Including dielectric loss in printed circuit models for improvedEMI/EMC predictions

The properties of printed circuit boards (PCBs) pertinent to electromagnetic interference/compatibility (EMI/EMC) are commonly studied using circuit models. This paper describes a method for improving these models by including the effects of frequency-dependent dielectric loss. The approach can be applied to discrete capacitors, microstrips, striplines, power buses, and power planes. The loss terms, which are expressible as frequency-dependent conductances shunting capacitors in the models, can be closely approximated over a wide frequency range as the real part of the driving-point admittance of a resistor-capacitor network. The method is applied to the important case of shunt loss conductance proportional to frequency, but other dielectric classes are as easily treated. An example power bus is analyzed for typical electrical responses, demonstrating the application of this approach, and showing the effect that frequency-dependent dielectric losses can have on the responses     

Reducing power bus impedance at resonance with lossy components

Power bus structures in printed circuit boards with solid power and ground planes exhibit resonances. When the power bus is resonant, the power bus impedance can increase dramatically. This paper explores the effect of component equivalent series resistance (ESR) on power bus resonances. General guidelines for selecting an optimum ESR are provided and are supported by laboratory measurements and numerical simulations.     

高电磁兼容性新型母线排的设计

提出了一种新型铜板母线排,它能减小开关电源电磁干扰的产生,提高设备电磁兼容性。分析不同形式母线排的电气特性,介绍了双层母线排的优点,给出了双层母线排的设计理论和方法。成功设计了大电流母线排,并将其应用于-30kV／50kW大功率高压开关电源,给出了应用新母线排前后的实测波形,对比实验结果表明,新型母线排杂散电感小,有效提高了高压电源的电磁兼容性。     

Matrix substitution method for power bus analysis with isolated power island in high-speed packages and PCBs

We propose a matrix substitution method for analyzing a power bus containing a power island in high-speed packages and printed circuit boards (PCBs). The method is based on a segmentation method and a resonant cavity model for a rectangular cavity, and the impedance of the power bus containing the power island can be calculated analytically. Finally, the proposed method is verified by means of impedance measurements in the frequency domain.     

基于EDA 仿真技术的综合网络设计方法

提出了基于EDA 仿真技术的综合网络多层PCB 设计方法。借助EDA 仿真技术可以快速得到射频电路性能的计算结果,同时能够对PCB 板的信号完整性、电源完整性以及电磁兼容特性做出更精确的判断。该方法对于综合网络多层PCB 板的设计具有实用意义。     

PCB design techniques for lowest-cost EMC compliance .1

Application of good EMC (electromagnetic compatibility) practices to the design of printed circuit boards (PCBs) usually helps to achieve the EMC performance required of equipment and systems at much lower cost than alternative EMC measures at higher levels of integration, such as whole-product shielding. EMC design is a complex topic, but the proven best EMC practices for generalised PCB layout can be fairly simply stated and grouped into five techniques, which interact with each other to give dramatic improvements in EMC performance. This paper discusses the techniques of circuit segregation, interface suppression and the use of ground and power planes     

提高印制电路板的抗干扰能力及电磁兼容的措施

随着电子产品趋向于小型化、智能化,电子元器件也趋向于体积更小、速度更高、集成度更大,由此带来的电磁兼容问题也日益严重.目前各类电子设备的电子元器件仍然以印制电路板(PCB)为主要装配方式.在印制电路板的电路设计阶段进行电磁兼容性设计是非常重要的,保证PCB的电磁兼容性是整个系统设计的关键.文章从元器件布局、信号走线和电源地线设计等方面,较详细地讨论了提高印制电路板的抗干扰能力及电磁兼容的措施.     

PCB design techniques for lowest-cost EMC compliance. 2

For pt.1 see ibid., vol.8, no. 4, p.185-94 (1999). Printed circuit boards (PCBs) are widely used in electronic equipment and systems. Application of good EMC (electromagnetic compatibility) practices to their design usually helps to achieve compliance with EMC regulations at much lower cost than alternative EMC measures at higher levels of integration, and also improves signal integrity. This paper discusses in detail techniques for improving the power supply of a PCB and using transmission lines     

高速通信系统 PCB 的电磁兼容性设计

文中从通信系统的信号完整性设计和电磁兼容性设计的概念讲起,重点描述了某高速通信系统的EMC设计方法。该系统基于CPU、FPGA和DDR的核心架构,有信号频率高、交换容量大、板卡EMI指标严格的设计难点。文中在系统的EMC设计过程中重点考虑了高速信号完整性和电源完整性,有效的突破了该高速PCB设计的关键技术,并搭建了测试平台对板卡的信号完整性、电磁辐射进行了全面测试。经实验证明,文中设计的系统信号完整性与电磁兼容性性能优良,充分满足了设计要求,工作稳定可靠。     

Power bus decoupling on multilayer printed circuit boards

Guidelines for the selection and placement of decoupling capacitors that work well for one-sided or two-sided printed circuit boards are not appropriate for multilayer boards with power and ground planes. Boards without internal planes take advantage of the power bus inductance to help decouple components at the higher frequencies. An effective decoupling strategy for multilayer boards must account for the low inductance and relatively high capacitance of the power bus     

Parasitic modes on printed circuit boards and their effects on EMCand signal integrity

