共查询到16条相似文献,搜索用时 359 毫秒
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新型半导体功率器件在现代雷达中的应用研究(Ⅰ) 总被引:2,自引:0,他引:2
目前第一代半导体功率器件的制造技术和应用技术已趋于成熟,S波段及以下波段功率器件的输出功率、工作效率和可靠性指标都已达到相当高的水平。近年来第二代半导体功率器件的制造技术和应用技术发展迅速,S波段、C波段和X波段的器件已经形成了一定的系列化商品。但是面对现代雷达等新一代电子装备的需求,半导体功率器件在高功率、高效率和高频率等方面与真空管器件相比仍逊色许多,Si和GaAs功率器件的输出功率工作频率短期内不大可能有大的提高,而第三代半导体功率器件——宽禁带半导体器件固有的宽禁带、高击穿场强和良好的热稳定性等特性,决定了其可以输出更高功率、工作在更高频率、具有更高效率,并可更好地满足现代雷达的要求。 相似文献
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以SiC/GaN为代表的第三代半导体功率电子学已成为当今功率电子学创新发展的主流,超宽禁带半导体金刚石功率电子学将有可能成为下一代固态功率电子学的代表,受到研究人员的广泛关注。介绍了金刚石功率电子学的最新进展,如金刚石单晶、金刚石化学气相沉积同质和异质单晶外延、金刚石多晶外延、金刚石二极管、金刚石MOSFET、金刚石结型场效应晶体管、金刚石双极结型晶体管、金刚石逻辑电路、金刚石射频场效应晶体管和金刚石上GaN HEMT等。还介绍了金刚石材料的大尺寸、低缺陷和p型及n型掺杂等制备技术,金刚石新器件结构设计,金刚石新器件工艺,转移掺杂H端-金刚石沟道和金刚石/GaN界面热阻等研究成果。分析了金刚石功率电子学的发展由来、关键技术突破和发展态势。 相似文献
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基于SiC 三代半导体技术的T/R 组件功率放大电路设计 总被引:1,自引:1,他引:0
本文介绍了SiC宽禁带功率器件的特性及其在相控阵雷达中的应用情况,与Si功率器件相比,该器件在输出功率、功率密度、工作频率、工作带宽、环境适应性、抗辐射能力等方面有卓越的性能。并以SiC RF Power MESFET CRF24010在T/R组件功率放大电路上的应用为实例,详细介绍了SiC宽禁带功率放大电路的设计过程,包括直流偏置设计、稳定性设计、谐波阻抗优化设计、输出功率与效率的仿真,并对实际电路进行测试。本文可以为有源相控阵天线的设计提供工程应用上的参考。 相似文献
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作为制备光电子器件例如紫外光子探测器、异质结场效应晶体管(HFET)、高电子迁移率晶体管(HEMT)异质结场效应管等的一种宽禁带半导体材料, III V 族氮化物AlGaN器件近年来颇受关注.AlGaN与金属之间的低阻欧姆接触的实现问题阻碍了AlGaN(基)器件的发展.通过对相关文献的归纳分析,介绍了近年来AlGaN器件在欧姆接触形成、金属化方案、合金化工艺及表面处理等方面的研究进展. 相似文献
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GaN高电子迁移率晶体管(HEMT)以其输出功率密度大、工作电压高和输出阻抗高等特点,在微波通信、雷达等领域有着广泛的应用前景,将成为下一代高频固态微波功率器件. 相似文献
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Neudeck P.G. Okojie R.S. Liang-Yu Chen 《Proceedings of the IEEE. Institute of Electrical and Electronics Engineers》2002,90(6):1065-1076
The fact that wide bandgap semiconductors are capable of electronic functionality at much higher temperatures than silicon has partially fueled their development, particularly in the case of SiC. It appears unlikely that wide bandgap semiconductor devices will find much use in low-power transistor applications until the ambient temperature exceeds approximately 300/spl deg/C, as commercially available silicon and silicon-on-insulator technologies are already satisfying requirements for digital and analog VLSI in this temperature range. However practical operation of silicon power devices at ambient temperatures above 200/spl deg/C appears problematic, as self-heating at higher power levels results in high internal junction temperatures and leakages. Thus, most electronic subsystems that simultaneously require high-temperature and high-power operation will necessarily be realized using wide bandgap devices, once they become widely available. Technological challenges impeding the realization of beneficial wide bandgap high ambient temperature electronics, including material growth, contacts, and packaging, are briefly discussed. 相似文献
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Silicon based bipolar power transistor (BPT) as a switching power transistor has been replaced by other superior power devices in the past two decades. This transformation is primarily due to the poor performance of the BPT. Among many problems of the BPT, low current gain and small safe operation area (SOA) caused by the second breakdown have been most detrimental to silicon BPT's fate. However, BPT performance based on newer materials, such as wide bandgap semiconductors, has not been previously studied. This paper systematically compares the BPTs based on wide bandgap semiconductor materials. Device figures-of-merit for conduction and switching losses are proposed. Comparison of the BPT based on total power loss is then provided. Based on this work, it is concluded that BPTs based on wide bandgap materials overcome the critical disadvantages of silicon BPTs, and are capable of switching power operation at several hundred kilohertz frequencies at very high current densities and voltages. Therefore, BPTs based on wide bandgap materials are still very attractive switching power devices for the future 相似文献
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第三代宽禁带半导体GaN晶体管具有低导通阻抗、低寄生参数和更快的开关速度,有望取代传统Si MOSFET,成为未来高性能电源系统实现方案。GaN器件的优势在400 V以上高压系统中更为明显,可以实现更高的开关频率和功率密度,显著提高系统的转换效率,特别适合电源模块小型化发展趋势。介绍了200 V以下低压GaN驱动电路的应用和关键技术。分析了从低压系统拓展到400 V以上高压系统时需要作出的优化与改进。详细介绍了高压GaN系统中基于无磁芯变压器耦合隔离的隔离驱动技术和耗尽型GaN负压栅驱动技术。最后,总结了目前高压GaN驱动电路在工业领域的具体应用。 相似文献
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