An investigation of photocurrent loss due to reflectance and absorption in CdTe/CdS heterojunction solar cells

An attempt is made to understand, quantify, and reduce the reflectance and photocurrent loss in CdTe solar cells. Model calculations are performed to determine the optimum thicknesses of CdS and SnO₂ films and anti-reflection (AR) coating on glass that can minimize the reflectance and enhance the performance of CdTe/CdS/SnO₂/glass solar cells. Photocurrent loss due to absorption in CdS films is also calculated as a function of CdS thickness. It was found that the current loss due to reflectance ando absorption is more sensitive to the CdS film when its thickness falls below 1500Å. Model calculations show that reducing the CdS thickness from 1500 to 600Å increases short-circuit current density ( J_sc) by 3 mA/cm² because of reduced reflectance as well as absorption. Further decrease in CdS thickness below 600Å increases reflectance but results in higher J_sc, because current gain due to reduced absorption in thin CdS offsets the current loss due to higher reflectance. Model calculations also indicate that J_sc is not sensitive to SnO₂ thickness above 4000Å. Finally, an optimum thickness for single layer MgF₂ AR coating on glass was calculated to be 1100Å, which should provide an additional increase of 0.7 mA/cm² in J_sc. Some of these results are also experimentally validated in this paper.     

Direct growth of CdTe on (100), (211), and (111) Si by metalorganic chemical vapor deposition

CdTe epilayers were grown directly on (100), (211), and (111) silicon substrates by metalorganic chemical vapor deposition (MOCVD). The crystallinity and the growth orientation of the CdTe film were dependent on the surface treatment of the Si substrate. The surface treatment consisted of exposure of the Si surface to diethyltelluride (DETe) at temperatures over 600°C prior to CdTe growth. Direct growth of CdTe on (100) Si produced polycrystalline films whereas (lll)B single crystals grew when Si was exposed to DETe prior to CdTe growth. On (211) Si, single crystal films with (133)A orientation was obtained when grown directly; but produced films with (211)A orientation when the Si surface was exposed to DETe. On the other hand, only (lll)A CdTe films were possible on (111) Si, both with and without Te source exposure, although twinning was increased after exposure. The results indicate that the exposure to a Te-source changes the initial growth stage significantly, except for the growth on (111) Si. We propose a model in which a Te atom replaces a Si atom that is bound to two Si atoms.     

MOCVD生长高反射率AlN/GaN分布布拉格反射镜

利用金属有机物化学气相沉积(MOCVD)方法在蓝宝石c面衬底上制备出高反射率AlN/GaN分布布拉格反射镜(DBR).利用分光光度计测量,在418 nm附近最大反射率达到99%.样品表面显微照片显示,有圆弧形缺陷和少量裂纹出现;在缺陷和裂纹以外的区域,DBR具有较为平坦的表面,其粗糙度在10μm×10μm面积上为3.3 m左右.样品的截面扫描电镜(SEM)照片显示,DBR具有良好的周期性.对反射率和表面分析的结果表明,该样品达到了制备GaN基垂直腔面发射激光器(VCSEL)的要求.     

Voltage dependent photocurrent collection in CdTe/CdS solar cells

The voltage dependence of the photocurrent J_L(V) of CdTe/CdS solar cells has been characterized by separating the forward current from the photocurrent at several illumination intensities. J_L(V) reduces the fill factor (FF) of typical cells by 10–15 points, the open circuit voltage (V_OC) by 20–50 mV, and the efficiency by 2–4 points. Eliminating the effect of J_L(V) establishes superposition between light and dark J(V) curves for some cells. Two models for voltage dependent collection give reasonable fits to the data: (1) a single carrier Hecht model developed for drift collection in p‐i‐n solar cells in which fitting yields a parameter consistent with lifetimes of 10⁻⁹ s as measured by others; or (2) the standard depletion region and bulk diffusion length model fits almost as well. The simple Hecht‐like drift collection model for photocurrent gives very good agreement to J(V) curves measured under AM1·5 light on CdTe/CdS solar cells with FF from 53% to 70%, CdTe thickness from 1·8 to 7·0 µm, in initial and stressed states. Accelerated thermal and bias stressing increases J_L(V) losses as does insufficient Cu. This method provides a new metric for tracking device performance, characterizes transport in the high field depletion region, and quantifies a significant FF loss in CdTe solar cells. Copyright © 2007 John Wiley & Sons, Ltd.     

