Solderability, IMC evolution, and shear behavior of low-Ag Sn0.7Ag0.5Cu-BiNi/Cu solder joint

The solderability, intermetallic compounds (IMC) evolution, and shear behavior of the low-Ag Sn0.7Ag0.5Cu-3.5Bi-0.05Ni (SAC0705-BiNi)/Cu solder joint was investigated by comparing with Sn0.7Ag0.5Cu (SAC0705)/Cu and Sn3.0Ag0.5Cu (SAC305)/Cu solder joints. Experimental results demonstrated that the melting temperature of Sn0.7Ag0.5Cu-BiNi solder alloy was lower than that of SAC0705 and SAC305 solder. But the melting range of Sn0.7Ag0.5Cu-BiNi was wider. Compared with the other two kinds of alloys, SAC0705-BiNi showed the best wettability. SAC0705/Cu, SAC0705-BiNi/Cu, and SAC305 solder joints appeared similar IMC morphologies and grain size at the beginning of soldering, but evolved to different appearance as the soldering process proceeded. The growth rate of the IMC grains in SAC0705-BiNi/Cu solder joint was the lowest because of the refinement of Ni. SAC0705-BiNi/Cu solder joint showed the highest shear strength before and after being aged, mainly due to the enhancement of solid solution strengthening and dispersion strengthening of Bi and Ni in the bulk solder, as well as the refinement of Ni at the soldering interface.     

Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys

In this article, the tensile properties of low Ag lead-free solder alloys, SAC0307 and SAC105, are examined under various strain rates and temperatures. The wettability of these solders on Cu pad is also characterized by using different fluxes. The SAC305 and Sn37Pb solder alloys are also studied for comparison. Our results show that the properties of all solder alloys are dependent on the strain rate and temperature. The ultimate tensile strength increases monotonously with the increment of strain rate. Both SAC0307 and SAC105 alloys possess lower strength and higher elongation ratio than SAC305 and Sn37Pb alloys. For all the fluxes used in this study, the SAC0307 and SAC105 alloys show the similar wettability to SAC305, whereas worse than that of Sn37Pb alloy. Increasing the activity of the flux does not improve the wettability of the SAC solder alloys on Cu pad effectively.     

Life expectancies of Pb-free SAC solder interconnects in electronic hardware

The transition from lead (Pb) bearing solder to Pb-free solder has arisen in response to government restrictions on the use of lead (Pb) by the European Union. As a result, electronic manufacturers have sought a material comparable to the conventional 63Sn37Pb solder that has been traditionally used to assemble electronic hardware. Based on extensive review of various solder combination, the majority of electronic manufacturers appear to be adopting a tin–silver–copper (SAC) solder as a popular Pb-free solder replacement. Significant investments have been made by many researchers to characterize the material behavior and durability of this solder system. While the exact composition of the SAC solder is still in question, it now appears that the 96.5Sn3.0Ag0.5Cu (SAC305) solder is gaining wider acceptance as the favored Pb-free replacement, for surface mount assemblies that are going to be subjected predominantly to cyclic thermal environments. This paper presents a review of our current understanding of the life expectancy of Pb-free SAC solder interconnects for electronic hardware. To this end, the paper focuses on material characterization of SAC solder, as well as its temperature cycling and vibration fatigue reliability. From this review, SAC solder interconnects are shown to be suitable for providing adequate life expectancies for temperature cycling in electronic hardware. However, it is clear that there are differences between SAC and the conventional Sn37Pb solder, that need to be understood in order to design reliable electronic hardware.     

