掩模电镀镍微结构的镀层均匀性研究

在给定的电镀液组分下,对掩模电镀微结构的厚度均匀性及镀层横截面轮廓进行了研究,讨论了影响微结构镀层厚度均匀性的主要因素,分析了镀层横截面轮廓随电流密度的改变而变化的原因.电镀液中无添加剂时,镀层均匀性与阴极极化度及电镀边缘效应直接相关;电镀液中有添加剂时,本实验所使用添加剂所具有的并存吸附状态是影响镀层均匀性的主要因素.通过实验得到可获得良好均匀性镀层的电镀参数为:i＝(6±2)mA/cm2,t＝25℃.     

变截面梁的微电镀研究

介绍了微电镀原理和设计了微电镀平台,设计了悬臂梁的微电镀工艺流程.为了提高镍微电镀镀层的均匀性和降低镀层的内应力,以及如何解决表面积差异悬殊的镀层厚度的一致性问题,研究了不同电镀参数下的悬臂梁的电镀效果.实验结果表明,脉冲电源电镀优于直流电源电镀,且在阴极前放置细铁丝网、适当降低电流密度、增大占空比、延长电镀时间可以提高镀层厚度的一致性和镀层表面的均匀性.     

硬铬镀层厚度均匀性研究

铬镀层的硬度高,耐磨性好,而且可以在高温下工作,可以广泛地用于需要耐磨的零件和工具、量具、模具,以及修复零件的尺寸.针对硬铬镀层厚度不均匀的问题,通过对电镀铬层电导率、电流密度、槽液温度、槽液循环、电流效率等因素的研究,分析各要素对零件电镀铬层均匀性的影响,指出合理的电流密度为-3000～-6000 A/m2,电镀温度...     

电镀层均匀性的Ansys模拟与优化

尝试用Ansys有限元软件对电镀过程中电力线分布进行模拟分析.并采用一些辅助措施改进电镀模型,力求使电镀层厚度的均匀性有所提高。模拟分析发现:在阴阳极之间加上一块中间带孔的挡板,可以改善镀层的均匀性。当辅助挡板的孔径为5 cm、且离开阴极5.25 cm时,电镀层厚度的相对误差由无挡板时的41.8%降为24.3%。通过电镀试验验证模拟分析,结果两者显示出较好的一致性。     

电泳-电沉积制备纳米Al_2O_3增强镍基复合镀层中纳米颗粒的分布状态

采用电泳-电沉积技术制备了纳米Al2O3增强镍基复合镀层,并采用扫描电镜及其附带能谱仪分析了镀层中纳米颗粒的分布状态,运用正交试验法研究了电泳液中纳米颗粒含量、电泳沉积电压、电泳沉积时间以及电沉积阴极电流密度等工艺参数对复合镀层中纳米颗粒分布均匀性的影响.结果表明:电泳液中纳米颗粒含量及电沉积阴极电流密度是影响镀层中纳米颗粒分布均匀性的主要因素,而电泳沉积电压和电泳沉积时间的影响相对较小;在电泳液中A12O3纳米颗粒含量为8 g·L-1、电沉积阴极电流密度为0.5 A·dm-2时,可制得纳米颗粒均匀分布的纳米复合镀层.     

铝合金表面电沉积Ni-SiC复合镀层的研究

针对铝合金表面的电镀特点,采用化学侵锌、预镀镍等预处理方法,在铝合金表面得到了表面光洁平整,内部质量优良,与铝合金基体结合紧密的Ni-SiC复合镀层。研究了镀液中SiC浓度、电流密度、搅拌速度、镀液pH值和镀液温度等电镀参数对复合镀层厚度、镀层中的SiC体积分数及镀层显微硬度的影响。结果表明,电镀工艺条件的改变影响Ni-SiC复合镀层的共沉积速度与SiC粒子在镀层中的体积分数。当镀液SiC浓度为120g/L时,镀层中的SiC体积分数为8.5％,硬度为504.6HV,较纯铝(82.5HV)提高5倍,较纯镍(242.5.HV)提高l倍。     

镀液成分对高精度电镀金刚石工具镀层机械性能的影响

针对镀层机械性能对高精度电镀金刚石工具性能影响的问题,采用正交试验方案,对镍钴合金镀液的主要镀液成分硫酸镍、硫酸钴和氯化钠等进行了试验研究,用极差法对试验结果进行处理,分析了硫酸镍、硫酸钴、氯化钠的浓度对镀层抗拉强度和硬度的影响规律。镀液成分各因素对镍钴合金镀层的抗拉强度影响的主次顺序为:硫酸镍氯化钠硫酸钴;镀液成分各因素对镍钴合金镀层的硬度影响的主次顺序为:硫酸钴硫酸镍氯化钠。综合抗拉强度和硬度最优镀液配方为:硫酸镍270g/L、硫酸钴20g/L、氯化钠10g/L,硼酸30g/L,添加剂。     