Effect of growth pressure on indium incorporation during the growth of InGaN by MOCVD

The effect of the growth pressure on the In incorporation in InGaN thin films, grown by metalorganic chemical vapor deposition (MOCVD) have been investigated. The InGaN thin films were grown by varying the growth pressures, while maintaining all other growth parameters constant. Photoluminescence and high resolution x-ray diffraction (XRD) measurements showed that the In incorporation in the InGaN thin film was drastically increased with decreasing growth pressures. XRD analysis also revealed that the In concentration in the films was increased by 7.5% as the growth pressure was decreased from 250 torr to 150 torr. This can be attributed to the enhanced mass transportation of precursor gases through the boundary-layer on the substrate in the MOCVD system.     

温度循环下CdS/CdTe太阳电池稳定性的研究

对CdS/CdTe太阳电池在温度循环下的稳定性进行了研究,测定了其I-V特性曲线,并与室温下的电池作了比较.结果表明:经温度循环后电池的转换效率、填充因子和短路电流密度都有不同程度的下降,而用ZnTe作背接触层的电池稳定性有所改善.     

MOCVD生长Al0.48Ga0.52N/Al0.54Ga0.36N多量子阱的结构和光学特性

采用金属有机物化学气相淀积(MOCVD)技术,在蓝宝石衬底上生长了Al0.48Ga0.52N/Al0.54Ga0.36N多量子阱(MQWs)结构。通过双晶X射线衍射(DCXRD)、原子力显微镜(AFM)和阴极荧光(CL)等测试技术,分别对样品的结构和光学特性进行了表征。在DCXRD图谱中,可以观察到明显的MQWs衍射卫星峰,通过拟和,MQWs结构中阱和垒的厚度分别为2.1和9.4nm,Al组分分别为0.48和0.54。在AFM表面形貌图上,可以观察到清晰的台阶流,表明MQWs获得了二维生长;与此同时,MQWs结构存在一些裂缝,主要原因为AlGaNMQWs结构和下层GaN层间存在很大的应力。CL测试表明,AlGaNMQWs结构的发光波长为295nm,处于深紫外波段,同时观察到处于蓝光、绿光波段的缺陷发光。     

Insights into MOCVD process control as revealed by laser interferometry

In-situ laser interferometry has been used to study the nucleation of CdTe on basal plane sapphire in MOCVD growth. The nucleation delay and nucleation thickness were seen to be influential in the determination of overall buffer layer quality. This nucleation process was seen to be highly complex and the nucleation delay and nucleation layer thickness were seen to vary for constant conditions of nucleation II:VI ratio and temperature. A possible link between nucleation delay and nucleation temperature has been commented on. The results for CdTe on sapphire suggest that for consistent metalorganic chemical vapor deposition (MOCVD) growth conditions from run to run during the nucleation stage, the nucleation delay and thickness may still vary as a function of subtle differences in the substrate growth surface. This argument is further substantiated by our observations using laser interferometry to study the nucleation of CdTe on Si (211) in MOCVD, where different surface preparatory treatments were employed. Laser interferometry was found to be sensitive to differences in surface treatment of the Si substrates prior to ZnTe/CdTe growth. The benefits of the use of interferometry to study and to control the nature of complex epitaxial systems is discussed.     

The role of the low temperature buffer layer and layer thickness in the optimization of OMVPE growth of GaN on sapphire

In agreement with previous work,¹² a thin, low temperature GaN buffer layer, that is used to initiate OMVPE growth of GaN growth on sapphire, is shown to play a critical role in determining the surface morphology of the main GaN epilayer. X-ray analysis shows that the mosaicity of the main GaN epilayer continues to improve even after several μm of epitaxy. This continuing improvement in crystal perfection correlates with an improvement in Hall mobility for thicker samples. So far, we have obtained a maximum mobility of 600 cm²/V-s in a 6 μm GaN epilayer. Atomic force microscopy (AFM) analysis of the buffer layer and x-ray analysis of the main epilayer lead us to conclude that the both of these effects reflect the degree of coherence in the main GaN epitaxial layer. These results are consistent with the growth model presented by Hiramatsu et al., however, our AFM data indicates that for GaN buffer layers partial coherence can be achieved during the low temperature growth stage.     

