聚芳醚酮改性苯并恶嗪树脂相结构与冲击性能研究

以热塑性聚芳醚酮(PAEK)改性的热固性苯并恶嗪树脂为对象,用扫描电子显微镜观察了树脂体系分相后的相结构并对其进行测量分析,用动态机械热分析仪和动态数字化冲击仪测试了改性树脂浇铸体的耐热性和冲击韧性。结果表明,加入PAEK后体系发生了旋节线相分离而形成双连续相结构,富苯并恶嗪的自相似特征步长由PAEK用量为5份时的0.49μm降低到35份时的0.22μm;因高PAEK含量的改性体系形成了细小的相结构(小于0.5μm),使得位错绕过而可能无法形成较强的"钉扎"效应,导致树脂体系的韧性提高幅度较小;但PAEK与苯并恶嗪的相容性较好,改性苯并恶嗪树脂体系并未因PAEK的加入而降低耐热性。     

聚芳醚酮改性苯并恶嗪树脂动态冲击性能研究

以聚芳醚酮改性苯并恶嗪树脂为原材料,用动态数字化冲击仪测试了改性树脂浇铸体的冲击性能,获得了树脂体系的冲击力-位移-能量曲线、冲击功和冲击韧性,并用扫描电子显微镜对冲击断面进行了观察。结果表明,聚芳醚酮共混改性苯并恶嗪树脂体系在冲击破坏时的能耗以裂纹形成功为主,体系的冲击韧性值与冲击功的变化趋势相似;冲击断面整体上呈现河流状纹路,裂纹扩展路径上能有效阻隔裂纹发散的点或吸收能量的长条状碎小断面少,对整体韧性贡献较小。     

BMI改性苯并恶嗪树脂及其复合材料研究

采用双马来酰亚胺(BMI)对苯并恶嗪进行改性,通过溶液法制备了苯并恶嗪/BMI树脂基玻璃布复合材料,对其力学性能和吸水性能进行了研究,并研究了苯并恶嗪/BMI树脂体系的物理性能和反应特性.结果表明,随BMI用量的增加,苯并恶嗪/BMI树脂体系的凝胶时间缩短;体系的聚合过程只有一个放热峰,峰顶温度为232℃,且与BMI的用量无关;随BMI用量的增加,复合材料的弯曲强度和冲击强度升高,吸水率下降.     

苯并恶嗪树脂的耐热改性研究进展

分别从分子结构设计、无机粒子改性、共混或共聚改性以及新型苯并恶嗪的合成等方面介绍了近年来国内外对新型热固性树脂苯并恶嗪在耐热改性方面取得的研究性进展,预测了苯并恶嗪树脂的未来发展趋势。分子结构设计是利用苯并恶嗪分子的灵活性,将反应性基团或刚性基团引入到苯并恶嗪中。研究表明,各种改性方法均从不同方面显著地提高了苯并恶嗪树脂的耐热性能。     

苯并噁嗪树脂合成、耐热及增韧改性研究进展

介绍了苯并噁嗪(BZ)树脂的合成方法(溶剂法和非溶剂法),特别综述了BZ耐热、增韧改性在单体的分子结构设计、引入其他可聚合官能团、形成共混或共聚物以及加入纳米粒子等方面的研究进展。最后对BZ树脂的发展方向进行了展望。     

苯并恶嗪改性RTM双马来酰亚胺树脂性能研究

采用苯并恶嗪(BOZ)树脂对RTM双马来酰亚胺(BMI)树脂改性,通过流变性能测试,动态机械分析,扫描电镜及力学性能测试研究了BOZ含量对改性树脂性能的影响。结果表明,加入质量分数7%BOZ的改性树脂体系综合性能最优,相比于未改性树脂,固化收缩率减小约16%,冲击强度提高约47%,且拉伸强度未有明显下降,而拉伸模量和弯曲模量则略有提高,并保持了较好的耐热性能,可满足RTM工艺的开放期要求。     

苯并恶嗪改性酚醛树脂模塑料的研究

合成了单环苯并恶嗪树脂(BZ),利用不同的维纶短纤维对苯并恶嗪/酚醛树脂(PF)共混体系进行增强.采用傅立叶红外光谱、核磁共振对BZ的结构进行了表征,采用差示扫描量热研究了共混体系的固化行为,并对模塑料的力学性能、热性能等进行了研究.结果表明,PF降低了BZ的固化温度,共混树脂体系具有良好的工艺性,共混树脂体系各项性能...     

苯并恶嗪树脂的合成及其改性的研究进展

综述了近年来国内外在苯并恶嗪树脂基础研究与应用领域内的最新进展情况;介绍了苯并恶嗪树脂的合成及其改性方法,并对苯并恶嗪树脂的发展趋势进行了展望.     