耳片铆接孔镀前铰刀和塞规的设计

为了防止黑色金属零件的锈蚀，经常采用电镀一层金属或发蓝来进行表面处理。常用的电镀方法有镀锌、镀镉和镀铬。表面处理后，可以提高零件的使用寿命并使外形美观。 图1是我厂生产的耳片的产品图样，它的2×φ6H11（07500.+）mm是要求镀后达到的尺寸。该零件的表面处理为镀锌，镀层厚度为5~12μm。要达到镀后φ6H11 mm的要求，就必须预留出镀层厚度，这样在镀后才可达到图样的尺寸要求。按照图样的最大极限尺寸镀最薄的镀层厚度、最小极限尺寸镀最厚的镀层厚度的原则，这个零件两孔的镀前尺寸应为： 最大极限尺寸=6.075+0.005×2=6.085 mm…     

碳纳米管/镍复合镀层硬度研究

在瓦特镀镍溶液中加入碳纳米管,研究球磨处理、搅拌分散形式、分散剂对碳纳米管在镀液中均匀稳定分散的影响,采用恒电流电沉积工艺制备了碳纳米管／镍复合镀层。结果表明：碳纳米管球磨后加入到镀液中,并通过超声分散,可以得到稳定的复合电镀液;碳纳米管与镍能很好地共沉积。当阴极电流密度为2．5A／dm^2、镀液温度为45℃、碳纳米管加入量为0．8～1．2g／L时镀层显微硬度达到最大值。     

镍铁合金电镀工艺存在的问题及解决方法

镍铁合金电镀工艺近年来有较大发展,并得到了广泛的实际应用。实践证明,镀层为含铁20～45％的光亮镍铁合金,其性能与亮镍镀层相同,甚至更好;尤其是用铜或黄铜打底,含铁量为20～45％的合金镀层,厚度小于12.7微米(如2.54微米)时,其效果比用同样厚度的亮镍镀层更好。为了节约更多的金属镍,目前各国都在努力研究把镍铁合金镀层中的铁含量提高到最大值。国内最近的研究成果表明,在以镍铁合金电镀液为基的复合电镀工艺中     

Corrosive Wear and Mechanical Properties of Ni/Al2O3 Micro- and Nanoparticulates-Reinforced Coatings on Ti-6Al-4V Alloy

Nanocomposite coatings can endow a plated surface with various properties such as wear resistance, high-temperature corrosion protection, oxidation resistance, and self-lubrication. This work studies the corrosion and corrosive wear resistance of electroplated nickel nanocomposite coatings on Ti-6Al-4V alloy in a Hank's solution, adding various concentrations of an Al₂O₃ powder in plating solution, with particle diameters of 20–30 nm and 1 μm for comparisons. The experimental results showed that the content of Al₂O₃ incorporated into the electroplated nickel composite coating increased with the concentration of Al₂O₃ powder in the electroplating solution, and increasing the surface hardness, corrosion, and corrosive wear resistance of electroplated nickel micro- and nanocomposite coatings caused smearing of the nodule boundary and elimination of voids in the deposits. The Al₂O₃ nanoparticulates were embedded and distributed more uniformly than the Al₂O₃ microparticulates in the nickel matrix after a heat treatment of 400°C, producing a more continuous and dense coated composite layer on the Ti-6Al-4V substrate. This phenomenon is responsible for the Ni/Al₂O₃ composite coating with superior surface hardness, providing high corrosion resistance and corrosive wear protection to the Ti-6Al-4V alloy substrate in Hank's solution.     

电镀金刚石线锯的制造工艺研究

利用复合电镀法,以直径φ0．3mm的琴钢丝为基体,选取400。的金刚石作为磨料,选用瓦特型镀液,采用埋砂法制造金刚石线锯。利用显微镜测试了镀层厚度,利用体视显微镜观察了线锯形貌。结果表明,上砂电流密度在2．0A／dm2,上砂时间20min时能够获得金刚石磨粒分布均匀、与基体结合力好的金刚石线锯;给出了本实验条件下制造电镀金刚石线锯的最佳电镀工艺参数。     

用表面活化技术提高金刚石与镀层的结合性能

分别用活化处理和未活化处理的金刚石磨粒制备了电镀金刚石工具,通过扫描电子显微镜观察金刚石与镀层的结合状况。对氧化铝陶瓷材料进行钻削加工,对比电镀金刚石钻头在耐用度期间的陶瓷材料去除体积。结果表明,经活化处理的金刚石表面沉积分散的钯质点,工具电镀过程中,在金刚石与镀层间的结合面上形成分散的连接点。应用表面活化技术制作电镀金刚石工具,可使金刚石与镀层形成牢固连接,改善镀层与金刚石的结合性能,其氧化铝陶瓷材料去除体积是未经活化处理金刚石电镀钻头的1.5倍,明显提高了电镀金刚石工具的磨削性能和使用寿命。     

