Ga0.51In0.49P/In0.15Ga0.85As/GaAs pseudomorphic doped-channel FET with high-current densityand high-breakdown voltage

Ga_0.51In_0.49P/In_0.15Ga_0.85 As/GaAs pseudomorphic doped-channel FETs exhibiting excellent DC and microwave characteristics were successfully fabricated. A high peak transconductance of 350 mS/mm, a high gate-drain breakdown voltage of 31 V and a high maximum current density (575 mA/mm) were achieved. These results demonstrate that high transconductance and high breakdown voltage could be attained by using In_0.15Ga_0.85As and Ga_0.51In_0.49P as the channel and insulator materials, respectively. We also measured a high-current gain cut-off frequency f_t of 23.3 GHz and a high maximum oscillation frequency f_max of 50.8 GHz for a 1-μm gate length device at 300 K. RF values where higher than those of other works of InGaAs channel pseudomorphic doped-channel FETs (DCFETs), high electron mobility transistors (HEMTs), and heterostructure FETs (HFETs) with the same gate length and were mainly attributed to higher transconductance due to higher mobility, while the DC values were comparable with the other works. The above results suggested that Ga_0.51In_0.49P/In_0.15Ga_0.85 As/GaAs doped channel FET's were were very suitable for microwave high power device application     

Device linearity improvement byAl0.3Ga0.7As/In0.2Ga0.8Asheterostructure doped-channel FETs

The linearities of pseudomorphic heterostructure Al_0.3Ga_0.7As/In_0.2Ga_0.8As doped-channel FETs (DCFETs) and HEMTs were evaluated by DC and RF testings. Due to the absence of parallel conduction in the doped-channel approach, as compared to the modulation-doped structure, a wide and flat device performance together with a high current density was achieved. This improvement of device linearity suggests that doped-channel designs are suitable for high frequency power device application     

High temperature performance and operation of HFETs

The high temperature performance of Al_0.75Ga_0.25 As/In_0.25Ga_0.75As/GaAs Complementary Heterojunction FETs (CHFETs) is reported between 25 and 500°C. Both experimental and modeled devices have shown acceptable digital characteristics to 400°C. Digital logic circuits have also been shown to operate at temperatures of over 400°C. This strongly suggests that GaAs based devices are capable of satisfying high temperature electronics requirements in the 125-400°C range. Two dimensional physically based modeling has been used to understand the high temperature operation of the HFETs. This work has shown that the devices suffer from gate limited drain leakage currents at elevated ambient temperatures. This off-state leakage current is higher than anticipated. Simulation has shown that, although forward gate leakage currents are reduced with the heterostructure device design, the reverse current is not     

Dual-Gate E/E- and E/D-Mode AlGaAs/InGaAs pHEMTs for Microwave Circuit Applications

In this paper, we developed dual-gate enhancement/enhancement-mode (E/E-mode) and enhancement/depletion-mode (E/D-mode) AlGaAs/InGaAs pHEMTs for high-voltage and high-power device applications. These dual-gate devices had a higher breakdown voltage (V_br) and maximum oscillation frequency (f_max). This could be obtained because there were two depletion regions, and the total electrical field was shared between the two regions, leading to lower output conductance (g_o) and lower gate-to-drain capacitance (C_gd). The dual-gate device can be operated at a higher drain-to-source voltage (V_ds), resulting in better linear gain and output power performance, as compared to a conventional single-gate E-mode GaAs pHEMT device. The maximum oscillation frequency obtained using the dual-gate E/E-mode device increased from 78 to 123 GHz. When operated at 2.4 GHz, the maximum RF output power of the single-gate E-mode and dual-gate E/D-mode devices increased from 636 to 810 mW/mm, respectively. We also produced a 2.4-GHz high-gain and high-power density two-stage power amplifier using dual-gate E/E and E/D-mode transistors. A linear gain of 40 dB and a maximum output power of 24 dBm were obtained.     

