Ti和Cu对C/Al复合材料界面反应的影响

在文献[1]所建立的C/Al复合材料界面反应动力学的基础上,利用扫描俄歇微探针深度分析测量了不同退火工艺的模拟C/Al-Ti和C/Al-Cu样品界面反应层的厚度,求得相应的界面反应激活能,并确定了界面反应从慢到快的顺序为C/Al-Ti、C/Al-Cu和C/Al。     

热处理对热等静压Sip/Al-Cu复合材料显微组织和力学性能的影响

采用元素粉作为原料,通过热等静压技术(HIP)制备出50％ SiP/Al-Cu和70％SiP/Al-Cu(体积分数)复合材料,研究固溶处理和峰值时效处理对复合材料显微组织、Al2Cu相溶解过程及力学性能的影响.结果表明:热等静压技术制备的SiP/Al-Cu复合材料完全致密,组织均匀细小,材料由Si相、Al相和Al2 Cu组成,白色Al2Cu相产生于原始的Cu粉与Al粉界面处.在516℃固溶处理2h后,70％ SiP/Al-Cu复合材料中的Al2Cu相全部溶入Al基体中,而50％ SiP/Al-Cu复合材料中还残留少量Al2Cu相.经过峰值时效处理后,50％ SiP/Al-Cu和70％ SiP/Al-Cu复合材料的抗弯强度为548 MPa和404 MPa,相对于热等静压态分别提高了38.81％和13.51％,复合材料的强度显著增强.     

热处理对热等静压SiP/Al-Cu复合材料显微组织和力学性能的影响

采用元素粉作为原料, 通过热等静压技术(HIP)制备出50%Si_P/Al-Cu和70%Si_P/Al-Cu(体积分数)复合材料, 研究固溶处理和峰值时效处理对复合材料显微组织、 Al₂Cu相溶解过程及力学性能的影响。结果表明: 热等静压技术制备的Si_P/Al-Cu复合材料完全致密, 组织均匀细小, 材料由Si相、 Al相和Al₂Cu组成, 白色Al₂Cu相产生于原始的Cu粉与Al粉界面处。在516 ℃固溶处理2 h后, 70%Si_P/Al-Cu复合材料中的Al₂Cu相全部溶入Al基体中, 而50%Si_P/Al-Cu复合材料中还残留少量Al₂Cu相。经过峰值时效处理后, 50%Si_P/Al-Cu和70%Si_P/Al-Cu复合材料的抗弯强度为548 MPa和404 MPa, 相对于热等静压态分别提高了38.81%和13.51%, 复合材料的强度显著增强。     

B4C/Al复合材料的研究进展及展望

综述了国内外B4C/Al复合材料的制备过程、反应产物、结构及主要性能.指出B4C/Al复合材料的主要反应产物为B4C、Al、Al4BC(Al3BC)、AlB24C4、AlB2、Al3B48C2及Al4C3,并讨论了B4C/Al复合材料界面反应产物对材料性能的影响和解决途径.同时指出B4C/Al梯度复合材料必将成为研究的发展方向.     

低压铸造-轧制法快速制备Al-Cu复合材料

采用低压铸造-轧制法实现了快速制备650mm×30mm×7mm×R3.5mm的Al/Cu复合材料,并通过SEM、EDS、XRD和电子万能试验机(AG-X)表征其结构和界面剪切强度。结果表明:在Cu管预热温度200℃,轧制压下率30%,冷却水通量400L/h,Al液温度680~740℃条件下均可实现Al-Cu之间的冶金结合,界面合金层随着Al液温度的升高而变宽;复合材料的导电性能和界面结合剪切强度受界面金属间化合物层宽度的影响,其宽度越宽,剪切强度降低。低压铸造法制备Al-Cu复合材料工艺流程短,一次成形快,并能对界面物相进行有效调控。     

