本征非晶硅薄膜的准分子激光晶化

为了减低非晶硅薄膜太阳能电池的光致衰减效应和提高其光电转换效率,用等离子体化学气相沉积系统制备了本征非晶硅薄膜,用波长为248nm的KrF准分子激光器激光晶化了非晶硅表层,用共焦显微喇曼测试技术研究了非晶硅薄膜在不同的激光能量密度和不同的频率下的晶化状态,并用扫描电子显微镜测试晶化前后薄膜的形貌。结果表明,随着激光能量密度的增大,薄膜晶化效果越来越好,能量密度达到268.54mJ/cm2时晶化效果最好,此时结晶比约为76.34%;最佳的激光能量密度范围是204.99mJ/cm2~268.54mJ/cm2,这时薄膜表面晶化良好;在1Hz~10Hz范围内,激光频率越大晶化效果越好;晶化后薄膜明显出现微晶和多晶颗粒,从而达到了良好的晶化效果。     

脉冲Nd:YAG激光器选区晶化制备多晶硅薄膜

采用三倍频后的Nd:YAG固体脉冲激光系统(波长为355 nm)选区诱导晶化非晶硅薄膜,以制备多晶硅薄膜。分别测试了激光晶化前后薄膜的表面形貌和拉曼光谱。在文中分析了400 nm厚薄膜在激光扫描前后的表面形貌变化。拉曼光谱显示薄膜的晶化程度随着激光能量的增加而提高。最优的激光晶化能量密度与薄膜的厚度相关。对于300 nm和400 nm厚的非晶硅薄膜,有效晶化非晶硅的能量密度分别在440-634 mJ/cm²,777-993 mJ/cm²之间。在激光能量密度分别为634 mJ/cm²,975 mJ/cm²和1571 mJ/cm²时,300 nm、400 nm和500 nm厚薄膜达到最好的晶化效果。     

平顶绿光晶化制备多晶硅薄膜

利用倍频Nd∶YAG激光器使玻璃基底上沉积的非晶硅薄膜成功实现了晶化.YAG激光器的倍频绿光经蝇眼透镜阵列整形后得到一光强均匀分布的平顶光束,并用此光束对非晶硅薄膜进行扫描晶化处理.分别测量了激光晶化前后薄膜的拉曼谱和表面形貌.测量结果表明,非晶硅实现了到多晶硅的相变,且晶化处理后表面起伏度明显增大.根据拉曼谱的数据计算了不同激光能量密度下薄膜的粒度大小和结晶度.结果表明,在一定能量密度(400～850 mJcm2)范围内,结晶膜的晶粒粒度和结晶度随激光能量密度升高而增大.然而能量密度大于1000 mJ/cm2后,检测不到明显的多晶硅特征峰.激光能量密度在850 mJ/cm2左右可得到最佳晶化效果.     

308nm准分子激光剥离聚酰亚胺薄膜实验研究

为了研究聚酰亚胺薄膜在308nm准分子激光下的剥离效果, 采用实验研究的方法, 分别探究了激光能量密度、光斑重叠率、脉冲频率、衬底温度对激光剥离效果的影响, 并结合显微镜观察剥离后的衬底和薄膜形貌。结果表明, 激光剥离能量阈值约为160mJ/cm2, 在激光能量密度为180mJ/cm2~190mJ/cm2左右、光斑重叠率为68.33%时, 剥离效果较好; 提高衬底温度有利于激光剥离过程。该研究对聚酰亚胺薄膜在柔性电子领域的工业化应用具有一定意义。     

固体纳秒激光器应用于非晶硅薄膜结晶的研究

多晶硅薄膜比非晶硅薄膜具有更高的电子迁移率,在器件中表现出更优良的性能,脉冲激光结晶非晶硅薄膜制备多晶硅薄膜的方法具有热积存小、对衬底影响小、成本低等优点。使用532 nm固体纳秒激光器进行了非晶硅薄膜激光结晶实验,为了解决直接使用高斯光束结晶时因光斑能量分布带来的结晶效果不均匀,首先基于光束整型系统将圆形的高斯光束整型成为线性平顶光束,而后研究单脉冲能量密度、脉冲个数、非晶硅薄膜厚度对结晶效果的影响。结果表明,线性平顶光束用于非晶硅薄膜结晶具有更好的均匀性,对于100 nm非晶硅薄膜,随着能量密度的增加,晶粒逐渐变大,直到表面出现热损伤,最大晶粒尺寸约为1 μm×500 nm。随着脉冲个数的增加,表面粗糙度有减小的趋势,观察到的最小粗糙度约为2.38 nm。对于20 nm超薄非晶硅薄膜,只有当能量密度位于134 mJ/cm2和167 mJ/cm2之间、脉冲个数大于或等于八个时才能观察到明显的结晶效果。     

