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碳膜电位器端头用铜银导电浆料的研究 总被引:1,自引:1,他引:0
碳膜电位器端头一般用银导电浆料,以微细片状银粉作导电相。本文的研究工作试图以铜代替部分银,并根据碳膜电位器端头导电性及表面光泽度的要求,适当调整铜扣银含量的比例,通过大量的实验,给出了最佳条件。 相似文献
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1 概述 1.1 应用范围 自廿世纪九十年代近十年以来,随着电子计算机的应用日益普及、通信设备(如移动电话、传真机等)、音像设备(如电视机、影碟机、音响等)、网络信息的电子产品(如机顶盒、掌上电脑、网络电话)以计算机为主体,集声、光、图像为一体的新一代家电——“信息家电”、“数字化家电”的崛起。而与其相匹配的离不开印制板生产的不断更新发展。如仍使用传统的金属化孔板,其不但成本高,而要满足上述产品的配套,在印制板生产中会产生大量金属化孔及电镀中的三废污染地球环境,前途堪忧。如今已产生采用低 相似文献
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纳米银及其导电浆料的制备与研究 总被引:1,自引:0,他引:1
以聚丙烯酸铵为保护剂,水合肼或葡萄糖为还原剂,采用液相化学还原法成功制备了单分散的纳米银颗粒.利用透射电子显微镜,X射线衍射对样品的形貌和结构进行了分析.利用紫外-可见分光光度计对纳米银溶胶的粒径大小分布及其稳定性进行了分析.把制得的纳米银分散在一定量丙三醇中,涂在载玻片上并烧结,对其表面性能进行分析.研究结果表明,所制备的纳米银溶胶的稳定性较好,氨水及还原剂的种类对纳米银的粒径和形貌有重要的影响.以水合肼为还原剂制得的纳米银的平均粒径为10 nm,粒径分布在6 nm到15 nm.烧结后的纳米银的表面形状较好,具有良好的导电性,其体积电阻率约为3.5×10-5Ω·cm. 相似文献
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随着微型电子产品的蓬勃发展,传统的贵金属浆料由于成本等因素逐渐无法满足市场的需求,因此需要开发具有成本优势的新型贱金属电子浆料。铜电极浆料因为整体优势而受到广泛关注。电子浆料在印刷使用过程中对粘度、触变性等流变性能有着严格的要求,而流变性能主要由有机载体决定。通过正交试验的方法,系统地研究了有机载体中各成分的配比对铜电极浆料粘度、触变性的影响。表征了烧结后铜膜的方阻、附着力。结果表明,粘结剂乙基纤维素对铜浆性能影响最大。当蓖麻油为质量分数9%,氢化蓖麻油为2%,乙基纤维素为3%时,能得到综合性能最优的铜浆。在950℃烧结2 h后可得到方阻小于2.97 mΩ/□、附着力高于4.13 MPa的铜膜。 相似文献
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环氧树脂–银粉复合导电银浆的制备 总被引:3,自引:1,他引:2
导电油墨(导电银浆等)是以全印制电子技术制作印制电路板的关键材料。研究了以环氧树脂为连结剂、自制超细银粉为填料、聚乙二醇等材料为添加剂的复合导电银浆配方及制备方法。研究获得的最佳配方为:w(银粉)为70%~80%,其他各组分之间的质量比ζ(环氧树脂∶四氢呋喃∶固化剂∶聚乙二醇)=1.00∶(2.00~3.00)∶(0.20~0.30)∶(0.05~0.10)。在最佳配方范围内,复合导电银浆室温固化后电阻率小于100Ω/cm,有机物挥发少,对环境友好,符合实际应用要求。 相似文献
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A novel alkaline copper slurry that possesses a relatively high planarization performance is investigated under a low abrasive concentration.Based on the action mechanism of CMP,the feasibility of using one type of slurry in copper bulk elimination process and residual copper elimination process,with different process parameters,was analyzed.In addition,we investigated the regular change of abrasive concentration effect on copper and tantalum removal rate and within wafer non-uniformity(WIWNU) in CMP process.When the abrasive concentration is 3 wt%,in bulk elimination process,the copper removal rate achieves 6125 °/min,while WIWNU is 3.5%,simultaneously.In residual copper elimination process,the copper removal rate is approximately 2700°/min,while WIWNU is 2.8%.Nevertheless,the tantalum removal rate is 0 °/min,which indicates that barrier layer isn’t eliminated in residual copper elimination process.The planarization experimental results show that an excellent planarization performance is obtained with a relatively high copper removal rate in bulk elimination process.Meanwhile,after residual copper elimination process,the dishing value increased inconspicuously,in a controllable range,and the wafer surface roughness is only 0.326 nm(sq < 1 nm) after polishing.By comparison,the planarization performance and surface quality of alkaline slurry show almost no major differences with two kinds of commercial acid slurries after polishing.All experimental results are conducive to research and improvement of alkaline slurry in the future. 相似文献