组元配比对球磨固态燃烧式反应和扩散型反应的影响

采用搅拌式高能球磨机研究了不同铝含量的Al/CuO球磨固态燃烧反应和Al-Cu及Al-Cu-Al2O3扩散型反应。结果表明：理想配比的Al/CuO的反应孕育期最短,偏离这一配比,孕育期延长,反应由整体燃烧式逐渐过渡到渐进燃烧式完成;球磨强度扩大以燃烧式进行的组元配比范围;当铝含量超过理想配比中的比例,随Al含量增加,反应由单一的还原反应向还原＋合成复合反应模式转化,反应产物为平衡组织,依次为Cu Al2O3、CuoAl4 Al2O3、CuAl2 Al2O3、Al(Cu) Al2O3;而球磨Al-Cu和Al-Cu-Al2O3体系的反应以扩散方式进行,产物是非平衡组织。     

Al-Ti纤维增强Mg合金复合材料的制备及其微观组织

本文采用粉末冶金工艺制备出了一种新的Al-Ti纤维增强Mg合金复合材料,经光学显微镜、扫描电子显微镜和X射线衍射分析,表明Al-Ti纤维在Mg合金基体中分布均匀,制备过程中没有被损伤.纤维/基体界面上有不连续的颗粒状Mg17Al12析出,此析出相直径小于1.5μm,且数量很少.     

SiC颗粒增强铝基复合材料的纯铜中间层液相扩散焊

采用Cu箔中间层在Ar气氛保护、550℃条件下过渡液相扩散焊(TLP)焊接SiC颗粒(SiC_P)增强Al基复合材料SiC_P/ZL101和SiC_P/Al (SiC_P 10vol%),对母材与焊接接头的微观组织、剪切强度、焊接接头剪切断面与断裂路径等进行分析。结果表明:在铸Al(ZL101)与纯Al(Al)基体中,分别通过共晶温度较低的Al-Si-Cu(524℃)三元共晶反应与Al-Cu(548℃)二元共晶反应实现中间层金属/基体金属(M/M)界面润湿。其中铸Al基体焊接接头中虽有颗粒偏聚,但由于Al-Si-Cu三元共晶反应的Cu含量(26.7wt%)低于Al-Cu二元共晶反应的Cu含量(33wt%),SiC_P/ZL101焊接接头焊缝中CuAl₂相少于SiC_P/Al焊接接头焊缝中的CuAl₂相,且未出现CuAl₂相的聚集,故其强度较高。Cu中间层形成的金属间化合物CuAl₂相是影响焊接接头力学性能的重要因素,两种复合材料焊接接头的剪切强度分别为85.4 MPa和73 MPa。      

近熔态扩散新工艺制备SiC纤维增强Al基复合材料的界面分析

采用近熔态扩散新工艺制备了SiCf /Al(5A02)铝合金基复合材料,采用透射电镜(TEM)和X射线能谱 (EDX)分析了界面产物和反应机理.与采用传统固态扩散法制备的样品相对比,样品界面处没有形成脆性相Al4C3,且Al2O3被MgO取代;而固态扩散工艺制得的样品界面处发现针状或块状的Al4C3在C涂层或附着在C涂层上的Al2O3边缘形成,并向基体中生长,破坏了界面的连续性.采用近熔态扩散法制备的样品由于合金元素Mg在从半液态冷却过程中偏聚到界面附近,并与Al2O3发生反应,生成细小的MgO颗粒,阻碍了C的扩散,并抑制了脆性相Al4C3的形成,有利于对界面有害反应的控制.     

SiC-Ni 双涂层的界面反应对 C/Al 复合材料力学性能的影响

研究了不同工艺条件下具有 SiC-Ni 双涂层的碳纤维增强 Al 基复合材料的界面反应、界面结构及其对复合材料力学性能的影响,分析了不同界面条件下复合材料的典型破坏过程。实验表明:以 SiC 涂层作为界面反应阻挡层,可有效地阻止纤维与基体的反应,保证 C/Al 复合材料在界面反应很严重的情况下仍能保持较高的强度水平。初步提出了这种复合材料保持较高强度的原因和断裂机制。     

C/Al复合材料界面反应动力学

本文通过对扩散控制C/Al界面反应的理论分析和试验测量,建立了模拟复合材料界面反应的动力学方程.理论分析求解的是一组反应扩散方程;实验测量界面反应层厚度用的是扫描俄歇微探针深度剖面分析方法.实验测量的结果很好地验证了理论分析所建立的界面反应动力学方程,并给出了所用样品界面反应的激活能.      

