首页 | 本学科首页   官方微博 | 高级检索  
相似文献
 共查询到20条相似文献,搜索用时 15 毫秒
1.
利用0 35μm CMOS工艺实现了一种用于低中频接收机的Gilbert型下变频器.其中,混频器的输出级采用折叠级联输出,射频信号、本振信号和中频信号的频率分别为2 452GHz,2 45GHz和2MHz.测试表明:在3 3V电源电压条件下,整个混频器电路消耗的电流约为4mA,转换增益超过6dB,输入1dB压缩点约为-11dBm.  相似文献   

2.
A 2.4GHz CMOS monolithic transceiver front-end for IEEE 802.11b wireless LAN applications is presented.The receiver and transmitter are both of superheterodyne structure for good system performance.The front-end consists of five blocks:low noise amplifier,down-converter,up-converter, pre-amplifier,and LO buffer.Their input/output impedance are all on-chip matched to 50Ω except the down-converter which has open-drain outputs.The transceiver RF front-end has been implemented in a 0.18μm CMOS process.When the LNA and the down-converter are directly connected,the measured noise figure is 5.2dB,the measured available power gain 12.5dB,the input 1dB compression point -18dBm,and the third-order input intercept point -7dBm.The receiver front-end draws 13.6mA currents from the 1.8V power supply.When the up-converter and pre-amplifier are directly connected,the measured noise figure is 12.4dB,the power gain is 23.8dB,the output 1dB compression point is 15dBm,and the third-order output intercept point is 16dBm.The transmitter consumes 276mA current from the 1.8V power supply.  相似文献   

3.
Hao Mingli  Shi Yin 《半导体学报》2010,31(1):015004-015004-4
This paper presents a 2.4 GHz power amplifier (PA) designed and implemented in 0.35 μm SiGe BiCMOS technology. Instead of chip grounding through PCB vias, a metal plate with a mesa connecting ground is designed to decrease the parasitics in the PCB, improving the stability and the gain of the circuit. In addition, a low-pass network for output matching is designed to improve the linearity and power capability. At 2.4 GHz, a P_(1dB) of 15.7 dBm has been measured, and the small signal gain is 27.6 dB with S_(11) < -7 dB and S_(22) < -15 dB.  相似文献   

4.
利用0.35μm CMOS工艺实现了一种用于低中频接收机的Gilbert型下变频器.其中,混频器的输出级采用折叠级联输出,射频信号、本振信号和中频信号的频率分别为2.452GHz,2.45GHz和2MHz.测试表明:在3.3V电源电压条件下,整个混频器电路消耗的电流约为4mA,转换增益超过6dB,输入1dB压缩点约为-11dBm.  相似文献   

5.
利用0.35μm CMOS工艺实现了一种用于低中频接收机的Gilbert型下变频器.其中,混频器的输出级采用折叠级联输出,射频信号、本振信号和中频信号的频率分别为2.452GHz,2.45GHz和2MHz.测试表明:在3.3V电源电压条件下,整个混频器电路消耗的电流约为4mA,转换增益超过6dB,输入1dB压缩点约为-11dBm.  相似文献   

6.
基于Tower Jazz 0.13 μm SOI CMOS工艺,提出了一种应用于无线局域网的2.4/5.5 GHz双频段低噪声放大器(LNA)。该双频段LNA基于带源极电感的共源共栅结构,在放大管栅极与共源共栅管漏极之间增加负反馈电容,以改善5.5 GHz频段的阻抗匹配。工作频段的切换通过开关控制的电感电容匹配网络实现。SOI射频开关通过增加MOS管尺寸来减小导通时的插入损耗,并且保持较低的关断电容,使开关的引入对LNA性能的影响最小化。Cadence后仿真结果表明,在2.4 GHz频段范围内,S21为10.3~10.7 dB,NF为2.1 ~2.2 dB,IIP3为5 dBm;在5.5 GHz频段范围内,S21为9.7 ~11.8 dB,NF为2.4~2.9 dB,IIP3为14 dBm。  相似文献   

7.
提出了一种应用于无线内窥镜系统的2.4GHz低功耗ASK发射机.为了获得高的数据传输速率,采用了基于混频器的直接上变换发射机结构.为了节省功耗,提出了一种基于电流复用技术的伪差分堆栈结构的A类功放.低功耗发射机由两部分组成:基于恒幅度锁相环(PLL)的20MHz的ASK基带调制器和直接上变换的射频电路.该设计已经采用TSMC 0.25μm CMOS工艺实现并进行了验证.测试结果表明,发射数据速率为1Mbps时,发射机的输出功率为-23.217dBm.采用单2.5V的电源供电下,低功耗发射机消耗的电流约为3.17mA.  相似文献   

