Solution processable bilayered gate dielectric towards flexible organic thin film transistors

In this study, we have successfully explored the potential of a new bilayer gate dielectric material, composed of Polystyrene (PS), Pluronic P123 Block Copolymer Surfactant (P123) composite thin film and Polyacrylonitrile (PAN) through fabrication of metal insulator metal (MIM) capacitor devices and organic thin film transistors (OTFTs). The conditions for fabrication of PAN and PS-P123 as a bilayer dielectric material are optimized before employing it further as a gate dielectric in OTFTs. Simple solution processable techniques are applied to deposit PAN and PS-P123 as a bilayer dielectric layer on Polyimide (PI) substrates. Contact angle study is further performed to explore the surface property of this bilayer polymer gate dielectric material. This new bilayer dielectric having a k value of 3.7 intermediate to that of PS-P123 composite thin film dielectric (k ∼ 2.8) and PAN dielectric (k ∼ 5.5) has successfully acted as a buffer layer by preventing the direct contact between the organic semiconducting layer and high k PAN dielectric. The OTFT devices based on α,ω-dihexylquaterthiophene (DH4T) incorporated with this bilayer dielectric, has demonstrated a hole mobility of 1.37 × 10⁻² and on/off current ratio of 10³ which is one of the good values as reported before. Several bending conditions are applied, to explore the charge carrier hopping mechanism involved in deterioration of electrical properties of these OTFTs. Additionally, the electrical performance of OTFTs, which are exposed to open atmosphere for five days, can be interestingly recovered by means of re-baking them respectively at 90 °C.     

水基前驱体法制备BST铁电薄膜的研究

Ba1-SrxTiO3(BST)薄膜具有非线性强、漏电流小、不易疲劳等特点,在高密度动态随机存储器的应用,受到x了极大关注。以水基溶液为前驱体,调整Ti(OC4H9)4与H2O的配比以改变溶胶的黏度,并采用旋涂法制备了BST铁电薄膜。对水基BST前驱体溶液进行了DSC/TG和XRD分析。实验表明,采用较高浓度的水基前驱体,有利于薄膜的形成和均匀性。薄膜的相结构研究表明,随着退火温度的上升,BST薄膜的结晶度上升,而晶粒尺寸随之略有下降。     

钙钛矿型外延薄膜中两种分解失配位错的HRTEM研究

在（001）LaAlO3上生长钙钛矿型Ba0.3Sr0.7TiO3外延薄膜近界面层,用HRTEM观察到多种新型的分解失配位错,其中两种较复杂的分解失配位错已见报道。本文介绍在该薄膜中观察到的另外两种有趣的分解失配位错。这两种失配位错都分解成两个柏格斯矢量b=（1／2）（110）的不全位错,都与（1／2）（110）层错相伴。这些不全位错对薄膜应变松弛都有贡献,其发生与Ba0.3Sr0.7TiO3薄膜的岛状成核和莫扎克生长有关。     

Photonic bandgap amorphous chalcogenide thin films with multilayered structure grown by pulsed laser deposition method

Amorphous chalcogenide thin films were fabricated by the pulsed laser deposition technique. Thereafter, the stacks of multilayered thin films for reflectors and microcavity were designed for telecommunication wavelength. The prepared multilayered thin films for reflectors show good compatibility. The microcavity structure consists of Ge25Ga5Sb10S65 (doped with Er3+) spacer layer surrounded by two 5-layer As40Se60/Ge25Sb5S70 reflectors. Scanning/transmission electron microscopy results show good periodicity, great adherence and smooth interfaces between the alternating dielectric layers, which confirms a suitable compatibility between different materials. The results demonstrate that the chalcogenides can be used for preparing vertical Bragg reflectors and microcavity with high quality.     