C/Al复合材料界面反应动力学

本文通过对扩散控制C/Al界面反应的理论分析和试验测量,建立了模拟复合材料界面反应的动力学方程.理论分析求解的是一组反应扩散方程;实验测量界面反应层厚度用的是扫描俄歇微探针深度剖面分析方法.实验测量的结果很好地验证了理论分析所建立的界面反应动力学方程,并给出了所用样品界面反应的激活能.     

Ternary interfacial superstructure enabling extraordinary hydrogen evolution electrocatalysis

Realizing large-scale electrochemical hydrogen evolution in alkaline and neutral media by robust and non-noble-metal heterogeneous catalysts is highly ambitious due to the sluggish reaction kinetics at low H⁺ conditions. Herein, highly efficient hydrogen evolution reaction (HER) catalysts, comprising Ni, NiO clusters, and defective carbon, are successfully constructed via a facile and large-scale route. Multiple synchrotron radiation-based X-ray spectroscopic characterizations, combining high-resolution transmission electron microscopy measurements, indicate the formation of ternary interfacial superstructure with intimate interfacial coupling through abundant NiOC bonds. Impressively, the optimized catalyst loaded onto the usual glass carbon electrode exhibits exceptional catalytic activities with overpotentials of 64 and 76?mV to reach 10?mA?cm^?2 in 1?M KOH and 1?M phosphate buffer solution (PBS), respectively, representing one of the best non-noble-metal HER electrocatalysts to date. Insights into the metal/oxide interfacial effects through density functional theory calculations reveal that the interface sites could efficiently lower the energy barrier of the rate-determining step (RDS), contributing to the fast reaction kinetics. This work not only provides comprehensive insights into interfacial feature of highly active HER catalysts but also broadens the fundamental understanding of interfacial effects toward HER catalysis.     

Intermetallic-reinforced aluminum matrix composites produced in situ by friction stir processing

Friction stir processing (FSP) is applied to produce intermetallic-reinforced aluminum matrix composites from elemental powder mixtures of Al-Cu and Al-Ti. The intermetallic phases are identified as Al₂Cu and Al₃Ti, which are formed in situ during FSP. The volume fraction of the intermetallic phases in the in situ composites may reach as high as ∼ 0.5. The composites produced by FSP are fully dense with high strength, and the composite strength increases with the reinforcement content.     

Synergistically Designed Dual Interfaces to Enhance the Electrochemical Performance of MoO2/MoS2 in Na- and Li-Ion Batteries

It is indispensable to develop and design high capacity, high rate performance, long cycling life, and low-cost electrodes materials for lithium-ion batteries (LIBs) and sodium-ion batteries (SIBs). Herein, MoO₂/MoS₂/C, with dual heterogeneous interfaces, is designed to induce a built-in electric field, which has been proved by experiments and theoretical calculation can accelerate electrochemical reaction kinetics and generate interfacial interactions to strengthen structural stability. The carbon foam serves as a conductive frame to assist the movement of electrons/ions, as well as forms heterogeneous interfaces with MoO₂/MoS₂ through C S and C O bonds, maintaining structural integrity and enhancing electronic transport. Thanks to these unique characteristics, the MoO₂/MoS₂/C renders a significantly enhanced electrochemical performance (324 mAh g⁻¹ at 1 A g⁻¹ after 1000 cycles for SIB and 500 mAh g⁻¹ at 1 A g⁻¹ after 500 cycles for LIBs). The current work presents a simple, useful and cost-effective route to design high-quality electrodes via interfacial engineering.     

