印刷电路板上化学镀钯工艺研究

采用L9(34)混合正交体系,系统地研究复合络合剂-乙二胺、乙二胺四乙酸二钠和丙烯酸在不同工艺参数和不同添加配比情况下对化学镀钯质量的影响,以镀层的光亮度,镀液的稳定性和沉积速度为评价指标,筛选出最佳的化学镀钯添加剂为:乙二胺0.2mol/L,乙二胺四乙酸二钠0.01mol/L,丙烯酸0.3mol/L,pH值8。研究结果表明,优化后的化学镀钯镀液稳定性高、沉积速度快、钯膜与基体镍镀层结合力强、钯镀层光亮性好。     

NH_3 Plasma Surface Treatments of Engineering Fluoropolymers: A Way to Enhance Adhesion of Ni or Cu Thin Films Deposited by Electroless Plating

FLUOROPOLYMERS(FPs)are thermoplasticmaterials which exhibit a number of unique chemicaland physical characteristics that no other man-madeplastic product gets together.For example,FPs showvery good resistance to almost all chemicals,excellentwater vapor barrier properties,high thermal stability,outstanding electrical insulation properties(lowdielectric constant and dissipation factors),extremelylow frictional coefficient giving them high auto-lubrication properties,high resistance to rad…     

Electroless plating of palladium and copper on polypyrrole films

A novel process for the metallization of polypyrrole (PPY) film surface through consecutive electroless plating of palladium and copper in the complete absence of the SnCl₂ sensitization step was demonstrated. X-ray photoelectron spectroscopy (XPS) technique was used to characterize the polymer surface at each stage of the metallization process. It was found that only the fully reduced PPY film could reduce palladium ions to palladium metal (Pd(0)) in substantial amounts from either the Pd(NO₃)₂ or PdCl₂ acid solution. The palladium metal was necessary for catalyzing the subsequent electroless plating of copper. The reduction of Pd(II) ions in acid solution to Pd(0) on the film surface was accompanied by a simultaneous increase in intrinsic oxidation state and doping level of the film. The copper plating process after the palladium uptake step was highly dependent on the [Pd]/[N] ratio on the film. Through XPS and Auger photoeletron spectroscopy measurements, it was postulated that during the electroless copper plating process, the Cu(II) ions were first reduced to Cu(I) on the PPY film surface before complete reduction to copper metal.     

A novel surface activation method for Ni/Au electroless plating of acrylonitrile-butadiene-styrene

Direct electroless metallization on acrylonitrile-butadiene-styrene (ABS) plastic with Pd-free activation method could reduce the cost of production. A novel surface activation method with the immobilization of Ni(0) nanoparticles by chitosan (CTS) film on ABS and then the deposition of Ni and Au on ABS were investigated in this paper. X-ray photoelectron spectroscopy (XPS), fourier transform infrared (FTIR) spectra and scanning electron microscopy (SEM) data revealed the related interfacial reaction mechanism in activation process. The Ni(0) nanoparticles immobilized by the CTS films were effective auto-catalysts in the nickel electroless plating process. The formations of Ni plating layers at different deposition time were observed by SEM. The x-ray diffraction (XRD) patterns revealed the Ni layer at 30 min was in an amorphous phase. Au was successfully plated on the Ni layers in a new, stable non-cyanide Au electroless plating bath with different reducing agents. The chemical compositions of Ni/Au layers were analyzed by inductive couple plasmas (ICP) and ion chromatography (IC) measurements. Inorganic element (P or S) from reducing agents made the surface morphology of Au layers different in SEM images. However, they did not change the Au crystallization phase at all based on XRD patterns.     