A temperature-dependent nonlinear analysis of GaN/AlGaN HEMTs usingVolterra series

Gain and intermodulation distortion of an AlGaN/GaN device operating at RF have been analyzed using a general Volterra series representation. The circuit model to represent the GaN FET is obtained from a physics-based analysis. Theoretical current-voltage characteristics are in excellent agreement with the experimental data. For a 1 μm×500 μm Al_0.15Ga_0.85N/GaN FET, the calculated output power, power-added efficiency, and gain are 25 dBm, 13%, and 10.1 dB, respectively, at 15-dBm input power, and are in excellent agreement with experimental data. The output referred third-order intercept point (OIP₃) is 39.9 dBm at 350 K and 33 dBm at 650 K. These are in agreement with the simulated results from Cadence, which are 39.34 and 35.7 dBm, respectively. At 3 GHz, third-order intermodulation distortion IM₃ for 10-dBm output power is -72 dB at 300 K and -56 dB at 600 K. At 300 K, IM₃ is -66 dB at 5 GHz and -51 dB at 10 GHz. For the same frequencies, IM ₃ increases to -49.3 and -40 dB, respectively, at 600 K     

DC and RF characteristics of doped multichannelAlAs0.56Sb0.44/In0.53Ga0.47As field effect transistors with variable gate-lengths

Depletion-mode doped-channel field effect transistors (DCFETs) using a AlAs_0.56Sb_0.44/In_0.53Ga_0.47 As heterostructure with multiple channels grown by molecular beam epitaxy (MBE) on an InP substrate are presented. Devices with gate lengths ranging from 0.2 μm to 1.0 μm have been fabricated. Three doped In_0.53Ga_0.47As channels separated by undoped AlAs_0.56Sb_0.44 layers are used for the devices. The devices exhibit unity current gain cut-off frequencies typically between 18 GHz and 73 GHz and corresponding maximum oscillation frequencies typically between 60 GHz and 160 GHz. The multiple channel approach results in wide linearity of dc and RF performance of the device     

The effect of gate recess profile on device performance ofGa0.51In0.49P/In0.2Ga0.8Asdoped-channel FET's

The effect of gate recess profile on device performance of Ga_0.51In_0.49P/In_0.2Ga_0.8As doped-channel FETs was studied. In the experiment, Ga_0.51In _0.49P/In_0.2Ga_0.8As doped-channel FETs (DCFET's) using triple-recessed gate structure were compared with devices using single-recessed and double-recessed gate structures. It is found that triple-recessed gate approach provides higher breakdown voltage (35 V) than single-recessed (16 V) and double-recessed gate (28 V) approaches. This is attributed to the larger aspect ratio in the triple-recessed gate structure. A unified method to calculate the breakdown voltages of MESFETs, HEMTs and DCFETs (or MISFETs) of any given arbitrary recessed gate profile was proposed and used to explain the experimental results     

Effects of Sc2O3 and MgO passivation layerson the output power of AlGaN/GaN HEMTs

The low temperature (100°C) deposition of Sc₂O₃ or MgO layers is found to significantly increase the output power of AlGaN/GaN HEMTs. At 4 GHz, there was a better than 3 dB increase in output power of 0.5×100 μm² HEMTs for both types of oxide passivation layers. Both Sc₂ O₃ and MgO produced larger output power increases at 4 GHz than conventional plasma-enhanced chemical vapor deposited (PECVD) SiN_x passivation which typically showed ⩽2 dB increase on the same types of devices. The HEMT gain also in general remained linear over a wider input power range with the Sc₂O₃ or MgO passivation. These films appear promising for reducing the effects of surface states on the DC and RF performance of AlGaN/GaN HEMTs     

Microwave phase shifter using optical waveguide structure

A microwave phase shifter with an integrated optics structure with high efficiency is discussed. The structure and the performance of the device are discussed. Microwave phase shifting was carried out using the fabricated phase shifter of titanium diffused LiNbO₃ optical waveguides. The measured voltage to obtain halfwave phase shift for a 800 MHz microwave signal was 7.0 V. The input microwave power was 21 dBm, and the detected output microwave power was -24 dBm, so the microwave insertion loss was calculated to be approximately -45 dB. The optical insertion loss of the device was -12 dB     

Temperature-dependent nonlinearities in GaN/AlGaN HEMTs

Temperature-dependent nonlinearities of GaN/AlGaN HEMTs are reported. The large-signal device model of the transistor is obtained by using a physics-based analysis. The model parameters are obtained as functions of bias voltages and temperature. The analysis of the device has been carried out using a time-domain technique. f_max for a 0.23 μm×100 μm Al_0.13Ga_0.87N/GaN FET is calculated as 69 GHz at 300 K, while at 500 K, f_max decreases to 30 GHz, which are in agreement with the experimental data within 7% error. f_max as obtained from calculated unilateral gain, decreases monotonically with increasing temperature. For shorter gate lengths irrespective of the operating temperature f_max is less sensitive to bias voltage scaling. For longer gate length devices, f_max becomes less sensitive to the bias voltage scaling at elevated temperatures. 1-dB compression point (P_1-dB ) at 4 GHz for a 1 μm×500 μm Al_0.15Ga_0.85N/GaN FET is 13 dBm at 300 K. At 500 K, P_1-dB decreases to 2.5 dBm for the same operating frequency. Similar results for output referred third intercept point (OIP3) are reported for different gate length devices     