Effect of Ni,Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints

This paper investigated the effect of Bi, Ni concentration on the microstructure and interfacial intermetallic compounds of low-Ag Sn–0.7Ag–0.5Cu–xBi–yNi/Cu solder joints by comparing with Sn–0.7Ag–0.5Cu (SAC0705)/Cu and Sn–3Ag–0.5Cu (SAC305)/Cu. Meanwhile, the shear behavior of the solder joints at both the bulk solder and soldering interface with various Bi, Ni content were also studied. Experimental results indicated that SAC0705–3.5Bi showed coarse microstructure due to the excessive growth of β-Sn dendritic crystal, which can be obviously suppressed by small amount of Ni element addition. Needle-like (Cu, Ni)₆Sn₅ appeared in the bulk solder of SAC–Bi–Ni/Cu, instead of the pipe-like Cu₆Sn₅ in SAC/Cu. Compare with SAC0705/Cu and SAC305/Cu, SAC–Bi–Ni/Cu showed higher shear strength at both the bulk solder and soldering interface. The increase of Bi content significantly increased the shear strength of Sn–0.7Ag–0.5Cu–xBi–yNi/Cu solder joints at the soldering interface. Brittle fracture appeared in the bulk solder of Sn–0.7Ag–0.5Cu–3.5Bi–0.05Ni/Cu solder joint. But this brittle failure can be suppressed by increasing the concentration of Ni in the solder alloys.     

Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging

In this paper, the formation and evolution characteristics of the intermetallic compounds (IMCs) in SAC305/Ag/Cu and SAC0705-3.5Bi-0.05Ni/Ag/Cu solder during reflow and 150 °C isothermal aging are investigated. Experimental results indicate that Ag₃Sn forms as soon as the SAC305/Ag/Cu solder spheres wetted to the substrates. With increased soldering time, the Ag layer on a Cu substrate dissolved into the molten SAC305 solder and the interfacial IMC consisted of Cu₆Sn₅. The Ag layers show a faster dissolution rate in SAC0705-3.5Bi-0.05Ni/Ag/Cu than in SAC305/Ag/Cu, which is attributed to a larger concentration gradient of Ag for SAC0705-3.5Bi-0.05Ni/Ag/Cu. The formation and coarsening of a Cu₃Sn layer between Cu₆Sn₅ and the Cu substrate caused the formation of Kirkendall voids and delamination during aging in the SAC305/Ag/Cu. A small addition of Ni in the solder significantly suppressed the formation of a Cu₃Sn layer in the SAC0705-3.5Bi-0.05Ni/Ag/Cu, resulting in fewer voids in the soldering interface.     

Influence of Thermal Cycling on the Microstructure and Shear Strength of Sn3.5Ag0.75Cu and Sn63Pb37 Solder Joints on Au/Ni Metallization

The influence of thermal cycling on the microstructure and joint strength of Sn3.5Ag0.75Cu （SAC） and Sn63Pb37 （SnPb） solder joints was investigated. SAC and SnPb solder balls were soldered on 0.1 and 0.9 μm Au finished metallization, respectively. After 1000 thermal cycles between -40℃ and 125℃, a very thin intermetallic compound （IMC） layer containing Au, Sn, Ni, and Cu formed at the interface between SAC solder joints and underneath metallization with 0.1 μm Au finish, and （Au, Ni, Cu）Sn4 and a very thin AuSn-Ni-Cu IMC layer formed between SAC solder joints and underneath metallization with 0.9 μm Au finish. For SnPb solder joints with 0.1 μm Au finish, a thin （Ni, Cu, Au）3Sn4 IMC layer and a Pb-rich layer formed below and above the （Au, Ni）Sn4 IMC, respectively. Cu diffused through Ni layer and was involved into the IMC formation process. Similar interfacial microstructure was also found for SnPb solder joints with 0.9μm Au finish. The results of shear test show that the shear strength of SAC solder joints is consistently higher than that of SnPb eutectic solder joints during thermal cycling.     

