粉状铝基钎料的高频钎焊工艺研究

介绍了粉状铝基钎料的制备方法,探讨了粉状铝基钎料的工艺性能。从表面张力的角度出发,讨论了粉末粒度、氧含量、加热速度、加热均匀性、钎料钎剂比例等因素对高频铝材钎焊工艺和性能的影响。结果表明:用粒度在150~180μm的粉状铝基钎料钎焊铝材,其钎焊剪切强度较高;加热速度较快、加热盘温度均匀的钎焊效果较好;钎料钎剂的比值在10∶8~10∶10范围钎焊效果较好。     

钎焊金刚石工具的研究现状与展望

从钎焊工艺、钎焊料、工具产品和生产自动化4个方面介绍了当前国内外钎焊金刚石工具的研究成果，并在此基础上对钎焊金刚石工具下一步的研究重点进行了展望。详细论述了钎焊温度、保温时间、钎料合金成分对钎焊金刚石的影响。适宜的钎焊温度和保温时间可以保证金刚石/钎料界面发生充分反应，界面结合强度增强，获得较好的钎焊接头质量。添加适量的元素或化合物改进钎料合金成分，可以调控钎料的性能，降低金刚石石墨化和热损伤程度。概括总结了常规钎焊金刚石工具、磨粒有序排布钎焊金刚石工具及细粒度钎焊金刚石工具的发展现状，钎焊金刚石工具具有电镀和烧结金刚石工具无可比拟的优点；金刚石有序排布会提高工具的加工效率和使用寿命，提高磨削表面质量；对细粒度钎焊金刚石工具亟待解决的磨粒等高性和分布均匀性问题的研究进行了概述。     

含锑软钎料钎焊黄铜组织与性能的研究

为判断含锑钎料钎焊黄铜是否可行 ,研究了锡铅锑钎料钎焊H6 2黄铜时锑与锌的作用 ,并对其接头的组织与性能进行了深入分析。研究结果表明锡铅锑钎料钎焊黄铜的接头组织中未发现锌锑化合物相 ,含锑量0 2 2 %～ 0 .8% (质量分数 )的锡铅锑钎料钎焊黄铜未引起接头性能下降 ,认为可以钎焊黄铜。     

高磷铜钎料的研制和应用

研制的ZQ—11无银高磷韧性钎料解决了高磷钎料的脆性以及不能对铁族合金钎焊的问题。在封闭式车前灯的使用中,成功地取代了HLAgCu30—25钎料。在冷气机、空调机、刀具等方面的钎焊可取代含银5％～45％的钎料。同时还探讨了材料研制和使用考核的内在机制,从而突破了钎焊手册磷铜钎料不能用于铁族合金的规定。     

TiAl合金钎焊研究进展

TiAl合金钎焊因具有无气体杂质、对母材力学性能影响小、钎料成分易控制等突出优点而被广泛应用。概述了TiAl合金的发展历程及其组织特点,重点介绍了TiAl合金钎料种类以及钎焊工艺对焊接接头组织与性能的影响,最后指出TiAl合金钎焊技术的发展方向：加强焊接接头的动态试验研究,如疲劳性能、冲击韧性及蠕变试验;从扩散机理出发,首先进行热力学和动力学分析,再根据母材成分变化设计专用钎料;进一步扩展TiAl合金钎焊技术的应用领域。     

DA8501钎料的研制及应用

ＤＡ８５０１钎料是一种新型代银，节能钎料，具有熔点低，钎焊性能好和易于加工成形的综合性能，能在较宽领域内代替含银５０％的银钎料，用于钢材，硬质合金，铜及铜合金等材料的钎焊，亦可代替黄铜钎料，降低钎焊温度，节约能源。     

L631钎剂研制

一、概述 1989年试用我所研制的铜磷钎料的厂家,要求为他们研制与铜磷钎料配用的钎剂,这种钎剂国产的各系列于生产不理想,长期都依靠香港进口。根据厂家的要求,我所组成了钎剂研制组。在生产现场观察,了解钎焊操作情况。我所有条件研制出一种可代替外国进口的钎剂,配合CP系列钎料作钎焊用。     

钛基非晶态钎焊料发展评述

钛基非晶态钎焊料是一种较有应用前景的新型钎焊材料。本文综述钛及钛基钎焊料的发展,结合非晶态钎焊材料的特点,列举现有钛基非晶钎焊料及其典型应用实例,并对钛基非晶态钎焊材料的研究发展趋势作出展望。     