脉冲激光沉积低内应力多层类金刚石膜

为解决类金刚石膜内应力极大的问题,利用很薄的岛状结构锗层与较厚的类金刚石层循环,设计并制备了具有低内应力的多层类金刚石膜。其中,类金刚石层为主要功能膜层,起到硬质保护和光学增透的作用;而锗层作为缓冲层,起到缓解纯类金刚石膜内应力过大的问题,同时由于锗层很薄,对整个膜层的机械性能和红外特性的影响很小。测试表明,制备的多层类金刚石膜内应力为2.14 GPa,比纯类金刚石膜降低了39%,通过了GJB2485-95《光学膜层通用规范》中的重摩擦测试;同时,其纳米硬度仍保持在47 GPa的高水平。该多层类金刚石膜可以作为实际应用的红外窗口保护膜。     

Low voltage copper phthalocyanine organic thin film transistors with a polymer layer as the gate insulator

Low voltage organic thin film transistors(OTFTs) were created using polymethyl-methacrylate-co g-lyciclyl-methacrylate(PMMA-GMA) as the gate dielectric.The OTFTs performed acceptably at supply voltages of about 10 V.From a densely packed copolymer brush,a leakage current as low as 2×10~(-8) A/cm~2 was obtained.From the measured capacitance-insulator frequency characteristics,a dielectric constant in the range 3.9-5.0 was obtained. By controlling the thickness of the gate dielectric,the threshold voltage ...     

基于聚合物绝缘栅的低电压有机薄膜晶体管

利用甲基丙烯酸甲酯-甲基丙烯酸环氧丙脂为栅绝缘层制备了酞箐铜有机薄膜晶体管,在电压为10V时器件具有较好的性能,栅绝缘层的漏电流密度低至2×10-8A/cm2 。测量其电容特性,该绝缘薄膜的介电常数介于3.9-5.0 。通过对绝缘层的减薄,阈值电压由 -3.5V 升至-2.0V,该酞箐铜有机薄膜晶体管可以在低电压下工作,其场效应迁移率为1.2×10-3 cm2/Vs 。     

PLD法制备高介电调谐率的纳米晶BZT薄膜

用脉冲激光沉积工艺制备了Ba(ZrxTi1-x)O3(x=0.25,0.30简称BZT25和BZT30)介电薄膜。在650℃原位退火10 min,薄膜为(111)取向柱状生长的晶粒,取向度分别为0.45和0.75。BZT25和BZT30薄膜的平均晶粒尺寸分别为50 nm和60 nm。在室温、1 MHz和3×105 V/cm条件下,BZT25的最大εr和调谐率分别达到563和65%,BZT30的最大εr和调谐率分别达到441和57%。薄膜为(111)取向生长,主要是基于薄膜与底电极Pt界面层立方相结构Pt3Ti的诱导,即(111)Pt3Ti和(111)BZT的晶格匹配。     

IGZO thin film transistors with Al2O3 gate insulators fabricated at different temperatures

Thin film transistors (TFTs) with bottom gate and staggered electrodes using atomic layer deposited Al₂O₃ as gate insulator and radio frequency sputtered In–Ga–Zn Oxide (IGZO) as channel layer are fabricated in this work. The performances of IGZO TFTs with different deposition temperature of Al₂O₃ are investigated and compared. The experiment results show that the Al₂O₃ deposition temperature play an important role in the field effect mobility, I_on/I_off ratio, sub-threshold swing and bias stability of the devices. The TFT with a 250 °C Al₂O₃ gate insulator shows the best performance; specifically, field effect mobility of 6.3 cm²/Vs, threshold voltage of 5.1 V, I_on/I_off ratio of 4×10⁷, and sub-threshold swing of 0.56 V/dec. The 250 °C Al₂O₃ insulator based device also shows a substantially smaller threshold voltage shift of 1.5 V after a 10 V gate voltage is stressed for 1 h, while the value for the 200, 300 and 350 °C Al₂O₃ insulator based devices are 2.3, 2.6, and 1.64 V, respectively.     

