Multiple-channel GaAs/AlGaAs high electron mobility transistors

Multiple-channel high electron mobility transistors (HEMT's) have been designed and fabricated on GaAs/AlGaAs heterostructural material grown by molecular beam epitaxy (MBE). The sheet carrier density of the two-dimensional electron gas (2-DEG) measured at 77 K was linearly proportional to the number of high mobility electron channels, and reached 5.3 × 10¹²cm^-2for six-channel HEMT structures. Depletion-mode devices of the double-heterojunction HEMT were operated between negative pinchoff voltage and forward-biased gate voltage without any transconductance degradation. A peak extrinsic transconductance of 360 mS/mm at 300 K and 550 mS/mm at 77 K has been measured for a 1-µm gate-length double-heterojunction enhancement-mode device. An extremely high drain current of 800 mA/mm with a gate-to-drain avalanche breakdown voltage of 9 V was measured on six-channel devices.     

Fabrication and characterization of AlGaAs/GaAs heterojunction bipolar transistors

The fabrication and characterization of MBE-grown AlGaAs/GaAs heterojunction bipolar transistors (HBT's) are described, A Be redistribution profile in the HBT epi-layer at the emitter-base heterojunction interface is investigated using secondary ion mass spectrometry, A relatively high substrate temperature of 650°C during growth can be employed by introducing a 100-Å undoped spacer layer between the emitter and base layer. A simple wafer characterization method using phototransistors is demonstrated for accurately predicting current gain in a three-terminal device. A dc current gain of up to 230 is obtained for the fabricated HBT with a heavy base doping of 1 × 10¹⁹/cm³. A gain-bandwidth product fTof 25 GHz is achieved with a 4.5-µm-width emitter HBT.     

AlGaAs/Ge/GaAs heterojunction bipolar transistors grown bymolecular beam epitaxy

An N-Al_0.22Ga_0.78As emitter, p-Ge base, and n-GaAs collector (AlGaAs/Ge/GaAs) heterojunction bipolar transistor (HBT) in the emitter-up configuration grown by molecular beam epitaxy is discussed. Devices exhibited common-emitter current gains of as high as 300 at a collector current density of 2000 A/cm² and a collector voltage of 4 V. As the device area is reduced from 50×50 to 10×40 μm, the current gain did not show significant changes, suggesting a low surface recombination velocity in the Ge base     

DC modeling and characterization of AlGaAs/GaAs heterojunctionbipolar transistors for high-temperature applications

The large signal dc characteristics of AlGaAs/GaAs heterojunction bipolar transistors (HBT) at high temperatures (27°-300°C) are reported. A high-temperature SPICE model is developed which includes the recombination-generation current components and avalanche multiplication which become extremely important at high temperatures. The effect of avalanche breakdown is also included to model the current due to thermal generation of electron/hole pairs causing breakdown at high temperatures. A parameter extraction program is developed and used to extract the model parameters of HBT's at different temperatures. Fitting functions for the model parameters as a function of temperature are developed. These parameters are then used in the SPICE Ebers-Moll model for the dc characterization of the HBT at any temperature between (27°-300°C)     

Microwave properties of self-aligned GaAs/AlGaAs heterojunction bipolar transistors on silicon substrates

(Al,Ga)As/GaAs heterojunction transistors (HBT's) grown on Si substrates have been characterized at microwave frequencies and have been found to perform extremely well. For emitter dimensions of 4 × 20 µm², current gain cutoff frequenciesf_{T} = 30GHz and maximum oscillation frequenciesf_{max}of 11.5 GHz have been obtained in a mesa-type structure. These values compare very well with thef_{T} = 40GHz andf_{max} = 26GHz which are the highest reported for HBT's on GaAs substrates in a nonmesa structure with an emitter width of ∼ 1.5 µm. These results clearly demonstrate the potential of HBT's in general at microwave frequencies, as well as the viability of GaAs on Si technology.     

Inverted GaAs/AlGaAs modulation-doped field-effect transistors with extremely high transconductances

Inverted GaAs/AsGaAs MODFET's with transconductances as high as 1810 mS/mm at 77 K and 1180 mS/mm at 300 K are fabricated using a self-aligned process. The devices have the gate-heterojunction interface spacing of only 100 Å, and the observed values of the transconductance are limited primarily by the source series resistance and by the gate current. The MODFET characteristics are interpreted using the charge control velocity saturation model which takes into account the gate current. The obtained results show a great potential of inverted MODFET's for ultrahigh-speed applications.     