镀覆金属对金刚石性能的影响及其在自蔓延高温中的变化

通过扫描电子显微镜和X射线衍射分析研究了经盐浴镀Ti和化学镀Ni和Cu处理的人造金刚石表面形貌、镀层界面的结构和组成，并研究了镀膜金刚石在Ni—Al自蔓延高温反应体系中的变化。发现盐浴镀Ti的金刚石的镀层界面结构致密；镀膜金刚石可以经受Ni—Al自蔓延高温并保持较好的形态。     

化学镀镍诱发过程催化活性的电化学本质

ＸＰＳ电子能谱技术的测定表明,化学镀诱发伊始,先只有镍的沉积,然后才有ＮｉＰ的共沉积出现。结合铜基试样在所设计的４种溶液体系中动电位扫描伏安曲线的结果,初步显示,对化学镀镍具有催化特性的金属,从电化学本质上来说,就是一种自身能提供到达或超过镍的析出电位的金属。通过电极电位的理论计算及混合电位的测定,说明了化学镀镍首先是镍析出,然后再发生ＮｉＰ共沉的机理     

Silver nanoparticle catalyst for electroless Ni deposition and the promotion of its adsorption onto PET substrate

Silver nanoparticle catalyst was prepared to replace Pd catalyst for electroless Ni plating. The adsorption of Ag nanoparticle onto the poly(ethylene terephthalate) (PET) was promoted by conditioning the substrate with 3-aminopropyltrimethoxysilane and 3-mercaptopropyl- triethoxysilane. Electroless Ni deposition was started at the PET substrates catalyzed with Ag nanoparticle linking to the substrate via Ag-S bond. The composition and topography of nickel plating PET films were characterized by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD) and energy dispersive X-ray (EDX) analysis, respectively. Peel adhesion strength, more than 50 N/cm, was achieved for planting nickel layer to the Ag activated PET substrate; however, a relative low value as 10.2 N/cm was obtained for the sample with Pd catalyst by the same measurement. Silver catalyst together with silane modification has the significant merits for electroless deposition of Ni on PET film.     

化学镀 Ni-Mo-P 合金镀层的组织结构与防垢性能研究

目的采用材料测试方法和防垢实验,研究不同工艺条件下的化学镀Ni-Mo-P合金镀层的组织结构与防垢性能。方法在化学镀Ni-P镀层基底上,添加含有钼酸根离子杂多酸盐,在不同工艺条件下化学沉积Ni-Mo-P合金镀层,研究化学镀Ni-Mo-P合金镀层的表面形貌和组织结构,分析镀液中硼酸含量和钼酸铵含量对镀层沉积速率的影响,观测镀层在结垢实验后的表面形貌并分析结垢速率。通过SEM,XRD和EDS对化学镀Ni-Mo-P合金镀层的表面形貌和组织结构进行检测,研究在酸性镀液中硼酸含量对化学镀Ni-Mo-P工艺条件的影响。采用防垢实验测试化学镀Ni-Mo-P合金镀层的防垢性能。结果在化学镀Ni-Mo-P过程中,钼酸根离子杂多酸盐具有稳定作用。化学镀Ni-Mo-P合金镀层的化学沉积镀液的最佳工艺条件为:Ni SO4·6H_2O 16.5 g/L,Na H_2PO_2·H_2O 20 g/L,钼酸钠0.5~0.8 g/L,硼酸2 g/L,乙酸钠7.5 g/L。化学镀Ni-Mo-P合金镀层的结垢速率明显低于化学镀Ni-P镀层,具有良好的防垢能力,形成了非晶态的镀层。结论采用化学镀Ni-P镀层基底上沉积得到非晶态的Ni-Mo-P合金镀层,硼酸具有调节镀液p H值和络合作用,非晶态的Ni-Mo-P合金镀层平均结垢速率最小值为0.58μm/h,具有良好的阻垢能力。     

化学镀Ni-Cu-P合金工艺研究

通过实验数据及图表论述了化学镀 Ni- Cu- P的工艺条件 ,探讨了镀液的主要组成成分、镀液的 p H值、施镀时间对镀层中 Ni、Cu、P质量百分含量、镀层的沉积速度的影响 ,总结随工艺参数变化镀层成分变化的趋势及规律     

A method for polyaniline coatings on solid polystyrene surfaces and electroless copper deposition