Annealing effect to constitutive behavior of Sn–3.0Ag–0.5Cu solder

Sn–Ag–Cu based solder alloys are replacing Sn–Pb solders in electronic packaging structures of commercial electric devices. In order to evaluate the structural reliability, the mechanical property of solder material is critical to the numerical simulations. Annealing process has been found to stabilize material properties of Sn–37Pb solder material. In the current study, the annealing effect on tensile behaviour of Sn–3.0Ag–0.5Cu (SAC305) solder material is investigated and compared with Sn–37Pb solder. It is found that the tensile strength for both materials are more stabilized and consistent after the annealing process, nevertheless, the annealing process will improve the plasticity of SAC305 solder dominated by dislocation motion, and impede the occurrence of hardening deformation in Sn–37Pb solder dominated by grain-boundary sliding mechanism. Furthermore, the annealing effect is quantified in the proposed constitutive model based on unified creep–plasticity theory. The parameters are calibrated against the measured stress–strain relationships at the tensile strain rates ranging from 1?×?10^?4 to 1?×?10^?3 s^?1. The numerical regressions for dominant parameters in the proposed model reveal the intrinsic differences between SAC305 and Sn–37Pb solders under annealing treatment.     

Effects of microstructure and temperature on corrosion behavior of Sn–3.0Ag–0.5Cu lead-free solder

The heterogeneous microstructure of solder could be obtained when cooling rate of the solder joint was not even, which would affect the corrosion behavior of solder during service. The ambient temperature would also affect the corrosion behavior of solder joint. In this paper, the effects of microstructure and temperature on the corrosion behavior of Sn–3.0Ag–0.5Cu (SAC305) lead-free solder were investigated. The various microstructures of SAC305 lead-free solder were obtained by cooling specimens in air and furnace. Compared to the fine-fibrous Ag₃Sn phase inside the commercial SAC305 solder, platelet-like Ag₃Sn formed as cooling speed decreasing. The polarization behavior of SAC305 solders in 3.5 wt.% NaCl solution was not significantly affected by various microstructures, but sensitive to temperature.     

Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders

In this paper, the tensile tests were conducted to investigate the effect of adding a small amount of Ni on the microstructure, thermal and mechanical properties of 3.0Ag–0.5Cu(SAC 305) solder. The results indicated that addition of Ni can effectively decrease both the undercooling and the onset melting temperature of SAC(305) solder alloy. The strength and ductility of the SAC(305) solder depend significantly on Ni content. In general, the SAC(305)–0.5%Ni solder reveals superior mechanical properties in terms of maximum strength and ductility when compared to the high Ni-content or plain solders. Microstructure analysis revealed that a new η-(Cu,Ni)₆Sn₅ intermetallic compound (IMC) phase containing large amount of Ni was generated, while the initial Cu₆Sn₅ phase was converted into (Cu,Ni)₆Sn₅ phase after 0.5%Ni addition. Besides, the fine fiber-like Ag₃Sn and finer dot-shaped precipitates rather than needle-like morphology have occurred at the surface of β-Sn matrix easily, which could provide more obstacles for dislocation pile up in the adjacent grains and enhanced the mechanical property. With increasing Ni addition, the Ni-doped SAC(305) solder showed a corresponding deterioration in their mechanical property due to the coarsening of (Cu,Ni)₆Sn₅ IMCs and increasing the inter-particle spacing of Ag₃Sn IMCs in the eutectic colony.     

Effect of ZnO nanoparticles addition on thermal, microstructure and tensile properties of Sn–3.5 Ag–0.5 Cu (SAC355) solder alloy

Regarding to the development of Sn–Ag–Cu (SAC) lead-free solders for advance electronic components, the effect of 0.5 wt% nano-sized ZnO particles on the thermal, microstructure and tensile properties of Sn–3.5 wt% Ag–0.5 wt% Cu (SAC355) lead-free solder alloy is investigated. The results showed that addition of 0.5 wt% nano-sized ZnO particles into the conventional lead-free SAC355 solder caused a slight increase of its liquidus temperature by about 1.1 K. Metallographic observations of SAC355–0.5 wt% ZnO (composite solder) revealed an obvious refinement in the microstructure compared with the SAC355 (non-composite) solder. Consequently, addition of nano sized-ZnO particles could improve the stress–strain characteristics proof stress (σ_y0.2) and ultimate strength (σ_UTS). This was rendered to suppressing effect of ZnO on the coarsening of the intemetallic compounds (IMCs) Ag₃Sn and Cu₆Sn₅ during the solidification process in the composite solder and subsequently dispersion strengthening is considered to be the dominating mechanism. This will allow the use of SAC355 composite lead-free solder alloy, to be consistent with the conditions of usage for conventional SAC solder alloys and to overcome the serious problem of the excessive growth of IMCs and the formation of microvoids in the SAC lead-free solder alloys.     

Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient

In this study, 96.5Sn–3Ag–0.5Cu (SAC305) lead-free composite solder containing graphene nanosheets (GNS) decorated with Ni nanoparticles (Ni-GNS) was prepared using a powder metallurgy method. A lab-made set-up and a corresponding Cu/solder/Cu sample design for assessing thermo-migration (TM) was established. The feasibility of this setup for TM stressing using an infrared thermal imaging method was verified; a temperature gradient in a solder joint was observed at 1240 K/cm. Microstructural evolution and diffusion of Cu in both plain and composite solder joints were then studied under TM stressing conditions. Compared to unreinforced SAC305 solder, the process of diffusion of Cu atoms in the composite solder joint was significantly reduced. The interfacial intermetallic compounds (IMCs) present in the composite solder joint also provide a more stable morphology after the TM test for 600 h. Furthermore, during the TM test, the Ni-GNS reinforcement affects the formation, migration and distribution of Ni–Cu–Sn and Cu–Sn IMCs by influencing the dissolution rate of Cu atoms.     

Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density

Sn37Pb (SP) and Sn3.5Ag0.5Cu (SAC) ball grid array (BGA) solder joints between Au/Ni (P)/Cu pads were stressed with a moderate current density of 6.0 × 10² A/cm² at an ambient temperature of 125°C up to 600 h. The solder joint reliability was evaluated in terms of temperature measurement, microstructural analysis and mechanical strength test. It was confirmed that no obvious electromigration occurred with this moderate current density. However, the local temperature of solder joints rose considerably due to massive Joule heating, which degraded the solder joint reliability seriously. Phase coarsening was observed for both solders and it was particularly apparent in the SP solder joints. Compared to the SP, the SAC was found to be more reactive and hence a thicker intermetallic compound (IMC) was developed during the current stressing. Nevertheless, the IMC thickening was not as remarkable as expected with current stressing at high temperature. It exhibited a sub-parabolic growth manner that was mainly controlled by grain boundary diffusion. However, a sufficiently thick IMC layer initially formed during reflow soldering and the low diffusivity of the Ni atoms retarded the growth. The shear strength of the solder joints was found to decrease severely with the current stressing time. This degradation was attributed to the large stresses arising from localized thermal mismatch, phase coarsening, volume shrinkage of IMC evolution, Ni–P layer crystallization and the pad cracking during current stressing.     

Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn–3.0Ag–0.5Cu lead-free solder

In this paper, the effects of microstructure on the corrosion behavior of Sn–3.0Ag–0.5Cu (SAC305) lead-free solder were investigated by potentiodynamic polarization and atmospheric corrosion test. Scanning electron microscopy and X-ray diffraction were used to characterize the samples after the electrochemical and atmospheric corrosion tests. Results showed that commercial SAC305 solder exhibits better corrosion resistance than air-cooled and furnace-cooled SAC305 solders both in 3.5 wt% NaCl solution and at 60 °C/100 % relative humidity condition.     

Effective diffusivity of lead free solder alloys

A Monte Carlo simulation based algorithm is developed to compute the effective diffusivity of lead free solder alloys. Simulations are performed to determine the vacancy diffusivity for 95.5Sn–4.0Ag–0.5Cu (SAC405) solder alloy for different paths. Temperature and micro-structural influence on diffusivity are studied. A map of diffusivity versus temperature and average grain size is developed. Significant differences between diffusivity values reported in the literature for the same solder alloy is also discussed.     