Viscoelastic properties of polyarylene ether nitriles/thermotropic liquid crystalline polymer blend

Polyarylene ether nitriles (PEN)/thermotropic liquid crystalline polymer (TLCP) blend was prepared via melt mixing. The immiscible phase morphologies, linear and nonlinear, as well as transient viscoelastic properties of the blend were studied using SEM, rheometer, and DMA. The linear dynamic viscoelastic behavior of the blend shows temperature dependence due to further evolution of the immiscible morphology and, as a result, the principle of time‐temperature superposition (TTS) is invalid. In the steady shear flow, the discrete TLCP phase is difficult to be broken up because of the high viscosity ratio of the blend systems, while is easy to be coarsened and followed by elongation, and finally, to form fibrous morphology at high TLCP content and high shear level. During this morphological evolution process, the transient stress response presents step increase and nonzero residual relaxation behavior, leading to increase of the dynamic viscoelastic responses after steady preshear. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Effect of polyarylene ether nitriles on processing and mechanical behaviors of phthalonitrile‐epoxy copolymers and glass fiber laminated composites

A series of copolymers and glass fiber composites were successfully prepared from 2,2‐bis [4‐(3,4‐dicyanophenoxy) phenyl] propane (BAPh), epoxy resins E‐44 (EP), and polyarylene ether nitriles (PEN) with 4,4′‐diaminodiphenyl sulfone as curing additive. The gelation time was shortened from 25 min to 4 min when PEN content was 0 wt % and 15 wt %, respectively. PEN could accelerate the crosslinking reaction between the phthalonitrile and epoxy. The initial decomposition temperatures (T_i) of BAPh/EP copolymers and glass fiber composites were all more than 350°C in nitrogen. The T_g of 15 wt % PEN glass fiber composites increased by 21.2°C compared with that of in comparison with BAPh/EP glass fiber composite. The flexural strength of the copolymers and glass fiber composites reached 119.8 MPa and 698.5 MPa which increased by 16.6 MPa and 127.3 MPa in comparison with BAPh/EP composite, respectively. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Electrospun magnetic fibrillar polyarylene ether nitriles nanocomposites reinforced with Fe‐phthalocyanine/Fe3O4 hybrid microspheres

The electrospinning method has been employed to fabricate ultrafine nanofibers of high‐performance polyarylene ether nitriles (PEN) and PEN/Fe‐phthalocyanine/Fe₃O₄ nanocomposite fibers for the first time. Through optimizing the operational conditions, such as polymer concentration, applied electric voltage, federate, and distance between needle tip and collector, bead‐free and uniform fibers with smooth surfaces and certain diameters were obtained. The morphology of the PEN nanofibers is correlated to the corresponding rheological behaviors of the polymer solutions. The nanocomposite fibers showed a beads‐in‐string structures without agglomeration after introducing the Fe‐phthalocyanine/Fe₃O₄ hybrid microspheres in the polymer fibers. Thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC) reveal an enhanced thermal stability of the nanocomposite fibers after introducing the hybrids. The glass transition temperature (T_g) of the nanocomposite fibers increases by 10°C with 30 wt % hybrid microspheres, compared with those of the pure PEN fibers. The magnetic properties of the PEN/Fe‐phthalocyanine/Fe₃O₄ nanocomposite fibers are different from those of the hybrid microspheres. The hybrid microspheres in the composite nanofibers become magnetically harder with a much larger coercivity than that of the fillers. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Preparation and thermal effects of polyarylene ether nitrile aluminium nitride composites

Particulate‐filled polyarylene ether nitrile (PEN) composites were prepared using methyltriethoxy‐silane‐treated aluminium nitride (AlN) as the filler for thermal modification. The effects of AlN fraction, particle size and surface treatment on the thermal performance of PEN were investigated. The thermal conductivities of the composites increased when the AlN filler concentration was increased, as well as with decrement of the filler size. The thermal conductivity value of the composites increased up to 0.779 W m^?1 K^?1 when the AlN weight loading was 60 wt%. The trend of the thermal conductivities of the composites can be more efficiently predicted by theoretical models than empirical models. The composites exhibited stable performances of thermal decomposition and thermal expansion when AlN filler faction in the composites increased. © 2013 Society of Chemical Industry     

核壳聚合物增韧环氧树脂的进展

核壳聚合物（CSP）现已用于增韧环境树脂，它具有许多优点：预先设计的CSP在环氧基体中的形态、大小和分散状态与固化规范无关；在提高环氧树脂韧性的同时不降低玻璃化温度。本文综述了CSP／环氧共混物的性能和增韧机理。主要的增韧机理是CSP粒子空穴化，释放裂缝附近的三轴度，继而产生膨胀形变和剪切屈服。     

