LaCrO3—NiMn2O4复合陶瓷的结构分析

将尖晶石型ＮｉＭｎ２Ｏ４及钙钛矿型ＬａＣｒＯ３这二者电阻率较高的半导体陶瓷热敏材料复合并经高温烧结后，其复合体电阻率大幅度降低。应用ＸＲＤ，ＸＰＳ，ＴＥＭ和ＳＥＭ对复合体结构进行较为系统的研究，结果表明：ＮｉＭｎ２Ｏ４与ＬａＣｒＯ３按一定比例复合后，在烧结过程中两者之间有离子迁移发生，离子迁移的结果使钙钛矿结构的ＬａＣｒＯ３转变为高导电相的Ｌａ［Ｃｒ１－ｘ－ｙＮｉｘＭｎｙ］Ｏ３（０〈ｘ〈１，０〈ｙ     

LaCrO_3－NiMn_2O_4复合陶瓷的结构分析

将尖晶石型ＮｉＭｎ＿２Ｏ＿４及钙钛矿型ＬａＣｒＣ＿３这二者电阻个较高的半导体陶瓷热敏材料复合并经高温烧结后，其复合体电阻率大幅度降低。应用ＸＲＤ，ＸＰＳ，ＴＥＭ和ＳＥＭ对复合体结构进行较为系统的研究，结果表明：ＮｉＭｎ＿２Ｏ＿４与ＬａＣｒＯ＿３按一定比例复合后，在烧结过程中两者之间有离子迁移发生，离子迁移的结果使钙钛矿结构的ＬａＣｒＯ＿３转变为高导电相的Ｌａ［Ｃｒ＿（１－ｘ－ｙ）Ｎｉ＿ｘＭＮ＿ｙ］Ｏ＿３（０＜ｙ＜０，０＜ｘ＋ｙ＜０），它使复合体电阻率大幅度降低。     

Ba^2＋改性PFN—PFW系统反应机理的研究

研究了Ｂａ＾２＋改性ＰＦＮ－ＰＦＷ系统的反应机理。对该系统中钙钛矿结构的生成机理进行了研究，ＸＲＤ分析结果证明，系统除生成复合钙钛矿相之外，还生成Ｂ位缺陷菱型焦氯石相Ｐｂ２２Ｎｂ１８Ｏ６７和极少量的Ａ位缺陷四方焦氯石相Ｐｂ３Ｎｂ４Ｏ１３，前一种焦氯石相易于向钙钛矿相转化；后一种焦氯石相始终存在，不易转化成钙钛矿相。系统没有发现理想焦氯石相Ｐｂ２Ｎｂ２Ｏ７结构。     

复合钙钛矿型Ba（Mg1／3Ta2／3）O3中B位有序结构的研究

本文讨论了复合钙钛矿型Ｂａ（Ｍｇ１／３Ｔａ２／３）Ｏ３中Ｂ位离子的有序程序同材料的介电损耗之间的关系。用Ｘ射线谱和Ｒａｍａｎ光谱研究了陶瓷烧结温度对Ｂａ（Ｍｇ１／３Ｔａ２／３）Ｏ３中Ｂ位离子的有序程度的影响，当适当提高烧结温度可增大有序程度。     

化学法制取RE—Ni—B—Al2O3复合镀层及其性能研究

提出ＲＥ－Ｎｉ－Ｂ－Ａｌ２Ｏ３化学复合镀溶液和工艺条件，以获得Ｂ４．８ｗｔ％、ＲＥ０．４５ｗｔ％、Ａｌ２Ｏ３６．２ｗｔ％的复合镀层。分析镀液中ＲＥ（稀土）、Ａｌ２Ｏ３浓度、搅拌速度、温度对镀速、复合镀层Ａｌ２Ｏ３共析量、硬度和耐磨性的影响，使用Ｘ射线衍射仪和扫描电镜观察镀层微观形貌。稀土的加入可以提高晶化温度和镀层性能。在热处理中复合镀层晶变过程为非晶态－混晶态－晶态，在３５０℃、５００℃热处理１     

