共查询到19条相似文献,搜索用时 250 毫秒
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以氧化铟锡(ITO)玻璃作为基底,采用UV-LIGA技术制作了双层微齿轮型腔模具的镶块。首先,采用正胶(RZJ-304)进行光刻,在ITO玻璃表面电镀镍掩模,通过镍掩模对第一层SU-8光刻胶进行背面曝光。再利用正面套刻的方法对第二层SU-8光刻胶进行曝光,显影得到双层微齿轮的胶模。最后,进行微电铸得到双层微齿轮型腔镶块。通过实验验证了双层微齿轮模具镶块制作的工艺流程,优化了其工艺参数,克服了底部曝光不足引起的问题,并对制作工艺过程中产生的涂胶不平整、前烘时胶层不稳定、热板加热不均以及接触式曝光破坏胶层表面等问题进行了研究。所制得的双层微齿轮胶模垂直度高,表面质量好,且套刻精度高。 相似文献
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UV-LIGA双层微齿轮加工工艺研究 总被引:1,自引:0,他引:1
利用SU-8光刻胶UV—LIGA技术制备了双层微齿轮,齿轮单层的厚度可达450μm。制备中分别采用了三种工艺路线:两次电铸、溅射种子层一次电铸和直接一次电铸,均成功地制备出了双层微齿轮,并讨论了三种工艺路线各自的适用范围,即两次电铸工艺路线适用于对机械强度要求不高的各类多层微结构器件,一次电铸工艺路线适用于对机械强度要求较高的结构,其中溅射种子层工艺适用于深宽比较小的多层微结构模具,而直接电铸工艺适用于深宽比较大且层间直径相差较小的多层微结构器件。 相似文献
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SU-8胶是一种负性、环氧树脂型、近紫外线光刻胶。它适于制作超厚、高深宽比的MEMS微结构。为电铸造出金属微结构,通常需要采用金属基底。但SU-8胶对金属基底的结合力通常不好,因而限制了其深宽比的提高。从SU-8胶与基底的浸润性、基底表面粗糙度以及基底对近光紫外光的折射特性入手,对SU-8胶与基底的结合力进行分析,首次指出:在近紫外光的折射率高的基底与SU-8胶有很好的结合性。经实验得出经过氧化处理的TI片的SU-8胶的结合性强。这有利于为MEMS提供低成本,高深宽比的金属微结构。 相似文献
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研究了一种基于紫外厚胶SU-8的亚毫米探针的加工工艺,通过溶液间的界面张力形成微球,再由深紫外光刻形成微柱。这种新技术利用紫外LIGA技术替代较为复杂昂贵的深反应离子刻蚀(DRIE)技术,使用甘油补偿紫外胶与空气之间的折射率差,使紫外光透过微球后依然可以曝光厚达几百微米SU-8胶形成微柱,并且提出原位放大接触点的对准方法,实现了微球与微柱的同轴。最终实现高深宽比的探针结构,可以作为关键部件应用于三坐标测量机。由于此工艺与传感器工艺相容,探针可以直接制作在集成了传感器的测头基底上,大幅减少了装配误差。 相似文献
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在多丝正比室(MWPC)受到严重挑战的形势下,微网气体探测器(micromegas)以其响应时间快、计数能力高的优势而从各种新型的气体探测器中脱颖而出。本文介绍了利用两种方法制作微网气体探测器微结构的工艺,一种是利用准LIGA工艺,以SU8胶为绝缘层;另一种是利用干膜做绝缘层来制作微网气体探测器。对比分析了SU8胶和干膜对于制作微网气体探测器的优劣。实验证明,利用干膜制作的微网气体探测器性能更好。使用放射源55Fe对其能量分辨本领进行了实验研究,结果利用干膜制作的微网气体探测器得到了有效增益,测出了逃逸峰。另外,还分析了使用编织丝网和电铸镍网对微网气体探测器的影响,实验证明,电铸镍网更适合于微网气体探测器的性能要求。 相似文献
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In the present study, a modified deep X-ray lithography process is utilized for an efficient fabrication of precise metallic mold insert. A bare bulk polymethylmethacrylate (PMMA) sheet is used without any substrate as an X-ray photoresist in order to achieve a stable fabrication by avoiding a generation of a secondary radiation during a deep X-ray lithography process. The patterned PMMA sheet after development is then bonded on a metallic substrate using adhesive layers. The adhesive layers on the opened region of the patterned PMMA sheet are subsequently removed by X-ray exposure of short duration time. The next procedure is an electroplating process onto the opened area in the PMMA sheet, consequently resulting in the final mold insert. In this manner, a robust metallic mold insert for a mass replication of microstructures could be realized quite efficiently. The present fabrication method is confirmed by an example with a replication of microchannels via hot embossing process. 相似文献
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本文对影响LTPS工艺中光刻胶和衬底间粘附力的4个因素进行了实验及理论分析。经实验发现:衬底的材质和粗糙度以及光刻胶中分子量的分布是影响光刻胶和衬底粘附力的最重要的两个因素。在改善粘附力方面HMDS对于电负性较强的金属衬底和光刻胶的粘附力有较好的改善效果,对于SiNX、A-Si及P-Si衬底改善效果明显,且无差异,对于ITO没有改善。光刻胶涂布后适当延长烘烤时间也可以有效改善光刻胶和衬底的粘附力。 相似文献
