氮化镓功率器件小信号模型参数提取算法研究

针对氮化镓高电子迁移率晶体管(GaN High Electron Mobility Transistor,GaN HEMT)小信号等效电路模型参数提取和优化过程中存在的误差累计问题,基于GaN HEMT 19元件小信号模型,提出了一种扫参与迭代相结合的参数提取算法.该算法在迭代过程中,每次使用比前一次更准确的元件值进行计算,可使结果趋向最优解.通过Mat-lab编程实现后计算结果表明,仿真与实测S参数在0.1～40 GHz频率范围内吻合良好.     

AlGaN/GaN HEMT器件小信号等效电路参数值的提取

利用国际通用的ColdFET以及宽带小信号提取方法对AlGaN/GaN HEMT器件进行小信号参数的提取,用仿真软件ADS(advanced design system)建立HEMT小信号等效电路模型,并对参数值进行优化.可快速提取器件的小信号参数并给予工艺一些反馈和指导.     

AlGaN/GaN HEMT器件小信号等效电路参数值的提取

利用国际通用的ColdFET以及宽带小信号提取方法对AlGaN/GaN HEMT器件进行小信号参数的提取,用仿真软件ADS(advanced design system)建立HEMT小信号等效电路模型,并对参数值进行优化.可快速提取器件的小信号参数并给予工艺一些反馈和指导.     

GaN HEMT器件22元件小信号模型

采用了新型的包含22元件的GaN HEMT小信号模型,通过增加与栅源电容Cgs和栅漏电容Cgd并联的电导Ggsf和Ggdf来表征GaN HEMT栅漏电情况.结果表明22元件小信号模型拟合度提高,物理意义更为明确.同时重点改进了寄生电容参数的提取方法,可有效地提取新型栅场板、源场板器件小信号参数.由算法提取的参数值可准确反映GaN HEMT器件的物理特性.     

GaN HEMT器件22元件小信号模型

采用了新型的包含22元件的GaN HEMT小信号模型,通过增加与栅源电容Cgs和栅漏电容Cgd并联的电导Ggsf和Ggdf来表征GaN HEMT栅漏电情况.结果表明22元件小信号模型拟合度提高,物理意义更为明确.同时重点改进了寄生电容参数的提取方法,可有效地提取新型栅场板、源场板器件小信号参数.由算法提取的参数值可准确反映GaN HEMT器件的物理特性.     

AlGaN/GaN HEMT小信号模型参数提取算法

本文采用了新型的22元件AlGaN/GaN HEMT小信号等效电路模型,较传统的模型,增加了栅漏电导Ggdf和栅源电导Ggsf来表征GaN HEMT的栅极泄漏电流。同时针对新型的栅场板、源场板结构器件,提出了一种改进的寄生电容参数提取方法,使之适用于提取非对称器件的小信号模型参数。为验证此模型,获得了S参数的测试结果和模型仿真结果,此二者的吻合度较高,表明新型的22元件小信号模型精确、稳定而且物理意义明确。     

HBT小信号等效电路参数解析提取

提出一种求解异质结双极晶体管(HBT)小信号等效电路模型的解析方法。在提取过程中,采用集电极开路测量和直流测量相结合的方法,精确提取到了具有物理意义的唯一的外部串联电阻值,并在精确提取非本征参数的基础上,直接提取本征参数。较大频率范围S参数的计算值与测量值有很好的吻合。     

用改进的差分进化算法提取HEMT小信号模型的参数

高电子迁移率晶体管(HEMT)以其噪声低和频带宽等特点在微波毫米波领域得到了广泛的应用,本文在传统优化方法的基础上,对差分进化算法进行了改进,并基于该算法对HEMT小信号等效电路模型进行了模型参数提取。实验结果表明,2×20μm GaAs HEMT器件S参数模拟结果和测试结果在40 GHz频率范围内吻合很好,误差在2%以内。     