AlN—BN复合陶瓷的介电性能

以ＡｌＮ－ＢＮ复合陶瓷为研究对象，着重探讨了ＡｌＮ－ＢＮ复合陶瓷的极化机理，应用基本的介电介质物理理论，结合ＡｌＮ－ＢＮ复合陶瓷组成和结构特点，研究了ＡｌＮ－ＢＮ复合陶瓷介电性能（介电常数，介电损耗角正切值）随测量温度，测量频率变化而发生变化的温度特性和频率特性。     

Ni—Al2O3复合电镀工艺

在Ｎｉ－Ａｌ２Ｏ３复合电镀研究的基础上，用扫描电镜和Ｘ射线衍射方法对复合镀层表面形貌及微观结构进行了分析，采用高温实验检测镀层的润湿性。实验表明，搅拌速度和镀液中Ａｌ２Ｏ３的含量是影响复合量的主要因素，复合镀层的结构没有显著变化。复合镀层改善了铜基体与铁水的润湿性，作为功能性镀层用于冶金行业及钢铁厂。     

BN—YAION复合陶瓷的烧结行为

对ＢＮ－ＹＡ１ＯＮ复便陶瓷进行了热压和无压烧结试验，对烧结体的密度变化和显微结构进行了研究，分析了影响ＢＮ基复合陶瓷致密化的主要因素。认为卡片房式结构是妨碍ＢＮ基复合陶瓷致密化的主要原因。热夺过程中施加的压力足够大时，可以破坏这种卡片房式结构，使片状ＢＮ定向排列，因而能获得高致密度的ＢＮ基复合陶瓷。热压过程中若有液相出现。，有利于片片ＢＮ定向排列，因而能促进ＢＮ基复合陶瓷的致密化。无压烧结时因不能     

催化剂对复合推进剂凝聚相反应热效应的影响

应用热分析方法研究了ＣｕＯ、Ｃｒ２Ｏ３、Ｃｏ２Ｏ３及其碳酸盐的煅烧产物对ＡＰ／ＨＴＰＢ复合推进剂凝聚相反应热效应的影响。试验表明,绝大多数催化剂使推进剂的分解总热效应增大,使氧化剂ＡＰ与粘结剂ＨＴＰＢ间的界面反应明显增强,煅烧ＣｕＯ与煅烧Ｃｏ２Ｏ３在混合比为１∶２和１∶３（重量）时可有效地增强粘结剂的吸热分解反应     

相转移催化法合成新树型配体—N,N′,N″—（三苄基）—三乙氨基胺和 …

报道了以相转移催化法合成一类新有机试剂－三乙氨基胺类树型配体Ｎ，Ｎ′，Ｎ″－（三苄基）－三乙氨基胺（ＴＢＡＡ）和Ｎ，Ｎ′，Ｎ″－（三苯甲酰）－三乙氨基胺（ＴＢＯＡＡ），产率８５％以上。此类化合物具有近似三角架形结构，能产生荧光，可以与稀土离子进行选择性配位。     

Ni—LDPE复合材料的研究

报道了Ni-LDPE复合材料中镍粉含量对材料的导电性及力学性能影响的研究结果。实验表明,在低密度聚乙烯中加入片状镍粉以后,随着镍粉含量的增加,导电性上升,但力学强度先上升后下降。在镍粉体积分数为8％～15％时,电阻率急剧下降,然而力学强度仍然上升,直至达最大值后才急剧下降。这说明,在此期间镍粒子之间巳能充分接近、接触,形成导电通路;但是,如果聚乙烯份量太少,镍粒子被润湿、粘结不充分时,力学强度就会恶化。总之,复合材料的结构对其导电性及力学强度同时产生强烈的影响。     

