5083铝合金搅拌摩擦焊接头拉伸行为研究

目的 研究5083铝合金搅拌摩擦焊接（FSW）的组织、力学性能和拉伸应变,分析接头的拉伸行为。方法 采用数码相机、光学显微镜、电子扫描显微镜等表征分析方法,对焊缝的表面宏观成形、微观组织、断口形貌进行分析;利用拉伸机、三维数字动态散斑应变测量分析系统和显微维氏硬度计对接头的力学性能和拉伸应变进行测试。结果 不同焊接工艺参数下FSW接头的最低抗拉强度为305 MPa,断后延伸率达到了14%以上;焊核区拉伸应变沿板厚方向呈现上高下低和上宽下窄的不均匀梯度分布,发生了较大程度的变形强化,直到拉伸应力达到抗拉强度。断裂失效前300/120接头的最大拉伸应变在晶粒粗大的母材区,500/120和500/200接头的最大拉伸应变则位于晶粒尺寸差异较大的后退侧焊核区与热力影响区交界处。接头拉伸断口宏观上均为45°剪切韧性断裂,微观上均以韧窝韧性断裂为主,而高热输入500/120接头出现脆性断裂特征,其延伸率明显降低。结论 高热力耦合输入使铝合金FSW接头薄弱区发生转变,强韧性降低。     

Mg/Zn/Al瞬间液相过冷连接界面的组织与性能研究

采用瞬间液相过冷连接方法对AZ31镁合金/锌中间层/5083铝合金进行连接,利用SEM、XRD、拉伸实验机和微观硬度计对结合界面的微观组织、力学性能进行了表征。结果表明,以锌作中间层,采用瞬间液相过冷连接可以实现AZ31镁合金与5083铝合金的有效连接,接头的最高抗拉强度可以达到38.5MPa,随着低温扩散保温时间的延长,扩散层厚度随之增加,接头的抗拉强度也随之升高;接头的拉伸断口属于脆性断裂,结合界面形成了MgZn2和少量的Mg17Al12金属间化合物;结合界面的微观硬度最高达170。     

Ti40阻燃钛合金电子束焊接头组织与力学性能

采用不同工艺参数对2 mm厚Ti40阻燃钛合金进行电子束焊接(EBW),通过金相分析、电子探针(EPMA)、室温拉伸以及显微硬度测试对Ti40阻燃钛合金电子束焊接接头的显微组织和力学性能进行分析.结果表明,焊缝中分布着晶粒内部有片层状组织析出的β柱状晶和少量等轴β晶粒,熔合线到焊缝中心晶粒逐渐细化,无明显热影响区.接头中易产生气孔、裂纹等缺陷,通过添加直线扫描波形能够有效地控制焊缝气孔缺陷,从而提高接头的强度.添加直线扫描波形电子束焊的Ti40阻燃钛合金的抗拉强度仍可达到917 MPa,断口呈现出脆性断裂与韧性断裂的混合特征,焊缝区的硬度高于母材,其最大值为376HV.     

大功率CO2激光原位直接反应合成TiN/Ti 复合材料的研究

使用大功率CO₂激光原位直接反应合成TiN /Ti 复合材料, 分析了材料的微观结构、物相组成、成分及显微硬度分布。结果发现: 氮化层是富钛结构的, 由TiN 相和α-Ti 构成, TiN 以枝晶形式在氮化层均匀分布。材料横截面显微硬度连续变化。氮化层的氮化程度随激光作用时间的增加而增加, 辐照的激光能量密度越高, 氮化层的厚度越大。激光功率密度, 激光扫描速度, 氮气喷射压强分别为3. 35×105W·cm-2, 300mm·min-1, 0.35M Pa 时, 材料表面硬度值达到Hv1600, 氮化层的厚度有350Lm。      