连续氩氪离子激光晶化非晶硅薄膜的研究

为了研究连续激光晶化非晶硅薄膜中激光功率密度对晶化效果的影响,利用磁控溅射法制备非晶硅薄膜,采用连续氩氪混合离子激光器对薄膜进行退火晶化,用显微喇曼光谱测试技术和场发射扫描电子显微镜研究了薄膜在5ms固定时间下不同激光功率密度对晶化效果的影响,并对比了普通玻璃片和石英玻璃两种衬底上薄膜晶化过程的差异。结果表明,在一定激光功率密度范围内(0kW/cm2~27.1kW/cm2),当激光功率密度大于15.1kW/cm2时,普通玻璃衬底沉积的非晶硅薄膜开始实现晶化;随着激光功率密度的增大,晶化效果先逐渐变好,之后变差;激光功率密度增大到24.9kW/cm2时,薄膜表面呈现大面积散落的苹果状多晶硅颗粒,晶粒截面尺寸高达478nm ;激光功率密度存在一个中间值,使得晶化效果达到最佳;石英衬底上沉积的非晶硅薄膜则呈现与前者不同的结晶生长过程,当激光功率密度为19.7kW/cm2时,薄膜表面呈现大晶粒尺寸的球形多晶硅颗粒,并且晶粒尺寸随着激光功率密度的增大而增大,在 27.1kW/cm2处晶粒尺寸达到最大5.38m。研究结果对用连续激光晶化法制备多晶硅薄膜的研究具有积极意义。     

准分子激光诱导非晶硅晶化制备多晶硅薄膜晶体管

讨论了用准分子激光诱导非晶硅晶化法制备多晶硅薄膜晶体管的结构与工艺优化问题。用 Xe Cl准分子激光器对 PECVD法生长的非晶硅薄膜进行了诱导晶化处理 ,成功制备了多晶硅薄膜晶体管 ,获得最大场效应迁移率为 1 4.5cm2 /V· s,亚阈值斜率为 1 .9V/dec,开关电流比为 1 .0× 1 0 6的器件性能。     

利用金属键合和激光剥离技术制备GaN/metal /Si异质结构的研究

利用金属键合和激光剥离将生长在蓝宝石衬底上的GaN薄膜转移到Si衬底上。键合后采用波长为248nm的准分子脉冲激光辐照蓝宝石衬底,低温处理去除蓝宝石衬底。系统地研究不同键合温度和激光能量密度对GaN结构和光学特性的影响。AFM、XRD和PL测试表明：键合温度和激光剥离的能量密度较低,转移衬底后GaN的质量较好;激光剥离的阈值能量密度为300mJ/cm2;键合温度400℃的样品均方根粗糙度（RMS）约为50nm。     

脉冲激光沉积制备Ge纳米薄膜的研究

利用脉冲激光沉积(PLD)技术,在Ar环境下于Si基片上制备出Ge纳米薄膜.用X射线衍射(XRD)仪和原子力显微镜(AFM)观测了薄膜的微观结构和形貌,分析了它们随激光能量密度和衬底温度的变化情况.结果表明:Ge薄膜在室温下即可以结晶,其平均品粒尺寸随脉冲激光能量密度的增大而增大.当脉冲激光能量密度为0.94 J/cm2时,所制备的薄膜由约13 nm的颗粒组成;当脉冲激光能量密度增大为1.31 J/cm2时,颗粒的平均尺寸增大为56 nm,凡薄膜表面变得比较均匀.此外,当衬底温度从室温升到450℃过程中,晶粒平均尺寸随温度升高而增大.在实验基础上,对薄膜的生长机理进行了分析.     

GaN基外延膜的激光剥离和InGaN LD外延膜的解理

利用波长为248nm的KrF准分子激光器进行了蓝宝石衬底GaN外延层剥离。对极薄的MOCVD生长的单层GaN外延膜(3μm)和InGaNLD外延膜(5μm)实现了大面积剥离。对剥离蓝宝石衬底背面抛光和未抛光外延片的不同特点作了比较,激光剥离所需的能量密度阈值分别约为200mJ/cm2和300mJ/cm2,优化结果表明,能量密度分别在400mJ/cm2和600mJ/cm2可实现稳定的剥离。同时对剥离后的InGaN多量子阱LD结构薄膜进行了解理,SEM观察显示获得的InGaNLD腔面平整光滑。基于这种技术可以获得无蓝宝石衬底的GaN基光电子和电子器件。     