PDC钻头用急冷钎料的研究

本文针对PDC钻头焊接的需要,研究了硬质合金真空钎焊用的Ag-Cu-In-Ti活性钎头。结果表明,在PDC热稳定极限温度以下,急冷的Ag-Cu-In-Ti钎料可以连接硬质合金,接头剪切强度可达308MPa以上。连接过程中,活性元素Ti起着重要的作用。Ti在结合界面富集并与硬质合金发生化学反应,反应的主要产物为TiC。钎焊温度和保温时间都有一个最佳范围,在此范围之内,接头强度最高。     

BNi73CrSiB-40Ni钎料的钎焊工艺性能及接头组织研究

为了解BNi73CrSiB—40Ni钎料的钎焊工艺性能，对该钎料进行了表面质量分析、化学成分分析及DTA测试，以GH3044，ЭП708高温合金为母材，研究了钎料的铺展面积、填充间隙能力、漫流长度等钎焊工艺性能。结果表明：该钎料具有良好的流动性能、良好的填充间隙性能，适宜大间隙和不等间隙接头的钎焊。该钎料的钎焊接头中有大量的固溶体组织，不同于常用钎料BNi82CrSiB的钎焊接头的组织。     

Ultrasonic-Assisted Soldering of 5056 Aluminum Alloy Using Quasi-Melting Zn-Sn Alloy

To obtain sound butt-joints of 5056 aluminum alloy rods, ultrasonic-assisted soldering was conducted using Zn-18Sn and Zn-60Sn alloys. Each solder foil was inserted between rods of 5056 aluminum alloy. Ultrasonic vibration was propagated to faying surfaces at soldering temperatures below the liquidus temperature of the solder alloys, and then the samples were air cooled to room temperature. The optimum vibration time at the soldering temperature must be more than 2 seconds to have complete wetting and less than 4 seconds to avoid excessive dissolution of the 5056 alloy. The 5056 alloy joints soldered using quasi-melting. Zn-Sn alloys showed greater strength than the joints soldered at the temperatures over its respective liquidus temperature. As the soldering temperature was increased, the increased formation of the intermetallic compound Mg₂Sn or phases containing Mg generated by dissolution of 5056 into the solder layer decreased the joint strength. Ultrasonic-assisted soldering at an optimum temperature between solidus and liquidus of the Zn-Sn alloys is an important consideration for producing sound joints with sufficient strength.     

The 1996 Bigelow Award of the Boston Surgical Society: Henry Jacob Bigelow and David C. Sabiston, Jr

STATEMENT OF PROBLEM: For laboratory production, it would be economically advisable to reuse excess cobalt-chromium alloys in manufacturing partial denture frameworks. Furthermore, discrepancies in fit, modifications, repairs, and also economic factors could lead to soldering procedure on the metal framework. PURPOSE: This study evaluated the influence of soldering and remelting procedures on the fatigue strength of Steldent, Dentorium, and Biosil cobalt-chromium alloys, as new alloys and in a mixture of new and previously casted alloy and when submitted or not submitted to conventional soldering procedure. MATERIAL AND METHODS: The soldering procedure was conducted in rod specimens 1.7 mm in diameter made with new, or with a mixture of new and reused alloy (n = 10 per group). The results were compared with those of intact rods. The fatigue strength was carried out with a cyclic testing machine simulating the insertion and the removal of partial dentures. After failure, the fracture surface was examined with a scanning electron microscope. RESULTS: The soldered specimens revealed 1119 loading cycles before fracture. These means differed statistically from those of intact alloys, which disclosed 2733 cycles before failure (p < 0.05). Statistical analysis indicated that the soldering procedure reduced fatigue strength of all new alloys or those in a mixture of new and previously casted alloys. It was also found that the soldering procedure may cause premature failure of a removable partial denture. Photomicrographs from fracture surfaces revealed the presence of inclusions and voids. Conversely, there were no significant differences between new and reused specimens, soldered or not (p > 0.05), which suggested that it may be possible to reuse excess cobalt-chromium alloys without compromising the fatigue strength of the framework.     

高炉钻头的工艺及改进措施

根据高炉开铁口钻的工作条件,选择钻头结构材料,包括钢材、硬质合金、钎料、焊剂。采用感应钎焊工艺,钻头性能满足钢铁厂开口作业要求,通过产品跟踪分析钻头报废形式,通过改进措施完善钻头设计、钎焊工艺。     

工业炉在钎焊工艺中的应用

介绍了工业炉在焊接工艺中的应用,引用设备实例对真空钎焊炉及氮基钎焊炉的原理、结构、控制方法及使用特点进行了详细描述.     