A new efficient method is presented for electroless copper deposition on solid polystyrene surfaces via polyaniline (PANI) coatings. It was demonstrated that, partial polymerization of aniline by catalytic air oxidation in the presence of dissolved polystyrene (PS) (M_n: 87.000 K) gives viscous solution of PANI-PS mixture in aniline. Direct application of the polymerization mixture with copper catalyst onto polystyrene sheets (5 × 15 cm) resulted in extension of the polymerization by air oxygen to give a smooth PANI-PS composite layer on the host surface. Treatment of the surface with a similar PANI solution without PS gave Emeraldine base film with homogenously dispersed copper. Reduction of the surface copper by diluted hydrazine (5%) yielded zero-valent copper serving as seed points for accumulation of more copper from an electroless plating solution in the following process. Experiments showed that, the method presented offers a simple pathway to produce excellent copper deposits on PS substrate. This method is superior to traditional electroless plating process, since tedious surface etching and expensive palladium activation steps are being avoided. The surface characteristics were examined by X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM), adhesion tests and contact angle measurements. The results showed that, the electroless plating process gives a homogeneous and highly robust copper layer with 34.2 μm of thickness within 48 h. Adhesion of the copper layer to the underlining surface was satisfactory as inferred from pull-off measurements (1.6 N/mm²).     

化学镀镍工艺对空心微球表面包覆效果及其电磁性能的影响

采用化学镀工艺在空心微球表面包覆一层金属Ni,以获得轻质吸波材料。针对空心微球比表面积大的特点,深入探讨化学镀工艺中镀液的主盐和络合剂的浓度比以及镀液pH值对Ni包覆空心微球效果的影响。在此基础上,确定了化学镀液的主盐和络合剂浓度比为0.46,主盐的浓度为0.12mol/L,以及与之相匹配的化学镀工艺参数pH值为8。最后对包覆Ni的空心微球的电磁性能进行测量,发现所得的功能化空心微球具有一定的电磁损耗性能。     

Copper-Ti3SiC2 composite powder prepared by electroless plating under ultrasonic environment

In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 μm in diameter on an average. The Cu plating was carried out at middle temperature （62-65℃） with the application of ultrasonic agitation. The copper deposition rate was determined by measuring the weight gain of the powder after plating. It has been found that the pretreatment of Ti3SiC2 powder is very important to obtain copper nanoparticles on the surface of Ti3SiC2 The optimum procedure before plating aimed to add activated sites and the adjustment of the traditional composition of the electroless copper plating bath could decelerate the copper deposition rate to 0.8 gm/h. X-ray diffraction （XRD） indicates that the chemical composition of the plating layer is copper. SEM images show that the surface of the Ti3SiC2 particles is successfully coated with continuous copper layer. The wetting property between the copper matrix and Ti3SiC2 can be improved so as to increase the interfacial strength.     

化学沉积Fe-Ni-La-P合金镀层影响因素分析

采用化学沉积的方法制备Fe-Ni-La-P合金镀层,通过重量法、电化学法分析了镀液成分对Fe-Ni-La-P镀层沉积行为的影响.结果表明,改变镀液组成和沉积工艺,沉积速度随之改变.用电化学方法计算得到的沉积速率与重量法测得的的沉积速率有相同的变化趋势.     

化学镀 Cu-Co-P 非晶合金及其催化性能表征

目的优化Cu-Co-P非晶合金的化学镀工艺,研究其对硼氢化钠水解制氢的催化性能。方法以铁片为基体,研究化学镀Cu-Co-P非晶合金的制备工艺,探讨镀液成分对沉积速率、镀液稳定性及镀层质量的影响,并根据研究结果筛选出化学镀Cu-Co-P的优化配方。采用该配方对氧化铝(γ-Al2O3)基体施镀,制备出负载型Cu-Co-P/γ-Al2O3非晶合金催化剂,对其组成、形貌和结构等进行表征。利用硼氢化钠水解制氢实验,评价制备的负载型Cu-Co-P多元合金催化剂的催化性能。结果根据优化配方制备出的负载型非晶合金Cu-Co-P/γ-Al2O3催化剂的比表面积为233 m2/g,相对组成为57.85%Cu+39.69%Co钴+2.46%P(均为质量分数)。45℃条件下,在20 m L含1 g硼氢化钠和1 g氢氧化钠的溶液中,硼氢化钠水解制氢的速率为1295 m L/(g·min)。结论化学镀Cu-Co-P的优化配方组成为:硫酸钴20 g/L,硫酸铜0.7 g/L,次亚磷酸钠40 g/L,柠檬酸钠20 g/L,EDTA-2Na 10 g/L,氟化铵25 g/L。工艺参数为:温度(85±1)℃,p H=9。     

离子注入陶瓷化学镀Cu工艺的优化

离子注入可作为前处理工艺辅助Al2O3陶瓷表面化学镀铜,优化了离子注入后以甲醛为还原剂、酒石酸钾钠为络合剂的碱性化学镀铜的基本配方.探讨了主盐浓度、甲醛、pH值、温度等对沉铜速度和镀层表面粗糙度的影响.研究了注入不同金属对沉铜速度的影响,结果表明注入铜比注入镍的化学镀铜速度快.     