Thermally deposited Ag-doped CdS thin film transistors with high-k rare-earth oxide Nd2O3 as gate dielectric

The performance of thermally deposited CdS thin film transistors doped with Ag has been reported. Ag-doped CdS thin films have been prepared using chemical method. High dielectric constant rare earth oxide Nd₂O₃ has been used as gate insulator. The thin film trasistors are fabricated in coplanar electrode structure on ultrasonically cleaned glass substrates with a channel length of 50 μm. The thin film transistors exhibit a high mobility of 4.3 cm² V^?1 s^?1 and low threshold voltage of 1 V. The ON-OFF ratio of the thin film transistors is found as 10⁵. The TFTs also exhibit good transconductance and gain band-width product of 1.15 × 10^?3 mho and 71 kHz respectively.     

Electrical properties of sputtered (Ba, Sr)TiO3 thin films prepared by two-step deposition method

The influence of two-step deposition on the electrical properties of sputtered (Ba,Sr)TiO₃ thin films was investigated. BST thin films with thickness 40 nm were deposited by a simple two-step radio frequency-magnetron sputtering technique, where the BST thin film consisted of a seed layer and a main layer. The dielectric constant was strongly dependent on the thickness of seed layer, but there was no dependence on deposition temperature of the seed layer. For a 2 nm seed layer, the dielectric constants were higher by about 29% than those of single-step BST thin films due to higher crystallinity and the leakage current was nearly the same as that of a single-step sample in bias voltage from −2 to 2.5 V. However, an improvement of the dielectric constant was not observed for samples having above 4 nm thick seed layers. A 40 nm thick BST film with 2 nm thick seed layer deposited by a two-step method exhibited a SiO₂ equivalent thickness of 0.385 nm and a leakage current density of 2.74 × 10⁻⁸A/cm²at+1.5V after post-annealing under an atmosphere of flowing N₂ for 30 min at 750°C.     

Al2O3/TiO2 nanolaminate gate dielectric films with enhanced electrical performances for organic field-effect transistors

Nanolamination has entered the spotlight as a novel process for fabricating highly dense nanoscale inorganic alloy films. OFET commercialization requires, above all, excellent dielectric properties of gate dielectric layer. Here, we describe the fabrication and characterization of Al–O–Ti (AT) nanolaminate gate dielectric films using a PEALD process, and their OFET applications. The AT films exhibited a very smooth surface (R_q < 0.3 nm), a high dielectric constant (17.8), and a low leakage current (8.6 × 10⁻⁹ A/cm² at 2 MV/cm) compared to single Al₂O₃ or TiO₂ films. Importantly, a 50 nm thick AT film dramatically enhanced the value of μFET (0.96 cm²/V) on a pentacene device, and the high off-current level in a single TiO₂ film was effectively reduced. The nanolamination process removes the drawbacks inherent in each single layer so that the AT film provides excellent dielectric properties suitable for fabricating high-performance OFETs. Triethylsilylethynyl anthradithiophene (TES-ADT), a solution-processable semiconductor, was combined with the AT film in an OFET, and the electrical properties of the device were characterized. The excellent dielectric properties of the AT film render nanolamination a powerful strategy for practical OFET applications.     

Organic thin film transistors with HfO2 high-k gate dielectric grown by anodic oxidation or deposited by sol–gel

We report here on pentacene based organic field effect transistors (OFETs) with a high-k HfO₂ gate oxide. HfO₂ layers were prepared by two different methods: anodic oxidation and sol–gel. A comparison of the two processes on the electrical properties of OFETs is given. Ultra thin nanoporous (20 nm) sol–gel deposited oxide films were obtained following an annealing at 450 °C. They lead to high mobility and stable devices (μ = 0.12 cm²/V s). On the other hand, devices with anodic HfO₂ revealed a little bit more leaky and show some hysteresis. Anodization, however, presents the advantage of being a fully room temperature process, compatible with plastic substrates. Stability and response to a bias stress are also reported.     

