超声电镀锡铋合金研究

研究了超声波对锡铋合金电镀的影响.通过赫尔槽试验优选出最佳镀液配方和工艺条件,用SEM法观测了镀层形貌,并测试了镀层和镀液性能.结果表明:超声波的作用扩大了电流密度范围和温度范围;所得镀层表面光亮、结晶更细致、均匀,镀层结合力、抗氧化性和可焊性改善明显,耐蚀性增强;镀液性能稳定,阴极电流效率和沉积速度得到提高.因此,超声波对电镀工艺条件、镀层质量和镀液性能都有明显的改善作用.     

添加剂对锌镍合金电镀的影响

研究了添加剂在电镀锌镍合金中的作用。通过极化曲线测量发现,镀液中加入添加剂后,可以提高阴极极化,使镀层更加光亮平整,测试了镀层的耐蚀性并通过实验确定了光亮镀层的最佳镀液配方。     

柠檬酸铵对丙三醇无氰镀铜工艺的影响

为取代氰化镀铜工艺,通过极化曲线分析、赫尔槽试验及镀层、镀液性能测试,研究了添加剂柠檬酸铵对丙三醇碱性无氰镀铜工艺的影响.结果表明:柠檬酸铵的加入可提高镀液稳定性, 增大阴极极化作用,可使阴极电流密度范围扩宽到0.11～1.54A/dm2,阴极电流效率高达95.6%,所得镀层细致、均匀、结合力好,为取代氰化镀铜提供了新思路.     

光亮锌铁合金工艺通过鉴定

上海振光日用五金电镀总厂研制的全光亮锌铁合金电镀新工艺最近在上海通过鉴定,从而为节镍代镍工艺开辟了一条新途径。该工艺主要是以弱碱性焦磷酸盐为络合剂,添加ZF型多种添加剂,从而获得全光亮锌铁合金镀层,然后镀铬。镀层具有良好的整平性和全光亮性。其工艺可与传统的铜,镍、铬的镀层相媲美,该镀液稳定,分散能力好,溶液成份简单,工作范围宽,对铁基体的防腐蚀性能优越,是良好的节镍镀种,有良好的推广应用前景。     

微量铈在电镀工业中的应用

论证含铈镀层代金代银镀层的可能性,简介锡铈镀液的特点、镀层的性能及有关配方,探讨铈元素电化掺杂反应的机理.文章提供的配方及其工艺参数有一定的参考价值。     

烟酸镀银添加剂的研究

为了进一步提高烟酸镀银的光亮性,改善镀液的性能,通过赫尔槽试验研究了2,2-联吡啶与硫代硫酸钠对镀层外观的影响,并用金相显微镜观察基础配方和优化配方(含添加剂)的镀层的表面形貌.试验结果表明:2,2-联吡啶和硫代硫酸钠联合使用可以提高镀层的光亮性,扩大镀液的电流密度范围.     

钢铁件化学镀Ni-Cu-P合金工艺研究

在酸性化学镀Ni-P合金镀液中加入硫酸铜和光亮剂,成功研制了一种钢铁件的全光亮化学镀Ni-Cu-P合金工艺,检测了镀液和镀层性能,探讨了主要成分和工艺条件对化学镀Ni-Cu-P合金镀层性能的影响.结果表明,所形成的Ni-Cu-P合金镀层结晶细致、光泽高,具有较高的装饰性,镀层耐蚀性、耐磨性和镀液稳定性优于酸性化学镀Ni-P合金工艺.     

无刻蚀直流镀铁工艺的研究

介绍了一种无刻蚀直流镀铁工艺，通过测量镀液的阴极极化曲线，分析了镀液中各种添加剂的作用，讨论了电流密度对镀层沉积速度和镀层硬度的影响，以及镀层厚度与施镀时间的关系，试验结果表明，镀液性能稳定，镀层沉积速度快，镀层硬度高，质量好，结果强度大。     

Ni-TiO2复合电镀工艺研究

通过正交设计,研究了Ni-TiO2复合电镀工艺中镀液的pH值、搅拌速度、电流密度、微粒悬浮量、添加剂等工艺条件和参数对Ni-TiO2复合镀层的影响.在充分分析各不同镀液组成和工艺条件下,对复合镀层中微粒共析量的影响曲线和对镀层的表观形貌的观察后,得出了其最佳镀液组成和工艺参数;能量色散谱分析,制备的复合镀层中TiO2共析量为10%～24.23%(质量分数).采用SEM观察镀层的表面形貌,其外观均匀、细致.     