A new approach to joining of bulk copper using microwave energy

Metallurgical joining of high thermal conductivity materials like copper has been technically challenging. This paper illustrates a novel method for joining of bulk metallic materials through microwave heating. Joining of copper in bulk form has been carried out using microwave energy in a multimode applicator at 2.45 GHz and 900 W. Charcoal was used as susceptor material to facilitate microwave hybrid heating (MHH). Copper in coin and plate forms have been successfully joined through microwave heating within 900 s of exposure time. A sandwich layer of copper powder with approximately 0.5 mm thickness was introduced between the two candidate surfaces. Near complete melting of the powder particles in the sandwich layer does take place during the microwave exposure leading to metallurgical bonding of the bulk surfaces. Characterisation of the joints has been carried out through microstructure study, elemental analysis, phase analysis, microhardness survey, porosity measurement and tensile strength testing. X-ray diffraction (XRD) pattern indicates that some copper powder particles got transformed into copper oxides. XRD analysis also reveals that the dominant orientation (3 1 1) in starting copper powder got transformed into a preferential orientation (1 1 1) in the joint. A dense uniform microstructure with good metallurgical bonds between the sandwich layer and the interface was obtained. The hardness of the joint area was observed to be 78 ± 7 Hv, while the porosity in the joint was observed to be 1.92%. Strength character of the copper joints shows approximately 29.21% elongation with an average ultimate tensile strength of 164.4 MPa.     

水下搅拌摩擦焊对铝/铜接头组织与性能的影响

目的 采用搅拌摩擦焊,对比分析大气环境和水下环境下铝/铜接头的组织与性能,以期获得力学性能更优异的铝/铜焊接接头。方法 利用搅拌摩擦焊,在焊接速度为40 mm/min、旋转速度为1 000 r/min的条件下,分别在大气环境和水下环境下对厚度为9 mm的6061铝合金板和T2纯铜板进行焊接。然后,对铝/铜界面、焊核区进行扫描电镜及能谱分析,并对铝/铜界面及焊核区进行物相分析,确定产物相组成。最后,对铝/铜试样进行拉伸及硬度检测。结果 铝/铜接头均无裂纹、气孔等缺陷。铜颗粒弥散分布在焊核区,铝/铜界面形成金属间化合物层。水下搅拌摩擦焊下界面元素扩散距离明显变短,且金属间化合物厚度更薄。铝/铜接头的金属间化合物为AlCu和Al4Cu9。大气环境焊接下接头的抗拉强度为130.6 MPa,断裂方式为脆性断裂;水下焊接下接头的抗拉强度为199.5 MPa,断裂方式为韧性断裂。水下环境下的接头硬度值更高,其中热影响区的硬度最低值约为65HV。结论 水下搅拌摩擦焊铝/铜接头无裂纹、气孔等缺陷。组织上,水下搅拌摩擦焊的铝/铜接头界面元素扩散距离更短,硬脆的金属间化合物更少;性能上,水下搅拌摩擦焊的铝/铜接头强度更高,抗拉强度达到199.5 MPa,达到母材的74.4%。     

热处理对GH4169激光焊接头组织性能的影响

针对2 mm厚的GH4169镍基合金板材进行激光对焊,研究热处理对GH4169激光焊接头组织和性能的影响。采用线切割方法制备激光焊接头试样,对热处理和非热处理激光焊接头进行拉伸实验、硬度测定、OM分析、SEM分析、EDS分析和XRD相分析。实验结果表明:热处理后接头抗拉强度为1372 MPa,延伸率为14%,焊缝平均硬度为473HV;较未热处理接头强度提高52%,延伸率降低71%,硬度提高69%。OM、SEM、EDS和XRD分析表明:对GH4169激光焊接头热处理能细化焊缝晶粒,改善枝晶形态,消除残余应力,析出δ相、γ′相和γ″相,使得焊接接头硬度和强度有所提高。     