The development of technology for making SvAK12 welding wire from shaving billet

A technology for making a welding wire with a diameter of 1.2 and 2.0 mm from the shavings of SvAK12 aluminum alloy is developed. This technology includes hot briquetting the graded shaving scrap at 400–420°C, the hot extrusion of briquettes at 460–470°C with elongation factors of 32 and 56, cold wire drawing the extruded bars with average unit reductions for a pass of 15–20%, and intermediate annealings at 400°C. It is shown that this wire is suitable for soldering parts of aluminum alloys, and the level of the mechanical properties allows it to be recommended for wide application.     

Mechanisms of Soldering Formation on Coated Core Pins

Die soldering is one of the major casting defects during the high-pressure die casting (HPDC) process, causing dimensional inaccuracy of the castings and increased downtimes of the HPDC machine. In this study, we analyzed actually failed core pins to determine the mechanism of soldering and its procedures. The results show that the soldering process starts from a local coating failure, involves a series of intermetallic phase formation from reactions between molten aluminum alloys and the H13 steel pin, and accelerates when an aluminum-rich, face-centered cubic (fcc) phase is formed between the intermetallic phases. It is the formation of the aluminum-rich fcc phase in the reaction region that joins the core pin with the casting, resulting in the sticking of the casting to the core pin. When undercuts are formed on the core pin, the ejection of castings from the die will lead to either a core pin failure or damages to the casting being ejected.     

Soldering of Mg Joints Using Zn-Al Solders

Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 °C, 450 °C, 475 °C, and 500 °C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.     

Application of combined casting–pressing for the fabrication of aluminum wire for soldering waveguides

Technical and process features of a flowsheet for fabricating the wire of casting aluminum alloys intended to solder waveguides with the use of the combined continuous casting–pressing of nonferrous metals are considered. The dependences necessary and sufficient to design the constructive elements of equipment and process modes providing the implementation of conditions for the stable run of processes of continuous supply of the metal melt into the stream of the carousel molding laboratory machine, its solidification, and extrusion into the die opening similarly to Conform technology are established. The magnitude of the cross section of the hole in the supply dispenser of the metal melt into the stream of the crystallizer wheel is calculated. The process modes of the continuous casting–pressing using a laboratory installation of a billet 3 mm in diameter and its subsequent treatment by high-quality rolling and drawing in combination with intermediate annealing procedures to the final sizes are presented. According to this flowsheet, a pilot batch of round and square wire of alloys AK12Ts10 and AK12Ts15 has been produced in the amount of 3 kg and delivered to the AO ISS enterprise for industrial test soldering of waveguides.     

Microstructural analysis of lead-free solder alloys

Among the many issues related to the performance of lead-free solder alloys, the dependence of their mechanical properties on the microstructure and the stability of the microstructure stability are some of the most important issues. A comprehensive understanding of the process-microstructure-property relationships is essential. Toward that goal, a microtextural analysis is performed using orientation imaging microscopy (OIM) for alloy Sn-3.8Ag-0.7Cu (wt pct) processed at four different temperatures. Sn-3.8Ag-0.7Cu is one of the most promising lead-free solder alloys that has shown superior mechanical properties to other candidate lead-free solder alloys. However, a comprehensive understanding of their microstructure and the dependence of microstructure on processing conditions are still lacking. In the present work, a detailed microstructure characterization with respect to phase compositions, grain size and size distributions, texture, and orientation relationships between various phases are performed. The measured microstructural features are correlated with the soldering temperatures.     

Solidification Condition Effects on Microstructures and Creep Resistance of Sn-3.8Ag-0.7Cu Lead-Free Solder

Metallurgical, mechanical, and environmental factors all affect service reliability of lead-free solder joints and are under extensive study for preparation of the transition from Sn-Pb eutectic soldering to lead-free soldering in the electronic industry. However, there is a general lack of understanding about the effects of solidification conditions on the microstructures and mechanical behavior of lead-free solder alloys, particularly on the long-term reliability. This study attempts to examine the creep resistance of the Sn-Ag-Cu eutectic alloy (Sn-3.8Ag-0.7Cu, SAC387) with a variety of solidification conditions with cooling rates ranging from 0.3 °C/s to 17 °C/s. Results indicate that solidification conditions have a major influence on the creep resistance of SAC387 alloy; up to two orders of magnitude change in the steady-state creep rates were observed at low stress levels. An understanding of the mechanical property change with microstructures, which are determined by the solidification conditions, should shed some light on the fundamental deformation and fracture mechanisms of lead-free solder alloys and can provide valuable information for long-term reliability assessment of lead-free solder interconnections. This article is based on a presentation made in the symposium entitled “Solidification Modeling and Microstructure Formation: in Honor of Prof. John Hunt,” which occurred March 13–15, 2006 during the TMS Spring Meeting in San Antonio, Texas, under the auspices of the TMS Materials Processing and Manufacturing Division, Solidification Committee.