Surface photoabsorption monitoring of the growth of GaAs and InGaAs at 650°C by MOCVD

By monitoring the cyclic behavior of surface photoabsorption (SPA) reflectance changes during the growth of GaAs at 650°C and with sufficient H₂ purging time between the supply of trimethylgallium and AsH₃, we have been able to achieve controlled growth of GaAs down to a monolayer. Our results show, as confirmed by photoluminescence (PL) measurements, the possibility of growing highly accurate quantum well heterostructures by metalorganic chemical vapor deposition at conventional growth temperatures. We also present our PL measurements on the InGaAs single quantum wells grown at this temperature by monitoring the SPA signal.     

Passivation of carbon acceptors during growth of carbon-doped GaAs,InGaAs, and HBTs by MOCVD

Carbon dopedp-type GaAs and In_0.53Ga_0.47As epitaxial layers have been grown by low-pressure metalorganic chemical vapor deposition using CC1₄ as the carbon source. Low-temperature post-growth annealing resulted in a significant increase in the hole concentration for both GaAs and In_0.53Ga_0.47As, especially at high doping levels. The most heavily doped GaAs sample had a hole concentration of 3.6 × 10²⁰ cm⁻³ after a 5 minute anneal at ≈400° C in N₂, while the hole concentration in In_0.53Ga_0.47As reached 1.6 × 10¹⁹ cm⁻³ after annealing. This annealing behavior is attributed to hydrogen passivation of carbon acceptors. Post-growth cool-down in an AsH₃/H₂ ambient was found to be the most important factor affecting the degree of passivation for single, uncapped GaAs layers. No evidence of passivation is observed in the base region of InGaP/GaAs HBTs grown at ≈625° C. The effect ofn-type cap layers and cool-down sequence on passivation of C-doped InGaAs grown at ≈525° C shows that hydrogen can come from AsH₃, PH₃, or H₂, and can be incorporated during growth and during the post-growth cool-down. In the case of InP/InGaAs HBTs, significant passivation was found to occur in the C-doped base region.     

Metalorganic chemical vapor deposition of HgCdTe p/n junctions using arsenic and iodine doping

We report new results on metalorganic chemical vapor deposition (MOCVD)in situ growth of long wavelength infrared (LWIR) P-on-n and medium wavelength infrared (MWIR) n-on-P HgCdTe heterojunction photodiodes using the interdiffused multilayer process (IMP). The n-type regions are doped with iodine using the precursor ethyl iodide (El). I-doped HgCdTe using El has mobilities higher than that obtained on undoped background annealed films and are comparable to LPE grown In-doped HgCdTe. The p-type layers are doped with arsenic from either tertiarybutylarsine (TBAs) or a new precursor,tris-dimethylaminoarsenic (DMAAs). The substrates used in this work are lattice matched CdZnTe oriented (211)B or (100)4°→«110». Junction quality was assessed by fabricating and characterizing backside-illuminated arrays of variable-area circular mesa photodiodes. This paper presents four new results. First, carrier lifetimes measured at 80K on arsenic doped single HgCdTe layers are generally longer for films doped from the new precursor DMAAs than from TBAs. Second, we present data on the first P-on-n HgCdTe photodiodes grownin situ with DMAAs which have R₀A products limited by g-r current at 80K for λ_co = 7–12 μm, comparable to the best R₀A products we have achieved with TBAs. Third, we report the first experimental data on a new HgCdTe device architecture, the n-on-P heterojunction, with a wide gap p-type layer which allows radiation incident through the substrate to be absorbed in a narrower gap n-type layer, thereby eliminating interface recombination effects. With the n-on-P architecture, MWIR photodiodes were obtained reproducibly with classical spectral response shapes, high quantum efficiencies (70-75%) and R₀A products above 2 x 10⁵ ohm-cm² for λ_co = 5.0 μm at 80K. Fourth, we report 40K data for LWIR P-on-n HgCdTe heterojunction photodiodes (using TBAs), with R₀A values of 2 x 10⁴ ohm-cm² for λ_co = 11.7 μm and 5 x 10⁵ ohm-cm² for λ_co - 9.4 μm. These are the highest R₀A values reported to date for LWIR P-on-n heterojunctions grownin situ by MOCVD.     

