was measured at a peak power-added efficiency of 60.6% from a single SiGe HBT with a 3-/spl mu/m emitter finger stripe width and a 1340 /spl mu/m/sup 2/ total emitter area. The highest power-performance figure of merit (FOM) of 3.8/spl times/10/sup 5/ mW/spl middot/GHz/sup 2/ achieved from the device was resulted from using an optimized SiGe heterostructure and a compact device layout, which is made possible with a heavily doped base region.     

射频 Si/SiGe/Si HBT的研究

在Si／SiGe／SiHBT与Si工艺兼容的研究基础上,对射频Si／SiGe／SiHBT的射频特性和制备工艺进行了研究,分析了与器件结构有关的关键参数寄生电容和寄生电阻与Si／SiGe/Si HBT的特征频率fT和最高振荡频率fmax的关系,成功地制备了fT为2．5CHz、fmax为2．3GHz的射频Si／SiGe／SiHBT,为具有更好的射频性能的Si／SiGe／Si HBT的研究建立了基础。     

Theoretical small-signal performance of Si/SiGe/Si HBT

Application of the Monte Carlo technique to analyze electron and hole transport in bulk Si_0.8Ge_0.2 and strained Si _0.8Ge_0.2/Si is discussed. The computed minority- and majority-carrier transport properties were used in a comprehensive small-signal model to evaluate the high-frequency performance of a state-of-the-art n-p-n heterostructure bipolar transistors (HBT) fabricated with SiGe as the base material. The valence band discontinuity of a SiGe-base HBT reverses the degradation in emitter injection efficiency caused by bandgap narrowing in the base, and permits a higher ratio of base doping to emitter doping than would be practical for a bipolar transistor. Any degradative effect of increased base doping on electron and hole mobilities is offset by improved transport in the strained SiGe base, resulting in a marked decrease in the base resistance and base transit time. Compared to the Si BJT, the use of Si_0.8Ge_0.2 for the base region of an HBT leads to significant improvements in low-frequency common emitter current gain, low-frequency unilateral power gain, and maximum oscillation frequency     

A 5-GHz SiGe HBT return-to-zero comparator for RF A/D conversion

This paper presents a monolithic comparator implemented in a 0.5-μm SiGe heterojunction bipolar transistor (HBT) process. The SiGe HBT process provides HBT npn transistors with maximum f_T over 40 GHz and f_max over 55 GHz. The comparator circuit employs a resettable slave stage, which was designed to produce return-to-zero output data. Operation with sampling rates up to 5 GHz has been demonstrated by both simulation and experiments. The comparator chip attains an input range of 1.5 V, dissipates 89 mW from a 3-V supply, and occupies a die area of 407×143 μm². The comparator is intended for analog-to-digital (A/D) conversion of 900 MHz RF signals     

A 210-GHz fT SiGe HBT with a non-self-aligned structure

A record 210-GHz f_T SiGe heterojunction bipolar transistor at a collector current density of 6-9 mA/μm² is fabricated with a new nonself-aligned (NSA) structure based on 0.18 μm technology. This NSA structure has a low-complexity emitter and extrinsic base process which reduces overall thermal cycle and minimizes transient enhanced diffusion. A low-power performance has been achieved which requires only 1 mA collector current to reach 200-GHz f_T. The performance is a result of narrow base width and reduced parasitics in the device. Detailed comparison is made to a 120-GHz self-aligned production device     

A wide-bandwidth Si/SiGe HBT direct conversion sub-harmonicmixer/downconverter

A wideband sub-harmonic mixer/direct-conversion downconverter is implemented in a Si/SiGe HBT technology, with improved rejection of the local oscillator (LO), high input intercept point, and low current requirements. The circuit utilizes a combination of phase shifters operating at 45° and 90° to achieve better than 33-dB input-referred rejection of the LO. The measured third-order input intercept point (IIP3) was approximately -3 dBm and the second-order input intercept point (IIP2) was roughly 35 dBm, with a measured double sideband (DSB) noise figure of 7.8 dB. A comparison was made between devices of differing germanium concentration in the base, and the devices with higher Ge content exhibited improved noise figure and gain. Each mixer required approximately 2.8 mA from a 3.3 V supply     

Si/SiGe/SiHBT直流特性的可靠性

对单台面SiGeHBT在E-B结反偏应力下直流特性的可靠性进行了研究。研究结果表明,随应力时间的增加,开启电压增加,直流电流增益下降,特别是在低E-B正偏电压时下降明显;而交流电流增益退化缓慢。     

An 18-GHz 300-mW SiGe power HBT

An 18-GHz, 300-mW SiGe power heterojunction bipolar transistor (HBT) is demonstrated. The optimization of SiGe HBT vertical profile has enabled this type of devices to operate with high gain and high power at this high frequency. In the common-base configuration, a continuous wave output power of 24.73 dBm with a power gain of 4.5 dB was measured from a single 20-emitter stripe SiGe (2/spl times/30 /spl mu/m/sup 2/ of each emitter finger) double HBT. The overall performance characteristics represent the state-of-the-art SiGe power HBTs operating in the K-band frequency range.     