The effect of pretinning on the strength of a chip carrier solder joint

Pretinning of gold-plated components is often done to avoid the formation of brittle Au/Sn intermetallic compounds, which may lower the mechanical strength of the joints. In this investigation the reliability of 32LCCs surface mounted on alumina boards is tested in internal and external temperature cycling, as well as in shear tests, and the effect of pretinning is studied. One thousand times of temperature cycling between ?55 and +125°C and 2000 h of power cycling with an upper joint temperature of +75°C did not cause any electrical opens. Shear tests made after a 168 h heat treatment at +125°C and 1000 temperature cycles showed that forces of approximately 1000 N were required to break the chip carrier joints. The microstructure of Sn62/Pb36/Ag2 solder joints containing gold was examined and the existing phases were identified using electron diffraction X-ray analysis. The joints fail at the Au/Sn intermetallics at the chip carrier metallization or at the Cu/Sn compounds formed at the substrate thick film/solder interface. No deterioration of the overall joint strength due to Au/Sn intermetallics was seen, when the gold content in the joints was approximately 4 weight per cent.     

Comparative study on stress–strain hysteresis response of SAC solder joints under thermal cycles

The present study attempts to evaluate the stress-strain hysteresis responses of SAC solder joints in Resistor and FleXBGA144 packages subjected to thermal cyclic loading using several constitutive models. The total deformation of the solder material consists of elastic, rate-independent plastic and rate-dependent creep components. The constitutive models discussed in this study each weighted elastic, plastic and creep deformations differently. At low stresses SAC solder alloys were found to be creep resistant, where at higher stresses, the influence of different microstructures disappears as matrix-creep dominates in this region. Thus, the proper constitutive model requires all the three ingredients of the elastic, the creep, and the time-independent plastic data for different stress levels to effectively predict the hysteresis behavior of the SAC solder alloys. The hysteresis loops predicted by constitutive models were also found in close agreement with the loops generated by FEM for the SAC solder joint subjected to thermal cycling.     

Magnetic nanoparticle-based solder composites for electronic packaging applications

Sn–Ag–Cu (SAC) alloys are regarded as the most promising alternative for traditional Pb–Sn solders used in electronic packaging applications. However, the higher reflow temperature requirement, possible intermetallic formation, and reliability issues of SAC alloys generate several key challenges for successful adoption of Pb-free solder for next generation electronic packaging needs. Localized heating in interconnects can alleviate thermal stresses by preventing subjection of entire package to the higher reflow temperatures associated with the SAC solders. It had been demonstrated that SAC solder–FeCo magnetic nanoparticles (MNPs) composite paste can be reflowed locally with AC magnetic fields, enabling interconnect formation in area array packages while minimizing eddy current heating in the printed circuit board.Solder/magnetic nanocomposite pastes with varying MNP concentration were reflowed using AC magnetic fields. Differential scanning calorimetry results show a reduced undercooling of the composite pastes with the addition of MNPs. TEM results show that the FeCo MNPs are distributed in Sn matrix of the reflowed solder composites. Optical and SEM micrographs show a decrease in Sn dendrite regions as well as smaller and more homogeneous dispersed Ag₃Sn with the addition of MNPs. The MNPs promote Sn solidification by providing more heterogeneous nucleation sites at relatively low undercoolings. The mechanical properties were measured by nanoindentation. The modulus, hardness, and creep resistance, increase with the MNP concentration. The enhanced mechanical properties are attributed to grain boundary and dispersion strengthening.The reflow of solder composites have been modeled based on eddy current power loss in the substrate and magnetic power losses in the solder bumps. Induction reflow of pure solder bumps (<300 μm) in an area array package using 500 Oe magnetic field at 300 kHz requires excessive eddy current power loss in the substrate, resulting in extreme temperatures that lead to blistering and delamination of the substrate. Solder–MNP composites with modest MNP loading showed temperature increases sufficient to achieve solder reflow when subjected to the same AC magnetic fields. Thermomechanical behavior of a solder joint was also modeled under cyclic temperature variations. The stress and strain are highly localized at the interface between solder and substrate. Plastic work accumulated per cycle can be used for lifetime prediction.In this article we review lead-containing and lead-free solder systems, and the electronic packaging technologies pertinent to soldering process. Recent research on the effects of MNPs on localized heating, microstructure evolution, mechanical properties, and thermomechanical reliability are summarized.     

Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles

The size and morphology of intermetallic compounds (IMCs) of Sn–1.0Ag–0.5Cu (SAC105) solder alloys can have a significant influence on the mechanical strength of solder joints. The aim of the present study is to investigate the influence of SiC nano-particles addition on the microstructure, thermal behavior, and corresponding mechanical properties of SAC(105) solder alloys. Results show that the addition of SiC nanoparticles into the SAC(105) alloy melt prompts the formation of primary β-Sn phase with small sub-grain size in the solidified structure. The SiC nanoparticles can offer an additional nucleation sites for the formation of refined Ag₃Sn and Cu₆Sn₅ IMCs. The hard SiC particles and refined IMCs with small spacing could obstruct the dislocation slipping and thus, lead to a strong dispersion strengthening mechanism in the composite solder. As a result, the composite SAC(105)/SiC solder displayed a higher ultimate tensile strength and 0.2 % yield strength (0.2 %YS) than that of plain SAC(105) solder. The addition of SiC nano-sized particles can also effectively reduce the undercooling and pasty range, while the melting temperature is maintained at the SAC(105) level, indicating that the novel composite solder is fit for existing soldering process.     

Evolution of interfacial IMCs and mechanical properties of Sn–Ag–Cu solder joints with Cu-modified carbon nanotube

Cu-modified carbon nanotube (Cu-CNT) was mechanical mixed with Sn-3.0Ag-0.5Cu (SAC305) solder powder to fabricate composite solder. Experiments were carried out on the composite solder to investigate its thermal behavior and mechanical properties. Evolution of interfacial intermetallic compounds (IMCs) and shear fracture behaviors of composite solder joints were explored as well. Differential scanning calorimetry results showed that the addition of Cu-CNT increased the melting point of SAC305. Nanoindentation indicated that the hardness and modulus of composite solder increased with the increase of Cu-CNT content, indicating that the addition of Cu-CNT could improve the mechanical properties of SAC305 solder. SAC-xCu-CNT/Cu (x?=?0, 0.1 and 0.2 wt%) composite solder joints were obtained by reflow soldering, aging experiment was carried out subsequently. The results showed that Cu-CNT as the reinforcement phase of SAC305 solder could inhibit the growth of IMC. The suppression effect was enhanced when the content of Cu-CNT increased from 0.1 to 0.2 wt% in SAC305. The growth rate of the IMC layer of the composite solder joint with 0.2 wt% Cu-CNT was the lowest. Shear tests showed that adding Cu-CNT could improve the shear strength of solder joints and the fracture mode of the solder joint changed from mixed fracture to ductile fracture.

     

The ‘IMC rings’ growth mechanism in Sn–Ag–Cu solder ball and NiAu-plated BGA ball pad

Due to environmental pollution concerns, the law says the lead (Pb) inside electronics devices must be eliminated. Lots of lead-free materials have been introduced and been used for electronic products and Sn–Ag–Cu (SAC) is one of most popular lead-free representatives and has been used in high-volume production. The most popular IC packages, BGA packages which have higher I/O counts, and better thermal and electrical performance than lead-frame type packages, use solder balls of SAC for lead-free applications to connect with printed circuit boards. A particular phenomenon, so-called ‘IMC rings’, is only observed on BGA solder ball pad surfaces after the SAC solder balls are mounted on BGA ball pads which are plated with NiAu. It has not been found in either eutectic solder or Sn–Ag solder welding on plated NiAu pads. No significant evidence exists to show that ‘IMC rings’ degrade the strength of solder joints or cause earlier failures in mechanical tests. ‘IMC rings’ appear to be an inevitable outcome after the SAC is soldered onto a plated NiAu ball pad. This study is to find the growth mechanism of ‘IMC rings’ on the ball pad which is created between SAC ball and plated NiAu pad during solder ball temperature reflow. The design of the experiment and data have been discussed.