Ti/Al异种金属微电阻点焊接头力学性能及显微组织

目的 对0.2 mm厚的TC4和2A12薄板进行微电阻点焊研究,并确定最佳工艺参数。方法 通过测量接头剪切强度以及观察接头横截面形貌,研究工艺参数对接头拉剪力的影响,采用扫描电子显微镜(SEM)对点焊接头的连接特征及断裂行为进行深入研究,借助金相显微镜对接头微观组织进行分析。结果 焊接时间对接头的抗拉剪力没有显著影响,当焊接电流为4.2 kA,电极压力为110 N,焊接时间为10 ms时,取得最大剪切强度125.82 N。接头有两种断裂方式,分别为沿熔核中心断裂和纽扣状断裂。沿熔核中心断裂的断口呈现脆性断裂的特征,钮扣状断裂的断口熔核中心处呈韧性断裂特征,其热影响区呈脆性断裂特征。结论 实现了Ti/Al薄板的微电阻点焊,并通过改变工艺参数获得良好的剪切性能。观察焊缝的显微组织发现,远离熔核中心、靠近铝母材侧的区域,由于铝侧母材散热较好,组织为等轴晶以及细小的柱状晶,晶粒较小。靠近熔核中心的区域为组织较为粗大的柱状枝晶。     

Comparative study on local and global mechanical properties of bobbin tool and conventional friction stir welded 7085-T7452 aluminum thick plate

7085-T7452 plates with a thickness of 12 mm were welded by conventional single side and bobbin tool friction stir welding (SS-FSW and BB-FSW, respectively) at different welding parameters. The temperature distribution, microstructure evolution and mechanical properties of joints along the thickness direction were investigated, and digital image correlation (DIC) was utilized to evaluate quantitatively the deformation of different zones during tensile tests. The results indicated that heat-affected zone (HAZ), the local softening region, was responsible for the early plastic deformation and also the fracture location for SS-FSW samples, while a rapid fracture was observed in weld nugget zone (WNZ) before yield behavior for all BB-FSW specimens. The ultimate tensile strength (UTS) of SS-FSW joints presented the highest value of 410 MPa, 82% of the base material, at a rotational speed of 300 rpm and welding speed of 60 mm/min, much higher than that of BB-FSW joints, with a joint efficiency of only 47%. This should be attributed to the Lazy S defect produced by a larger extent of heat input during the BB-FSW process. The whole joint exhibited a much higher elongation than the slices. Scanning electron microscopic (SEM) analysis of the fracture morphologies showed that joints failed through ductile fracture for SS-FSW and brittle fracture for BB-FSW.     

Fabrication,Microstructure and Shear Properties of Al Foam Sandwich

Aluminum foam sandwich (AFS) structure materials have drawn much attention due to their unique structural and functional properties. However, the use of AFS materials as an attractive candidate for some applications was limited. In this work, AFS was fabricated by the brazing method, using Al-Si-based alloy, aluminum foam and steel plates as filler, matrix and panels, respectively. The microstructures of the soldered interfacial region, elemental distributions and phase identification were determined by scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS) and X-ray diffraction (XRD). The diffusion behavior of Si, Al, Fe and Cr was investigated. The effect of brazing time on the shear strengths of soldered joints was also analyzed. The results showed that the microstructures of joints were changed on increasing the brazing time. When the brazing time was 5 min, the solder started melting, which led to low shear strength. When increasing the brazing time to 10 min, the shear strength reached the peak value of 6.26 MPa due to the formation of a layer plate structure in the joints. When further increasing the brazing time, a number of Al/Fe intermetallic compound were formed in the joints, leading to a decrease of the shear strength due to the formation of brittle phase.     