Microwave power performance comparison between single and dualdoped-channel design in AlGaAs/InGaAs HFETs

Single and dual doped-channel AlGaAs/InGaAs FETs (DCFETs) were fabricated, characterized, and compared with each other in terms of dc, rf, and power performance. The dual doped channel design provides a higher current density, and a better linear operation range over a wide gate bias range and frequency. A 1 μm-long gate dual-DCFET operated at 1.9 GHz demonstrates a power-added efficiency of 51.5%, a gain of 19 dB, and an output power density of 305 mW/mm at 2.5 V. This performance suggests that dual doped-channel design is more suitable for linear and high power microwave device applications     

Metamorphic InP/InGaAs heterojunction bipolar transistors on GaAssubstrate: DC and microwave performances

High-performance InP/In_0.53Ga_0.47As metamorphic heterojunction bipolar transistors (MHBTs) on GaAs substrate have been fabricated using In_xGa_1-xP strain relief buffer layer grown by solid-source molecular beam epitaxy (SSMBE). The MHBTs exhibited a dc current gain over 100, a unity current gain cutoff frequency (f_T) of 48 GHz and a maximum oscillation frequency (f_MAX) of 42 GHz with low junction leakage current and high breakdown voltages. It has also been shown that the MHBTs have achieved a minimum noise figure of 2 dB at 2 GHz (devices with 5×5 μm ² emitter) and a maximum output power of 18 dBm at 2.5 GHz (devices with 5×20 μm² emitter), which are comparable to the values reported on the lattice-matched HBTs (LHBTs). The dc and microwave characteristics show the great potential of the InP/InGaAs MHBTs on GaAs substrate for high-frequency and high-speed applications     

Temperature dependence of the ionization coefficients of AlxGa1-xAs

As Al_xGa_1-xAs alloys are increasingly used for microwave and millimeter wave power devices and circuits that work under high electric field intensities and junction temperatures; understanding the temperature dependence of impact ionization and related properties in this material system becomes more and more important. Measurements of the multiplication gain and noise of avalanche photodiodes (APDs) provide insight to the avalanche characteristics of semiconductors. Previously, we have reported the characteristics of GaAs and Al_0.2Ga_0.8As APD's at room temperature. In this paper, the gain and noise of a series of homojunction Al_xGa_1-xAs APD's were investigated over a wide temperature range from 29°C to 125°C, and the temperature dependence of their ionization coefficients was extracted     

High-temperature microwave characteristics of GaAs MESFET deviceswith AlAs buffer layers

AlAs buffers used to reduce the leakage current of high-temperature GaAs MESFET devices are shown to have no detrimental effect on the microwave performance measured to 200°C. The f_t values decrease with increasing temperature, but do not appear to be influenced by the AlAs buffer. The f_max values also decrease with increasing temperature; however, they are improved with increasing AlAs buffer thickness due to a concomitant decrease in the device output conductance, At 200°C ambient temperature, f_t and f_max values of 14.5 GHz and 36.7 GHz, respectively, were measured     

Improved performance of submicrometer-gate GaAs MESFETs with an Al0.3Ga0.7As buffer layer grown by metal organicvapor phase epitaxy

Submicrometer-gate MESFETs were fabricated with a GaAs active layer and an Al_xGa_1-xAs buffer layer grown by metalorganic vapor-phase epitaxy. To investigate the effect of buffer layer composition on device performance, microwave FETs with GaAs and Al _0.3Ga_0.7As buffer layers were compared. Electron Hall mobility in the n-GaAs active layer was found to be unaffected by the Al content or carrier concentration in the buffer layer. However, a considerable improvement in the maximum available gain to as much as 5.2 dB was obtained at 26.5 GHz for FETs with a p-Al_0.3Ga_0.7 As buffer layer; this was 1.5 dB higher than the gain obtained with a p-GaAs buffer layer. The improvement is due to a 20-30% reduction in both drain conductance and drain-gate capacitance     