一种InP HEMT分布小信号模型建模方法

提出了一种用于InP高电子迁移率晶体管（high electron mobility transistor,HEMT）的分布式小信号等效电路建模方法。在采用的模型中考虑了分布电容效应,通过加入三个分布电容来表征。为了精确建模,在提取寄生电容时考虑到寄生电感引入的误差,首先提取了寄生电感。在达到50 GHz的InP HEMT中,小信号建模方法的有效性得到了验证。此外,在2～50 GHz频率范围内,S参数建模误差小于4%,这也证明了所提出建模方法的高建模精度。     

用改进的遗传算法提取PIN光探测器模型参数

光探测器是光电集成电路接收机的重要组成部分,成功提取光电探测器等效模型电路的参数将会对光电集成的研究起到重要作用.将改进的遗传算法用于PIN光探测器小信号等效电路模型参数的提取和优化中,实现PIN光探测器S21、S22参数的测量值与模拟值拟合.改进后的遗传算法自动优化了遗传、杂交和变异算子,节省了寻找最佳遗传、杂交和变异概率的时间,提高了参数提取的速度.     

Power performance and scalability of AlGaN/GaN power MODFETs

The scalability of power performance of AlGaN/GaN MODFETs with large gate periphery, as necessary for microwave power devices, is addressed in this paper. High-frequency large-signal characteristics of AlGaN/GaN MODFETs measured at 8 GHz are reported for devices with gatewidths from 200 μm to 1 mm. 1-dB gain compression occurred at input power levels varying from -1 to +10 dBm as the gatewidth increased, while gain remained almost constant at -17 dB. Output power density was ~1 W/mm for all devices and maximum output power (29.9 dBm) occurred in devices with 1-mm gates, while power-added efficiency remained almost constant at ~30%. The large-signal characteristics were compared with those obtained by dc and small-signal S-parameters measurements. The results illustrate a notable scalability of AlGaN/GaN MODFET power characteristics and demonstrate their excellent potential for power applications     

一种AlGaN/GaN HEMT非线性器件模型参数提取的方法

该文提出一种新的绝对误差函数,应用该函数进行非线性模型参数提取可以避免计算误差,显著降低参数提取的不准确性。由于氮化物半导体器件,尤其是AlGaN/GaN HEMT器件已经开始得到广泛应用,其模型和参数对射频和电力电子器件和电路设计至关重要,分别使用3种误差函数对 AlGaN/GaN HEMT器件模型进行了参数提取并对比,对比结果表明该文提出的误差函数更加精确和有效。同时为今后的电子器件的模型参数提取提供了一种有效且精确的方法。     

Low-Frequency Noise Characteristics in Ion-Implanted GaN-Based HEMTs

Low-frequency noise characteristics in ion-implanted GaN/AlGaN/GaN and AlGaN/GaN HEMTs were investigated. The normalized spectral noise density was about 6 dB lower in GaN/AlGaN/GaN HEMTs than in AlGaN/GaN HEMTs. The normalized spectral noise density dependence on the gate length Lg indicates that the main origin of low-frequency noise is at the region under the gate in both devices. The Hooge parameters alphaH for both devices are on the order of 10^-1-10^{- 2}. The ion implantation process introduces a lot of defects in the source/drain regions, but the values of alphaH are comparable with those for conventional GaN-based HEMT devices. The values of alphaH are also lower in GaN/AlGaN/GaN HEMTs than in AlGaN/GaN HEMTs, which is due to the decrease of surface potential fluctuations in GaN/AlGaN/GaN HEMTs.     

AlGaN/GaN界面特性研究进展

GaN是一种宽禁带半导体材料,由于具有优越的热稳定性和化学稳定性,使这种材料和与其相关的器件可以工作在高温和恶劣的环境中,并可用于大功率微波器件。本文主要介绍AlGaN/GaN有关界面特性,该特性反映了纵向纳米尺度下的能带特性;从AlGaN/GaNHEMT设计出发,给出了材料性质和结构参数对AlGaN/GaN异质结二维电子气特性影响的研究结果;讨论了AlGaN/GaN界面2DEG载流子的输运性质;分析了材料缺陷对AlGaN/GaN界面2DEG性质的影响;指出了有待研究的问题和方向。     

AlGaN/GaN高电子迁移率晶体管大信号I-V特性模型

对非线性电流源Ids(Vgs,Vds)的准确描述是Al GaN/GaN HEMT大信号模型的最重要部分之一.Materka模型考虑了夹断电压与Vds的关系,其模型参数只有三个,但是Ids与Vgs的平方关系不符合实际,计算结果与测量数据有误差.我们在考虑了栅电压与漏电流的关系及不同栅压区漏电流随漏电压斜率改变的基础上,提出了改进的高电子迁移率晶体管(HEMT)的直流特性模型.采用这个模型,计算了Al GaN/GaN HEMT器件的大信号I-V特性,并与实际测量数据进行了比较.实验结果表明改进的模型更精确,Ids与Vgs的呈2.5次方的指数关系.     