The Institute of Metals: 1987 Awards

Abstract

In the present study, an Al-Cu based metallic matrix was reinforced with graphite particles using an innovative partial liquid phase casting (rheocasting) technique. The results of microstructural characterisation studies revealed the presence of columnar-equiaxed grain morphology, afinite amount of porosity, interdendritic/intercellular Al-Cu phase, and predominantly grain boundary segregated distribution of graphite particles. Heat treatment studies conducted on rheocast composite specimens revealed accelerated ((Al-4.5Cu)/6.8C) and retarded ((Al-4.5Cu)/4.2C) aging kinetics when compared with unreinforced specimens. Ambient temperature tensile testing results, contrary to those reported by other investigators, revealed an increase in 0.2% yield stress and ultimate tensile strength of graphite reinforced specimens when compared with unreinforced specimens. The enhanced tensile properties realised by the graphite reinforced specimens are correlated with the processing influenced microstructural characteristics of these specimens.     

Electromigration testing of Ti: W/Al and Ti: W/Al-Cu film conductors

Electromigration-induced failures in metal film interconnections influence the reliability of integrated circuits. For shallow (< 1 μm) junction devices a barrier- metal interconnection system such as Ti: W/Al has been proposed to eliminate contact pitting due to silicon-aluminum reactions. The addition of copper to aluminum films is known to improve the electromigration resistance of aluminum film interconnections. Glass-passivated Ti: W/Al and Ti: W/Al-Cu (1.6 wt.% Cu) film conductors (9 μm wide, 1.14 mm long and 170 nm/800 nm thick) on oxidized silicon substrates were subjected to a current stress of 10⁶ A cm^-2 in the temperature range 150–270°C. Mean-time-to-failure data indicate an improvement of approximately a factor of two in electromigration resistance due to the addition of copper. This improvement is smaller than that reported by others. Life test data are consistent with activation energies of 0.61±0.05 and 0.71±0.03 eV for Ti: W/Al and Ti: W/Al-Cu film conductors respectively. Extrapolated mean times to failure are close to 24 and 100 a for Ti: W/Al and Ti: W/Al-Cu films respectively under a current stress of 5 × 10⁵ A cm^-2 at 55°C ambience. Projected failure rates at these operating conditions increase very rapidly with time and approach values of 9 × 10^-7 and 1 × 10^-11 h^-1 for Ti: W/Al and Ti: W/Al-Cu film conductors respectively at 100 000 h.     

Interaction Kinetics between Sn-Pb Solder Droplet and Au/Ni/Cu Pad

The interracial phenomena of the Sn-Pb solder droplet on and needle-like AuSn4 are formed at the interface after Au/Ni/Cu pad are investigated. A continuous AuSn2 the liquid state reaction （soldering）. The interracial reaction between the solder and Au layer continues during solid state aging with AuSn4 breaking off from the interface and felling into the solder. The kinetics of Au layer dissolution and diffusion into the solder during soldering and aging is analyzed to elucidate intermetallic formation mechanism at the solder/Au pad interface. The concentration of Au near the solder/pad interface is identified to increase and reach the solubility limit during the period of liquid state reaction. During solid state reaction, the thickening of Au-Sn compound is mainly controlled by element diffusion.     

纳米Fe/C复合材料的原位合成

在石油渣油中加入二茂铁，通过热缩聚反的位合成纳米级铁粒子均匀分散于炭基体中的新型复合材料，研究了在420℃热缩聚时停时间和二茂铁添加量对Fe/C形成的影响，并用TEM和XRD观测和分析了Fe/C的形态和结构，结果表明，在基体中铁粒子的粒径为25－50nm，在一定条件下，二茂铁添加量的增加和停留时间的延长均使Fe/C产率提高，停留时间对热缩聚反应的影响遵循一级反应动力学，二茂铁的添加能显著提高反应速率常数k值。