多晶硅微构件拉伸破坏特性的测量

硅表面工艺是微型机械制造的重要工艺,而多晶硅是表面工艺中最常用的主要材料,它的力学特性直接关系到微型电子机械系统的可靠性和使用寿命,因此对其破坏特性的研究是非常有必要的。本文在概述了国外对体硅工艺和表面工艺制作的构件材料破坏特性研究情况的基础上,提出了利用旋转台对表面工艺制作的多晶硅微梁进行拉伸破坏实验的方法,并在制作的测量系统上进行了实验,得出多晶硅微梁的拉伸破坏强度大于2．0GPa。     

The fretting fatigue behaviour of mild steel with electrodeposited nickel and Ni-Co alloys with controlled internal stresses

Mild steel specimens electroplated with nickel and with Ni-Co alloys were tested under conditions of fretting fatigue. A nickel electrodeposit 25 μm thick with an internal compressive stress of 61.8 MN m^?2 and with a hardness of 355 HV₃₀ produced the best result; an improvement of 58.5% was observed in the fretting fatigue limit. All the electrodeposits were prepared from a concentrated nickel or Ni-Co sulphamate electrolyte.     

Sensitivity analysis of plating conditions on mechanical properties of thin film for MEMS applications

In this paper, we report the detailed investigation into the effects of plating temperature and applied current density upon the mechanical properties of plated nickel film such as Young’s modulus and residual stresses. This method uses the resonance method of atomic force microscope, which does not require specially microfabricated cantilevers and additional experimental set-up. Thin layers of nickel are electroplated onto the tip surface of AFM cantilevers and plating thicknesses were measured at the end of each plating step. The self-deformation of the released AFM cantilever is also measured as a function of the plated nickel thickness, which is converted into the quantitative residual stress by appropriate mechanics. The measured Young’s modulus is as high as that of bulk nickel at low plating temperature and at low applied current density, but drastically drops at high temperature or current density. The dependence of Young’s modulus on the plating thickness is negligible in thin film less than few microns. The residual stress is also a strong function of the process conditions, and decreased with the elevation of the current density and plating temperature. And the intrinsic and extrinsic stresses of plated nickel are separated from the measured residual stress, and correlated with plating conditions. Dependence of the plated thickness on Young’s modulus and residual stress is also considered.     

Mechanical and tribological properties of vapour deposited low friction coatings on Ni plated substrates

Soft steel and aluminium substrates with load-carrying layers of electroplated nickel were coated with commercially available low friction vapour deposited coatings. The mechanical and tribological properties of the coating and substrate composites were evaluated with special emphasis on the influence of the nickel layer. Two different thicknesses of the intermediate load-carrying nickel layer were tested. The samples were evaluated regarding friction and sliding wear, abrasive wear, hardness and elastic modulus, morphology and coating thickness and adhesion between substrate and coating. It was found that all the evaluated low friction coatings were possible to be successfully deposited on the intermediate nickel layer. A relatively thick intermediate nickel layer is a promising candidate for improvement of the load-carrying capacity.     

High-speed dicing of silicon wafers conducted using ultrathin blades

High-speed dicing tests were conducted for silicon wafers using developed ultrathin electroplated diamond blades with metal bond. Chipping and kerf widths of 1.5 and 28 μm, respectively, are achieved by the developed ultrathin diamond blades. The calculated maximum undeformed chip thickness varied from 9.6 to 25.5 nm for various high-speed dicing conditions. The variation tendency between experimental chip width induced by three diamond blades and corresponding calculated maximum undeformed chip thickness is consistent. Scanning electron microscopy showed that the microstructure of diamond dicing blades significantly affected the chip width.     

电沉积纳米镍薄板的超塑微拉深性能

采用脉冲电沉积工艺制备了厚度为0．1mm的纳米镍薄板，在不同的温度和应变速率下对该薄板进行单向拉伸试验，确定了其超塑性变形的最佳工艺条件，在此基础上进行了纳米镍薄板的微拉深性能实验。实验结果表明：纳米镍薄板的微拉深性能随成形温度的升高而提高；在温度为723K、半球形拉深凸模直径为1mm、拉深速度为1～5mm／min的条件下，均可成功拉深出半球件。采用透射电镜和扫描电镜对拉深变形前的沉积态组织和拉深变形后的微观组织进行了观察比较，结果表明，微拉深后大部分镍晶粒长大到微米量级。根据实验结果，初步探讨了超塑微拉深的主要变形机制。     

电镀超硬磨料工艺的改进及参数优化

电镀磨料法是制造超硬磨料工具的常用方法,电镀质量直接影响到电镀超硬磨料工具的寿命和使用性能,而电镀工艺是影响电镀质量的主要因素.文中首先对原有的电镀基础工艺中镀前处理及镀底镍工序进行了改进,提出了镀前处理中增加去毛刺、电化学除油、阳极处理等过程及镀底镍工序中带电入槽和冲击电流的一套新的电镀工艺,并进行了实验研究,结果表明:新的工艺增强了镀层的结合力,提高了电镀质量;其次实验研究了电镀液配方及电流密度、镀液温度、PH值等工艺参数对电镀质量的影响,并得到了优化结果.