SiGe／Si HBT离子注入自对准的研究

介绍了离子注入技术自对准制作ＳｉＧｅ／ＳｉＨＢＴ的方法，分析了对器件特性的影响。     

与Si工艺兼容的Si/SiGe/Si HBT研究

我们对Si/SiGe/Si HBT及其Si兼容工艺进行了研究,在研究了一些关键的单项工艺的基础上,提出了五个高速Si/SiGe/Si HBT结构和一个低噪声Si/SiGe/Si HBT结构,并已研制成功台面结构Si/SiGe/Si HBT和低噪声Si/SiGe/Si HBT,为进一步高指标的Si/SiGe/Si HBT的研究建立了基础。     

SiGe/Si异质结双极晶体管工艺技术研究

介绍了多晶硅发射极双台面SiGe/Si异质结双极晶体管制作工艺流程。通过对LPCVD在n型Si衬底上外延生长SiGe合金层作为异质结双极晶体管基区、自中止腐蚀工艺制作发射区台面、多晶硅n型杂质掺杂工艺制作发射极、PtSi金属硅化物制作器件欧姆接触等工艺技术进行研究,探索出关键工艺的控制方法,并对采用以上工艺技术制作的多晶硅发射极双台面SiGe/Si异质结双极晶体管进行了I-V特性及频率特性测试。结果显示该器件饱和压降小,欧姆接触良好,直流电流放大倍数β随Ic变化不大,截止频率最高达到11.2 GHz。     

SiGe HBT技术进展

首先论述了 Si Ge技术的优势、发展历史和应用领域 ,并介绍了 Si Ge工艺和器件的进展 ,最后详细描述了 Si Ge IC的进展     

一种偏置电流可控的2.4GHz SiGe HBT功率放大器设计

A 2.4-GHz SiGe HBT power amplifier （PA） with a novel bias current controlling circuit has been realized in IBM 0.35-μm SiGe BiCMOS technology, BiCMOS5PAe. The bias circuit switches the quiescent current to make the PA operate in a high or low power mode. Under a single supply voltage of ＋3.5 V, the two-stage mode-switchable power amplifier provides a PAE improvement up to 56.7% and 19.2% at an output power of 0 and 20 dBm, respec- tively, with a reduced quiescent current in the low power mode as compared to only operating the PA in the high power mode. The die size is only 1.32×1.37mm^2.     

A 2.4-GHz SiGe HBT power amplifier with bias current controlling circuit

A 2.4-GHz SiGe HBT power amplifier (PA) with a novel bias current controlling circuit has been realized in IBM 0.35-μm SiGe BiCMOS technology, BiCMOS5PAe. The bias circuit switches the quiescent current to make the PA operate in a high or low power mode. Under a single supply voltage of 3.5 V, the two-stage mode-switchable power amplifier provides a PAE improvement up to 56.7% and 19.2% at an output power of 0 and 20 dBm, respectively, with a reduced quiescent current in the low power mode as compared to only operating the PA in the high power mode. The die size is only 1.32 × 1.37 mm2.     

一种宽带的InGaP/GaAs HBT 再生频率分频器

A dynamic divide-by-two regenerative GaP/GaAs heterojunction bipolar transistors （HBTs） frequency divider （RFD） is presented in a 60-GHz-fT Intechnology. To achieve high operation bandwidth, active loads instead of resistor loads are incorporated into the RFD. On-wafer measurement shows that the divider is operating from 10 GHz up to at least 40 GHz, limited by the available input frequency. The maximum operation frequency of the divider is found to be much higher than fT/2 of the transistor, and also the divider has excellent input sensitivity. The divider consumes 300.85 mW from 5 V supply and occupies an area of 0.47 × 0.22 mm^2.     

高频大功率SiGe/Si HBT的设计

详细地阐述了高频大功率SiGe/Si异质结双极晶体管(HBT)设计中的一些主要问题,主要包括器件的纵向设计中发射区、基区以及收集区中掺杂浓度、形貌分布、层厚的选择以及横向布局设计中的条宽、间隔的选择等.并对这些主要参数的选择给出了一些实用的建议.     

SiGe/Si HBT异质界面与pn结界面的相对位移的影响

从模拟和实验两方面研究了SiGe/Si HBT发射结中pn结界面和SiGe/Si界面的相对位置对器件的电流增益和频率特性的影响.发现两界面偏离时器件性能会变差.尤其是当pn结位于SiGe/Si界面之前仅几十?就足以产生相当高的电子寄生势垒,严重恶化器件的性能.据此分析了基区B杂质的偏析和外扩对器件的影响以及SiGe/Si隔离层的作用.     

5-GHz SiGe HBT monolithic radio transceiver with tunable filtering

A wide-band CDMA-compliant fully integrated 5-GHz radio transceiver was realized in SiGe heterojunction-bipolar-transistor technology with on-chip tunable voltage controlled oscillator (VCO) tracking filters. It allows for wide-band modulation schemes with bandwidth up to 20 MHz. The receiver has a single-ended single-sideband noise figure of 5.9 dB, more than 40 dB on-chip image rejection, an input compression point of -22 dBm, and larger than 70 dB local-oscillator-RF isolation. The phase noise of the on-chip VCO is -100 and -128 dBc/Hz at 100 kHz and 5 MHz offset from the carrier, respectively. The transmitter output compression point is +10 dBm. An image rejection better than 40 dB throughout the VCO tracking range has been demonstrated in the transmitter with all spurious signals 40 dB below the carrier. The differential transceiver draws 125 mA in transmit mode and 45 mA in receive mode from a 3.5-V supply