Investigations on the mechanical properties and microstructure of dissimilar cp-titanium and AISI 316L austenitic stainless steel continuous friction welds

Friction welding process is a solid state joining process that produces a weld under the compressive force contact of one rotating and one stationary work piece. In this study, the friction welding of dissimilar joints of AISI 316L stainless steel and cp-titanium is considered. The optical, scanning electron microscopy studies of the weld were carried out. Moreover, the X-ray diffraction analysis was performed. The integrity of welds was achieved by the micro hardness and tensile tests. The fracture surface was examined by the scanning electron microscopy. The study showed that the magnitude of tensile strength of the dissimilar welded specimen was below that of the titanium base material if preheating was not applied at the interface. The high weld tensile strength was achieved by preheating the 316L stainless steel material to 700 °C, smoothing and cleaning of the contact surfaces. Results illustrated that in dissimilar joints, different phases and intermetallic compounds such as FeTi, Fe₂Ti, Fe₂Ti₄O, Cr₂Ti and sigma titanium phase were produced at the interface. The presence of brittle intermetallic compounds at the interface resulted in degradation of mechanical strength which in turn led to premature failure of joint interface in the service condition. Preheating caused to produce oxide layer at the interface which was harmful for bonding. The oxide layer could be eliminated by applying pressure and smoothing the surface. Results of hardness tests illustrated that the high hardness was occurred in the titanium side adjacent to the joint interface. Moreover, the optimum operational parameters were obtained in order to achieve the weld tensile strength greater than the weak titanium material.     

Effect of Ni interlayer on strength and microstructure of diffusion-bonded Mo/Cu joints

Mo and Cu were bonded successfully by means of diffusion bonding using a Ni interlayer. The tensile strength of the joint increases firstly and then decreases with the bonding temperature or holding time increases. Compared with 79 MPa which was the maximum value of Mo/Cu joint, the maximum tensile strength of joint with Ni interlayer was 97 MPa. The interfacial structure of the joints was studied by SEM, EPMA, EDS and XRD, the results showed that the different atoms diffused to each other in the bonding process and no intermetallic compound appeared. MoNi and NiCu solid solutions formed in the joint. The fracture of the joint had taken place in the Mo/Ni interface rather than in the Ni/Cu interface and the fracture way of the joints was brittle fracture.     

Effects of annealing process on microstructure and electrical properties of cold-drawn thin layer copper cladding steel wire

The microstructure, mechanical and electrical properties of cold-drawn thin layer copper cladding steel (CCS) wires annealed after different processes were studied by optical microscopy, electron omnipotent material experiment machine, micro hardness machine, SEM and electrical resistivity measurement system. The results indicated that the recovery and recrystallization of steel-core happened in the temperature range 550–750 °C for the holding period of 120 min. When the annealing temperature was higher than 750 °C, grains begun to grow and grain sizes increased gradually with increasing the annealing temperature. The tensile strength and micro hardness were declined with increasing annealing temperature and holding time. The distance of Cu–Fe atoms interfacial diffusion of thin layer CCS wires ranged from 4 µm of cold-drawn wire to 7.5 µm of annealed wire at 850 °C for 120 min. The higher the annealing temperature become, the larger the distance of Cu–Fe atoms interfacial diffusion is. When the annealing temperature was lower than 650 °C, the resistivity was slightly less than 71 × 10^?3 Ω mm² m^?1 which was the resistivity of cold-drawn wire. When the annealing temperature was higher than 650 °C, the resistivity increased with increasing the annealing temperature. Meanwhile, the variation of electrical property of thin layer CCS wires was analyzed and discussed based on microstructure and interfacial diffusion.     

超声作用下的电铸铜微观结构与机械性能

为了改善电铸微细部件的机械性能,通过改变电铸工艺参数以及在电铸铜过程中引入超声场,得到具有不同微观结构特征的电铸铜材料.采用金相显微镜、扫描电子显微镜观察电铸铜层微观形貌,用X射线衍射分析铸层晶面择优取向,并用维氏硬度计和拉伸试验机分别测试电铸铜层机械性能.实验结果表明,超声作用下电铸和普通电铸得到的铜层表面均为(220)晶面择优取向,并且超声电铸铜层的择优取向程度更强.超声电铸铜层晶粒为细小柱状晶结构,与普通电铸铜相比,其抗拉强度和显微硬度均提高约30%.在电铸溶液中氯离子(Cl-)质量浓度为60mg/L时,铸铜层晶粒比其他Cl-质量浓度时晶粒更细小,抗拉强度和塑性也更高.在电铸过程中引入超声场能改善电铸铜层的微观结构,并提高电铸铜的机械性能.     