Metamorphic InAlAs/InGaAs enhancement mode HEMTs on GaAs substrates

In_0.5Al_0.5As/In_0.5Ga_0.5 As HEMTs have been grown metamorphically on GaAs substrates oriented 6° off (100) toward (111)A using a graded InAlAs buffer. The devices are enhancement mode and show good dc and RF performance. The 0.6-μm gate length devices have saturation currents of 262 mA/mm at a gate bias of 0.7 V and a peak transconductance of 647 mS/mm. The 0.6 μm×3 mm devices tested on-wafer have output powers up to 30 mW/mm and 46% power-added-efficiency (PAE) at 1 V drain bias and 850 MHz. When biased and matched for best efficiency performance, this same device has up to 68% PAE at V_d=1 V     

Low noiseIn0.32(AlGa)0.68As/In0.43Ga0.57As metamorphic HEMT on GaAs substrate with 850 mW/mm output powerdensity

A double-pulse-doped InAlGaAs/In_0.43Ga_0.57As metamorphic high electron mobility transistor (MHEMT) on a GaAs substrate is demonstrated with state-of-the-art noise and power performance, This 0.15 μm T-gate MHEMT exhibits high on- and off-state breakdown (V_ds>6 V and V_dg>13 V, respectively) which allows biasing at V_ds>5 V. The 0.6 mm device shows >27 dBm output power (850 mW/mm) at 35 GHz-the highest reported power density of any MHEMT. Additionally, a smaller gate periphery 2×50 μm (0.1 mm) 43% MHEMT exhibits a F_min=1.18 dB and 10.7 dB associated gain at 25 GHz, and also is the first noise measurement of a -40% In MHEMT. A double recess process with selective etch chemistries provides for high yields     

A low-distortion K-band GaAs power FET

A K-band low-distortion GaAs power MESFET was developed by incorporating a pulse-type channel doping profile using molecular-beam-epitaxial technology and a novel 0.3-μm T-shaped gate. The low-distortion FETs offer about 10 to 15 dBc improvement in second-harmonic distortion compared to devices fabricated on a uniformity doped active layer. Significantly larger power load-pull contours are obtained with the low-distortion devices, indicating the improved linearity of these devices. In an 8-20-GHz single-stage broad-band amplifier, up to 10 dBc improvement in harmonic performance was achieved using the low-distortion device. This low-distortion device exhibits very linear transconductance as a function of the gate bias. A typical 750-μm-gate-width device is capable of 26 dBm of output power with 6 dB of gain, and power-added efficiency in excess of 35% when measured at 18 GHz. At 25 GHz, the device is capable of 24 dBm of output power with 5 dB associated gain     

Double-dopedIn0.35Al0.65As/In0.35Ga0.65As power heterojunction FET on GaAs substrate with 1 W outputpower

A double-doped metamorphic In_0.35Al_0.65As/In _0.35Ga_0.65As power heterojunction FET (HJFET) on GaAs substrate is demonstrated. The HJFET exhibits good dc characteristics, with gate forward turn on voltage of 1.0 V, breakdown voltage of 20 V, and maximum drain current of 490 mA/mm. Under RF operation at a frequency of 950 MHz, a power added efficiency of 63% with associated output power of 31.7 dBm is obtained at a gate width of 12.8 mm. This large gate width and state-of-the-art power performance in metamorphic HJFETS were enabled by a selective etching, sputtered WSi gate process and low surface roughness due to an Al_0.60Ga_0.40As_0.69Sb_0.31 strain relief buffer     

A 50 to 70 GHz Power Amplifier Using 90 nm CMOS Technology

A 50 to 70 GHz wideband power amplifier (PA) is developed in MS/RF 90 nm 1P9M CMOS process. This PA achieves a measured P_sat of 13.8 dBm, P_{1 dB} of 10.3 dBm, power added efficiency (PAE) of 12.6%, and linear power gain of 30 dB at 60 GHz under V_DD biased at 1.8 V. When V_DD is biased at 3 V, it exhibits P_sat of 18 dBm, P_{1 dB} of 12 dBm, PAE of 15%, and linear gain of 32.4 dB at 60 GHz. The MMIC PA also has a wide 3 dB bandwidth from 50 to 70 GHz, with a chip size of 0.66 times 0.5 mm². To the author's knowledge, this PA demonstrates the highest output power, with the highest gain among the reported CMOS PAs in V-band.