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Nanoelectrode lithography is a pattern duplication method that combines nanoimprint with an electrochemical reaction. The method can form an oxide pattern directly on a semiconductor or metal. This method can use flat molds with patterns defined by substances with different conductivities, while the conventional nanoimprint technique must use a mold with a relief pattern. In this paper, the mold pattern for the technique is defined with an oxide material on the surface of a conductive substrate. Nanoelectrode lithography itself can be used to form a flat mold by using a conductive mold with a relief pattern, which leaves an oxide pattern via the anodic oxidation of Si. AFM lithography also can utilize an electrochemical reaction in the air to generate an oxide pattern on a conductive substrate, which gives us a flat mold. This paper shows that both types of flat mold can transfer a pattern to a target substrate. These strategies will allow us to realize on-demand mold fabrication, mold modification, and an easy way of obtaining a mold with a finer pattern. 相似文献
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提出了一种基于光刻胶牺牲层技术的用于制作多层次SU-8模具的新方法,并进一步采用浇注成型的方法制作了聚二甲基硅氧烷(PDMS)多层次蘑菇形微结构。在多层次SU-8模具的制作过程中,使用了正性光刻胶BP212作为牺牲层,并采用超声辅助显影的方法使显影的时间大大缩短。通过对多层次SU-8模具预处理,有效减小了多层次SU-8模具与PDMS的结合力,从而提高了PDMS脱模的成功率。对制作的PDMS多层次蘑菇形微结构和PDMS单层次微柱结构进行了接触角测试。结果表明,PDMS多层次蘑菇形微结构的接触角为150.93°±1.6°,PDMS单层次微柱结构的接触角为139.19°±0.1°。由此可知PDMS多层次蘑菇形微结构具有优异的超疏水性能。 相似文献
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In recent years, roller imprinting has been considered as the most efficient technique for replicating microstructures onto polymeric substrate. However, the preparation of roller is still a challenge. This paper reports an effective method of directly fabricating microstructures on metal rollers; the process includes dip coating of the photoresist on the roller, stepped rotating lithography and electroless nickel plating. The facilities for dip coating and stepped rotating lithography have been implemented. The positive photoresist (EPG510) is first uniformly coated on the roller surface using dip coating process. The microstructures on the roller can be then defined by using stepped rotating photolithography with a glass mask, followed by electroless nickel plating. Rigid microstructured roller can be obtained. The experimental results show that the dip-coated film thickness on the roller increases with the withdrawal velocity of the roller from the resin bath. The coated photoresist on the roller surface is uniform. The microstructures have been successfully fabricated onto the metal roller using the stepped rotating lithography; the rigid nickel microstructures with various pitches on metal roller can be fabricated by adjusting the rotating degree of stepped rotating lithography. 相似文献
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