L360QCS微合金钢焊接接头抗SSCC性能分析

经过反复焊接工艺试验,确定了合理的L360QCS微合金钢焊接工艺参数,针对L360QCS微合金钢焊接接头进行了抗SSCC试验研究。结果表明,焊接接头屈服强度为410 MPa,抗拉强度为528 MPa,平均冲击功值为145J,弯曲试验、刻槽锤断试验均未见缺陷,各类力学性能指标合格;根焊层、填充层、盖面层平均硬度值分别为136.6HV、146.3HV、157.1HV;根焊层、填充层微观组织晶粒细小,为等轴铁素体+珠光体盖,盖面焊层组织晶粒较粗大,为粒状贝氏体+珠光体+针状铁素体;焊接接头SSCC试验未出现裂纹,经XRD、SEM分析,腐蚀产物膜为呈堆砌状态的四方晶系晶体FeS。L360QCS微合金钢焊接接头能够满足NACE TM0177-2005标准规定的抗SSCC性能要求。     

Tribological properties of ultra‐high molecular weight polyethylene (UHMWPE) filled with copper micro‐powder

This paper investigates the tribological properties of ultra‐high molecular weight polyethylene (UHMWPE) filled with copper micro‐powder (CMP). The fabrication and testing procedures implemented to characterize strength and wear properties of the composite are discussed. The effect of copper micro‐powder concentration on tensile strength, elongation at break, impact resistance, coefficient of friction, and wear resistance of the composite is investigated. Results show that copper micro‐powder concentration of 1 wt% yields the optimal combination of wear resistance and tensile strength of the composite. A morphological analysis based on scanning electron microscope (SEM) images of the copper micro‐powder‐ultra‐high molecular weight polyethylene specimens is also discussed. The presence of ridges and plaques on the specimens, analyzed after the sliding wear tests, is attributed to fatigue and adhesion mechanisms. Investigations performed by using an electron probe micro‐analyzer provide evidence that the detachment of copper micro‐powder particles from the matrix during sliding wear tests creates a lubricating layer that drastically decreases the coefficient of friction of the composite and improves its wear resistance properties.     

Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin–silver–copper (Sn–Ag–Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates

Sn–Ag–Cu composite solder has been prepared by adding Ni nanoparticles. Interfacial reactions, the morphology of the intermetallic compounds (IMC) that were formed, the hardness between the solder joints and the plain Cu/immersion Ag-plated Cu pads depending on the number of the reflow cycles and the aging time have all been investigated. A scallop-shaped Cu₆Sn₅ IMC layer that adhered to the substrate surface was formed at the interfaces of the plain Sn–Ag–Cu solder joints during the early reflow cycles. A very thin Cu₃Sn IMC layer was found between the Cu₆Sn₅ IMC layer and the substrates after a lengthy reflow cycle and solid-state aging process. However, after adding Ni nanoparticles, a scallop-shaped (Cu, Ni)–Sn IMC layer was clearly observed at both of the substrate surfaces, without any Cu₃Sn IMC layer formation. Needle-shaped Ag₃Sn and sphere-shaped Cu₆Sn₅ IMC particles were clearly observed in the β-Sn matrix in the solder-ball region of the plain Sn–Ag–Cu solder joints. Additional fine (Cu, Ni)-Sn IMC particles were found to be homogeneously distributed in the β-Sn matrix of the solder joints containing the Ni nanoparticles. The Sn–Ag–Cu–0.5Ni composite solder joints consistently displayed higher hardness values than the plain Sn–Ag–Cu solder joints for any specific number of reflow cycles–on both substrates–due to their well-controlled, fine network-type microstructures and the homogeneous distribution of fine (Cu, Ni)–Sn IMC particles, which acted as second-phase strengthening mechanisms. The hardness values of Sn–Ag–Cu and Sn–Ag–Cu–0.5Ni on the Cu substrates after one reflow cycle were about 15.1 and 16.6 Hv, respectively–and about 12.2 and 14.4 Hv after sixteen reflow cycles, respectively. However, the hardness values of the plain Sn–Ag–Cu solder joint and solder joint containing 0.5 wt% Ni nanoparticles after one reflow cycle on the immersion Ag plated Cu substrates were about 17.7 and 18.7 Hv, respectively, and about 13.2 and 15.3 Hv after sixteen reflow cycles, respectively.     