8.
片上系统射频功率放大器是射频前端的重要单元.通过分析和对比各类功率放大器的特点,电路采用SMIC0.35-μm CMOS工艺设计2.4 GHz WLAN全集成线性功率放大器.论文中设计的功率放大器采用不同结构的两级放大,驱动级采用共源共栅A类结构组成,输出级采用共源级大MOSFET管组成.电路采用SMIC 0.35-μ...  相似文献   

9.
景一欧  李勇  赖宗声  孙玲  景为平   《电子器件》2007,30(4):1144-1147
采用0.18 μm CMOS工艺,实现了双频段低噪声放大器设计.通过射频选择开关,电路可以分别工作在无线局域网标准802.11g规定的2.4 GHz和802.11a规定的5.2 GHz频段.该低噪声放大器为共源共栅结构,设计中采用了噪声阻抗和输入阻抗同时匹配的噪声优化技术.电路仿真结果表明:在2.4 GHz频段电路线性增益为15.4 dB,噪声系数为2.3 dB,1 dB压缩点为-12.5 dBm,IIP3为-4.7 dBm;5.2 GHz频段线性增益为12.5 dB,噪声系数为2.9 dB,1 dB压缩点为-11.3 dBm,IIP3为-5.5 dBm.  相似文献   

10.
2.9GHz 0.35μm CMOS低噪声放大器   总被引:11,自引:0,他引:11       下载免费PDF全文
陶蕤  王志功  谢婷婷  陈海涛 《电子学报》2001,29(11):1530-1532
随着特征尺寸的不断减小,深亚微米CMOS工艺其MOSFET的特征频率已经达到50Hz以上,使得利用CMOS工艺实现GHz频段的高频模拟集成电路成为可能,越来越多的射频工程师开始利用先进的CMOS工艺设计射频集成电路,本文给出了一个利用0.35μmCMOS工艺实现的2.9GHz单片低噪声放大器,放大器采用片内集成的螺旋电感实现低噪声和单片集成。在3伏电源下,工作电流为8mA,功率增益大于10dB,输入反射小于-12dB.  相似文献   

11.
This paper presents a 2.4 GHz power amplifier(PA) designed and implemented in 0.35μm SiGe BiCMOS technology.Instead of chip grounding through PCB vias,a metal plate with a mesa connecting ground is designed to decrease the parasitics in the PCB,improving the stability and the gain of the circuit.In addition,a low-pass network for output matching is designed to improve the linearity and power capability.At 2.4 GHz,a P_(1dB) of 15.7 dBm has been measured,and the small signal gain is 27.6 dB with S_(11)<-7 ...  相似文献   

12.
提出了一种应用于MEMS压力传感器的高精度Σ-Δ A/D转换器。该电路由Σ-Δ调制器和数字抽取滤波器组成。其中,Σ-Δ调制器采用3阶前馈、单环、单比特量化结构。数字抽取滤波器由级联积分梳状(CIC)滤波器、补偿滤波器和半带滤波器(HBF)组成。采用TSMC 0.35 μm CMOS工艺和Matlab模型对电路进行设计与后仿验证。结果表明,该Σ-Δ A/D转换器的过采样比为2 048,信噪比为112.3 dB,精度为18.36 位,带宽为200 Hz,输入采样频率为819.2 kHz,通带波纹系数为±0.01 dB,阻带增益衰减为120 dB,输出动态范围为110.6 dB。  相似文献   

13.
基于0.35 μm工艺设计的APS CMOS图像传感器   总被引:1,自引:0,他引:1  
介绍了一种基于CHRT公司0.35 μm工艺而设计的CMOS图像传感器.该图像传感器采用APS像素结构,像素阵列256×256,包含有列放大器、阵列扫描、串行接口、控制逻辑和ADC等模块.该图像传感器采用动态数字双采样(DDDS)的新方法消除FPN噪音,并已经通过MPW采用CHRT 0.35 μm salicide 2P4M工艺流片.  相似文献   

14.
文章采用全开关状态的延时单元和双延时路径两种电路技术设计了一种高工作频率、低相位噪声的环形振荡器.环路级数采用偶数级来获得两路相位相差90 ℃的正交输出时钟.采用TSMC 0.18 μm CMOS工艺进行流片,电压控制振荡器(VCO)的频率范围为4.9~5.5 GHz,模拟的相位噪声为-119.3 dBc/Hz@5 M,采用1.8 V电源电压,核芯电路的功耗为30 mW, 振荡器核芯面积为60 μm×60 μm.  相似文献   