镁合金微弧氧化层化学镀镍的镍盐活化工艺研究

通过差热分析、扫描电镜?斓仁侄?对镁合金微弧氧化层化学镀镍的镍盐活化工艺进行了研究,并与钯盐活化的效果进行了对比。结果表明:用镍盐对镁合金微弧氧化陶瓷层进行化学镀镍的活化是可行的,活化需要通过活化液室温浸泡和热还原两个步骤完成,活化液配方和热还原工艺是影响活化效果的重要因素;与钯盐活化相比,镍盐活化后化学镀镍的镀速低,最终形成的镀层厚度小,但有利于保持化学镀液在施镀过程中的稳定性。     

化学镀法制备Ni包覆ZrO_2微粉

采用共沉淀t-ZrO2(10%MgO,以摩尔计)微粉为基体原料,用化学镀法制备了不同Ni含量的Ni包覆ZrO2复合微粉.由于采用了合适的络合剂和稳定剂,反应速度易于控制,且粉末不需活化处理即可施镀.运用XRD、SEM、EPAX等分析检测技术研究了粉体.结果表明,镀覆后颗粒均由Ni和ZrO2两种成份复合而成,达到了均匀分散金属相和陶瓷相的目的     

Electroless deposition of Ni on template of halloysite and its magnetic property

Halloysite template, a ceramic substrate, is of a hollow cylindric structure, on which the fine Pd nanoparticles are uniformly formed by the reduction of palldate chloride to initiate electroless deposition. The electroless deposition of Ni is catalyzed by the Pd particles, which results in a uniform layer of Ni-P alloy on halloysite. The alloy is of a nanocrystalline structure, of which the average diameter is about 6 nm. After being heat-treated at 400 ℃, it contains both Ni and Ni12P5 crystal, meanwhile, the Ni crystal gets larger with an average size of 51.9 nm.The content of phosphorous in the Ni layer has a great influence on crystal structure. The metallized halloysite has a higher inherent coercive force, and a much lower saturation magnetization in its as-plated state, while after heattreatment, the inherent coercive force decreases drastically. These magnetic properties have great relationship with the superparamagnetism of Ni nanocrystalline and the stress anisotropy in Ni layer.     

Novel technology of electroless Ni-W-P on plastics and its interface behavior

The electroless Ni-W-P coatings on polyoxymethylene(POM) were prepared. The POM was pretreated by hot spraying Al powder on it. Before the electroless Ni-W-P deposition, the POM with Al coating was flash plated in alkaline bath. The mechanism of Ni-W-P deposition was studied and the technology was optimized. The XRD analysis shows that the "as-deposited" Ni-W-P plating has mixed crystalline structure. The hardness value of deposits is more than HV700. The abrasion resistance of deposits is six times more than that of POM. Bending test was used to determine the cohesion between the deposits and the substrates. SEM was used to study the behavior of surface abrasion and interface bonding condition. The reason for the excellent cohesion was interpreted.     

稀土元素对酸性化学镀镍的影响*

在酸性化学镀镍磷合金镀液中添加稀土元素(La、Pr、Nd),研究了其对镀速的影响。对镀层进行了XRD分析,用SEM观测表面形貌,EDX分析镀层组成,并进行了耐腐蚀极化曲线测定。结果表明在镀液中添加稀土离子能显著降低镀速,甚至完全终止Ni-P的沉积。镀液中添加稀土时,镀层中不含稀土元素,镀层仍为非晶态结构,但P含量略有降低,镀层的表面形貌发生了变化。镀液中含稀土(La、Pr、Nd)时,所得镀层在3.5%NaCl溶液中的自腐蚀电位降低,腐蚀电流密度增大,耐腐蚀性降低。