Microstructure and strength of diffusion-bonded joints of TiAl base alloy to steel

Diffusion bonding of TiAl-based alloy to steel was carried out at 850–1100 °C for 1–60 min under a pressure of 5–40 MPa in this paper. The relationship of the bond parameters and tensile strength of the joints was discussed, and the optimum bond parameters were obtained. When products are diffusion-bonded, the optimum bond parameters are as follows: bonding temperature is 930–960 °C, bonding pressure is 20–25 MPa, bonding time is 5–6 min. The maximum tensile strength of the joint is 170–185 MPa. The reaction products and the interface structures of the joints were investigated by scanning electron microscopy (SEM), electron probe X-ray microanalysis (EPMA) and X-ray diffraction (XRD). Three kinds of reaction products were observed to have formed during the diffusion bonding of TiAl-based alloy to steel, namely Ti₃Al+FeAl+FeAl₂ intermetallic compounds formed close to the TiAl-based alloy. A decarbonised layer formed close to the steel and a face-centered cubic TiC formed in the middle. The interface structure of diffusion-bonded TiAl/steel joints is TiAl/Ti₃Al+FeAl+FeAl₂/TiC/decarbonised layer/steel, and this structure will not change with bond time once it forms. The formation of the intermetallic compounds results in the embrittlement of the joint and poor joint properties. The thickness of each reaction layer increases with bonding time according to a parabolic law. The activation energy Q and the growth velocity K₀ of the reacting layer Ti₃Al+FeAl+FeAl₂+TiC in the diffusion-bonded joints of TiAl base alloy to steel are 203 kJ/mol and 6.07 mm²/s, respectively. Careful control of the growth of the reacting layer Ti₃Al+FeAl+FeAl₂+TiC can influence the final joint strength.     

Tensile properties and fracture behavior of friction stir welded joints of Fe-32Mn-7Cr-1Mo-0.3N steel at cryogenic temperature

This study investigates the cryogenic tensile properties and fracture behavior of fiction stir welded and post-weld heat-treated joints of 32 Mn-7 Cr-1 Mo-0.3 N steel. Cryogenic brittle fracture, which occurred in the as-welded joint, is related to the residual particles that contain tungsten in the joint band structure. Post-weld water toughening resulted in the cryogenic intergranular brittleness of the joint, which is related to the non-equilibrium segregation of solute atoms during the post-weld water toughening.Annealing at 550℃ for 30 min can effectively inhibit the cryogenic intergranular brittleness of the postweld water-toughened joint. The yield strength, ultimate tensile strength, and uniform elongation of the annealed joint are approximately 95%, 87%, and 94% of the corresponding data of the base metal.     

马氏体气阀钢多元共渗层的组织及性能

用固体粉末法,在4Cr10Si2Mo马氏体气阀钢表面制备了Al—Cr二元渗层及Al—Cr—Ce三元渗层,研究了渗层的显微组织和成分分布,测定了渗层由表及里的显微硬度。Al—Cr渗层厚度约为3501μm,硬度为580Hv;Al-Cr—Ce渗层厚度约为420μm,硬度为500Hv。