15.
郝明丽  石寅 《半导体学报》2010,31(1):015004-4
本文报道了基于0.35µm SiGe BiCMOS工艺的2.4GHz功率放大器的设计。为了降低PCB上的寄生效应,提高电路稳定性和增益,设计了带台面的金属板使芯片通过台面接地而避免通过PCB过孔接地。另外,输出匹配网络中采用了低通匹配形式,提高了电路的线性度和功率输出能力。在2.4GHz,测得1dB压缩点输出功率为15.7dBm,线性增益为27.6dB,S11和S22分别低于-7dB和-15dB。  相似文献   

16.
彭苗  林敏  石寅  代伐 《半导体学报》2011,32(12):101-106
A 2.4 GHz radio frequency receiver front end with an on-chip transformer compliant with IEEE 802.11b/g standards is presented.Based on zero-IF receiver architecture,the front end comprises a variable gain common-source low noise amplifier with an on-chip transformer as its load and a high linear quadrature folded Gilbert mixer.As the load of the LNA,the on-chip transformer is optimized for lowest resistive loss and highest power gain.The whole front end draws 21 mA from 1.2 V supply,and the measured results show a double side band noise figure of 3.75 dB,-31 dBm IIP3 with 44 dB conversion gain at maximum gain setting.Implemented in 0.13μm CMOS technology,it occupies a 0.612 mm~2 die size.  相似文献   

17.
针对数据转换器的应用,设计并实现了一种高速高性能锁相环电路.该锁相环采用Chartered 0.35 μm CMOS工艺进行制作.测试结果显示,在3.3 V工作电压下,电路在200 MHz~1.2 GHz频率下能可靠地工作.电路芯片面积为0.72 mm2,功耗为30 mW.  相似文献   

18.
实现了一个基于触发器结构用0.35μm CMOS工艺实现的1∶8分频器.它由3级1∶2 分频器单元组成,其中第一级为动态分频器,决定了整个芯片的性能,第二、三级为静态分频器,在低频下能稳定工作.分频器采用源极耦合逻辑电路,并在传统的电路结构上进行改进,提高了电路的性能.测试的结果表明,芯片工作速率超过8.5GHz,工作带宽大于2GHz.电路在3.3V电源电压下工作,每个1∶2分频器单元的功耗约为11mW,面积为35μm×50μm.该芯片可应用于高速射频或光电收发机系统中.  相似文献   

19.
A low-voltage CMOS low-noise amplifier (LNA) architecture is presented. We have used a TSMC 0.35?µm CMOS high-frequency model to design a fully integrated 1?V, 5.2?GHz two-stage CMOS low-noise amplifier for RF front-end applications. No off-chip element is needed and a conventional common-source with feedback technology is used in this circuit. The first stage of the LNA is the common-source with feedback structure and the output stage is a buffer which increases the gain somewhat. An interstage negative-impedance circuit is added between the two stages of the LNA to further enhance the overall gain and thus upgrade its performance. Mainly because of the finite Q of the inductor, the negative-impedance circuit used in this interstage can cancel the losses in the first-stage inductor load. The input and output matching network is matched to approximately 50?Ω. The simulation results show that the amplifier provides a gain of 9.48?dB, a noise figure of 4.08?dB, and draws 13.4?mW from a 1?V supply. The S11 and S22 are both lower than ?15?dB.  相似文献   

20.
设计了一个基于TSMC 0.18 μm CMOS工艺的2.45 GHz全差分CMOS低噪声放大器.根据电路结构特点,采用图解法对LNA进行功耗约束下的噪声优化,以选取最优的晶体管栅宽;设计了仅消耗15 μA电流的偏置电路;采用在输入级增加电容的方法,在改善输入匹配网络特性的同时,解决了栅极电感的集成问题.仿真结果表明:LNA噪声系数为1.96 dB,功率增益S_(21)超过20 dB,输入反射系数S_(11)和输出反射系数S_(22)分别小于-30 dB和-20 dB,反向功率增益S_(12)小于-30 dB,1 dB压缩点和三阶互调输入点IIP3分别达到-17.1 dBm和-2.55 dBm,整个电路在1.8 V电源下功耗为22.4 mW.  相似文献   

设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号