Polycrystalline silicon thin-film transistors fabricated by defect reduction methods

Fabrication of n-channel polycrystalline silicon thin-film transistors (poly-Si TFTs) at a low temperature is reported. 13.56 MHz-oxygen plasma at a 100 W, 130 Pa at 250/spl deg/C for 5 min, and heat treatment at 260/spl deg/C with 1.3/spl times/10/sup 6/-Pa-H/sub 2/O vapor for 3 h were applied to reduction of the density of defect states in 25-nm-thick silicon films crystallized by irradiation of a 30 ns-pulsed XeCl excimer laser. Defect reduction was numerically analyzed. Those treatments resulted in a high carrier mobility of 830 cm/sup 2//Vs and a low threshold voltage of 1.5 V at a laser crystallization energy density of 285 mJ/cm/sup 2/.     

XeCl Excimer laser annealing used in the fabrication of poly-Si TFT's

Mo-gate n-channel poly-Si thin-film transistors (TFT's) have been fabricated for the first time at a low processing temperature of 260°C. A 500-1000-A-thick a-Si:H was successfully crystallized by XeCl excimer laser (308nm) annealing without heating a glass substrate. TFT's were fabricated in the crystallized Si film. The channel mobility of the TFT was 180cm²/V.s when the a-Si:H was crystallized by annealing with a laser having an energy density of 200 mJ/cm². This result shows that high-speed silicon devices can be fabricated at a low temperature using XeCl excimer laser annealing.     

High-performance poly-Si TFTs made by Ni-mediated crystallization through low-shot laser annealing

High-performance polycrystalline silicon (poly-Si) thin-film transistors (TFTs) have been fabricated using metal-induced crystallization followed by laser annealing (L-MIC). Laser annealing after MIC was found to yield a major improvement to the electrical characteristics of poly-Si TFTs. At a laser fluence of 330 mJ/cm/sup 2/, the field effect mobility increased from 71 to 239 cm/sup 2//Vs, and the minimum leakage current reduced from around 3.0/spl times/10/sup -12/ A//spl mu/m to 2.9/spl times/10/sup -13/ A//spl mu/m at a drain voltage of 5 V. In addition, the dependence of the TFT characteristics on the laser energy density was much weaker than that for conventional excimer laser annealed poly-Si TFTs.     

GaN/metal/Si heterostructure fabricated by metal bonding and laser lift-off

A process methodology has been adopted to transfer GaN thin films grown on sapphire substrates to Si substrates using metal bonding and laser lift-off techniques. After bonding, a single KrF (248 nm) excimer laser pulse was directed through the transparent sapphire substrates followed by low-temperature heat treatment to remove the substrates. The influence of bonding temperature and energy density of the excimer laser on the structure and optical properties of GaN films were investigated systemically. Atomic force microscopy, X-ray diffraction and photolumi-nescence measurements showed that (1) the quality of the GaN film was higher at a lower bonding temperature and lower energy density; (2) the threshold of the energy density of the excimer laser lift-off GaN was 300 mJ/cm~2. The root-mean-square roughness of the transferred GaN surface was about 50 nm at a bonding temperature of 400 ℃.     

Selected area laser-crystallized polycrystalline silicon thin films by a pulsed Nd:YAG laser with 355 nm wavelength

Selected area laser-crystallized polycrystalline silicon(p-Si) thin films were prepared by the third harmonics (355 nm wavelength) generated by a solid-state pulsed Nd:YAG laser.Surface morphologies of 400 nm thick films after laser irradiation were analyzed.Raman spectra show that film crystallinity is improved with increase of laser energy.The optimum laser energy density is sensitive to the film thickness.The laser energy density for efficiently crystallizing amorphous silicon films is between 440-634 mJ/cm2 for 300 nm thick films and between 777-993 mJ/cm~2 for 400 nm thick films.The optimized laser energy density is 634,975 and 1571 mJ/cm~2 for 300,400 and 500 nm thick films,respectively.     

Laser pattern-write crystallization of amorphous SiC alloys

The aim of this work is to investigate the cw-laser crystallization of amorphous a-Si_1−xC_x alloys as a function of laser power and alloy composition. As the microRaman analysis reveals, many cases occur: in a silicon rich alloy (x ∼0.3) we can obtain two crystalline phases, i.e. polycrystalline Si or polycrystalline C, depending on the laser energy density irradiated on the film. The presence of polycrystalline SiC is observed only in quasi-stoichiometric alloy (x ∼ 0.48) in the cubic β-SiC phase. The experiment has been performed with a laser pattern-writing system that permits simultaneous control of annealing energy and focused spot size. PC control allows several patterns to be traced on the same film.