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低温固化型银基浆料电性能的研究 总被引:1,自引:1,他引:0
用银粉、热固性环氧树脂、六氢苯酐和环氧改性剂制得了在180℃固化的银基浆料。研究了银粉含量、银粉比例、环氧树脂含量、硅烷偶联剂用量以及固化时间对银基浆料性能的影响。结果表明:银粉含量及形状、固化时间等均会影响浆料性能。当w(环氧树脂)为8%~10%;w(银粉)为65%~70%,ζ(片状银粉∶球状银粉)为8∶2;w(硅烷偶联剂)为6%;w(各种添加剂)为14%~22%;固化时间为15min时,浆料的体电阻率最小为2.25×10–5Ω·cm,方阻为7.03mΩ/□。 相似文献
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银粉的形状对低温固化导电银浆导电性能的影响 总被引:3,自引:0,他引:3
研究了银粉含量、形状、表面处理工艺对低温固化导电银浆导电性能的影响。结果显示,最理想的银粉质量含量在65%~70%之间。同时,鳞片状银粉和球形粉的混合体制成的浆料导电性能最佳。另外,最好的固化条件是150℃、2 h。 相似文献
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以环氧树脂为基体,银粉为填料,制备出IC封装用导电银胶。研究了环氧树脂与银粉的比例、银粉的形貌和粒径以及触变剂SiO2的用量对导电银胶触变性的影响。结果表明,银胶触变性随树脂/银粉质量比的减小而增大,当其为0.2时,触变指数达到5.68。在一定粒径范围内,银胶的触变性与银粉粒径呈反比关系;银胶触变性随SiO2的用量增大而增大。 相似文献
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纳米银粉在低温银浆中的烧结工艺研究 总被引:1,自引:0,他引:1
为了在柔性基材上获得导电性良好的导电线路,以直流电弧等离子体蒸发凝聚法制备了纳米银粉,并以其作为导电功能相制备了低温银浆,对其烧结工艺展开了研究。结果表明所制的银粉为一种球形度高、结晶性良好、不同大小纳米颗粒复合的粉体,以其制备的银浆在250~300℃烧结即可形成导电性膜层,且烧结温度越高,所得膜层方阻越低。但烧结温度较高时,需缩短烧结时间,以避免膜层剧烈收缩产生的裂纹降低膜层的导电性。所制银浆经300℃烧结30 min所得膜层的导电性最好,方阻可低至8.8 m?/□。 相似文献
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研究的银浆选用片状银粉作导电填料,其松装密度1.20~1.70g/cm~3,平均粒度<5μm,在电镜视场下显半透明状。选用改性聚甲基丙烯酸甲酯(PMMA)树脂,再加适当的交联改性剂及偶联剂等。银浆固化温度130~150℃;体积电阻率ρ_v≤1.0×10 ~4Ω·cm;在205~210℃的2Ag 36Pb 62Sn焊料中5~7s,浸焊性良好;抗剪切力>186N/cm~2。能满足引进生产线150℃固化,197~205℃、5s浸焊的要求。电容器损耗tgδ值小,如CA42型16V-22μF规格,被Ag后tgδ为1.98%,而工序标准只要求tgδ≤3.4%。代替进口银浆,已应用于生产中。 相似文献
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采用优化后的玻璃粉配制成导电银浆,与MgSiO3-CaSiO3生瓷片共烧后形成导电厚膜,探讨了不同玻璃粉配方对所制厚膜的微观结构、热学性能、附着力、线膨胀系数和导电性能的影响,研究了导电银浆与基片低温共烧的匹配性能。结果表明,SiO2-Al2O3-B2O3-CaO-Li2O系玻璃粉配制的导电银浆低温共烧后获得的导电厚膜平滑、均匀、致密;随着该系玻璃粉中Li2O含量的增加,导电银浆的线胀系数逐渐降低;Li2O的质量分数为6%时,该浆料线胀系数最低,为18.482×10–6℃–1;Li2O的质量分数为2%时,导电厚膜与基片的线膨胀匹配性良好,导电性能最好,方阻为3.02 m?/□。 相似文献
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以相关化学知识中的“银镜反应”和“电镀铜”等理论依据为切入点,建立全新的化学印制电路板断路修补模式。经过多次实验和总结,提出了一套用导电银浆作为打底导电层,用电刷镀铜为覆盖层的印制电路板铜导线断路修补路径。为企业减少了废品损失,同时减少了印制电路板生产过程中产生的固体废弃物对环境的污染。 相似文献
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There has been a steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics
manufacturing. In this paper, several anisotropic conductive adhesive (ACA) pastes were formulated, which consist of diglycidyl
ether of bisphenol F or diglycidyl ether of bisphenol A as polymer matrix, imidazoles as curing agents, and different sizes
of silver (Ag) powders or gold (Au)-coated polymer spheres as conductive particles. The effects of ACA resin and different
curing agents, as well as different conductive particles, on flexible substrate of the flip-chip joint were studied. The results
show that the size and type of different conductive particles have very limited influence on an ACA flip-chip joint. The ACA
resin as well as the curing agent can affect the reliability of the joint. The same results can be applied for the failure
analysis of ACA flip-chip technology. 相似文献
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Silver oxide pastes were formulated from silver oxide powder, silver α-neodecanoate, and solvents, which lowers the sintering
temperature of printed silver films to 150°C. In this paper, solvent effects were investigated through the formulation of
silver oxide pastes using various solvents with high boiling points such as glycol, ether, and terpineol. Solvent structures
such as terminal methyl and alkoxyl groups affected the solubility of silver α-neodecanoate and the swelling of the polydimethylsiloxane
(PDMS) blanket. Particularly, higher solubility induced uniform mixing of the silver oxide powder and silver α-neodecanoate,
which resulted in higher conductivity after sintering. Glycols and monoalkyl ethers reacted with the silver oxide or silver
salt, which deteriorated the pot life of the paste. Among the various candidates, α-terpineol satisfied all the requirements
such as printability and stability, exhibiting a solubility of 47.8 g in 100 g of solvent, PDMS swelling of 4.6%, and conductivity
of 1.8 × 105 S/cm after sintering at 150°C for 30 min. 相似文献
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An aqueous developable photoimageable silver conductor composition for high density electronic packaging 总被引:2,自引:0,他引:2
G.G. Umarji S.A. Ketkar G.J. Phatak V.D. Giramkar U.P. Mulik D.P. Amalnerkar 《Microelectronics Reliability》2005,45(12):1903-1909
In our preliminary work, we have formulated aqueous developable photoimageable thick film conductor pastes, consisting of ‘inhouse processed’ submicron sized silver powders (functional material), micron sized lead borosilicate glass frits (permanent binder), epoxy acrylate resin with pendant –COOH group (base photoimageable polymer/temporary binder/organic vehicle) and 2,2′-dimethoxy-2-phenylacetophenone (photoinitiator). The conductor pastes thus formulated were manually screen printed on the alumina substrates, dried, exposed to the ultra-violet light through the desired test patterns, developed in a 1% aqueous sodium carbonate solution, and subjected to a standard one-hour thick film firing cycle. Solid content of the polymer appears to influence the paste performance. Prima facie observations indicate that the paste with the organic:inorganic ratio of 28:72 (corresponding to solid content of 89.9% of the polymer system) exhibits better electrical conductivity, relatively smooth surface finish and line/space resolution of 100 μm with ±5 μm accuracy. Investigations related to the effect of glass content on the properties of photoimageable conductor paste are also furnished in this communication. 相似文献
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