集成电路封装用GNPs/CNTs/HDPE导热高分子复合材料的研究

本文以高密度聚乙烯(HDPE)为基体,以自制的h-G-C-2/1体系杂化填料为导热填料,制备了GNPs/CNTs/HDPE导热高分子复合材料,重点对比了杂化填料和复配填料对GNPs/CNTs/HDPE复合材料在导热、导电及力学性能方面的影响。结果表明,GNPs/CNTs/HDPE导热高分子复合材料的拉伸强度为31.9 MPa,冲击强度为22.1 kJ/m^2,体积电阻率为690 MΩ·cm,热导率为0.759 W/(m·K),满足集成电路封装用技术参数要求。杂化填料的分散性优于复配填料,杂化填料在提高复合材料的拉伸性能方面优于复配填料,复配填料在提高复合材料的热导率方面优于杂化填料。本文所获得的研究成果为制备新型综合性能优异的集成电路封装用导热高分子复合材料提供了一条新的思路。     

Thermally stable conducting composites based on a carbon black‐filled polyoxadiazole matrix

New thermally stable conducting materials can be obtained by dispersing conducting carbon black into poly(4,4′‐diphenylether‐1,3,4‐oxadiazole) (POD–DPE) solution in NMP. The blend preparation process resulted in quite good dispersed composite and a relatively low percolation threshold (around 5 wt % of CB). The effect of the compressive stress on the resistivity of composite has been evaluated. The resistivity decreases continuously as the applied pressure is increased. In addition to the electrical conductivity, the presence of carbon black resulted in higher thermally stable materials. The thermal stability, electrical conductivity, and pressure‐sensible characteristics make this conducting material a good candidate for application in manufacture of pressure sensors for high temperature ambient. This material shows a typical semiconductor behavior, characterized by an increase of conductivity with the temperature. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 93: 1631–1637, 2004     

碳纳米管/有机酸复合相变材料的制备及性能

以多壁碳纳米管（MWNT）为支撑材料，十二酸（LA）、十四酸（MA）、十六酸（SA）和十八酸（PA）为相变主材，采用熔融共混法制备不同成型复合相变材料。利用压片机、红外热成像仪、导热系数测试仪和电阻率测试仪对成型材料的物理性质、温度场分布、蓄-放热时间、导热率和电阻率进行测试。结果表明，成型压力和MWNT添加量对复合材料密度影响较小。4种有机酸中分别添加24%、19%、25%和26%的MWNT时，有机酸不会泄漏。成型后虽然温度场分布更均匀，且具有良好疏水性，但蓄热速度减缓。复合材料导热率分别比纯有机酸提高2.7~3.7倍、2.7~4.5倍、2.7~4.4倍和1.7~2.4倍。压力从1MPa变到11MPa时，复合材料电阻率分别减小75.9%、76.5%、72.2%和74.0%，材料电阻率变化曲线拟合表明两者之间相关性较高。说明制备的复合相变材料具有良好的疏水、导热和导电性能。     

High Thermal Conductivity Nanocomposites Based on Conductive Polyaniline Nanowire Arrays on Boron Nitride

With the development of soft electronics, conductive composites are garnering an increasing amount of attention. The electrical conductivity, thermal conductivity, and electrical stability of conductive composites are all very important. In particular, the thermal conductivity of conductive composites is critical to the stability of their conductive properties. However, little is reported on thermal management in conductive systems. Herein, sufficiently hydroxylated boron nitride nanosheets (BN‐OH)@polyaniline (PANI) composite nanosheets with a high thermal conductivity and outstanding conductance stability are reported. PANI nanowire arrays are aligned vertically on BN‐OH. This well‐ordered nanostructure provides the means to form a good conductive and thermally conductive path. Notably, the composite through‐plane thermal conductivity is 2.1 W m^?1 K^?1(≈1000% that of pure PANI) and that the resistivity of the composite is 1.38 Ω cm. Importantly, the resistivity of the composite remains unchanged after 1 h of work. The results show that this composite has prospective applications for use in soft electronics.     