In this paper, parasitic modes, such as slotline, parallel plane, and surface wave (SW) modes, commonly found on printed circuit boards (PCBs) are analyzed and their effects on electromagnetic compatibility (EMC) and signal integrity are discussed. The analysis is based on numerical simulations using the finite difference time domain (FDTD) method which is shown to be very well suited for rigorous modeling of parasitic mode effects. The EMC and signal integrity problems discussed include power loss, crosstalk, ground bounce, and free space radiation. Design guidelines for improved EMC and signal integrity are derived from the results obtained. Comprehensive simulation and characterization of SWs using FDTD is presented for the first time     

结合电磁带隙结构和磁性材料的PCB电源接地层设计

在印制电路板的设计中,供电系阻抗谐振所引起的噪声和电磁干扰问题一直是设计人员关注的焦点。已有的研究显示,适当的电磁带隙（EBG）结构可以有效地降低供电系的电磁干扰。本文通过运用基于快速算法和分解元法的计算机仿真,研究供电系EBG结构中采用磁性材料后的阻抗特性。研究表明,在供电系内侧增加磁性材料涂层,能在原有基础上进一步抑制电磁干扰。     

Circuit models for power bus structures on printed circuit boards using a hybrid FEM-SPICE method

Power bus structures consisting of two parallel conducting planes are widely used on high-speed printed circuit boards. In this paper, a full-wave finite-element method (FEM) method is used to analyze power bus structures, and the resulting matrix equations are converted to equivalent circuits that can be analyzed using SPICE programs. Using this method of combining FEM and SPICE, power bus structures of arbitrary shape can be modeled efficiently both in the time-domain and frequency-domain, along with the circuit components connected to the bus. Dielectric loss and losses due to the finite resistance of the power planes can also be modeled. Practical examples are presented to validate this method.     

混合动力汽车上CAN总线网络中的变频器的EMC设计

本文主要针对混合动力汽车上CAN总线的电磁环境进行分析，并重点阐述了动力系统节点的EMC设计，通过整车的联合调试试验表明，该设计能够保证CAN总线正常通信.     

Application of the cavity model to lossy power-return plane structures in printed circuit boards

Power-return plane pairs in printed circuit boards are often modeled as resonant cavities. Cavity models can be used to calculate transfer impedance parameters used to predict levels of power bus noise. Techniques for applying the cavity model to lossy printed circuit board geometries rely on a low-loss assumption in their derivations. Boards that have been designed to damp power bus resonances (e.g., boards with embedded capacitance) generally violate this low-loss assumption. This paper investigates the validity of the cavity model when applied to printed circuit board structures where the board resonances are significantly damped. Cavity modeling results for sample lossy power-return plane structures are validated using a three-dimensional full wave numerical code. A simple method is also established to check the validity of the cavity model for a power-return plane structure with imperfect conductors and lossy dielectric substrates.     

电磁兼容自适应扫描系统的研制

针对近场测试系统的市场需求及该系统在国内相关领域的研究空白,设计并实现了一款新型电磁兼容扫描系统。该系统可对PCB板、线缆、机箱等被测设备进行全局扫描、局部扫描或自适应扫描,并以三维彩色图形的形式显示被测设备的电磁辐射状态,实现电磁场＂可视化＂。提出了＂自适应扫描＂原理,设计并实现了步进长度可调整的自适应式扫描的技术方案,从而达到节省扫描时间、提高效率并降低成本的效果。     

The development of a closed-form expression for the input impedance of power-return plane structures

In multilayer printed circuit boards, the noise on the power bus is influenced by the impedance between the power and ground planes. Power-bus noise estimates require an accurate estimate of the power-bus input impedance. This paper develops a closed-form estimate of the input impedance for circular power-return plane structures. When the structure is lossy (e.g., boards employing embedded capacitance or densely populated boards), the energy reflected from the board edge does not significantly affect the input impedance. In general, the expressions developed here for circular structures can be used to estimate the impedance of lossy power-return plane structures of any shape.     

Far-field predictions from near-field measurements using an exactintegral equation solution

This paper presents a new approach to derive far-field data needed in antenna and EMI/EMC testing from near-field measurements. An exact integral equation solution to the wave propagation problem is used to transform the near-field data to the far field. The method requires near-field measurements on two closed surfaces enclosing all sources and inhomogeneities. The approach is validated with numerical simulation of measurements of fields radiated from a known antenna     

基于有限元法的高频开关电源PCB电磁兼容设计与仿真

在高频开关电源的设计中,功率开关器件在高频下的通断会产生强大的EMI,所以不可避免的会出现电磁兼容问题。这篇文章应用有限元法分别对自动布线后的高频开关电源PCB与按照电磁兼容设计规则布线后的PCB进行仿真,得到其在200 MHz、600 MHz、1 GHz频率处的近场辐射参数。仿真结果表明:自动布线生成的高频开关电源PCB近场辐射的范围和数值均较大,电磁干扰较强。根据电磁兼容的相关规则对PCB进行优化后,近场辐射的范围和数值均有所减小,提高了PCB板的电磁兼容性。     

A method for rebroadcasting signals in an optical backplane bussystem

A guided-wave optical backplane bus system intended for use in high-performance board-to-board interconnects is described. Its multiplexed polymeric holograms can implement optical signal broadcast between boards so that all boards share common optical channels. By introducing an active coupler to the doubly multiplexed hologram at the center board, signals received from any board can be rebroadcast to all other boards. We describe the design concepts for a centralized optical backplane and the resulting performance and assembly advantages over previously developed guided-wave and free-space optical backplane bus systems used for broadcasting signals. These advantages include equalized fan-out power, increased interconnect distance, and simpler fabrication