MOCVD生长1．06μm InGaAs／GaAs量子阱LDs

用低压MOCVD生长应变InGaAs/GaAs量子阱,采用中断生长、应变缓冲层(SBL)、改变生长速度和调节Ⅴ/Ⅲ等方法改善InGaAs/GaAs量子阱的光致发光(PL)质量。PL结果表明,10s生长中断结合适当的SBL生长的量子阱PL谱较好。该量子阱应用于1.06μm激光器的制备,未镀膜的宽条激光器(100μm×1000μm)有低阈值电流密度(110A/cm2)和高的斜率效率(0.256W/A,per.facet)。     

Electrical and structural properties of epitaxial CdTe/HgCdTe interfaces

In this study, CdTe epilayers were grown by metalorganic chemical vapor deposition on epitaxial HgCdTe with the purpose of developing suitable passivation for HgCdTe photodiodes. Two types of CdTe layers were investigated. One was grown directly,in situ, immediately following the growth of HgCdTe. The second type of CdTe was grown indirectly, on top of previously grown epitaxial HgCdTe samples. In this case, the surface of the HgCdTe was exposed to ambient atmosphere, and a surface cleaning procedure was applied. The material and structural properties of the CdTe/HgCdTe interfaces were investigated using secondary ion mass spectroscopy, Auger electron spectroscopy, Rutherford back scattering, and x-ray double crystal diffractometry techniques. Electrical properties of the CdTe/HgCdTe heterostructure were determined by capacitance-voltage (C-V) characterization of Schottky barrier devices and metal insulator semiconductor devices. Also, a preliminary current-voltage characterization of n⁺ p photodiodes was performed. A theoretical model suitable for analysis of graded heterojunction devices was used for interpretation of C-V measurements.     

In-situ monitoring and control for MOCVD growth of AlGaAs and InGaAs

We have used spectroscopic ellipsometry to perform real-time monitoring during metalorganic chemical vapor deposition growth of AlGaAs (on GaAs) and InGaAs (on GaAs and InP). Optical constants for these materials were obtained up to growth temperatures of 600 to 700°C. This information permits real-time extraction of composition and layer thickness from the raw ellipsometric data at sample rates on the order of 0.5 Hz. We describe closed-loop control of composition and total layer thickness on AlGaAs-based structures, including Bragg reflectors. In-situ data obtained on double-heterostructure quantum-well laser structures demonstrate that spectroscopic ellipsometry is an extremely powerful monitoring and quality-control tool, giving important real-time information on complex structures that would be difficult and time-consuming to obtain after growth.     

Poly- and single-crystalline h-GaN grown on SiCN/Si(100) and SiCN/Si(111) substrates by MOCVD

This paper reports the growth of polycrystalline GaN on Si(100) and single-crystalline h-GaN on Si(111) substrates with a single-crystalline SiCN burffer layer by metalorganic chemical vapor deposition (MOCVD). From high-resolution x-ray diffraction (HRXRD) and scanning election microscopy (SEM) analyses, GaN on SiCN/Si(100) is polycrystalline and GaN on SiCN/Si(111) is single-crystalline. From photoluminescence analysis, the energy gaps of h-GaN/SiCN/Si(100) and c-GaN/SiCN/Si(100) are ∼3.4 and ∼3.2 eV at 300 K but shift to 3.5 and 3.3 eV at 15 K, respectively. A model to explain the growth mechanism is also proposed.     