先进复合材料基体树脂的增韧研究

通过4种聚醚酰亚胺(PEI)PID、PIM、PIP和PIB改性3种热固性树脂(环氧、氰酸酯以及双马来酰亚胺树脂)的研究,讨论了PEI结构、用量、分子质量以及固化剂用量等因素对改性体系的相结构以及力学性能的影响,结果表明控制相结构是增韧基体树脂的关键因素,对基体树脂增韧的研究有指导意义。对不同的热固性树脂体系需采用不同的结构、配方和固化工艺。PIP改性环氧体系呈现的双连续相结构,PEI改性双马来酰亚胺体系,PEI质量分数为5%时呈现了PIM分散粒子相结构,PEI质量分数为10%时呈现了双连续相结构而PEI质量分数大于15%时呈现了相反转结构,PIP分子质量为18 000或20 000时呈现了双连续相结构,而对于PIP改性氰酸酯体系高PIP分子质量较低的呈现双连续相结构,该体系在120℃固化6 h呈现相反转结构,而150℃或180℃固化形成双连续相结构,双连续相结构增韧效果明显。     

聚芳醚腈/TiO2杂化薄膜的制备及其介电性能

通过溶胶一凝胶法原位合成具有较高介电常数的聚芳醚腈的TiO2杂化薄膜,采用红外光谱、X射线光电子能谱和扫描电子显微镜分析表明,TiO2以纳米粒径均匀分散在薄膜中。薄膜的介电常数与TiO2的含量呈线性增长关系,在ω(TiO2)为20％时达到6．21,并且介电强度没有明显的下降。综合各项性能分析显示ω(TiO2)为15％的杂化薄膜具有优良的力学性能、热性能和介电性能。     

不饱和聚酯增韧技术进展及机理探讨

简单介绍不饱和聚酯树脂增韧的研究进展及基本理论,并分别探讨不饱和聚酯树脂的液体橡胶增韧、互穿网络增韧和刚性粒子增韧的增韧机理。     

Compatibility,rheological, and thermal properties of the melt blends of PEN (HQ/PP) with PEN (HQ/RS)

Two kinds of polyarylene ether nitriles (PEN) copolymers PEN (HQ/PP) and PEN (HQ/RS) were synthesized using 2,6-dicholorobenzonitrile (DCBN) with equal molar of phenolphthalein (PP) and hydroquinone (HQ), DCBN with equal molar of HQ and resorcin (RS), respectively. The melt-mixed blends of two PENs over the complete composition range were characterized by dynamic mechanical analyses (DMA), tensile testing, scanning electronic microscopy (SEM), and capillary rheometer test for their compatibility, thermal, mechanical, and melt flow properties study. DMA show a considerable compatibility between the two PENs. Morphology examinations reveal good component dispersion and strong interface adhesion. The capillary rheometer test found that the blending of PEN (HQ/RS) enhanced the fluidity of the PEN (HQ/PP)/PEN (HQ/RS) blends by reducing its viscosity, which is beneficial to the processability of PEN (HQ/PP). © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Polyarylene ether nitrile/divinyl siloxane-bisbenzocyclobutene composite films: Curing reaction and thermal/mechanical/dielectric properties

Polymer dielectrics, are commonly used as insulating materials for electronic products. Light weight, good mechanical properties and high thermal conductivity are important properties. However, electrical and thermal parameters are interrelated, and it is challenging to have a dielectric polymer that is also resistant to high temperatures and high thermal conductivity. Hence, high-performance composite films were prepared by the method of post-solid phase chemical reaction using polyarylene ether nitrile (PEN) and divinyl siloxane-bisbenzocyclobutene (BCB) as raw materials. First, parameters of the curing reaction were determined by rheological and activation energy calculations. Then, through adjusting the content of BCB resin and treatment temperature, the performance of PEN/BCB composites could be tuned. Thermal properties have been studied by differential scanning calorimetry, dynamic mechanical analysis, thermal gravimetric analysis, and hot-disk method. Here, the PEN/BCB composite electric insulating materials with outstanding thermal performance (T_g: 208–400°C, T_5%: 469–544°C, thermal conductivity: 1.270–2.215 W/m K). Besides, its mechanical and dielectric properties were investigated in detail. It is noteworthy that the tensile strength of composite film can exceed a maximum of 130 MPa, which is 23.19% higher compared to the untreated one. Also, PEN/BCB composites own low dielectric constant (2.27–4.08 at 1 KHz), and the relationship between frequency or a wide temperature range and dielectric constant/loss is stable. Thus, it has a greater potential for applications in electronics in high-temperature environments.