不同基材上装饰性镀铑的电化学行为及镀层性能

利用电化学工作站,探讨了不同基材上硫酸铑体系镀铑的开路电位和极化曲线,并讨论研究了不同基材上电沉积铑的电流效率.同时通过中性盐雾实验、镀层结合力测试,研究和比较了不同基材上铑镀层的性能.结果表明:不同的电镀基材在硫酸铑体系中对其阴极极化的影响不明显;以镍为基材镀铑时,具有开路电势低、电流效率低、白度高、结合力好等特点;以钯为基材时,具有开路电势高、耐蚀性强等特点;以银为基材时,具有电流效率高、结合力好等特点.     

A novel electrolyte for the high speed electrodeposition of bright pure tin at elevated temperatures

A new tin electroplating process capable of producing fully bright, pure tin deposits from an electrolyte operated at temperatures of up to 50°C has been developed. Unlike conventional bright tin deposits, the tin deposit from the new process has an increased grain size and low carbon content. In addition, the deposit demonstrates excellent ductility, solderability, and low tendency for whisker growth. Production trials conducted by various industries have proven that the new pure tin deposit is suitable for connector applications, as well as for corrosion protection and decorative uses. In this article, the characteristics of the tin electrolyte and the bright tin deposit are described.Electrodeposition of bright tin, characterized by its silvery-white decorative appearance, excellent solderabilty, conductivity, good corrosion and tarnish resistance, and non-toxic nature, has been widely used in the electronic industry and protective-decorative applications. The industrial importance of tin electrodeposition has been markedly extended with the introduction of lead-free solder in the electronic marketplace. However, certain drawbacks of commonly used bright tin plating processes have limited the acceptance of electrodeposited bright tin. The operation and control of bright tin plating solutions is more difficult compared to that of matte tin processes, since the additive system of conventional bright tin electrolytes usually contains many volatile organic components that act as brightening agents. Because of the volatile nature of the organic brightening agents, a cooling system is usually required in conventional bright tin plating baths, in order to maintain the bath temperature between 20 to 25°C where most brightening agents are effective. For high-speed plating, the use of a cooling system becomes essential since the bath temperature naturally rises rapidly during plating. A key concern with the use of bright tin in certain applications is the relatively low ductility often associated with bright deposits and the reportedly higher tendency towards tin whisker growth compared to matte deposits. For demanding automotive applications, where the use of bright tin-lead has been permitted for a limited period of time, continuing efforts are being made by both the electronics industry and suppliers of plating chemistry to replace bright tin-lead with bright pure tin. Tin whisker performance has become one of the most critical characteristics in qualification of any bright pure tin plating process for use in the electronics industry.The newly developed plating bath, SOLDERON? BHT-350 bright tin, has been designed to be operated at temperatures between room temperature and 50°C, while producing ductile, bright deposits with low whisker growth tendency. Production trials conducted by different industries have demonstrated that the new process is able to produce bright tin deposits under high speed reel-to-reel plating conditions, and the simple additive system facilitates automatic or manual dosing during operation. The resulting bright tin deposits are suitable for connectors, contacts, wire and other items requiring a bright tin finish. In this article, the characteristics of the electrolyte and the properties of the bright tin deposit, including microstructure, carbon content, ductility, texture, solderability and whisker performance are described in detail.     