The synergistic effects on enhancing thermal conductivity and mechanical strength of hBN/CF/PE composite

In this work, a simple and novel method was applied to prepare polymer composites by taking the advantage of melt flow shear force driving orientation of the fillers. By using this method, hexagonal boron nitride/polyethylene (hBN/PE) and hexagonal boron nitride/carbon fibers/polyethylene (hBN/CF/PE) composites were fabricated to be possessed of high thermal conductivity and mechanical properties. A high thermal conductivity of 3.11 W/mK was realized in the composite containing 35 wt% hBN and 5 wt% CF, which was over 1,200% higher than that of unfilled PE matrix. Under this component, the compressive strength and modulus of hBN/CF/PE composite were determined to be 30.1 and 870.9 MPa, respectively, which were far higher than that of unfilled PE accordingly. The bending performance was also somewhat enhanced. Meanwhile, the bulk resistivity of the composite material reached 2.55 × 10¹¹ Ω·cm, which was basically the same as that of pure PE. The novel composites with high thermal conductivity, excellent mechanical properties, and controllable electrical insulation could be a potential thermal management material for electrical and electronics industries.     

Synergistic effects of carbon fillers in electrically and thermally conductive liquid crystal polymer based resins

Adding conductive carbon fillers to insulating thermoplastic resins increases composite electrical and thermal conductivity. Often, as much of a single type of carbon filler is added to achieve the desired conductivity, while still allowing the material to be molded into a bipolar plate for a fuel cell. In this study, varying amounts of three different carbons (carbon black, synthetic graphite particles, and carbon fiber) were added to Vectra A950RX Liquid Crystal Polymer. The resulting single filler composites were tested for electrical resistivity (1/electrical conductivity) and thermal conductivity. In addition, the effects of single fillers and combinations of two different carbon fillers were studied via a factorial design. The results indicated that for the composites containing only single fillers, synthetic graphite, followed by carbon fiber, cause a statistically significant decrease in composite electrical resistivity. Composites containing only synthetic graphite, followed by carbon black, and then carbon fiber cause a statistically significant increase in thermal conductivity. For the combinations of two different fillers, the composites containing carbon black/synthetic graphite and synthetic graphite/carbon fiber had a statistically significant and positive effect on thermal conductivity. It is possible that thermally conductive pathways are formed that “link” these carbon fillers, which results in increased composite thermal conductivity. POLYM. COMPOS., 2008. © 2008 Society of Plastics Engineers     

锂离子电池负极硬炭／沥青复合材料的性能研究

通过高温固相法在硬炭表面包覆沥青热解炭,制备锂离子电池负极材料。SEM测试显示,硬炭包覆上沥青热解炭后表面形貌发生了明显变化。由例得到,硬炭表面包覆的沥青热解炭的平均厚度为300nm。当硬炭表面包覆上沥青热解炭后（硬炭与沥青的质量比为2：1）,首次库仑效率由55％提高到70％,可逆容量也有所提高。研究发现,硬炭在高倍率下的容量和循环稳定性比石墨好。     

Electrical conductivity of carbon‐filled polypropylene‐based resins

Adding conductive carbon fillers to insulating thermoplastic resins increases composite electrical conductivity. Often, as much of a single type of carbon filler is added to achieve the desired conductivity and still allow the material to be molded into a bipolar plate for a fuel cell. In this study, various amounts of three different carbons (carbon black, synthetic graphite particles, and carbon nanotubes) were added to polypropylene resin. The resulting single‐filler composites were tested for electrical resistivity (1/electrical conductivity). The effects of single fillers and combinations of the different carbon fillers were studied via a factorial design. The percolation threshold was 1.4 vol % for the composites containing only carbon black, 2.1 vol % for those containing only carbon nanotubes, and 13 vol % for those containing only synthetic graphite particles. The factorial results indicate that the composites containing only single fillers (synthetic graphite followed closely by carbon nanotubes and then carbon black) caused a statistically significant decrease in composite electrical resistivity. All of the composites containing combinations of different fillers had a statistically significant effect that increased the electrical resistivity. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009