Improved temperature model of AlGaN/GaN HEMT and device characteristics at variant temperature

In this paper, an improved temperature model for AlGaN/GaN high electron mobility transistor (HEMT) is presented. Research is being conducted for a high-performance building block for high frequency applications that combine lower costs with improved performance and manufacturability. The effects of channel conductance in the saturation region and the parasitic resistance due to the undoped GaN buffer layer have been included. The effect of both spontaneous and piezoelectric polarization induced charges at the AlGaN/GaN heterointerface has been incorporated. The proposed model is used to determine the transfer characteristics, output current-voltage characteristics and small-signal microwave parameters of HEMTs. The investigated temperature range is from 100–600 K. The small signal microwave parameters have been evaluated to determine the unity current gain cut-off frequency (f _T ). High f _T (10–70 GHz) values and high current levels (～550 mA/mm) are achieved for a 1 μm AlGaN/GaN HEMTs. A custom DC measurement system is used to facilitate the DC characterization of the unpackaged GaN HEMT test device. The calculated critical parameters and the simulation results suggest that the performance of the proposed device degrades at elevated temperatures.     

A surface-potential-based model for AlGaN/AlN/GaN HEMT

A new surface-potential-based model for AlGaN/AlN/GaN high electron mobility transistor(HEMT) is proposed in this paper. Since the high polarization effects caused by AlN interlayer favorably influence the two dimensional electron gas(2DEG) and scattering mechanisms, we first add spontaneous and piezoelectric charge terms to the source equation of surface-potential, and a mobility model for AlGaN/AlN/GaN HEMT is rewritten. Compared with TCAD simulations, the DC characteristics of AlGaN/AlN/GaN HEMT are faithfully reproduced by the new model.     

蓝宝石衬底上AlGaN/GaN HEMT自热效应研究

建立了包含“自热效应”的A lG aN/G aN HEM T(高电子迁移率晶体管)直流I-V特性解析模型。从理论的角度分析了自热效应对A lG aN/G aN HEM T器件的影响,并同已有的实验结果进行了对比,符合较好。证明基于这种模型的理论分析适于A lG aN/G aN HEM T器件测试及应用的实际情况。     

一种改进的AlGaN/GaN HEMT全局直流模型

对Angelov直流FET模型进行改进,并应用同一遗传算法对改进前后的模型进行全局直流模型参数提取,平均相对误差分别为4.58%和1.8%。将模型计算值与实验数据进行对比,结果表明,改进后的模型能更加准确地描述AlGaN/GaN HEMT源漏电流随栅、漏电压变化的全局直流输出特性,从而为AlGaN/GaN HEMT提供一种准确的全局直流模型和精确的参数提取方法。     

Scalable Multi-harmonic Large-Signal Model for AlGaN/GaN HEMTs Including a Geometry-Dependent Thermal Resistance

A scalable large-signal model of AlGaN/GaN High electron mobility transistors (HEMTs) suitable for multi-harmonic characterizations is presented.This model is fulfilled utilizing an improved drain-source current (Ids) formulation with a geometry-dependent thermal resistance (Rth) and charge-trapping modification.The Ids model is capable of accurately modeling the highorder transconductance (gm),which is significant for the prediction of multi-harmonic characteristics.The thermal resistance is identified by the electro-thermal Finite element method (FEM) simulations,which are physically and easily scalable with the finger numbers,unit gate width and power dissipations of the device.Accurate predictions of the quiescent currents,S-parameters up to 40GHz,and large-signal harmonic performance for the devices with different gate peripheries have been achieved by the proposed model.