Formulae for the squeeze film between a rigid cylinder and a thin elastic layer with sinusoidal waviness

A set of formulae for the variation of the film thickness with time when a rigid cylinder approaching a thin elastic layer with sinusoidal waviness is derived. The shapes of the solids are assumed to be the same as the elastically deformed surfaces under dry conditions. Two geometrical configurations are investigated. First, the layer is resting without friction on a rigid substrate (unbonded layer). Second, the layer is attached firmly to a rigid substrate (bonded layer). The obtained results showed a good agreement with those reported for a smooth bonded layer.     

Note on the complete contact between a flat rigid punch and an elastic layer attached to a dissimilar substrate

The contact pressure distribution is found for a square ended rigid punch, pressing normally onto an elastic layer, itself attached to an elastically dissimilar half-plane, under plane deformation. Each interface may be either frictionless or adhesive, and it is shown that the shear traction assumption has only a very small influence on the contact pressure, which is found as a perturbation on the classical Flamant half-plane solution. For thin layers the contact pressure distribution is only weakly dependent on the pad aspect ratio.