国内装饰铬底层的现状与发展

围绕节镍代镍工艺,概述用于装饰铬底层的氰化物光亮镀铜,三乙醇胺光亮镀铜,焦磷酸盐镀铜和氰化镀光亮铜锡合金等工艺的进展和在生产中的应用。     

添加剂对PCB酸性铜镀层质量及镀液性能影响

采用霍尔槽法、电化学、SEM、XRD等方法研究了添加剂浓度对酸性铜镀层质量及镀液性能的影响。试验表明,随着添加剂BSP、PPNI、ABSS、PN加入量增大,镀层光亮区和镀液分散能力先增大后减小,其适宜的浓度分别为24 mg/L、20 mg/L、0.02 mL/L、20 mg/L。在适宜的工艺条件下施镀15 min所得镀层光亮平整,光亮区为0.6～9.8 cm,对应电流密度0～13.38 A/dm2。镀液分散能力可达到95.1%,深镀能力L/φ至少可到5。在1～4 A/dm2下电流效率几乎为100%。混合添加剂使铜阴极峰电位负移80 mV,峰电流由43 A/cm2降至37 A/cm2。SEM试验表明镀层光滑平整、结晶细小均匀,XRD表明镀层为面心立方Cu,且在(111)晶面择优取向。该工艺具有电流密度及温度范围宽的特点,适合于PCB酸性镀铜生产。     

添加剂对甲基磺酸盐镀锡电沉积过程的影响

为了探讨添加剂对锡电沉积的作用机理,运用循环伏安法、计时安培法和阴极极化曲线法研究了添加剂2-巯基苯并噻唑对锡电沉积过程的影响.结果表明锡的电沉积过程经历了晶核形成过程,其电结晶按照三维瞬时成核方式进行,加入添加剂没有改变锡的电结晶机理,对锡的电沉积过程起阻化作用,但有利于晶核的形成,从而可以得到结晶细致的镀层.     

铸铝上刷镀Ni-P合金工艺研究

铸铝箱体件很容易因磨损而报废,对磨损后的铸铝箱体件采用Ni-P合金刷镀再修复,可恢复铸铝箱体件的原始配合尺寸,提高其使用寿命.研究了刷镀铸铝箱体零件的Ni-P合金刷镀液、特殊预处理液的配方及电刷镀工艺.特殊预处理工序有效地防止了铸铝表面的再氧化,使后续刷镀层结合力好,避免了刷镀层易剥落的弊端.铸铝刷镀过镀层采用高堆积碱铜,工作层采用Ni-P舍金.刷镀层硬度高(可达613HV),耐磨性好.该工艺方法解决了铸铝箱体件磨损后修复难等问题.     

一种较为经济的快速电刷镀工艺

电刷镀适合于不易搬动的大型零件的修补.但传统镍钨钴配方的镀速较低,而快速商品镀液的成本高.因此,研究较为经济的快速电刷镀工艺具有重要意义.用千分尺和扫描电镜SEM测试方法,实测了电源波形、硫酸镍、次亚磷酸钠、复合络合剂对电刷镀的镀速和镀层形貌的影响,确定了经济、快速电刷镀镍磷的配方和工艺参数,适用于耐磨钢件的电刷镀.     

镁合金微弧氧化层化学镀镍的镍盐活化工艺研究

通过差热分析、扫描电镜?斓仁侄?对镁合金微弧氧化层化学镀镍的镍盐活化工艺进行了研究,并与钯盐活化的效果进行了对比。结果表明:用镍盐对镁合金微弧氧化陶瓷层进行化学镀镍的活化是可行的,活化需要通过活化液室温浸泡和热还原两个步骤完成,活化液配方和热还原工艺是影响活化效果的重要因素;与钯盐活化相比,镍盐活化后化学镀镍的镀速低,最终形成的镀层厚度小,但有利于保持化学镀液在施镀过程中的稳定性。     

无氰电刷镀金技术在航天工业中的应用

应用FJY-18无氰电刷镀金技术制得的金镀层具有孔隙率低、色泽金黄、光亮、结合力好,镀厚能力大于20μm,显微硬度HV=130～150,施工温度范围宽、无毒等特点,该技术已用于航天工业中某一关键部件的表面减磨密封镀金.     

酸性光亮镀铜的原材料选择及工艺维护

为了保证酸性光亮镀铜工艺的稳定性,获得高质量的酸铜镀层,从实践中总结出硫酸铜、硫酸、氯离子、添加剂、水、磷铜阳极等各种电镀原料的作用和要求以及影响工艺稳定的各种关键因素,指出了正确的镀液维护方法,分析了常见故障并提出相应的解决方法.