High-performance AlGaAs/GaAs SDHTs and ring oscillators grown byMBE on Si substrates

High-performance AlGaAs/GaAs selectively doped heterojunction transistors (SDHTs) and 19-stage oscillators fabricated on silicon substrates are discussed. Epitaxial layers of AlGaAs/GaAs were grown by MBE on Si substrates. The mobility of two-dimensional electron gas (2DEG) in the SDHTs was as high as 53000 cm²/V-s at 77 K for a sheet charge density of 10×1¹² cm^-2. For 1-μm-gate-length devices, maximum transconductances of 220 and 364 mS/mm were measured at 300 and 77 K, respectively, for the SDHTs. A minimum propagation delay time of 27 ps/stage at room temperature was obtained for a 19-stage direct-coupled FET logic ring oscillator with a power dissipation of 1.1 mW/stage. The propagation delay time was reduced to 17.6 ps/stage at 77 K. From microwave S-parameter measurements at 300 K, current gain and power gain cutoff frequencies of 15 and 22 GHz, respectively, were measured. These results are comparable to those obtained for SDHT technology on GaAs substrates     

AlGaAs/GaAs Heterojunction bipolar power transistors

An AlGaAs/GaAs heterojunction bipolar transistor with a total emitter periphery of 320 ?m has been developed for power amplifier applications. For the base contact, Zn diffusion was used to convert the n-type emitter material into p-type with a doping of ?1.0 × 1020 cm?3. Because of the highly doped layer, contact resistivity was extremely low (5 × 10?7 ?cm2). At 3 GHz, a CW output power of 320 mW with 7 dB gain and 30% power-added efficiency was obtained. Under pulsed operation, the output power increased to 500 mW with 6 dB gain and 40% power-added efficiency. With further device structure optimisations, the power performance of heterojunction bipolar transistors is expected to rival, or even surpass, that of the GaAs MESFETs.     

Magnetotransport phenomena in single AlGaAs/GaAs quantum wires grown on laterally patterned substrates

Single, sub-micrometer wide quantum wires have been fabricated using molecular beam epitaxy on mesa-etched GaAs substrates, where the GaAs wire is embedded in AlGaAs. By using a Hall bar pattern, potential probes were directly attached to the wires while grown. To avoid problems associated with anisotropic etching and regrowth, the wire structures were oriented along the 100 crystallographic directions. From this fabrication technique, described in detail by Shitara et al., Appl. Phys. Lett. 66, 2385 (1995), one can expect the formation of high quality “self-aligned” quantum wires with a confinement potential determined by the conduction band discontinuity of AlGaAs and GaAs. Here we study the four-point magnetoresistance of 50 μm long single quantum wires with widths between 250 and 700 nm from 1.3 to 21 K. A distinct weak localization peak and universal conductance fluctuations dominate the low magnetic field regime and are used to estimate the phase-coherence length of the electrons. Pronounced 1/B periodic quantum oscillations at magnetic fields above 1 T are consistent with the picture of wires with a square-well shaped confining potential.     

GaAs/AlGaAs heterojunction bipolar transistors for integrated circuit applications

Molecular-beam epitaxy (MBE) and ion implantation were used to fabricate GaAs/AlGaAs heterojunction bipolar transistors with buried wide bandgap emitters. Inverted-mode current gains of ∼ 100 were obtained, demonstrating the feasibility of this technology for I²L types of digital integrated circuits.     

Quantum-well p-channel AlGaAs/InGaAs/GaAs heterostructureinsulated-gate field-effect transistors with very high transconductance

Quantum-well p-channel pseudomorphic AlGaAs/InGaAs/GaAs heterostructure insulated-gate field-effect transistors with enhanced hole mobility are described. The devices exhibit room-temperature transconductance, transconductance parameter, and maximum drain current as high as 113 mS/mm, 305 mS/V/mm, and 94 mA/mm, respectively, in 0.8-μm-gate devices. Transconductance, transconductance parameter, and maximum drain current as high as 175 mS/mm, 800 mS/V/mm, and 180 mA/mm, respectively were obtained in 1-μm p-channel devices at 77 K. From the device data hole field-effect mobilities of 860 cm²/V-s at 300 K and 2815 cm²/V-s at 77 K have been deduced. The gate current causes the transconductance to drop (and even to change sign) at large voltage swings. Further improvement of the device characteristics may be obtained by minimizing the gate current. To this end, a type of device structure called the dipole heterostructure insulated-gate field-effect transistor is proposed     

Neutron radiation effects in high electron mobility transistors[AlGaAs/GaAs]

The effect of fast neutron radiation has been investigated in High Electron Mobility Transistors (HEMT's). Devices with different layer structures have been employed for the better understanding of failure mechanism sources. The deep traps introduced by neutron irradiation in the AlGaAs donor layer have been, for the first time, studied. The application of charge control model allowed the determination of buffer layer degradation and the theoretical estimation of the shift of the threshold voltage     