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在阻挡层化学机械抛光中,实现可控的铜,钽,介质去除速率选择比是一项挑战。双氧水作为氧化剂加上BTA作为抑制剂的作用被认为是一种有效的方法。但是,由于双氧水易于分解使得含有双氧水的抛光液使用寿命短。另外,BTA对抛光后清洗带来挑战:在片子表面残留有毒的有机物和颗粒。最近,我们一直致力于研究一种不加氧化剂和BTA的阻挡层抛光液。在这些工作的基础上,本文的目的是通过实验研究抛光液中不同的组分(包括硅溶胶,FA/O螯合剂,溶液PH,硝酸)胍)对铜,钽,介质去除速率的影响来讨论配置这种新型的不加BTA和氧化剂的阻挡层抛光液的机理。相关可能的抛光机也会在本论文中提出。 相似文献
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This work investigates the static corrosion and removal rates of copper as functions of H202 and FA/OIIconcentration, and uses DC electrochemical measurements such as open circuit potential (OCP), Tafel ana- lysis, as well as cyclic voltammetry (CV) to study HaOa and FA/OIIdependent surface reactions of Cu coupon electrode in alkaline slurry without an inhibitor. An atomic force microscopy (AFM) technique is also used to measure the surface roughness and surface morphology of copper in static corrosion and polishing conditions. It is shown that 0.5 vol.% H202 should be the primary choice to achieve high material removal rate. The electro- chemical results reveal that the addition of FA/O II can dissolve partial oxide film to accelerate the electrochemical anodic reactions and make the oxide layer porous, so that the structurally weak oxide film can be easily removed by mechanical abrasion. The variation of surface roughness and morphology of copper under static conditions is consistent with and provides further support for the reaction mechanisms proposed in the context of DC electro- chemical measurements. In addition, in the presence of H202, 3 vol.% FA/O II may be significantly effective from a surface roughness perspective to obtain a relatively flat copper surface in chemical mechanical planarization (CMP) process. 相似文献
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为了生态环境和人们身体健康,研究和开发酸性蚀刻液再生利用方法及设备,实现清洁生产,已成为印制线路板行业污染防治工作的重点。文章介绍了一种酸性蚀刻液再生利用的新方法:采用膜电解技术,硫酸作为阳极液,蚀刻废液作为阴极液,将蚀刻废液中的铜离子沉积在阴极板上形成致密的铜板,铜离子浓度降低至1g/L,氢离子浓度上升至3.6m01/L,提铜后的蚀刻废液可当盐酸回用于酸性蚀刻液的配制中。实验结果表明:阴极液铜离子浓度为(15~5)g/L,电流密度为4.16A/dm^2为该电解工艺的最佳参数,能得到纯度高于99%的铜板,并达到80%以上的电流效率,而酸度对该电解工艺影响不大。 相似文献
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The planarization mechanism of alkaline copper slurry is studied in the chemical mechanical polishing (CMP) process from the perspective of chemical mechanical kinetics.Different from the international dominant acidic copper slurry,the copper slurry used in this research adopted the way of alkaline technology based on complexation. According to the passivation property of copper in alkaline conditions,the protection of copper film at the concave position on a copper pattern wafer surface can be achieved without the corrosion inhibitors such as benzotriazole(BTA),by which the problems caused by BTA can be avoided.Through the experiments and theories research,the chemical mechanical kinetics theory of copper removal in alkaline CMP conditions was proposed. Based on the chemical mechanical kinetics theory,the planarization mechanism of alkaline copper slurry was established. In alkaline CMP conditions,the complexation reaction between chelating agent and copper ions needs to break through the reaction barrier.The kinetic energy at the concave position should be lower than the complexation reaction barrier,which is the key to achieve planarization. 相似文献