GaAs-based metal-oxide semiconductor field-effect transistors with Al2O3 gate dielectrics grown by atomic layer deposition

We demonstrate GaAs-based, metal-oxide-semiconductor field-effect transistors (MOSFETs) with excellent performance using an Al₂O₃ gate dielectric, deposited by atomic layer deposition (ALD). This achievement is very significant because Al₂O₃ possesses highly desirable physical and electrical properties as a gate dielectric. These MOSFET devices exhibit extremely low gate-leakage current, high transconductance, and high dielectric breakdown strength. A short-circuit, current-gain, cutoff frequency (f_T) of 14 GHz and a maximum oscillation frequency (f_max) of 25.2 GHz have been achieved from a 0.65-μm gate-length device. The interface trap density (D_it) of Al₂O₃/GaAs is evaluated by the hysteresis of drain-source current, I_ds, versus gate-source bias, V_gs, and the frequency dispersion of transconductance, g_m.     

PLD生长Fe_3O_4薄膜的微结构及磁性能研究

以烧结α-Fe2O3为靶材,采用脉冲激光沉积(PLD)方法,在Si(100)基片上制备了Fe3O4薄膜。XRD分析表明,所得薄膜为立方尖晶石结构的Fe3O4,而且具有(311)和(440)择优取向;显微激光喇曼(Raman)光谱分析进一步证实薄膜中只出现单相Fe3O4;AFM分析表明,所得Fe3O4薄膜表面平整;采用VSM分析表明,Fe3O4薄膜的饱和磁化强度Ms约为170kA·m–1,而其矫顽力约为412kA·m–1。     

PLD法生长Al2O3基ZnO薄膜的特性

在不同衬底温度下,用脉冲激光沉积法(PLD),在Al2O3(0001)平面上生长了ZnO薄膜。研究了衬底温度对其结晶质量、电学性质以及发光性质的影响。结果显示:XRD在2θ为34°处出现了唯一的ZnO(0002)衍射峰;ZnO薄膜的电阻率随衬底温度的升高而增大;在衬底温度为500℃时,出现了位于410nm附近的特殊的光致发光(PL)峰。     

Effect of titanium dioxide (TiO2) seed layer on the phase composition of 0.7Pb (Mg1/3Nb2/3)O3-0.3PbTiO3 film prepared by pulsed laser deposition

Lead-magnesium niobate-lead titanate (PMN-PT) thin films with and without the TiO₂ seed layer were deposited on Pt/Ti/SiO₂/Si substrates through pulsed laser deposition. The study aimed to characterize the effect of the TiO₂ seed layer on the phase composition and properties of PMN-PT film. Without the TiO₂ seed layer, the pure perovskite phase could be obtained in the thinner PMN-PT film while with the TiO₂ seed layer, the pure perovskite phase was formed in the thicker PMN-PT film. The ferroelectric properties of PMN-PT films with the TiO₂ seed layer were exhibited. As a result, the maximum amount of remnant polarization reached the amount of 32 μC/cm² for the PMN-PT thin film with the TiO₂ seed layer.     

Dielectric properties of low loss Ba<Subscript>6−3x</Subscript>Nd<Subscript>8+2x</Subscript>Ti<Subscript>18</Subscript>O<Subscript>54</Subscript> thin films prepared by pulsed laser deposition for microwave applications

Ba_6−3xNd_8+2xTi₁₈O₅₄ with x=0.25 (BNT-0.25, or simply, BNT) dielectric thin films with a thickness of 320 nm have been prepared on Pt-coated silicon substrates by pulsed laser deposition (PLD) at the substrate temperature of 650°C in 20 Pa oxygen ambient. X-ray analysis showed that the as-deposited films are amorphous and the films remain amorphous after a postannealing at 750°C for 30 min. The dielectric constant of the BNT films has been determined to be about 80 with a low loss tan δ of about 0.006 at 1 MHz. The capacitance-voltage (C-V), capacitance-frequency, and capacitance-temperature characteristics of a BNT capacitor with Pt top electrode were measured. A low leakage-current density of 4×10⁻⁶ A/cm² at 6 V was measured, and a preliminary discussion of the leakage-current mechanism is also given. It is proposed that amorphous BNT-0.25 thin films will be a potential dielectric material for microwave applications.