Cathodoluminescence study of AlGaAs/GaAs multilayers grown on ridge-type triangles on GaAs (111)A substrates

We have studied the cathodoluminescence of AlxGa1-xAs/GaAs multilayers grown on ridge-type triangles by molecular beam epitaxy. The compositional variation of Al, as well as the distribution of impurity and/or defect, was revealed by variations in the cathodoluminescence spectra and images. The Al composition in an AlxGa1-xAs layer was highest in the (111)A facet and decreased in the order (100), (411)A, (111)-delta and (110) facets. On the other hand, the carbon concentration was highest in the (411)A facet and decreased in the order (111)A, (111)-delta, (100) and (110) facets. It should be noted that the (111)-delta facet has a significant effect on the redistribution of Al. Although our ridge-type triangles are rather large for the quantum structures, these data have elucidated the self-organization mechanism of the AlxGa1-xAs/GaAs system and have yielded information on the design of quantum structures. We conclude that cathodoluminescence observation is a powerful tool for studying the compositional variation or band structure of three-dimensional microscale or nanoscale construction.     

High-frequency characteristics of AlGaAs/GaAs heterojunction bipolar transistors

The fabrication and high-frequency performance of MBE-grown AlGaAs/GaAs heterojunction bipolar transistors (HBT's) is described. The achieved gain-bandwidth product fTis 25 GHz for a collector current density Jcof 1 × 10⁴A/cm²and a collector-emitter voltage VCEof 3 V.fTcontinues to increase with the collector current in the high current density region over 1 × 10⁴A/cm²with no emitter crowding effect nor Kirk effect. The limitation on fTin fabricated devices is found to be caused mainly by the emitter series resistance.     

Fabrication and characterization of InGaP/GaAs heterojunction bipolar transistors on GOI substrates

In this letter, we report the first demonstration of InGaP/GaAs heterojunction bipolar transistors (HBTs) on germanium-on-insulator (GOI) substrates. We have performed physical characterization of the epitaxial layers to verify the high quality of the III-V epitaxial material grown on the GOI substrates and performed dc characterization of large-area InGaP/GaAs HBTs fabricated on the substrates. The InGaP/GaAs HBTs realized on GOI substrates were compared with identical devices grown on bulk germanium substrates and similar devices on semi-insulating GaAs substrates.     

Dual junction GaInP/GaAs solar cells grown on metamorphic SiGe/Si substrates with high open circuit voltage

Dual junction GaInP/GaAs solar cells have been grown and fabricated on Si substrates using relaxed, compositionally graded SiGe buffer layers that provide a nearly lattice-matched low threading dislocation Ge surface for subsequent cell growth. The dual junction cells on SiGe/Si displayed high open circuit voltages in excess of 2.2 V, compared to 2.34 V for control cells on GaAs, that are consistent with maintaining the 1.8/spl times/10/sup 6/ cm/sup -2/ threading dislocation density throughout the cell structure. Even with total current output limited by large grid coverage and high reflectance, total area AM1.5G efficiency is 16.8%, with active area efficiency at 18.6%. The high V/sub oc/ establishes that SiGe metamorphic buffers are viable for integrating III-V multijunction cells on Si in a monolithic process.     

Collector-top GaAs/AlGaAs heterojunction bipolar transistors for high-speed digital ICs

GaAs/AlGaAs collector-top heterojunction bipolar transistors with magnesium and phosphorus double-implanted external bases were fabricated. A cutoff frequency of 17 GHz and a gate delay time of 63 ps for DCTL were obtained. These results indicate the potential of collector-top HBTs for high-speed ICs.     

Threshold voltage scattering of GaAs MESFET's fabricated on LEC-grown semi-insulating substrates

Threshold voltage standard deviation (sigma V_{th}) for MESFET's on a liquid encapsulated Czochralski (LEC) grown GaAs wafer was investigated, in connection with dislocation distribution. Threshold voltage (Vth) scattering was found to be strongly correlated to the dislocation cell network structure in the substrate. This dislocation cell network is characteristic of the LEC-grown crystal. At largesigma V_{th}region, strongly networked dislocation cell structure was observed. In the area where dislocations distributed randomly without network structure,sigma V_{th}was small in spite of high dislocation density. For FET's located in the dislocation-free region inside the network cell, low drain current Idsand high Vthwere recognized directly by a curve tracer. The experimental results regarding the dislocation network effect on Vthscattering are discussed along with cathodoluminescence study results.