Growth of InGaN HBTs by MOCVD

The design and growth of GaN/InGaN heterojunction bipolar transistors (HBTs) by metalorganic chemical vapor deposition (MOCVD) are studied. Atomic-force microscopy (AFM) images of p⁺InGaN base layers (∼100 nm) deposited under various growth conditions indicate that the optimal growth temperature is limited to the range between 810 and 830°C due to a trade-off between surface roughness and indium incorporation. At these temperatures, the growth pressure must be kept above 300 Torr in order to keep surface pit density under control. An InGaN graded-composition emitter is adopted in order to reduce the number of V-shaped defects, which appear at the interface between GaN emitter and InGaN base and render an abrupt emitter-base heterojunction nearly impossible. However, the device performance is severely limited by the high p-type base contact resistance due to surface etching damage, which resulted from the emitter mesa etch.     

The growth of InAsSb/InAsP strained-layer superlattices for use in infrared emitters

We describe the metalorganic chemical vapor deposition of InAsSb/InAsP strained-layer superlattice (SLS) active regions for use in mid-infrared emitters. These SLSs were grown at 500°C, and 200 Torr in a horizontal quartz reactor using TMIn, TESb, AsH₃, and PH₃. By changing the layer thickness and composition, we have prepared structures with low temperature (≤20K) photoluminescence wavelengths ranging from 3.2 to 4.4 μm. Excellent performance was observed for a SLS light emitting diode (LED) and both optically pumped and electrically injected SLS lasers. An optically pumped, double heterostructure laser emitted at 3.86 μm with a maximum operating temperature of 240K and a characteristic temperature of 33K. We have also made electrically injected lasers and LEDs utilizing a GaAsSb/InAs semi-metal injection scheme. The semi-metal injected, broadband LED emitted at 4 μm with 80 μW of power at 300K and 200 mA average current. The InAsSb/InAsP SLS injection laser emitted at 3.6 μm at 120K.     

Metalorganic chemical vapor deposition growth and characterization of InGaP/GaAs superlattices

Lattice-matched In_0.49Ga_0.51P/GaAs superlattices were grown on (001) GaAs substrates using metalorganic chemical vapor deposition. The interface properties were characterized by photoluminescence, transmission electron microscopy, and x-ray diffraction. By varying the growth temperature, the precursor flow rates, and the growth interruption at the interfaces, we found that, while arsenic and phosphorus carry over have some effect on the formation of a low-bandgap InGaAsP quaternary layer at the interfaces, the In surface segregation seems to play an important role in the formation of the interface quaternary layer. Evidence of this indium segregation comes from x-ray and photoluminescence studies of samples grown at different temperatures. These studies show that the formation of an interfacial layer is more prominent when the growth temperature is higher. Growing a thin (∼1 monolayer thick) GaP intentional interfacial layer on top of the InGaP before the growth of the GaAs layer at the P→As transition effectively suppresses the formation of the low-bandgap unintentional interface layer. On the other hand, the growth of a thin GaAsP (or GaP) layer before the growth of the InGaP layer, at the As→P transition increases the formation of a low-bandgap interfacial layer. This nonequivalent effect of a GaP layer at the two interfaces on the PL properties is discussed.     

Strain from modified interface compositions in InGaAs/InP superlattices

Thin strained regions have been inserted at the interfaces of lattice-matched InGaAs/lnP superlattices to assess growth conditions for tailoring of localized compositional changes and for studying As-P intermixing behavior during heterojunction growth. Also, precise growth rates of binary composition layers were determined from specially designed superlattices using strained layers of common anion compounds inserted periodically into InP and GaAs. Growth rates of fractional monolayers are found to be identical to thick layer growth rates. When thin InAs, GaAs, GaP, ALAs, or AIP layers were inserted at the InGaAs/lnP heterojunctions, the measured strain at either one or both interfaces was equal to the strain predicted from the growth rate x time product. Excess strain seen in some cases is due to a change in As-P intermixing and this component can be separated from the predicted strain. Insertion of Ga-compounds at the InP-grown-on-InGaAs interface causes interface roughening which degrades the superlattice. For all other compositions the thin, highly strained regions are not detrimental to the crystalline quality of the periodic structure.